Improved water-cooling radiator

Abstract

The utility model discloses an improved water-cooling radiator, which comprises a water-cooling plate body, the water-cooling plate body comprises an upper plate, a lower plate and a radiating contact plate, the lower plate is provided with a through groove penetrating up and down and a through groove allowing the radiating contact plate to be placed therein, the upper plate is buckled on the lower plate, and the radiating contact plate is positioned between the upper plate and the lower plate. The side end of the upper plate is provided with a liquid inlet and a liquid outlet through which water cooling liquid enters / is discharged, and a groove body through which the water cooling liquid flows is further arranged between the upper plate and the lower plate; according to the utility model, the structure is simple, the use is convenient and fast, the contact area of the heat dissipation contact plate is increased, so that the heat conduction area of the heat dissipation contact plate and the chip is increased, the other end face is provided with the plurality of heat dissipation fins protruding upwards, the thickness of each heat dissipation fin is 0.2 mm, the distance between the adjacent heat dissipation fins is 0.3 mm, and the heat dissipation efficiency is improved. And more water-cooling liquid can enter the cooling water tank to take away redundant heat, so that the heat generated by a chip is reduced, the temperature of a working environment is reduced, and stable operation of an electronic product is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to an improved water-cooled radiator. Background Art

[0002] With the continuous advancement of science and technology, many electronic high-tech products have been integrated into daily life. Their arrival has provided great convenience to people's life, production and work, saved time and improved efficiency. In electronic products, the core component is the chip. Through the processing of the chip, the problems encountered can be solved. However, heat will occur during use, making the internal temperature too high, which may easily lead to electronic product overload, jamming, etc. Therefore, during use, it is necessary to dissipate the internal heat in time to avoid high temperature environment.

[0003] The existing radiators on the market are divided into air-cooled radiators and water-cooled radiators. Among them, the water-cooled radiator is achieved by setting pipes on the heat sink to facilitate the flow of water-cooling liquid and take away the heat generated by the heat chip, thereby achieving a cooling effect. However, the heat dissipation area of ​​the existing heat sink is small, so that the contact area between it and the water-cooling liquid is small, resulting in poor heat dissipation effect, resulting in the temperature of the chip cannot be effectively reduced, so that the electronic product cannot operate for a long time.

[0004] Therefore, it is necessary to study a new technical solution to solve the above problems. Utility Model Content

[0005] In view of this, the present invention aims to solve the deficiencies in the prior art, and its main purpose is to provide an improved water-cooling radiator.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] An improved water-cooled radiator comprises a water-cooled plate body, wherein the water-cooled plate body comprises an upper plate, a lower plate and a heat dissipation contact plate, wherein the lower plate is provided with a through groove which runs through from top to bottom and in which the heat dissipation contact plate is placed, wherein the upper plate is buckled onto the lower plate and the heat dissipation contact plate is located therebetween, wherein a liquid inlet and a liquid outlet are provided at the side end of the upper plate for water-cooled liquid to enter / discharge, wherein a groove body for water-cooled liquid to flow is further provided between the upper plate and the lower plate, wherein one end of the groove body is connected to the heat dissipation contact plate, and the other end is connected to the liquid inlet or the liquid outlet.

[0008] As a preference, the trough body includes a liquid inlet trough and a liquid outlet trough, one end of the liquid inlet trough is connected to the liquid inlet, and the other end is located on one side of the heat dissipation contact plate, for supplying water-cooling liquid to be poured in from the liquid inlet and flow into the heat dissipation contact plate to take away heat; one end of the liquid outlet trough is connected to the liquid outlet, and the other end is located on the other side of the heat dissipation contact plate, for transporting the water-cooling liquid passing through the heat dissipation contact plate to the outside and discharging it through the liquid outlet.

[0009] As a preference, a "U"-shaped structure is formed between the heat dissipation contact plate and the inner wall of the lower plate, the liquid inlet groove is located at one end of the "U"-shaped structure, and the liquid outlet groove is located at the other end of the "U"-shaped structure. The water-cooling liquid flows into the liquid inlet groove at one end and passes through the heat dissipation contact plate to take away the heat, and then is discharged outward from the liquid outlet groove at the other end to achieve cooling.

[0010] As a preference, the liquid inlet groove and the liquid outlet groove are respectively arranged on the upper plate and the lower plate, and the upper plate and the lower plate are installed and buckled so that the liquid inlet groove and the liquid outlet groove located on the upper and lower end surfaces of the upper plate and the lower plate buckle to form a complete groove body for water-cooling liquid to flow inside it.

[0011] Preferably, the upper end surface of the heat dissipation contact plate is provided with heat dissipation fins protruding upward, the heat dissipation fins are located between the upper plate and the lower plate, the heat dissipation fins are arranged in a transverse arrangement, and the arrangement direction of the heat dissipation fins is consistent with the direction of the liquid inlet groove, so that the water-cooled liquid flows in and is separated into multiple streams through the heat dissipation fins.

[0012] As a preference, the number of the heat dissipation fins is set to be plural, and the plural heat dissipation fins are arranged in an array at intervals on the upper end surface of the heat dissipation contact plate, and heat dissipation grooves are formed between the left and right adjacent heat dissipation fins.

[0013] As a preference, the thickness of the heat dissipation fins is 0.2 mm, and the spacing between the heat dissipation slots is 0.3 mm.

[0014] Preferably, the water cooling plate body is further provided with a plurality of locking holes for screws to pass through and lock and fix.

[0015] As a preference, the lower plate is further provided with a protection pad, and the protection pads are distributed at intervals on the lower end surface of the lower plate to prevent the lower plate from touching the installation surface.

[0016] As a preferred embodiment, the water cooling plate body is made by processing and molding copper material, and the water cooling plate body is also made by adopting brazing processing technology.

[0017] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:

[0018] The utility model has a simple structure and is quick and convenient to use. By increasing the contact area of ​​the heat dissipation contact plate, the heat conduction area with the chip is enlarged, and a plurality of upwardly protruding heat dissipation fins are arranged on the other end surface, and the thickness of each heat dissipation fin is 0.2mm, and the spacing between adjacent heat dissipation fins is 0.3mm, so that more water-cooling liquid can enter therein to take away excess heat, and the direction of the liquid inlet groove is also set to be consistent with the direction of the heat dissipation fins, so that the water-cooling liquid can directly flush and flow onto the heat dissipation fins, and then take away the heat in time, thereby reducing the heat generated by the chip, lowering the temperature of the working environment, and ensuring the stable operation of the electronic product. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0020] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0021] Figure 2 It is another perspective overall structural schematic diagram of the utility model.

[0022] Figure 3 It is a schematic diagram of the upper plate separation structure of the utility model.

[0023] Figure 4 It is a schematic diagram of the upper plate separation structure from another viewing angle of the utility model.

[0024] Figure 5 It is a schematic diagram of the overall exploded structure of the utility model.

[0025] Figure 6 It is a structural schematic diagram of the heat dissipation contact plate of the utility model.

[0026] Among them, the reference numerals in the figure are:

[0027] 100, water cooling plate body; 110, upper plate; 120, lower plate; 130, heat dissipation contact plate; 131, heat dissipation fins; 132, heat dissipation slot; 140, through slot; 150, liquid inlet; 160, liquid outlet; 170, slot body; 171, liquid inlet slot; 172, liquid outlet slot; 180, locking hole; 190, protective pad. DETAILED DESCRIPTION

[0028] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0029] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0030] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0031] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0032] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0033] Reference Figure 1-6As shown: An improved water-cooled radiator includes a water-cooled plate body 100, wherein the water-cooled plate body 100 includes an upper plate 110, a lower plate 120 and a heat dissipation contact plate 130, and a through groove 140 is provided on the lower plate 120, so that the heat dissipation contact plate 130 can be placed in the through groove 140, and the edge of the heat dissipation contact plate 130 can be overlapped and fixed in the through groove 140 of the lower plate 120, and then fixed together by welding technology to form a sealed state to avoid gaps and leakage, and then by buckling the upper plate 110 The upper plate 110 is combined with the lower plate 120 so that the heat dissipation contact plate 130 is located therebetween, and a liquid inlet 150 and a liquid outlet 160 for water cooling liquid to enter / discharge are provided at the side end of the upper plate 110, and a groove body 170 for water cooling liquid to flow is provided between the upper plate 110 and the lower plate 120, wherein one end of the groove body 170 is connected to the heat dissipation contact plate 130 so that the water cooling liquid can flow through the heat dissipation contact plate 130 for heat conduction and cooling, and then the other end of the groove body 170 is connected to the liquid inlet 150 or the liquid outlet 160 so as to facilitate the filling or discharge of the water cooling liquid.

[0034] In this embodiment, the tank body 170 includes a liquid inlet tank 171 and a liquid outlet tank 172. One end of the liquid inlet tank 171 is connected to the liquid inlet 150, and the other end is set on one side of the heat dissipation contact plate 130, so that water-cooling liquid is poured into the liquid inlet 150 and flows into the heat dissipation contact plate 130 to take away the generated heat; then one end of the liquid outlet tank 172 is connected to the liquid outlet 160, and the other end is set on the other side of the heat dissipation contact plate 130, so that the water-cooling liquid passing through the heat dissipation contact plate 130 can smoothly flow into the liquid outlet tank 172, so that the used water-cooling liquid can be transported outward and discharged outward through the liquid outlet 160, thereby reducing the temperature of the chip working environment and ensuring its stability during operation.

[0035] Specifically, a "U"-shaped structure is formed between the heat dissipation contact plate 130 and the inner wall of the lower plate 120, so that the liquid inlet groove 171 is located at one end of the "U"-shaped structure, and the liquid outlet groove 172 is located at the other end of the "U"-shaped structure. By designing this structure, the water-cooling liquid flows into the liquid inlet groove 171 at one end, can smoothly flow through the heat dissipation contact plate 130 and take away the heat, and then is discharged outward from the liquid outlet groove 172 at the other end to achieve cooling.

[0036] In this embodiment, the liquid inlet groove 171 and the liquid outlet groove 172 are respectively arranged on the upper plate 110 and the lower plate 120. After the upper plate 110 and the lower plate 120 are installed and buckled, the liquid inlet groove 171 and the liquid outlet groove 172 located on the upper and lower end surfaces of the upper plate 110 and the lower plate 120 are buckled with each other to form a complete groove body 170, so that the water-cooling liquid can flow inside the groove body 170 and effectively avoid leakage of the water-cooling liquid.

[0037] In the present embodiment, the upper end surface of the heat dissipation contact plate 130 is provided with a heat dissipation fin 131 protruding upward. When the heat dissipation fin 131 is buckled and installed, the heat dissipation fin 131 is located between the upper plate 110 and the lower plate 120, and the heat dissipation fin 131 is arranged and distributed in a transverse manner. The arrangement direction of the heat dissipation fin 131 is also consistent with the direction of the liquid inlet groove 171, so that when the water-cooling liquid flows into the heat dissipation fin 131, it can be separated into multiple streams and flow through the two end surfaces of the heat dissipation fin 131 at the same time; specifically, the number of the heat dissipation fins 131 is set to a plurality of blocks, and the plurality of heat dissipation fins 131 are arranged in an array at intervals on the upper end surface of the heat dissipation contact plate 130, and heat dissipation grooves 132 are formed between the left and right adjacent heat dissipation fins 131, so that when the water-cooling liquid flows through the heat dissipation fins 131, it can take away the heat on different heat dissipation fins 131 at the same time, thereby improving the cooling effect and ensuring the cooling efficiency.

[0038] Furthermore, by setting the thickness of the heat sink 131 to 0.2 mm and the spacing of the heat sink 132 to 0.3 mm, the thermal conductivity of the heat sink 131 can be maximized, and then the water-cooling liquid flows through the heat sink 132, which can effectively take away the heat generated by the chip, improve the cooling effect, and ensure a constant working temperature.

[0039] In this embodiment, the water cooling plate body 100 is further provided with a plurality of locking holes 180 for screws to pass through and be locked and fixed. The water cooling plate can be fixedly installed on the mainboard through the locking holes 180 to avoid loosening.

[0040] In this embodiment, a protective pad 190 is further provided on the lower plate 120. The protective pads 190 are distributed at intervals on the lower end surface of the lower plate 120 to prevent the lower plate 120 from touching the upper surface of the mainboard during installation, thereby achieving a good protective effect and a good shock-absorbing effect. When the water-cooling liquid enters the groove body 170 of the water-cooling plate body 100, the slight vibration generated can be mitigated and eliminated by the protective pad 190.

[0041] In this embodiment, the material used for the water cooling plate body 100 is copper material, and the water cooling plate body 100 is made by using brazing processing technology.

[0042] The above are only preferred embodiments of the present invention, and only specifically describe the technical principles of the present invention. These descriptions are only for the purpose of explaining the principles of the present invention, and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanation here, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention, and other specific implementation methods of the present invention that can be associated with by technicians in this field without creative labor, should be included in the scope of protection of the present invention.

Claims

1. An improved water-cooled radiator, comprising a water-cooled plate body, characterized in that: The water-cooling plate body comprises an upper plate, a lower plate and a heat dissipation contact plate, the lower plate is provided with a through groove which runs through from top to bottom and in which the heat dissipation contact plate is placed, the upper plate is buckled with the lower plate and the heat dissipation contact plate is located therebetween, a liquid inlet and a liquid outlet for water-cooling liquid to enter / discharge are provided at the side end of the upper plate, a groove body for water-cooling liquid to flow is also provided between the upper plate and the lower plate, one end of the groove body is connected to the heat dissipation contact plate, and the other end is connected to the liquid inlet or the liquid outlet.

2. The improved water-cooling radiator according to claim 1 is characterized in that: The tank body includes a liquid inlet tank and a liquid outlet tank, one end of the liquid inlet tank is connected with the liquid inlet, and the other end is located at one side of the heat dissipation contact plate, and is used for supplying water-cooling liquid to flow into the heat dissipation contact plate from the liquid inlet and take away heat; one end of the liquid outlet tank is connected with the liquid outlet, and the other end is located at the other side of the heat dissipation contact plate, and is used for transporting the water-cooling liquid passing through the heat dissipation contact plate to the outside and discharging it through the liquid outlet.

3. The improved water-cooling radiator according to claim 2 is characterized in that: A "U"-shaped structure is formed between the heat dissipation contact plate and the inner side wall of the lower plate. The liquid inlet groove is located at one end of the "U"-shaped structure, and the liquid outlet groove is located at the other end of the "U"-shaped structure. The water-cooling liquid flows into the liquid inlet groove at one end and passes through the heat dissipation contact plate to take away the heat, and then is discharged outward from the liquid outlet groove at the other end to achieve cooling.

4. The improved water-cooling radiator according to claim 2 is characterized in that: The liquid inlet groove and the liquid outlet groove are respectively arranged on the upper plate and the lower plate, and the upper plate and the lower plate are installed and buckled so that the liquid inlet groove and the liquid outlet groove located on the upper and lower end surfaces of the upper plate and the lower plate are buckled to form a complete groove body for water cooling liquid to flow inside.

5. The improved water-cooling radiator according to claim 2 is characterized in that: The upper end surface of the heat dissipation contact plate is provided with a heat dissipation fin protruding upward, and the heat dissipation fin is located between the upper plate and the lower plate. The heat dissipation fin is arranged in a transverse distribution, and the arrangement direction of the heat dissipation fin is consistent with the direction of the liquid inlet groove, so that the water-cooled liquid flows into the heat dissipation fin and is separated into multiple streams.

6. The improved water-cooling radiator according to claim 5, characterized in that: The number of the heat dissipation fins is set to be a plurality of pieces, and the plurality of heat dissipation fins are arranged in an array at intervals on the upper end surface of the heat dissipation contact plate, and heat dissipation grooves are formed between the heat dissipation fins adjacent to each other on the left and right.

7. The improved water-cooling radiator according to claim 6, characterized in that: The thickness of the heat dissipation fins is 0.2 mm, and the spacing between the heat dissipation slots is 0.3 mm.

8. The improved water-cooling radiator according to claim 1 is characterized in that: The water cooling plate body is also provided with a plurality of locking holes for screws to pass through and be locked and fixed.

9. The improved water-cooling radiator according to claim 1, characterized in that: The lower plate is also provided with a protection pad, which is distributed at intervals on the lower end surface of the lower plate to prevent the lower plate from contacting the installation surface.

10. The improved water-cooling radiator according to claim 1, characterized in that: The water cooling plate body is made by processing and shaping copper material, and the water cooling plate body is also made by adopting brazing processing technology.

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