Polycrystalline silicon chip reclaimed material cutting device

Abstract

A polycrystalline silicon chip recycled material cutting device comprises a diamond wire seat arranged on a cutting device body, a lower fixed seat is arranged on the top face of the diamond wire seat, an upper movable seat is arranged on the lower fixed seat, a wire coil seat is arranged on the upper movable seat, a wire coil is arranged on the wire coil seat, and a diamond wire used for cutting is wound around the wire coil. A plurality of diamond wire seats are arranged on the periphery of the top of the cutting device body, diamond wires are arranged among the diamond wire seats, and silicon wafer recycled materials are cut. By the adoption of the structure, in the cutting machining process, multi-wire diamond wire cutting is relied on, the efficiency in the operation process is improved, and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of polycrystalline silicon slice recycling, in particular to a polycrystalline silicon slice recycling material cutting device. Background Art

[0002] Recycled materials are an important part that needs to be reused in the production process of polysilicon wafers. Currently, recycled materials are mainly cut by high-speed sawing machines, which have low efficiency, high labor costs and high maintenance costs. Summary of the invention

[0003] The technical problem to be solved by the utility model is to provide a polysilicon slice recycling material cutting device, which relies on multi-wire diamond wire cutting during the truncation process, which not only improves the efficiency of the operation process, but also reduces the production cost.

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is: a polycrystalline silicon wafer recycling material cutting device, comprising a diamond wire seat arranged on the cutting device body, a lower fixed seat is arranged on the top surface of the diamond wire seat, an upper movable seat is arranged on the lower fixed seat, a wire reel seat is arranged on the upper movable seat, a wire reel is arranged on the wire reel seat, and a diamond wire for cutting is arranged around the wire reel;

[0005] A plurality of diamond wire seats are arranged around the top of the cutting device body, and diamond wires are arranged between the plurality of diamond wire seats to cut the silicon wafer recycling material.

[0006] In the preferred solution, the diamond wire seat is a U-shaped plate structure, a slot is provided on the cutting device body, the U-shaped diamond wire seat slot part is arranged on the cutting device body, and fixing bolts are passed through the vertical parts on both sides of the diamond wire seat, and the fixing bolts are arranged through the slot.

[0007] In a preferred solution, the lower fixed seat and the upper movable seat are connected by a movable connection, and the upper movable seat can rotate around the central axis between it and the lower fixed seat;

[0008] A connecting side groove is provided on the side wall of the inner courtyard surface of the lower fixed seat, and the connecting side groove is used to connect the upper movable seat. A plurality of limiting grooves are also provided on the top surface of the lower fixed seat. A vertical movable seat limiting mechanism is passed through the upper movable seat. The movable seat limiting mechanism and the limiting groove are plugged and matched to realize the fixation of the upper movable seat on the lower fixed seat.

[0009] In a preferred solution, the movable seat limiting mechanism includes a limiting rod, and the lower end of the limiting rod passes through the upper movable seat and is inserted into the limiting groove.

[0010] In a preferred solution, at least two vertical rods are provided on the top surface of the upper movable seat, the upper ends of the plurality of vertical rods are fixed to the same ring plate, and the limit rod passes through the circular hole in the center of the ring plate;

[0011] A circular plate is fixed on the limiting rod below the ring plate, a vertical rod is arranged through the circular plate, and a spring is sleeved on the vertical rod located above the circular plate.

[0012] The utility model provides a polysilicon wafer recycling material cutting device, which achieves the purpose of multiple diamond wire cutting by adopting the above-mentioned structure, effectively improves the cutting efficiency of polysilicon wafer recycling material and reduces production costs; in addition, the diamond wire seat can be rotated and adjusted relative to the device body to achieve the adjustment of the diamond wire routing direction relative to the device body, which can meet more cutting operation requirements on the one hand, and avoid the TTV phenomenon on the silicon wafer caused by the deviation of the diamond wire on the other hand. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0014] Figure 1 It is a front view structural schematic diagram of the utility model.

[0015] Figure 2 It is a side structural schematic diagram of the utility model.

[0016] Figure 3 It is a schematic diagram of the structure of the lower fixing seat of the utility model.

[0017] Figure 4 The utility model is a schematic diagram of a top view of the device structure in a wiring mode.

[0018] Figure 5 This is a schematic diagram of the top view of the device structure in another wiring mode of the utility model.

[0019] In the figure: cutting device body 1, slot 2, diamond wire seat 3, fixing bolt 4, lower fixing seat 5, connecting side groove 501, limiting groove 502, upper movable seat 6, movable seat limiting mechanism 7, wire reel seat 8, wire reel 9, limiting rod 10, round plate 11, vertical rod 12, ring plate 13, round hole 131, spring 14. DETAILED DESCRIPTION

[0020] like Figure 1-3 A polycrystalline silicon wafer recycling material cutting device includes a diamond wire seat 3 arranged on a cutting device body 1, a lower fixed seat 5 is arranged on the top surface of the diamond wire seat 3, an upper movable seat 6 is arranged on the lower fixed seat 5, a wire reel seat 8 is arranged on the upper movable seat 6, a wire reel 9 is arranged on the wire reel seat 8, and a diamond wire for cutting is arranged around the wire reel 9;

[0021] A plurality of diamond wire seats 3 are arranged around the top of the cutting device body 1 , and diamond wires are arranged between the plurality of diamond wire seats 3 to cut the silicon wafer recycling material.

[0022] In the preferred embodiment, the diamond wire seat 3 is a U-shaped plate structure, a slot 2 is provided on the cutting device body 1, the slot part of the U-shaped diamond wire seat 3 is arranged on the cutting device body 1, and fixing bolts 4 are passed through the vertical parts on both sides of the diamond wire seat 3, and the fixing bolts 4 are arranged through the slot 2.

[0023] In a preferred solution, the lower fixed seat 5 and the upper movable seat 6 are connected by a movable connection, and the upper movable seat 6 can rotate around the central axis between it and the lower fixed seat 5;

[0024] A connecting side groove 501 is provided on the inner side wall of the lower fixed seat 5, and the connecting side groove 501 is used to connect the upper movable seat 6. A plurality of limiting grooves 502 are also provided on the top surface of the lower fixed seat 5. A vertical movable seat limiting mechanism 7 is passed through the upper movable seat 6. The movable seat limiting mechanism 7 is plugged and matched with the limiting groove 502 to fix the upper movable seat 6 on the lower fixed seat 5.

[0025] In a preferred solution, the movable seat limiting mechanism 7 includes a limiting rod 10 , and the lower end of the limiting rod 10 passes through the upper movable seat 6 and is inserted into the limiting groove 502 .

[0026] In a preferred embodiment, at least two vertical rods 12 are provided on the top surface of the upper movable seat 6, and the upper ends of the plurality of vertical rods 12 are fixed on the same ring plate 13, and the limit rod 10 passes through the circular hole 131 in the center of the ring plate 13;

[0027] A circular plate 11 is fixed on the limiting rod 10 below the ring plate 13 , a vertical rod 12 is arranged through the circular plate 11 , and a spring 14 is sleeved on the vertical rod 12 located above the circular plate 11 .

[0028] The invention discloses a polysilicon wafer recycling material cutting device, such as Figure 1-3 As shown, the diamond wire is fixed by the wire drum 9. In this state, the limit rod 10 is pulled to release the limit of the lower fixed seat 5 and the upper movable seat 6, and then the diamond wire seat 3 is rotated to adjust the angle of the diamond wire seat 2, which can be achieved as follows: Figure 2 , 3 Switching between states facilitates the adjustment of the diamond wire routing to meet the routing direction requirements of different cutting operations. Compared with conventional cutting machines or sawing machines, it can also achieve the purpose of cutting multiple silicon wafers at a time, effectively increasing the efficiency and quality of cutting operations.

Claims

1. A polysilicon wafer recycling material cutting device, characterized in that: It comprises a diamond wire seat (3) arranged on a cutting device body (1), wherein a lower fixed seat (5) is arranged on the top surface of the diamond wire seat (3), an upper movable seat (6) is arranged on the lower fixed seat (5), a wire reel seat (8) is arranged on the upper movable seat (6), a wire reel (9) is arranged on the wire reel seat (8), and a diamond wire for cutting is arranged around the wire reel (9); A plurality of diamond wire seats (3) are arranged around the top of the cutting device body (1), and diamond wires are arranged between the plurality of diamond wire seats (3) to cut the silicon wafer recycling material.

2. The device for cutting recycled polysilicon wafers according to claim 1, characterized in that: The diamond wire seat (3) is a U-shaped plate structure. A slot (2) is provided on the cutting device body (1). The slot part of the U-shaped diamond wire seat (3) is arranged on the cutting device body (1). Fixing bolts (4) are provided on the vertical parts on both sides of the diamond wire seat (3). The fixing bolts (4) are arranged through the slot (2).

3. The polysilicon wafer recycling material cutting device according to claim 1, characterized in that: The lower fixed seat (5) and the upper movable seat (6) are connected in a movable manner, and the upper movable seat (6) can rotate around the central axis between the upper movable seat (6) and the lower fixed seat (5); A connecting side groove (501) is provided on the inner side wall of the lower fixed seat (5), and the connecting side groove (501) is used to connect the upper movable seat (6). A plurality of limiting grooves (502) are also provided on the top surface of the lower fixed seat (5). A vertical movable seat limiting mechanism (7) is provided on the upper movable seat (6). The movable seat limiting mechanism (7) and the limiting groove (502) are plugged and matched to realize the fixing of the upper movable seat (6) on the lower fixed seat (5).

4. The polysilicon wafer recycling material cutting device according to claim 3, characterized in that: The movable seat limiting mechanism (7) comprises a limiting rod (10), the lower end of the limiting rod (10) passes through the upper movable seat (6) and is inserted into the limiting groove (502).

5. The polycrystalline silicon wafer recycling material cutting device according to claim 4, characterized in that: At least two vertical rods (12) are provided on the top surface of the upper movable seat (6), the upper ends of the plurality of vertical rods (12) are fixed on the same ring plate (13), and the limiting rod (10) passes through a circular hole (131) at the center of the ring plate (13); A circular plate (11) is fixed to the limiting rod (10) below the ring plate (13), a vertical rod (12) is arranged through the circular plate (11), and a spring (14) is sleeved on the vertical rod (12) located above the circular plate (11).

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