Semiconductor laser head damping device

Abstract

A semiconductor laser head damping device comprises a base, a damper, a laser head fixing seat, a semiconductor laser head and a tray, the base is arranged on the tray, the tray is arranged in a cabinet, the laser head fixing seat is arranged on the base, the semiconductor laser head is installed on the laser head fixing seat, and the damper is arranged on the base. The vibration absorbers are connected with the base and the laser head fixing seat, the vibration absorbers comprise the first vibration absorber and the second vibration absorber, the first vibration absorber is connected with the base and the laser head fixing seat in the vertical direction, on one hand, the first vibration absorber and the second vibration absorber are arranged, vibration conduction can be reduced and absorbed, and measurement errors caused by vibration are reduced; and on the other hand, front and rear support arms and left and right support arms are arranged, so that the device can be adaptively mounted in cabinets with various sizes.

Description

Technical Field

[0001] The utility model relates to the technical field of communication and computer testing, in particular to a semiconductor laser head vibration reduction device. Background Art

[0002] Semiconductor laser heads are widely used in laboratories and industrial production in the fields of communications, military industry, aerospace, and vehicle engineering. Usually, semiconductor laser heads are directly installed inside the test cabinet, and the test cabinet often needs to cope with a variety of environments, including outdoors. The chassis in the field of communications and computer testing usually does not have a shock-absorbing device. During the test, the vibration caused by bumps or resonance is transmitted to the semiconductor laser head part, which will affect the test results. In order to overcome the above problems, the utility model connects the left and right sides of the base and the laser fixing seat through shock absorbers, so that the cabinet can effectively absorb and reduce jitter and resonance when it vibrates and bumps, reduce the impact of vibration and resonance on the test results of the semiconductor laser head during the test, and greatly improve the accuracy of the test data and work efficiency. Summary of the invention

[0003] The utility model provides a semiconductor laser head vibration reduction device, which solves the problem in the prior art that vibration affects the test results during the test or detection process. The utility model arranges a vibration reduction device between a base and a laser fixing seat to reduce and absorb vibrations in multiple directions.

[0004] To achieve the above-mentioned purpose, the utility model provides a semiconductor laser head vibration reduction device, comprising: a base, a vibration damper, a laser head fixing seat, a semiconductor laser head and a tray, the base is installed on the tray, the base is arranged on the tray, the tray is arranged in a cabinet, a laser fixing seat is arranged on the base, a semiconductor laser head is installed on the laser head fixing seat, and the vibration damper connects the base and the laser head fixing seat.

[0005] Furthermore, the shock absorber includes a first shock absorber and a second shock absorber.

[0006] Furthermore, the first vibration damper is vertically connected to the base and the laser head fixing seat.

[0007] Furthermore, the second vibration damper is horizontally connected to the base and the laser head fixing seat.

[0008] Furthermore, the number of the first shock absorber and the second shock absorber is two or more.

[0009] Furthermore, the first vibration dampers are symmetrically distributed on the left and right sides of the base and the laser head fixing seat, and the second vibration dampers are symmetrically distributed on the left and right sides of the base and the laser head fixing seat.

[0010] Furthermore, the first vibration dampers are uniformly distributed on both sides of the base and the laser head fixing base.

[0011] Furthermore, the first shock absorber and the second shock absorber are elastic elements.

[0012] Furthermore, the first vibration absorber and the second vibration absorber are made of silicone or rubber.

[0013] Furthermore, the first shock absorber and the second shock absorber are cylindrical or rectangular in shape.

[0014] Furthermore, the first vibration damper and the second vibration damper are connected to the base and the laser head fixing seat by means of clamping or screw fastening.

[0015] Furthermore, the first shock absorber and the second shock absorber are symmetrically distributed on the left and right sides of the base and the laser head fixing seat.

[0016] Furthermore, groove tracks, front and rear arms and left and right arms are arranged on the side of the tray, and the front and rear arms and left and right arms are convex groove tracks, and the convex groove tracks of the front and rear arms and left and right arms slide in the groove tracks.

[0017] Furthermore, the groove rails may be replaced by slide rails, and the slide rails of the front and rear support arms and the left and right support arms may be replaced by support arms with grooves.

[0018] Furthermore, the number of the front and rear supporting arms is two, and the number of the left and right supporting arms is two.

[0019] Furthermore, the front and rear supporting arms and the left and right supporting arms are in the same horizontal plane, but in different directions.

[0020] Furthermore, the front and rear supporting arms and the left and right supporting arms enable the semiconductor laser head vibration reduction device to adapt to cabinets of various sizes and specifications.

[0021] Furthermore, the groove rail, the front and rear support arms, and the left and right support arms are also provided with locking bolts.

[0022] Furthermore, holes of various shapes are arranged on the tray.

[0023] Furthermore, the holes provided on the tray are conducive to heat dissipation of the semiconductor laser head.

[0024] Furthermore, the holes on the tray are used to install multiple devices of different sizes.

[0025] Furthermore, the front and rear support arms and the left and right support arms are fixed to the columns of the cabinet by fastening screws.

[0026] The beneficial effects of the present invention are as follows: (1) Compared with the prior art, the present invention provides a semiconductor laser head vibration reduction device with multiple horizontal and vertical vibration reduction devices on the left and right sides of the base and the laser fixing seat, which can reduce and absorb vibration conduction and reduce measurement errors caused by vibration; (2) The present invention provides a groove track and a support arm on the tray, which facilitates the device to be installed in cabinets of various sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic diagram of the structure of a semiconductor laser head vibration reduction device installed in a cabinet according to the utility model;

[0028] Figure 2 A schematic diagram of a semiconductor laser head vibration reduction device provided by an embodiment of the utility model;

[0029] Figure 3 A schematic diagram of two semiconductor laser head vibration reduction devices provided by an embodiment of the utility model installed in a cabinet;

[0030] Figure 4 A schematic diagram of the internal structure of a semiconductor laser head vibration reduction device provided by an embodiment of the utility model;

[0031] Figure 5 This is a front view of a semiconductor laser head vibration reduction device of the utility model;

[0032] The reference numerals include: base-1, vibration absorber-2, second vibration absorber-22, laser head fixing base-3, semiconductor laser head-4, and tray-5, groove rail-51, front and rear support arms-52, left and right support arms-53 and cabinet-6. DETAILED DESCRIPTION

[0033] In order to make the purpose and advantages of the utility model more clearly understood, the utility model is further described below in conjunction with embodiments; it should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model.

[0034] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0035] It should be noted that, in the description of the present invention, terms such as "up", "down", "left", "right", "inside", and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is merely for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0036] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0037] See also Figure 1 , 2 As shown in Figure 3, a semiconductor laser head vibration reduction device comprises: a base 1, a vibration damper 2, a laser head fixing seat 3, a semiconductor laser head 4 and a tray 5, wherein the base 1 is arranged on the tray 5, and the tray 5 is arranged in the cabinet 6, the base 1 is provided with a laser fixing seat 3, the semiconductor laser head 4 is mounted on the laser head fixing seat 3, and the vibration damper 2 connects the base 1 and the laser head fixing seat 3. Among them, the vibration damper 2 comprises a first vibration damper 21 and a second vibration damper 22. The first vibration damper 21 connects the base 1 and the laser head fixing seat 3 in a vertical direction. The second vibration damper 22 connects the base 1 and the laser head fixing seat 3 in a horizontal direction, and the number of the first vibration damper 21 and the second vibration damper 22 is two or more, and further, the first vibration damper 21 is symmetrically distributed on the left and right sides of the base 1 and the laser head fixing seat 3, and the second vibration damper 22 is symmetrically distributed on the left and right sides of the base 1 and the laser head fixing seat 3.

[0038] In a specific implementation, two groups of laser semiconductor laser heads are arranged on the tray 5, and two groups of semiconductor laser head vibration reduction devices are arranged correspondingly. The first vibration reducer 21 and the second vibration reducer 22 are elastic elements, preferably vibration isolation pads or buffer rubber piers made of silicone or rubber, which can absorb vibration and reduce resonance, and further reduce the influence of vibration on the detection results of the semiconductor laser head. The side of the tray 5 is provided with a groove track 51, front and rear support arms 52 and left and right support arms 53. The front and rear support arms 52 and left and right support arms 53 are convex groove tracks, and the convex groove tracks of the front and rear support arms 52 and left and right support arms 53 slide in the groove track 51. Furthermore, fastening bolts are also arranged between the support arms and the groove track. After the front and rear support arms and left and right support arms are installed on the columns of the cabinet 6, the fastening bolts are tightened and locked; the groove track, front and rear support arms and left and right support arms are arranged on the tray, so that the device is suitable for cabinets of various sizes, and it is also more flexible and convenient when the device is installed; holes of various shapes are also arranged on the tray 5, which is convenient for installing various equipment and components on the tray 5, such as Figure 5As shown, two sets of semiconductor laser head vibration reduction devices are installed in the cabinet. The two sets of vibration reduction devices only need to be installed on the same tray, and the disassembly and installation are very quick; the front and rear support arms 52 and the left and right support arms 53 are fixed to the columns of the cabinet 6 by fastening screws. When the equipment needs to be adjusted in height and disassembled and assembled, the workload can be greatly reduced and the work efficiency can be improved.

[0039] See also Figure 4 , Figure 5 As shown, it is a schematic diagram of the installation of the base 1 and the laser fixing seat 3 of the utility model. In experiments or outdoor operations, vibration and jitter will affect the measurement results. In order to overcome the above problems, the device sets a first vibration damper 21 in the vertical direction and a second vibration damper 22 in the horizontal direction before the base 1 and the laser fixing seat 3, and the first vibration damper 21 is vertically arranged on the left and right sides of the base 1 and the laser fixing seat 3, and their positions are symmetrical and the number is the same. As shown in the figure, there are 8 first vibration dampers 21 in total, and the first vibration dampers 21 effectively reduce and absorb vibration and resonance in the vertical direction; the second vibration damper 22 is horizontally arranged on the left and right sides of the base 1 and the laser fixing seat 3, and their positions are symmetrical and the number is the same. As shown in the figure, there are 4 second vibration dampers 22 in total, and the second vibration damper 22 can effectively reduce and absorb vibration and resonance in the horizontal direction. Therefore, the device can effectively reduce and absorb vibration and resonance, reduce the influence of vibration on the test results of the semiconductor laser head, and improve the test accuracy.

[0040] For specific implementation, see Figure 1 and Figure 4 As shown, first, the external cavity laser semiconductor laser head is installed on the laser head fixing seat 3, and the base 1 and the laser head fixing seat 3 are connected through the vibration damper 2, that is, 8 first vibration dampers 21 are installed in the vertical direction, and one vibration damper 21 is symmetrically and evenly distributed on both sides of the base 1 and the laser head fixing seat 3, and 4 second vibration dampers 22 are installed horizontally, and the second vibration dampers 22 are symmetrically and evenly distributed on both sides of the base 1 and the laser head fixing seat 3, and the vibration damper 2 is installed; then the device is installed in a 19-inch chassis, and the front and rear support arms 52 and the left and right support arms 53 of the tray extend along the groove track 51, and the front and rear support arms 52 and the left and right support arms 53 are adjusted to a suitable width and length. Finally, the tray is fixed on the column in the cabinet to complete the installation. The external cavity laser semiconductor laser head is opened to measure the relevant data of the optical clock. The installation of the laser head of the utility model greatly reduces the influence of vibration on the measurement data, and ensures the accuracy of measurement and experiment. The device has a simple structure, easy adjustment and operation, convenient installation, and is suitable for various models of cabinets.

[0041] So far, the technical solution of the utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings, but it is easy for those skilled in the art to understand that the protection scope of the utility model is obviously not limited to these specific embodiments. Without departing from the principle of the utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the utility model.

[0042] The above description is only a preferred embodiment of the utility model and is not intended to limit the utility model; for those skilled in the art, the utility model may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A semiconductor laser head vibration reduction device, comprising: A base (1), a vibration damper (2), a laser head fixing seat (3), a semiconductor laser head (4) and a tray (5), characterized in that the base (1) is mounted on the tray (5), the tray (5) is arranged in a cabinet (6), the base (1) is provided with a laser head fixing seat (3), the semiconductor laser head (4) is mounted on the laser head fixing seat (3), and the vibration damper (2) connects the base (1) and the laser head fixing seat (3).

2. The semiconductor laser head vibration reduction device according to claim 1, characterized in that: The vibration damper (2) comprises a first vibration damper (21) and a second vibration damper (22).

3. The semiconductor laser head vibration reduction device according to claim 2, characterized in that: The first vibration damper (21) is vertically connected to the base (1) and the laser head fixing base (3).

4. The semiconductor laser head vibration reduction device according to claim 2, characterized in that: The second vibration damper (22) is connected to the base (1) and the laser head fixing seat (3) in the horizontal direction.

5. The semiconductor laser head vibration reduction device according to claim 2, characterized in that: The number of the first vibration absorber (21) and the second vibration absorber (22) is two or more.

6. The semiconductor laser head vibration reduction device according to claim 5, characterized in that: The first vibration dampers (21) are symmetrically distributed on the left and right sides of the base (1) and the laser head fixing base (3), and the second vibration dampers (22) are symmetrically distributed on the left and right sides of the base (1) and the laser head fixing base (3).

7. The semiconductor laser head vibration reduction device according to claim 2, characterized in that: The first vibration damper (21) and the second vibration damper (22) are elastic elements.

8. The semiconductor laser head vibration reduction device according to claim 1, characterized in that: A groove track (51), front and rear support arms (52) and left and right support arms (53) are arranged on the side of the tray (5); convex groove tracks are arranged on the front and rear support arms (52) and left and right support arms (53); and the convex groove tracks of the front and rear support arms (52) and left and right support arms (53) slide in the groove track (51).

9. The semiconductor laser head vibration reduction device according to claim 8, characterized in that: The tray (5) is also provided with holes of various shapes.

10. The semiconductor laser head vibration reduction device according to claim 8, characterized in that: The front and rear support arms (52) and the left and right support arms (53) are fixed to the columns of the cabinet (6) by means of fastening screws.

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