Semiconductor carrier plate automatic measuring machine with image alignment function

Abstract

The utility model relates to the technical field of measuring machines, in particular to a semiconductor carrier plate automatic measuring machine with an image alignment function, which comprises a machine body, a fixing plate and a first screw rod, one side of the machine body is connected with a support frame in a welding manner, one side of the support frame is connected with a first motor through threads, the first motor is started through an external control terminal, and the first screw rod is connected with the fixing plate. The output end of the first motor drives the first lead screw to rotate, the rotation of the first lead screw drives the scraper to move, and the scraper is provided with the fan, so that when the semiconductor carrier plate is measured, dust on the semiconductor carrier plate is cleaned up, data measured by the semiconductor carrier plate is more accurate, and the measurement accuracy of the semiconductor carrier plate is improved. The qualified semiconductor carrier plates are pushed to the conveying belt through the scraper plate, and the conveying belt is driven to enable the qualified semiconductor carrier plates to go to the next step through rotation of the conveying shaft, so that stacking of the qualified semiconductor carrier plates together is reduced, damage to the semiconductor carrier plates is reduced, and the quality of the semiconductor carrier plates is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of measuring machines, in particular to a semiconductor carrier automatic measuring machine with an image alignment function. Background Art

[0002] Semiconductor substrate, Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, the support of electronic components, and the carrier for the electrical connection of electronic components. Because it is made by electronic printing, it is called "printed" circuit board. When the semiconductor substrate is completed, it needs to be tested by a measuring machine.

[0003] First, during the inspection process, workers will stack the qualified semiconductor substrates aside for easy transportation. The existing equipment cannot quickly transport qualified products to the next stage, so workers may bump into the products while working, causing damage to the products and reducing product quality.

[0004] Second, during the use of the device, the existing device requires manual loading and unloading of materials, which causes the workers to consume a lot of physical strength, thereby reducing the practicality of the device. Utility Model Content

[0005] The purpose of the present invention is to provide a semiconductor substrate automatic measuring machine with an image alignment function to solve the problems raised in the above-mentioned background technology.

[0006] In order to solve the above technical problems, the utility model provides the following technical solutions: A semiconductor carrier automatic measuring machine with image alignment function, including a machine body, a fixed plate, and a first screw rod. One side of the machine body is connected to a support frame by welding, one side of the support frame is connected to a first motor by threading, and the output end of the first motor is connected to the first screw rod by threading. A groove is provided inside the support frame, and the first screw rod is movably embedded in the groove. A scraper is provided on the outside of the first screw rod, and the inside of the scraper is connected to the first screw rod by threading. The fixed plate is provided below the scraper, and the bottom of the fixed plate is connected to a hydraulic rod by welding. The bottom of the hydraulic rod is connected to the machine body by welding. A groove is provided inside the machine body, and a push plate is movably embedded in the groove. The inside of the push plate is connected to one end of a second screw rod by threading, and the other end of the second screw rod is connected to the output end of the second motor by threading. The second screw rod is movably embedded in the groove inside the machine body, and a groove is provided on the side of the push plate away from the second screw rod, and one end of the fixed column is movably embedded in the groove, and a groove is provided on the side of the machine body away from the push plate.

[0007] Preferably, there are multiple hydraulic rods, which are distributed in a symmetrical manner, and the fixing column is movably embedded in a groove inside the body.

[0008] Preferably, the top of the support frame is connected to the imaging body via threads, and the imaging body is connected to the imaging head via threads.

[0009] Preferably, a control box is connected to the bottom of the machine body by welding, and a button is provided on one side of the control box.

[0010] Preferably, the side of the machine body away from the scraper is connected to the conveying frame by welding, and the interior of the conveying frame is connected to the conveying shaft by threads.

[0011] Preferably, one side of the transmission shaft is connected to the output end of the third motor via a thread, and a transmission belt is provided on the outer side of the transmission shaft.

[0012] Preferably, a side of the scraper close to the conveying frame is connected to the fan by welding, and a side of the scraper away from the fan is provided with an air inlet.

[0013] Compared with the prior art, the beneficial effects achieved by the utility model are:

[0014] First, the utility model starts the first motor through an external control terminal, and the output end of the first motor drives the rotation of the first screw rod, and the rotation of the first screw rod drives the movement of the scraper. The scraper is provided with a fan, so that when the semiconductor carrier is measured, the dust on the semiconductor carrier is cleaned, so that the data measured by the semiconductor carrier is more accurate, and the qualified semiconductor carrier is pushed to the conveyor belt by the scraper. Through the rotation of the conveying shaft, the conveyor belt is driven to let the qualified semiconductor carrier go to the next step, which reduces the stacking of qualified semiconductor carriers, reduces the damage of the semiconductor carrier, and improves the quality of the semiconductor carrier.

[0015] Second, the utility model is provided with a hydraulic rod through the fixed plate. When the semiconductor carrier board is unqualified, the second motor is turned on through the external control terminal. The output end of the second motor drives the rotation of the second screw rod, and the rotation of the screw rod drives the movement of the push plate. A groove is provided on one side of the machine body, so that the unqualified semiconductor carrier board can be discharged through the groove, which reduces the process of workers taking the board and improves the production efficiency and the practicability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional diagram of the utility model;

[0017] Figure 2 This is a schematic diagram of the vertical planer structure of the utility model;

[0018] Figure 3 This is a schematic diagram of the push plate structure of the utility model;

[0019] Figure 4 The schematic diagram of the conveyor belt structure of the utility model is as follows

[0020] Among them: 1. Machine body; 2. Control box; 3. Button; 4. Support frame; 5. Image body; 6. Image head; 7. Fixed plate; 8. First screw rod; 9. Scraper; 10. Conveyor belt; 11. Fan; 12. First motor; 13. Second screw rod; 14. Conveyor frame; 15. Conveyor shaft; 16. Second motor; 17. Fixed column; 18. Push plate; 19. Hydraulic rod; 20. Third motor; 21. Air inlet. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-4A semiconductor carrier automatic measuring machine with image alignment function includes a machine body 1, a fixing plate 7, a first screw rod 8, one side of the machine body 1 is connected to a support frame 4 by welding, one side of the support frame 4 is connected to a first motor 12 by threading, the output end of the first motor 12 is connected to the first screw rod 8 by threading, a groove is provided inside the support frame 4, the first screw rod 8 is movably embedded in the groove, a scraper 9 is provided on the outside of the first screw rod 8, the inside of the scraper 9 is connected to the first screw rod 8 by threading, a fixing plate 7 is provided below the scraper 9, the bottom of the fixing plate 7 is connected to a hydraulic rod 19 by welding, the bottom of the hydraulic rod 19 is connected to the machine body 1 by welding, a groove is provided inside the machine body 1, a push plate 18 is movably embedded in the groove, the inside of the push plate 18 is connected to one end of a second screw rod 13 by threading, the other end of the second screw rod 13 is connected to the output end of a second motor 16 by threading, the first The second screw rod 13 is movably engaged in the groove inside the body 1, and a groove is provided on the side of the push plate 18 away from the second screw rod 13, and one end of the fixed column 17 is movably engaged in the groove. A groove is provided on the side of the body 1 away from the push plate 18. The first motor 12 is turned on by an external control terminal, and the output end of the first motor 12 drives the rotation of the first screw rod 8. The rotation of the first screw rod 8 drives the movement of the scraper 9. The scraper 9 is provided with a fan 11, so that when the semiconductor carrier is measured, the dust on the semiconductor carrier can be cleaned, so that the data measured by the semiconductor carrier is more accurate. The qualified semiconductor carrier is pushed to the conveyor belt 10 by the scraper plate 9, and the rotation of the conveying shaft 15 drives the conveyor belt 10 to let the qualified semiconductor carrier go to the next step, which reduces the stacking of qualified semiconductor carriers, reduces the damage of the semiconductor carrier, and improves the quality of the semiconductor carrier.

[0023] Specifically, there are multiple hydraulic rods 19 , which are distributed in a symmetrical manner, and the fixing column 17 is movably embedded in a groove inside the body 1 .

[0024] Through the above technical solution, the lifting and lowering of the hydraulic rod 19 can drive the fixing plate 7 to lift up and down, and the fixing column 17 plays a role of fixing and supporting the push plate 18.

[0025] Specifically, the top of the support frame 4 is connected to the imaging body 5 via threads, and the imaging body 5 is connected to the imaging head 6 via threads.

[0026] Through the above technical solution, the imaging body 5 is provided with an imaging head 6, which can automatically align the product, and then detect the product after the automatic alignment.

[0027] Specifically, the lower side of the machine body 1 is connected to the control box 2 by welding, and a button 3 is provided on one side of the control box 2 .

[0028] Through the above technical solution, a control box 2 is provided under the body 1, and the control box 2 is provided with a button 3, and the device can be turned on by the button 3 to detect the product.

[0029] Specifically, the side of the machine body 1 away from the scraper 9 is connected to the conveying frame 14 by welding, and the interior of the conveying frame 14 is connected to the conveying shaft 15 by threads.

[0030] Through the above technical solution, the conveying frame 14 supports the conveying shaft 15 , and the conveying shaft 15 can rotate in the conveying frame 14 , and the conveying shaft 15 can drive the conveyor belt 10 to rotate.

[0031] Specifically, one side of the transmission shaft 15 is connected to the output end of the third motor 20 through a thread, and a conveyor belt 10 is provided on the outer side of the transmission shaft 15 .

[0032] Through the above technical solution, the output end of the third motor 20 can drive the rotation of the transmission shaft 15, and the conveyor belt 10 can drive the movement of the product.

[0033] Specifically, a side of the scraper 9 close to the conveying frame 14 is connected to the fan 11 by welding, and a side of the scraper 9 away from the fan 11 is provided with an air inlet 21 .

[0034] Through the above technical solution, the fan 11 sucks air through the air inlet 21, and the rotation of the fan discharges the wind, and the dust on the product is cleaned by the wind.

[0035] When in use, the new type starts the first motor 12 through an external control terminal, and the output end of the first motor 12 drives the rotation of the first screw rod 8, and the rotation of the first screw rod 8 drives the movement of the scraper 9. The scraper 9 is provided with a fan 11, so that when the semiconductor carrier is measured, the dust of the semiconductor carrier can be cleaned up, so that the data measured by the semiconductor carrier is more accurate, and the qualified semiconductor carrier is pushed to the conveyor belt 10 by the scraper 9, and the conveyor shaft 15 is rotated to drive the conveyor belt 10 to let the qualified semiconductor carrier go to the next step, reducing the stacking of qualified semiconductor carriers, reducing the damage of semiconductor carriers, and improving the quality of semiconductor carriers. A hydraulic rod 19 is provided through the fixed plate 7. When the semiconductor carrier is unqualified, the second motor 16 is started through the external control terminal, and the output end of the second motor 16 drives the rotation of the second screw rod 13, and the movement of the push plate 18 is driven by the rotation of the second screw rod 13. A groove is provided on one side of the body 1, so that the unqualified semiconductor carrier is discharged through the groove, reducing the process of workers taking, and improving the production efficiency and the practicality of the device.

[0036] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0037] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A semiconductor substrate automatic measuring machine with an image alignment function, comprising a machine body (1), a fixing plate (7), and a first screw rod (8), characterized in that: One side of the machine body (1) is connected to a support frame (4) by welding, one side of the support frame (4) is connected to a first motor (12) by threading, the output end of the first motor (12) is connected to the first screw rod (8) by threading, a groove is provided inside the support frame (4), the first screw rod (8) is movably engaged in the groove, a scraper (9) is provided on the outside of the first screw rod (8), the inside of the scraper (9) is connected to the first screw rod (8) by threading, the fixing plate (7) is provided below the scraper (9), the fixing plate (7) is connected to a hydraulic rod (19) by welding, and the hydraulic The lower part of the pressure rod (19) is connected to the machine body (1) by welding, and a groove is provided inside the machine body (1), and the push plate (18) is movably engaged in the groove. The inside of the push plate (18) is connected to one end of the second screw rod (13) by a thread, and the other end of the second screw rod (13) is connected to the output end of the second motor (16) by a thread. The second screw rod (13) is movably engaged in the groove inside the machine body (1), and a groove is provided on the side of the push plate (18) away from the second screw rod (13), and one end of the fixing column (17) is movably engaged in the groove. A groove is provided on the side of the machine body (1) away from the push plate (18).

2. The semiconductor substrate automatic measuring machine with image alignment function according to claim 1, characterized in that: There are multiple hydraulic rods (19) which are distributed in a symmetrical manner, and the fixed column (17) is movably embedded in a groove inside the machine body (1).

3. The semiconductor substrate automatic measuring machine with image alignment function according to claim 1, characterized in that: The top of the support frame (4) is connected to an imaging body (5) via threads, and the imaging body (5) is connected to an imaging head (6) via threads.

4. The semiconductor substrate automatic measuring machine with image alignment function according to claim 1, characterized in that: The lower part of the machine body (1) is connected to a control box (2) by welding, and a button (3) is provided on one side of the control box (2).

5. The semiconductor substrate automatic measuring machine with image alignment function according to claim 1, characterized in that: The side of the machine body (1) away from the scraper (9) is connected to a conveying frame (14) by welding, and the interior of the conveying frame (14) is connected to a conveying shaft (15) by threads.

6. The semiconductor substrate automatic measuring machine with image alignment function according to claim 5, characterized in that: One side of the transmission shaft (15) is connected to the output end of the third motor (20) via a thread, and a transmission belt (10) is provided on the outer side of the transmission shaft (15).

7. The semiconductor substrate automatic measuring machine with image alignment function according to claim 5, characterized in that: The side of the scraper (9) close to the conveying frame (14) is connected to the fan (11) by welding, and the side of the scraper (9) away from the fan (11) is provided with an air inlet (21).

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