Grabbing component, manipulator and wafer cleaning equipment

Abstract

The embodiment of the utility model relates to a grabbing component, a manipulator and wafer cleaning equipment. The grabbing component comprises a side wall part, an abutting part and a connecting part. Wherein the connecting part is connected with the side wall part and the abutting part; a groove is defined by the side wall part, the connecting part and the abutting part; when the grabbing component grabs the wafer bearing device, the end portion, away from the connecting portion, of the abutting portion abuts against the handle of the wafer bearing device, the abutting portion makes linear contact with the handle of the wafer bearing device, and at least part of the area of the handle of the wafer bearing device is suspended on the groove. According to the grabbing component provided by the embodiment of the invention, the contact area between the grabbing component and the wafer bearing device is greatly reduced, so that the cleaning liquid is prevented from remaining between the wafer bearing device and the grabbing component, and the cleaning effect on the wafer and the wafer bearing device is ensured.

Description

Technical Field

[0001] The present application relates to the field of wafer manufacturing technology, and in particular to a gripping component, a robot arm and a wafer cleaning device. Background Art

[0002] During the wafer manufacturing process, the wafer needs to be repeatedly cleaned and dried to remove dirt, residues and harmful substances on the wafer surface and ensure the cleanliness and purity of the wafer surface for subsequent processing and manufacturing steps.

[0003] Based on different process requirements, wafer cleaning can be divided into two categories: multi-wafer cleaning and single-wafer cleaning. In the multi-wafer cleaning process, wafers are generally stored in a wafer carrier, and the wafer carrier is cleaned together with the wafer. The same gripping component (such as a robot) is used to transfer the wafer carrier between different stations.

[0004] Conventionally, the gripping part of the gripping component is inserted into the insertion groove provided on the side handle of the wafer carrier device to grasp the wafer carrier device and transfer the wafer carrier device from the cleaning tank. During the transfer process, the gripping part needs to be immersed in the cleaning liquid. When the gripping part leaves the cleaning liquid, a part of the cleaning liquid will remain on the gripping part. When the wafer carrier device and the wafer are dried, the cleaning liquid remaining between the gripping part and the wafer carrier device is difficult to dry. When the wafer carrier device and the wafer are dried and the gripping part is separated from the wafer carrier device, cleaning liquid remains on the handle of the wafer carrier device and the gripping part. When the gripping part grabs other wafer carrier devices, it will also cause contamination to other wafer carrier devices, affecting the cleaning effect of the wafer carrier device and the wafer. Summary of the invention

[0005] In view of this, an embodiment of the present application provides a gripping component to solve at least one problem existing in the background technology.

[0006] In a first aspect, an embodiment of the present application provides a gripping component for gripping a wafer carrier, wherein the gripping component includes a side wall portion, an abutting portion, and a connecting portion; wherein:

[0007] The connecting portion connects the side wall portion and the abutting portion;

[0008] A groove is formed between the side wall portion, the connecting portion and the abutting portion;

[0009] When the grasping component grasps the wafer carrier, the end of the abutting portion away from the connecting portion abuts against the handle of the wafer carrier, and there is line contact between the abutting portion and the handle of the wafer carrier, and at least a partial area of ​​the handle of the wafer carrier is suspended on the groove.

[0010] In conjunction with the first aspect of the present application, in an optional implementation manner, the grabbing component further includes:

[0011] A cover plate portion is connected to the side wall portion. When the grasping component grasps the wafer carrier, the plane where the cover plate portion is located is inclined relative to the vertical plane and forms a first angle with the vertical plane, and the first angle is an obtuse angle.

[0012] In conjunction with the first aspect of the present application, in an optional implementation manner, the grabbing component further includes:

[0013] A cover plate portion is connected to the side wall portion. When the grasping component grasps the wafer carrier, a horizontal plane is used as a projection plane, and the orthographic projection of the cover plate portion on the projection plane covers the orthographic projection of the groove on the projection plane.

[0014] In conjunction with the first aspect of the present application, in an optional implementation manner, the grabbing component further includes:

[0015] The guide part is connected to the groove, the bottom wall of the guide part is coplanar with the bottom wall of the groove, the two side walls of the guide part are coplanar with the side wall part and the abutment part respectively, and the surface of the guide part is a slope structure.

[0016] In combination with the first aspect of the present application, in an optional embodiment, the inclined plane structure includes a first inclined plane and a second inclined plane, the first inclined plane is connected to the second inclined plane, the first inclined plane and the second inclined plane are arranged in mirror symmetry, and the first inclined plane and the second inclined plane form a inclined plane structure which is high in the middle and low at both ends.

[0017] In combination with the first aspect of the present application, in an optional embodiment, when the grasping component grasps the wafer carrier, the first inclined surface and the second inclined surface are both inclined relative to the horizontal plane and form a second angle and a third angle with the horizontal plane respectively, and the second angle and the third angle are both less than 30°.

[0018] In combination with the first aspect of the present application, in an optional embodiment, a sharp corner is formed between the connecting portion and the side wall portion or the abutting portion, and when the grasping component grasps the wafer carrier, the sharp corner is located at the bottom end of the grasping component in the vertical direction.

[0019] In combination with the first aspect of the present application, in an optional embodiment, when the grasping component grasps the wafer carrier, the plane where the side wall portion is located and the plane where the abutment portion is located are parallel to the vertical direction, the plane where the connecting portion is located is inclined relative to the horizontal plane and forms a fourth angle with the horizontal plane, and the fourth angle is an acute angle.

[0020] In a second aspect, an embodiment of the present application provides a robot arm for grasping a wafer carrier, including a grasping component provided by any embodiment provided in the first aspect.

[0021] In a third aspect, an embodiment of the present application further provides a wafer cleaning device, comprising the robot arm provided in the second aspect.

[0022] A gripping component is provided in an embodiment of the present application. The gripping component forms a groove through a side wall portion, a connecting portion and an abutting portion, and the end of the abutting portion is abutted on the handle of a wafer carrier, so that there is a line contact between the abutting portion and the handle, which greatly reduces the contact area between the gripping component and the wafer carrier, thereby avoiding the cleaning liquid from remaining between the wafer carrier and the gripping component, thereby ensuring the cleaning effect on the wafer and the wafer carrier.

[0023] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0025] Figure 1 It is a schematic diagram of the three-dimensional structure of the wafer carrying device involved in the embodiment of the present application;

[0026] Figure 2 A schematic diagram of the positional relationship between a gripping component, a wafer carrying device, and a connecting arm provided in an embodiment of the present application;

[0027] Figure 3 for Figure 2 The enlarged view of point B in the middle;

[0028] Figure 4 A schematic diagram of the three-dimensional structure of a gripping claw head in a gripping component provided in an embodiment of the present application;

[0029] Figure 5 A schematic diagram of the positional relationship between an inclined surface structure and a horizontal plane in a gripping component provided in an embodiment of the present application;

[0030] Figure 6 A side view of a clamping claw head in a gripping component provided in another embodiment of the present application;

[0031] Figure 7 A schematic diagram of a partial structure of a manipulator provided in one embodiment of the present application;

[0032] Reference numerals:

[0033] a, wafer carrying device; a1, handle; a2, insertion slot;

[0034] 10. Robotic arm; 110. Connecting arm;

[0035] 120, gripping member; 12a, groove; 121, side wall portion; 1211, bottom plate; 122, connecting portion; 1221, connecting plate; 123, abutting portion; 1231, abutting plate; 1232, pointed end; 124, cover portion; 1241, cover; 125, inclined surface structure; 1251, first inclined surface; 1252, second inclined surface; 126, sharp angle. DETAILED DESCRIPTION

[0036] The exemplary embodiments disclosed in the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the specific embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present application and to fully convey the scope disclosed in the present application to those skilled in the art.

[0037] In the following description, a large number of specific details are given to provide a more thorough understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features known in the art are not described; that is, all features of the actual embodiments are not described here, and well-known functions and structures are not described in detail.

[0038] In the drawings, the sizes of layers, regions, elements and their relative sizes may be exaggerated for clarity. Like reference numerals denote like elements throughout.

[0039] It should be understood that when an element or layer is referred to as "on ...", "adjacent to ...", "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to other elements or layers, or there can be intervening elements or layers. On the contrary, when an element is referred to as "directly on ...", "directly adjacent to ...", "directly connected to" or "directly coupled to" other elements or layers, there is no intervening element or layer. It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer or part discussed below can be represented as the second element, component, region, layer or part. And when the second element, component, region, layer or part is discussed, it does not indicate that the present application necessarily has the first element, component, region, layer or part.

[0040] Spatially relative terms such as "under", "beneath", "below", "under", "above", "above", etc., may be used here for convenience of description to describe the relationship between an element or feature shown in the figure and other elements or features. It should be understood that in addition to the orientation shown in the figure, the spatial relationship terms are intended to also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is turned over, then the elements or features described as "under other elements" or "under it" or "under it" will be oriented as "on" other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0041] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present application. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0042] In order to thoroughly understand the present application, detailed steps and detailed structures will be presented in the following description to illustrate the technical solution of the present application. The preferred embodiments of the present application are described in detail below, but in addition to these detailed descriptions, the present application may also have other implementation methods.

[0043] like Figure 1 As shown, Figure 1 FIG. 1 is a schematic diagram of the three-dimensional structure of the wafer carrier device involved in the embodiment of the present application. In the prior art, the grabbing component is a planar structure plug-in block, which is inserted into the wafer carrier device. Figure 1 The wafer carrier a is grasped in the insertion slot a2 shown in the figure. When the insert block is inserted in the insertion slot a2, a gap is formed between the insert block and the wafer carrier a. The cleaning liquid will enter the gap and penetrate between the insert block and the insertion slot a2. After the grasping component places the wafer carrier a in the drying area, the cleaning liquid remains on the grasping component, which affects the cleaning effect of the wafer carrier a and the wafer.

[0044] In response to the above technical problems, an embodiment of the present application provides a grasping component, wherein the grasping component 120 is surrounded by a groove 12a through a side wall portion 121, a connecting portion 122 and abutting portion 123, and the end of the abutting portion 123 is abutted on the handle a1 of the wafer carrier a to achieve line contact between the abutting portion 123 and the wafer carrier a, thereby greatly reducing the contact area between the abutting portion 123 and the wafer carrier a, thereby avoiding the cleaning liquid from remaining between the wafer carrier a and the grasping component 120, and ensuring the cleaning effect on the wafer and the wafer carrier a.

[0045] A grabbing component provided in an embodiment of the present application is described in detail below with reference to the accompanying drawings.

[0046] Specifically, Figures 2 to 4 As shown, a gripping component 120 provided in an embodiment of the present application is used to grip a wafer carrier a, and the gripping component 120 includes a side wall portion 121, an abutting portion 123, and a connecting portion 122. The connecting portion 122 connects the side wall portion 121 and the abutting portion 123; a groove 12a is formed between the side wall portion 121, the connecting portion 122, and the abutting portion 123. When the gripping component 120 grips the wafer carrier a, the end of the abutting portion 123 away from the connecting portion 122 abuts against the handle a1 of the wafer carrier a, and there is line contact between the abutting portion 123 and the handle a1 of the wafer carrier a, and at least a part of the handle a1 of the wafer carrier a is suspended on the groove 12a.

[0047] In the embodiment of the present application, the end of the abutting portion 123 is abutted against the bottom of the handle a1 of the wafer carrier a, so that the abutting portion 123 and the handle a1 are in line contact, which greatly reduces the contact area between the abutting portion 123 and the handle a1. In addition, no gap is formed when the abutting portion 123 and the handle a1 are abutted, thereby avoiding the phenomenon that the cleaning liquid remains between the handle a1 and the abutting portion 123.

[0048] In an alternative embodiment, if Figure 4 As shown, the connecting portion 122 includes a connecting plate 1221, the side wall portion 121 includes a bottom plate 1211, and the abutting portion 123 includes an abutting plate 1231. The connecting plate 1221, the bottom plate 1211 and the abutting plate 1231 are integrally formed through a bending process. The integrally formed grasping component 120 can ensure its structural strength and further ensure the stability of the grasping component 120 in grasping the wafer carrying device a.

[0049] In an alternative embodiment, if Figure 3 As shown, the grasping component 120 also includes a cover portion 124, and the cover portion 124 is connected to the side wall portion 121. When the grasping component 120 grasps the wafer carrier a, the plane where the cover portion 124 is located is inclined relative to the vertical plane and forms a first angle β with the vertical plane. The first angle β is an obtuse angle. Figure 3 The side wall portion 121 is parallel to the vertical direction.

[0050] In the embodiment of the present application, the cover portion 124 can improve the structural strength of the grabbing component 120 on the one hand; on the other hand, the obtuse angle formed by the cover portion 124 and the vertical plane can make the cleaning liquid on the cover portion 124 flow down more smoothly.

[0051] In another alternative embodiment, if Figure 3 As shown, when the grasping component 120 grasps the wafer carrier a, the horizontal plane is used as the projection plane, and the orthographic projection of the cover portion 124 on the projection plane covers the orthographic projection of the groove 12a on the projection plane.

[0052] That is to say, when the grasping component 120 moves upward and takes the wafer carrier a away from the cleaning liquid, the cover portion 124 plays a role of guiding the liquid, changing the flow direction of the liquid above the grasping component 120, so that the liquid flows along the cover portion 124, which is conducive to the rapid discharge of the liquid in the groove 12a. When the grasping component 120 and the wafer carrier a are separated from the cleaning liquid, the cover portion 124 can provide a shield for the grasping component 120, and the cleaning liquid dripping on the wafer carrier a is blocked by the cover portion 124 and flows along its outer wall and will not flow into the groove 12a, effectively avoiding the accumulation of residual cleaning liquid.

[0053] In an alternative embodiment, if Figure 4As shown, the cover plate portion 124 includes a cover plate 1241 , and the cover plate 1241 , the connecting plate 1221 , the bottom plate 1211 , and the abutting plate 1231 are integrally formed through a bending process to ensure the structural strength of the grabbing component 120 .

[0054] In an alternative embodiment, if Figure 4 As shown, the grabbing component 120 also includes a guide portion, which is connected to the groove 12a, the bottom wall of the guide portion is coplanar with the bottom wall of the groove 12a, the two side walls of the guide portion are coplanar with the side wall portion 121 and the abutment portion 123 respectively, and the surface of the guide portion is a slope structure 125.

[0055] In the above embodiment, first, the guide part is connected between the bottom plate 1211 and the abutment plate 1231. The setting of the guide part can keep the bottom plate 1211 and the abutment plate 1231 stable, thereby increasing the stability of the entire groove 12a structure and avoiding deformation of the structure of the groove 12a when grabbing the wafer carrier a. Secondly, even if the cover plate part 124 can shield the groove 12a, a small amount of cleaning liquid will still flow into the groove 12a. In the embodiment of the present application, the bottom wall of the guide part is coplanar with the bottom wall of the groove 12a, and the two side walls of the guide part are coplanar with the side wall part 121 and the abutment part 123 respectively, which can avoid the existence of a gap between the guide part and the groove 12a, and further avoid the accumulation of cleaning liquid. In addition, the inclined structure 125 of the guide part can make the cleaning liquid remaining in the groove 12a flow out smoothly.

[0056] In an alternative embodiment, if Figure 4 As shown, the inclined surface structure 125 includes a first inclined surface 1251 and a second inclined surface 1252. The first inclined surface 1251 is connected to the second inclined surface 1252. The first inclined surface 1251 and the second inclined surface 1252 are arranged in mirror symmetry. The first inclined surface 1251 and the second inclined surface 1252 form an inclined surface structure 125 that is high in the middle and low at both ends.

[0057] In the embodiment of the present application, the inclined structure 125 with a high middle and low ends can effectively and quickly make the cleaning liquid in the groove 12 a flow down, thereby preventing the cleaning liquid from accumulating in the groove 12 a.

[0058] In an optional embodiment, when the grasping component 120 grasps the wafer carrier a, the first inclined surface 1251 and the second inclined surface 1252 are both inclined relative to the horizontal plane and form a second angle and a third angle with the horizontal plane respectively, the second angle and the third angle are both less than 30°, the angle of the second angle is the same as the angle of the third angle, and the second angle and the third angle are both ε, such as Figure 5 As shown, Figure 5 The dotted line in the figure indicates a horizontal plane.

[0059] The second angle and the third angle are both less than 30°, which can make the cleaning liquid on the first inclined surface 1251 and the second inclined surface 1252 flow and drip smoothly under the action of gravity, and avoid the cleaning liquid remaining on the first inclined surface 1251 and the second inclined surface 1252. In an optional embodiment, when the grasping component 120 grasps the wafer carrier a, the plane where the side wall portion 121 is located and the plane where the abutting portion 123 is located are parallel to the vertical direction, and the plane where the connecting portion 122 is located is inclined relative to the horizontal plane and forms a fourth angle γ with the horizontal plane. The fourth angle γ is an acute angle, such as Figure 6 As shown, Figure 6 The dotted line in the figure indicates a horizontal plane.

[0060] The plane where the side wall portion 121 and the plane where the abutment portion 123 are located are parallel to the vertical direction, which can improve the structural stability when the grasping component 120 grasps the wafer carrier a. In addition, the fourth angle is an acute angle, which can improve the smoothness of the cleaning liquid leaving the outer wall of the connecting portion 122 and improve the flow efficiency of the cleaning liquid.

[0061] In the embodiment of the present application, as a replacement, when the grasping component 120 grasps the wafer carrier a, the plane where the side wall portion 121 is located and the plane where the abutment portion 123 is located have an inclination angle relative to the vertical direction. The size of the inclination angle is not limited in the embodiment of the present application and can be set according to specific circumstances.

[0062] In an optional embodiment, a sharp corner 126 is formed between the connecting portion 122 and the side wall portion 121 or the abutting portion 123. When the grasping member 120 grasps the wafer carrier a, the sharp corner 126 is located at the bottom end of the grasping member 120 in the vertical direction. Figure 3 As shown, a sharp angle 126 is formed between the side wall portion 121 and the connecting portion 122. Figure 6 As shown, a sharp corner 126 is formed between the abutting portion 123 and the connecting portion 122 .

[0063] The cleaning liquid flowing on the side wall portion 121 and the connecting portion 122 will eventually converge at the sharp corner 126. That is to say, the cleaning liquid remaining on the grabbing component 120 will flow to the sharp corner 126 under the action of gravity. Setting the bottom of the grabbing component 120 to a sharp corner 126 structure can avoid water hanging on the grabbing component 120. In addition, the sharp corner 126 can improve the smoothness of the dripping of the cleaning liquid. Compared with the chamfered structure at the bottom, even if the chamfer is controlled within a very small angle range, the cleaning liquid will still remain at the chamfer, affecting the drying effect.

[0064] In an alternative embodiment, if Figure 6 As shown, the end of the abutting portion 123 has a gradually narrowing tip 1232 , and when the grasping component 120 grasps the wafer carrying device a, the tip 1232 abuts against the bottom end of the handle a1 of the wafer carrying device a.

[0065] The tip 1232 is used to contact the handle a1 of the wafer carrier a. The contact between the narrower tip 1232 and the handle a1 further reduces the contact area between the abutting portion 123 and the handle a1, thereby preventing the cleaning liquid from remaining between the abutting portion 123 and the handle a1.

[0066] The present application also provides a robot, such as Figure 7 As shown, the robot 10 includes a grasping component 120 provided by any of the above-mentioned embodiments; it also includes a connecting arm 110 and a driving assembly (not shown in the figure), one end of the connecting arm 110 is connected to the grasping assembly, and the other end is connected to the driving assembly. Under the driving force of the driving assembly, the grasping assembly follows the connecting arm 110 to abut against the wafer carrying device a to grasp the wafer carrying device a.

[0067] The embodiment of the present application also provides a wafer cleaning device, including the robot 10 provided in the above embodiment. The robot 10 is used to grab the wafer carrier a and transfer it to each station to clean and dry the wafer in the wafer carrier a.

[0068] By using a robot 10 including a grasping component 120 to grasp the wafer carrier a, the base area between the robot 10 and the wafer carrier a can be reduced, residual cleaning liquid can be avoided, and contamination of the wafer carrier a at another workstation can be further avoided when the robot 10 grasps the wafer carrier a, thereby improving the cleaning effect of the wafer cleaning equipment.

[0069] It should be understood that the above embodiments are exemplary and are not intended to include all possible implementations included in the claims. Various modifications and changes may be made on the basis of the above embodiments without departing from the scope of the present disclosure. Similarly, the various technical features of the above embodiments may be arbitrarily combined to form other embodiments of the present application that may not be explicitly described. Therefore, the above embodiments only express several implementations of the present application and do not limit the scope of protection of the patent of this application.

Claims

1. A gripping component for gripping a wafer carrier, It is characterized in that The grabbing component includes a side wall portion, an abutting portion, and a connecting portion; wherein, The connecting portion connects the side wall portion and the abutting portion; A groove is formed between the side wall portion, the connecting portion and the abutting portion; When the grasping component grasps the wafer carrier, the end of the abutting portion away from the connecting portion abuts against the handle of the wafer carrier, and there is line contact between the abutting portion and the handle of the wafer carrier, and at least a partial area of ​​the handle of the wafer carrier is suspended on the groove.

2. The gripping member according to claim 1, It is characterized in that The grabbing component also includes: A cover plate portion is connected to the side wall portion. When the grasping component grasps the wafer carrier, the plane where the cover plate portion is located is inclined relative to the vertical plane and forms a first angle with the vertical plane, and the first angle is an obtuse angle.

3. The gripping member according to claim 1, It is characterized in that The grabbing component also includes: A cover plate portion is connected to the side wall portion. When the grasping component grasps the wafer carrier, a horizontal plane is used as a projection plane, and the orthographic projection of the cover plate portion on the projection plane covers the orthographic projection of the groove on the projection plane.

4. The gripping member according to claim 1, It is characterized in that The grabbing component also includes: The guide part is connected to the groove, the bottom wall of the guide part is coplanar with the bottom wall of the groove, the two side walls of the guide part are coplanar with the side wall part and the abutment part respectively, and the surface of the guide part is a slope structure.

5. The gripping member according to claim 4, It is characterized in that The inclined plane structure includes a first inclined plane and a second inclined plane, the first inclined plane is connected to the second inclined plane, the first inclined plane and the second inclined plane are arranged in mirror symmetry, and the first inclined plane and the second inclined plane form the inclined plane structure which is high in the middle and low at both ends.

6. The gripping member according to claim 5, It is characterized in that When the grasping component grasps the wafer carrier, the first inclined surface and the second inclined surface are both inclined relative to the horizontal plane and form a second angle and a third angle with the horizontal plane respectively, and the second angle and the third angle are both less than 30°.

7. The gripping member according to claim 1, It is characterized in that A sharp corner is formed between the connecting portion and the side wall portion or the abutting portion. When the grasping component grasps the wafer carrying device, the sharp corner is located at the bottom end of the grasping component in the vertical direction.

8. The gripping member according to claim 7, It is characterized in that When the grasping component grasps the wafer carrier, the plane where the side wall portion and the plane where the abutting portion are located are parallel to the vertical direction, the plane where the connecting portion is located is inclined relative to the horizontal plane and forms a fourth angle with the horizontal plane, and the fourth angle is an acute angle.

9. A robot for grabbing a wafer carrier, It is characterized in that Comprising a gripping component as claimed in any one of claims 1 to 8.

10. A wafer cleaning device, It is characterized in that Comprising the robot as claimed in claim 9.

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