Automatic dispensing device for semiconductor production line

Abstract

The utility model discloses an automatic adhesive dispensing device for a semiconductor production line, and belongs to the technical field of semiconductor adhesive dispensing devices, the automatic adhesive dispensing device comprises an operation table, two first linear motors are connected to the top of the operation table in a bilateral symmetry mode, electric push rods are connected to mover seats of the two first linear motors, and an adhesive dispensing execution piece is arranged on a mover seat of a second linear motor; and the passive frame body is respectively connected with a dispensing gun and a negative pressure suction structure capable of carrying out negative pressure suction treatment on gas emitted by the dispensing gun during dispensing. According to the automatic dispensing device for the semiconductor production line, when a semiconductor chip is subjected to dispensing operation through the dispensing execution part, waste gas generated in the dispensing process of the semiconductor chip can be continuously absorbed and captured through a negative pressure suction structure in the dispensing execution part, so that the production environment of the semiconductor chip is effectively purified; and the harm degree of waste gas generated in the dispensing process to workers is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor dispensing devices, and more specifically, to an automatic dispensing device for a semiconductor production line. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are widely used in radios, televisions, and chips. The production process of semiconductor chips requires a glue dispensing step, the main purpose of which is to accurately drip glue onto the back of the chip to achieve heat conduction, sealing, protection, etc., thereby improving the quality and stability of electronic products.

[0003] The document with the prior art publication number CN216704907U provides a dispensing device for semiconductor chip production. The device is provided with a lifting mechanism. The first servo motor controls the cam to rotate, and the cam drives the protrusion to rotate synchronously. The protrusion slides in the slide groove. At the same time, the protrusion drives the movable seat to move in the vertical direction through the slide groove. The movable seat drives the device to move in the vertical direction through the support seat and the workbench, so that the height of the dispensing device can be adjusted, which is convenient for personnel to operate; the second servo motor controls the screw to rotate, and the nut seat drives the second cylinder and the dispensing gun to move, so as to adjust the dispensing position and reduce the labor intensity.

[0004] Although the above-mentioned prior art solution can achieve the relevant beneficial effects through the structure of the prior art, it still has the following defects: the glue used in the production of semiconductor chips will produce harmful and irritating exhaust gas after heating and melting. These exhaust gases contain organic volatile gases such as formaldehyde that threaten human health and safety. However, when the above-mentioned existing semiconductor chip production dispensing device performs the dispensing task, it is still unable to treat the harmful exhaust gas generated during the dispensing work, which will not only pollute the production environment of the semiconductor chips, but also have an adverse effect on the health of the staff who produce semiconductor chips.

[0005] In view of this, we propose an automatic dispensing device for a semiconductor production line. Summary of the invention

[0006] 1. Technical issues to be solved

[0007] The purpose of the present application is to provide a method for an automatic dispensing device for a semiconductor production line, which solves the technical problems raised in the above-mentioned background technology.

[0008] 2. Technical solution

[0009] The technical solution of the present application provides an automatic dispensing device for a semiconductor production line, comprising an operating table, two first linear motors are symmetrically connected to the top of the operating table, and electric push rods are connected to the mover seats of the two first linear motors;

[0010] The top ends of the two electric push rods are commonly connected to a second linear motor, and a dispensing actuator is provided on a mover seat of the second linear motor;

[0011] The glue dispensing actuator comprises a passive frame fixedly connected to the second linear motor mover seat, and the passive frame is respectively connected with a glue dispensing gun and a negative pressure suction structure capable of performing negative pressure absorption treatment on the gas emitted by the glue dispensing gun during glue dispensing.

[0012] As an optional solution of the technical solution of the present application document, the negative pressure suction structure includes a processing cylinder fixedly connected to the passive frame, and a bearing ring is connected to the interior of the processing cylinder;

[0013] An embedded cylinder seat with a porous bottom is also placed inside the treatment cylinder. The inside of the embedded cylinder seat is filled with an activated carbon particle layer. A retaining net is connected to the top opening of the embedded cylinder seat. A sealing ring is fixed on the outer periphery of the embedded cylinder seat to seal the gap between the side wall of the embedded cylinder seat and the side wall of the inner cavity of the treatment cylinder.

[0014] An annular sealing gasket is connected to the top opening of the processing cylinder, and a top cover is also threadedly covered on the top opening of the processing cylinder, and a vacuum pump is connected to the top of the top cover;

[0015] A limit ring is connected to the top wall of the inner cavity of the top cover;

[0016] The bottom of the processing cylinder is also provided with a one-way check structure for preventing the gas flowing into the processing cylinder from flowing back into the atmosphere again when the vacuum pump is turned off.

[0017] As an optional solution of the technical solution of the present application document, the input end of the vacuum pump extends into the inner cavity of the top cover.

[0018] As an optional solution of the technical solution of the present application document, when the top cover is tightened to cover the top opening of the processing cylinder, the bottom end of the limiting ring abuts against the top surface of the retaining net.

[0019] As an optional solution of the technical solution of the present application document, the one-way non-return structure includes an inner fixing frame and a dust removal net, and a straightening rod is inserted through the inner fixing frame;

[0020] The bottom end of the straightening rod is connected with a valve piston, and the outer peripheral sleeve of the straightening rod is provided with a telescopic spring connected between a fixing frame and the valve piston.

[0021] As an optional solution of the technical solution of this application document, a fluid cavity adapted to the fixing frame is opened on the bottom wall of the inner cavity of the treatment cylinder, and a sealing groove adapted to the valve piston is opened on the bottom wall of the fluid cavity;

[0022] An inflow hole is formed through the bottom wall of the sealing tank body, and the bottom end of the inflow hole penetrates the bottom of the processing cylinder body and is connected with the atmosphere.

[0023] As an optional solution of the technical solution of this application document, the fixing frame is connected to the fluid cavity;

[0024] The valve piston seal is slidably connected to the inside of the seal groove;

[0025] The dust removal net is fixedly connected to the bottom of the processing cylinder and covers the bottom opening of the inflow hole.

[0026] 3. Beneficial effects

[0027] One or more technical solutions provided in the technical solution of this application have at least the following technical effects or advantages:

[0028] 1. When the automatic dispensing device of the semiconductor production line performs dispensing operation on the semiconductor chip through the dispensing actuator, the waste gas generated by the semiconductor chip in the dispensing process can be continuously absorbed and captured through the negative pressure suction structure in the dispensing actuator, thereby effectively purifying the production environment of the semiconductor chip and reducing the degree of harm to the workers caused by the waste gas generated in the dispensing process.

[0029] 2. Under the negative pressure suction of the vacuum pump, the waste gas generated during the dispensing process continuously flows into the interior of the treatment cylinder in the negative pressure suction structure through the inflow hole, and then the activated carbon particle layer adsorbs the organic harmful substances in the waste gas, thereby realizing the adsorption, purification and filtration of the waste gas. The gas purified and filtered by the activated carbon particle layer is then discharged into the production environment of the semiconductor chip by the vacuum pump, thereby effectively purifying the production environment of the semiconductor chip and reducing the degree of harm to the staff caused by the waste gas generated during the dispensing process.

[0030] 3. When the vacuum pump is turned off, under the elastic force of the telescopic spring in the one-way check structure, the valve piston quickly moves into the sealing groove and prevents the exhaust gas that has entered the inner cavity of the treatment cylinder from flowing back through the inlet hole into the production environment of the semiconductor chip.

[0031] 4. The first linear motor and the second linear motor are used to adjust the position of the glue gun in the width and length directions of the operating table respectively, so that the multi-dimensional position of the glue gun on the X and Y axes can be adjusted when dispensing glue on semiconductor chips, and then the glue gun can be accurately adjusted to the position to be dispensed when dispensing glue on semiconductor chips, thereby improving the dispensing effect on semiconductor chips.

[0032] 5. After unscrewing the top cover from the opening at the end of the treatment cylinder, take out the embedded cylinder seat from the inner cavity of the treatment cylinder, and then remove the retaining net from the top opening of the embedded cylinder seat, so as to facilitate the staff to regularly replace the activated carbon particle layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a schematic diagram of the overall structure of an automatic dispensing device for a semiconductor production line disclosed in a preferred embodiment of the present application;

[0034] Figure 2 It is a schematic cross-sectional structure diagram of a negative pressure suction structure in an automatic dispensing device for a semiconductor production line disclosed in a preferred embodiment of the present application;

[0035] Figure 3 The automatic dispensing device for semiconductor production line disclosed in a preferred embodiment of the present application is Figure 2 A schematic diagram of the enlarged local structure of part A.

[0036] Explanation of the numbers in the figure: 1. Operating table; 2. First linear motor; 3. Electric push rod; 4. Second linear motor; 5. Passive frame; 6. Glue dispensing gun; 7. Processing cylinder; 8. Top cover; 9. Vacuum pump; 10. Bearing ring; 11. Embedded cylinder seat; 12. Activated carbon particle layer; 13. Blocking net; 15. Limiting ring; 16. Ring sealing gasket; 17. Valve piston; 18. Telescopic spring; 19. Dust removal net; 20. Straightening rod. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application. The present application is further described in detail below in combination with the drawings in the specification.

[0038] Reference Figure 1 and Figure 2The embodiment of the present application provides an automatic dispensing device for a semiconductor production line, including an operating table 1, two first linear motors 2 are symmetrically connected to the top of the operating table 1, the mover seats of the two first linear motors 2 are connected to electric push rods 3, the tops of the two electric push rods 3 are commonly connected to a second linear motor 4, the mover seat of the second linear motor 4 is provided with a dispensing actuator, the dispensing actuator includes a passive frame 5 fixedly connected to the mover seat of the second linear motor 4, the passive frame 5 is respectively connected to a dispensing gun 6 and a negative pressure suction structure that can perform negative pressure absorption treatment on the gas emitted by the dispensing gun 6 when dispensing. When the automatic dispensing device for a semiconductor production line performs dispensing operation on semiconductor chips through the dispensing actuator, the negative pressure suction structure in the dispensing actuator can continuously absorb and capture the waste gas generated by the semiconductor chips during the dispensing process, effectively purifying the production environment of the semiconductor chips and reducing the degree of harm to the workers caused by the waste gas generated during the dispensing process. The first linear motor 2 and the second linear motor 4 are used to adjust the position of the glue gun 6 in the width and length directions of the operating table 1 respectively, so that the multi-dimensional position of the glue gun 6 on the X and Y axes can be adjusted when glue is being dispensed on the semiconductor chip, and the glue gun 6 can be accurately adjusted to the position to be glued when glue is being dispensed on the semiconductor chip.

[0039] Reference Figure 2 The embodiment of the present application provides an automatic dispensing device for a semiconductor production line. The negative pressure suction structure includes a processing cylinder 7 fixedly connected to a passive frame 5. The interior of the processing cylinder 7 is connected to a bearing ring 10. An embedded cylinder seat 11 with a porous bottom structure is also placed inside the processing cylinder 7. The interior of the embedded cylinder seat 11 is filled with an activated carbon particle layer 12. A blocking net 13 is connected to the top opening of the embedded cylinder seat 11. The inner diameter of the mesh of the blocking net 13 is smaller than the particle size of the activated carbon particles in the activated carbon particle layer 12. The embedded cylinder seat The outer periphery of 11 is sleeved and fixed with a sealing ring for sealing the gap between the side wall of the embedded cylinder seat 11 and the side wall of the inner cavity of the processing cylinder 7. The top opening of the processing cylinder 7 is connected with an annular sealing gasket 16. The top opening of the processing cylinder 7 is also threadedly covered with a top cover 8. The top of the top cover 8 is connected with a vacuum pump 9. The top wall of the inner cavity of the top cover 8 is connected with a limit ring 15. The bottom of the processing cylinder 7 is also provided with a one-way check structure for preventing the gas flowing into the processing cylinder 7 from flowing back to the atmosphere again when the vacuum pump 9 is turned off. The input end of the vacuum pump 9 extends into the inner cavity of the top cover 8. When the top cover 8 is tightened and covered on the top opening of the processing cylinder 7, the bottom end of the limit ring 15 rests on the top surface of the retaining net 13. After unscrewing the top cover 8 from the opening at the end of the treatment cylinder 7, take out the embedded cylinder seat 11 from the inner cavity of the treatment cylinder 7, and then remove the retaining net 13 from the top opening of the embedded cylinder seat 11, so as to facilitate the staff to regularly replace the activated carbon particle layer 12.

[0040] Reference Figure 2 and Figure 3 The embodiment of the present application provides an automatic dispensing device for a semiconductor production line. The one-way check structure includes an inner fixed frame and a dust removal net 19. A straightening rod 20 is inserted through the inner fixed frame. The bottom end of the straightening rod 20 is connected to a valve piston 17. The outer periphery of the straightening rod 20 is sleeved with a telescopic spring 18 connected between the fixed frame and the valve piston 17. A fluid cavity adapted to the fixed frame is provided on the bottom wall of the inner cavity of the processing cylinder 7. A sealing groove adapted to the valve piston 17 is provided on the bottom wall of the fluid cavity. An inflow hole is provided through the bottom wall of the sealing groove, and the bottom end of the inflow hole passes through the bottom of the processing cylinder 7 and is connected to the atmosphere. The fixed frame is connected to the fluid cavity, the valve piston 17 is sealingly and slidably connected to the inside of the sealing groove, and the dust removal net 19 is fixedly connected to the bottom of the processing cylinder 7 and covers the bottom opening of the inflow hole. Under the negative pressure suction of the vacuum pump 9, the waste gas generated during the dispensing process continuously flows into the interior of the treatment cylinder 7 in the negative pressure suction structure through the inflow hole, and then the organic harmful substances in the waste gas are adsorbed by the activated carbon particle layer 12, thereby achieving adsorption, purification and filtration of the waste gas. The gas purified and filtered by the activated carbon particle layer 12 is then discharged by the vacuum pump 9 into the production environment of the semiconductor chip, thereby effectively purifying the production environment of the semiconductor chip and reducing the degree of harm to the workers caused by the waste gas generated during the dispensing process. When the vacuum pump 9 is turned off, under the elastic force of the telescopic spring 18 in the one-way check structure, the valve piston 17 quickly moves into the sealing groove and prevents the waste gas that has entered the inner cavity of the treatment cylinder 7 from flowing back through the inflow hole to the production environment of the semiconductor chip again.

Claims

1. An automatic dispensing device for a semiconductor production line, characterized by: It comprises an operating table (1), wherein two first linear motors (2) are symmetrically connected to the top of the operating table (1), and electric push rods (3) are connected to the mover seats of the two first linear motors (2); The top ends of the two electric push rods (3) are commonly connected to a second linear motor (4), and a dispensing actuator is provided on a mover seat of the second linear motor (4); The glue dispensing actuator comprises a passive frame (5) fixedly connected to a mover seat of a second linear motor (4), the passive frame (5) being respectively connected to a glue dispensing gun (6) and a negative pressure suction structure capable of performing negative pressure absorption treatment on gas emitted by the glue dispensing gun (6) when dispensing glue.

2. The automatic dispensing device for semiconductor production line according to claim 1, characterized in that: The negative pressure suction structure comprises a processing cylinder (7) fixedly connected to a passive frame (5), and a bearing ring (10) is connected inside the processing cylinder (7); An embedded cylinder seat (11) having a porous bottom structure is also placed inside the treatment cylinder (7), the interior of the embedded cylinder seat (11) is filled with an activated carbon particle layer (12), a blocking net (13) is connected to the top opening of the embedded cylinder seat (11), and a sealing ring is sleeved and fixed on the outer periphery of the embedded cylinder seat (11) for sealing the gap between the side wall of the embedded cylinder seat (11) and the side wall of the inner cavity of the treatment cylinder (7); An annular sealing gasket (16) is connected to the top opening of the processing cylinder (7), and a top cover (8) is also threadedly closed on the top opening of the processing cylinder (7), and a vacuum pump (9) is connected to the top of the top cover (8); A limit ring (15) is connected to the top wall of the inner cavity of the top cover (8); The bottom of the processing cylinder (7) is also provided with a one-way check structure for preventing the gas flowing into the processing cylinder (7) from flowing back into the atmosphere again when the vacuum pump (9) is turned off.

3. The automatic dispensing device for semiconductor production line according to claim 2, characterized in that: The input end of the vacuum pump (9) extends into the inner cavity of the top cover (8).

4. The automatic dispensing device for semiconductor production line according to claim 2, characterized in that: When the top cover (8) is screwed on and covers the top opening of the treatment cylinder (7), the bottom end of the limiting ring (15) abuts against the top surface of the retaining net (13).

5. The automatic dispensing device for semiconductor production line according to claim 2, characterized in that: The one-way non-return structure comprises an inner fixing frame and a dust removal net (19), and a straightening rod (20) is inserted through the inner fixing frame; The bottom end of the straightening rod (20) is connected to the valve piston (17), and the outer periphery of the straightening rod (20) is sleeved with a telescopic spring (18) connected between the fixing frame and the valve piston (17).

6. The automatic dispensing device for semiconductor production line according to claim 5, characterized in that: A fluid cavity adapted to the fixing frame is provided on the inner bottom wall of the treatment cylinder (7), and a sealing groove adapted to the valve piston (17) is provided on the inner bottom wall of the fluid cavity; An inflow hole is formed through the bottom wall of the sealing tank body, and the bottom end of the inflow hole penetrates the bottom of the processing cylinder (7) and is connected to the atmosphere.

7. The automatic dispensing device for semiconductor production line according to claim 6, characterized in that: The fixing frame is connected to the fluid cavity; The valve piston (17) is sealingly and slidably connected to the inside of the sealing groove; The dust removal net (19) is fixedly connected to the bottom of the processing cylinder (7) and covers the bottom opening of the inflow hole.

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