Vapor chamber

Abstract

The utility model belongs to the technical field of radiators, and discloses a vapor chamber which comprises a first shell and a second shell which are connected with each other. A containing cavity is formed between the first shell and the second shell and used for circulating a circulating medium, and heat is transferred through vapor-liquid phase change of the circulating medium. The second shell protrudes outwards to form the first protruding part, the outer wall of the first protruding part makes contact with a heat source, heat of the small-range heat source can be conducted to the second shell as soon as possible, and the heat conduction efficiency is improved. An inner connecting assembly is arranged on the inner wall of the first shell, a heat dissipation assembly is arranged in the first protruding part, one end of the heat dissipation assembly is connected with the inner wall of the protruding part, and the other end of the heat dissipation assembly abuts against the inner connecting assembly. The distance from the inner wall of the first protruding part to the inner wall of the first shell is reduced by arranging the inner connecting assembly, the flowing path of the circulating medium is reduced, the flow resistance of the circulating medium is reduced, and then the thermal performance of the vapor chamber is improved. And the height size of the heat dissipation assembly can be reduced, the strength of the heat dissipation assembly is improved, and the structural strength of the vapor chamber is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a temperature equalizing plate. Background Art

[0002] Chip is a general term for semiconductor component products. It is the carrier of integrated circuits and is divided from wafers. Chip refers to a silicon wafer containing integrated circuits. It is very small and is often part of a computer or other electronic device. As the integration and performance frequency of electronic equipment continue to increase, the heat generated by the chips in the electronic equipment during operation will affect its working stability if it cannot be dissipated in time. In severe cases, the chip will be burned. Therefore, as a good thermal conductive device, the heat spreader can have a thermal conductivity of up to 100 times that of pure copper. It transfers heat by circulating the vapor and liquid phase change of the medium in a fully enclosed vacuum chamber. It is often used in electronic products with small size and fast heat dissipation, as well as other application scenarios with high heat dissipation requirements.

[0003] The temperature spreader is usually composed of an upper and lower shell body connected to each other, and a vacuum chamber is formed between the upper and lower shell bodies. Usually, in order to better transfer the heat source of the chip to the temperature spreader, a protrusion is protruded outward from the lower shell body to completely fit the heat source of the chip, and a heat dissipation component is arranged in the protrusion, and the upper end of the heat dissipation component abuts the upper shell body. However, the protrusion increases the distance of the circulating medium flow and reduces the thermal performance of the temperature spreader due to the large distance from the inner wall of the protrusion to the inner wall of the upper shell body. On the other hand, the height dimension of the heat dissipation component is too large, which reduces the strength of the heat dissipation component and thus reduces the structural strength of the temperature spreader.

[0004] Therefore, it is urgent to propose a temperature homogenizing plate to solve the above problems. Utility Model Content

[0005] The utility model provides a temperature averaging plate, which can improve the thermal performance of the temperature averaging plate and improve the structural strength of the temperature averaging plate.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] A temperature equalizing plate comprises a first shell and a second shell connected to each other, a containing cavity being formed between the first shell and the second shell, the containing cavity being used for circulating a circulating medium, a first protrusion being protruding outward from the second shell, an outer wall of the first protrusion being in contact with a heat source, an internal component being provided on the inner wall of the first shell, a heat dissipation component being provided inside the first protrusion, one end of the heat dissipation component being connected to the inner wall of the first protrusion, and the other end being in contact with the internal component.

[0008] As an optional technical solution for the temperature equalizing plate, the internally connected component is a groove body that is recessed inwardly of the first shell toward the accommodating cavity.

[0009] As an optional technical solution for the temperature homogenizing plate, the internally connected component is a copper block abutting against the inner wall of the first shell.

[0010] As an optional technical solution for the temperature equalizing plate, the heat dissipation component includes a plurality of heat dissipation fins, and a flow opening is provided at one end of the heat dissipation fin abutting against the internal component, and the flow opening is configured to allow the circulating medium to flow between the heat dissipation fins.

[0011] As an optional technical solution for the temperature equalizing plate, the heat dissipation component includes a first copper column and a second copper column, the second copper columns are dispersedly arranged between adjacent first copper columns, the height dimension of the second copper column is smaller than the height dimension of the first copper column, the radial dimension of the second copper column is smaller than the radial dimension of the first copper column, and the end of the first copper column abuts against the internal component.

[0012] As an optional technical solution for the temperature equalizing plate, the heat dissipation component includes a third copper column and a first dividing rib, and multiple first dividing ribs separate multiple third copper columns respectively. The ends of the third copper columns abut against the internal component, and the height dimension of the first dividing rib is smaller than the height dimension of the third copper column.

[0013] As an optional technical solution for the temperature homogenizing plate, the height of the first dividing rib is less than or equal to 5 mm.

[0014] As an optional technical solution for the temperature homogenizer, the heat dissipation component includes a fourth copper column and a second dividing rib, the fourth copper column is located at the intersection of the second dividing rib, and the end of the fourth copper column abuts against the internal component.

[0015] As an optional technical solution for the temperature homogenizing plate, the height of the second dividing rib is less than or equal to 5 mm.

[0016] As an optional technical solution for the temperature equalizing plate, the temperature equalizing plate further includes a heat pipe, and the heat pipe is located on the outer wall of the first shell.

[0017] Beneficial effects of the utility model: The utility model provides a temperature equalizing plate, comprising a first shell and a second shell connected to each other. A containing cavity is formed between the first shell and the second shell, and the containing cavity is used to circulate the circulating medium and transfer heat through the vapor-liquid phase change of the circulating medium. The second shell is provided with a first protrusion protruding outward, and the outer wall of the first protrusion contacts the heat source, so that the heat of the small-range heat source can be transferred to the second shell as soon as possible, thereby improving the heat conduction efficiency. An internal component is provided on the inner wall of the first shell, and a heat dissipation component is provided in the first protrusion, one end of the heat dissipation component is connected to the inner wall of the first protrusion, and the other end is abutted against the internal component. The heat dissipation component not only increases the contact area between the second shell and the circulating medium, thereby improving the heat transfer efficiency, but also provides support for the second shell, thereby increasing the structural strength of the temperature equalizing plate. The internal component is also provided to reduce the distance from the inner wall of the first protrusion to the inner wall of the first shell, which, on the one hand, reduces the flow distance of the circulating medium, thereby reducing the flow resistance of the circulating medium, thereby improving the thermal performance of the temperature equalizing plate. On the other hand, the height dimension of the heat dissipation component can be reduced, the strength of the heat dissipation component can be increased, thereby improving the structural strength of the temperature equalizing plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 1 is a cross-sectional schematic diagram of the temperature averaging plate when the internal connecting member of the temperature averaging plate in the embodiment of the utility model is a groove body;

[0019] Figure 2 1 is a cross-sectional schematic diagram of the temperature averaging plate when the internal connecting member of the temperature averaging plate in the embodiment of the utility model is a copper block;

[0020] Figure 3 It is a structural schematic diagram of the first shell when the internal connecting member of the temperature equalizing plate in the embodiment of the utility model is a copper cylinder;

[0021] Figure 4 This is a schematic diagram of a first internal partial structure of the second shell of the temperature homogenizing plate in an embodiment of the utility model;

[0022] Figure 5 This is a schematic diagram of a second internal partial structure of the second shell of the temperature homogenizing plate in an embodiment of the utility model;

[0023] Figure 6 This is a schematic diagram of a third internal partial structure of the second shell of the temperature homogenizing plate in the embodiment of the utility model;

[0024] Figure 7 It is a schematic diagram of the fourth internal partial structure of the second shell of the temperature equalizing plate in the embodiment of the utility model.

[0025] In the figure: 100, first shell; 110, internal component; 111, groove body; 112, copper block; 113, copper column; 200, second shell; 210, first protrusion; 220, heat dissipation component; 221, heat dissipation fin; 222, first copper column; 223, second copper column; 224, third copper column; 225, first dividing rib; 226, fourth copper column; 227, second dividing rib; 300, with heat pipe. DETAILED DESCRIPTION

[0026] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0027] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0029] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0030] The utility model provides a temperature averaging plate, which can improve the thermal performance of the temperature averaging plate and improve the structural strength of the temperature averaging plate.

[0031] Specific as Figure 1 , Figure 2 and Figure 3 As shown, the temperature equalizer includes a first shell 100 and a second shell 200 connected to each other. A receiving cavity is formed between the first shell 100 and the second shell 200, and the receiving cavity is used to circulate the circulating medium and transfer heat through the vapor-liquid phase change of the circulating medium. The second shell 200 is provided with a first protrusion 210 protruding outward, and the outer wall of the first protrusion 210 contacts the heat source, which can transfer the heat of the small-range heat source to the second shell 200 as soon as possible, thereby improving the heat conduction efficiency. An internal component 110 is provided on the inner wall of the first shell 100, and a heat dissipation component 220 is provided in the first protrusion 210. One end of the heat dissipation component 220 is connected to the inner wall of the first protrusion 210, and the other end is abutted against the internal component 110. The heat dissipation component 220 not only increases the contact area between the second shell 200 and the circulating medium, thereby improving the heat transfer efficiency, but also provides support for the second shell 200, thereby increasing the structural strength of the temperature equalizer. The internal connection component 110 is provided to reduce the distance between the inner wall of the first protrusion 210 and the inner wall of the first shell 100, which reduces the flow distance of the circulating medium, thereby reducing the flow resistance of the circulating medium, thereby improving the thermal performance of the temperature vapor chamber. On the other hand, the height dimension of the heat dissipation component 220 can be reduced, the strength of the heat dissipation component 220 can be increased, and the structural strength of the temperature vapor chamber can be improved.

[0032] The internal component 110 and the heat dissipation component 220 have different structural forms. The following are different structural forms of the internal component 110 and the heat dissipation component 220 in different embodiments. The technical features in each embodiment are only preferred embodiments and are not limitations of the present invention. In addition, the technical features in each embodiment can be implemented individually or in combination.

[0033] Continue as Figure 1 As shown, preferably, the internal component 110 is a groove body 111 that is concavely arranged in the first shell 100 toward the accommodating cavity, which is simple to process and low in cost. In addition, the groove body 111 can increase the contact area between the first shell 100 and the circulating medium in the accommodating cavity, so that the circulating medium can transfer heat to the first shell 100 as soon as possible, and then the gaseous circulating medium evaporated to the first shell 100 is quickly condensed and refluxed to the second shell 200, thereby improving the heat transfer efficiency of the temperature plate.

[0034] Continue as Figure 2As shown, preferably, the internal component 110 is a copper block 112 that abuts against the inner wall of the first shell 100, with strong supporting force and high strength. In addition, the copper block 112 can increase the contact area between the first shell 100 and the circulating medium in the accommodating cavity, so that the circulating medium can transfer heat to the first shell 100 as soon as possible, and then the gaseous circulating medium evaporated to the first shell 100 is quickly condensed and refluxed to the second shell 200, thereby improving the heat transfer efficiency of the temperature plate.

[0035] Continue as Figure 3 As shown, preferably, the internal component 110 is a plurality of copper cylinders 113 abutting against the inner wall of the first shell 100, which facilitates the arrangement of the internal component 110 and saves materials compared with the copper block 112. In addition, the copper cylinder 113 can increase the contact area between the first shell 100 and the circulating medium in the accommodating cavity, so that the circulating medium can transfer heat to the first shell 100 as soon as possible, thereby allowing the gaseous circulating medium evaporated to the first shell 100 to quickly condense and flow back to the second shell 200, thereby improving the heat transfer efficiency of the temperature plate.

[0036] like Figure 4 As shown, optionally, the heat dissipation component 220 includes a plurality of heat dissipation fins 221, and a circulation port is provided at one end of the heat dissipation fin 221 abutting against the internal component 110, and the circulation port is configured to allow the circulation medium to flow between the heat dissipation fins 221. On the one hand, the heat dissipation fins 221 increase the contact area between the second housing 200 and the circulating medium in the accommodating cavity, so that the second housing 200 can transfer the heat of the heat source to the circulating medium as quickly as possible, thereby causing the liquid circulating medium that flows back to the bottom of the first protrusion 210 to evaporate sequentially, thereby improving the heat transfer efficiency. On the other hand, a second channel separated from each other is formed between the heat dissipation fins 221, so that the circulating medium that is heated and evaporated into a gas state can be evenly diffused upward to the first shell 100 along the second channel, and the first shell 100 is heated more evenly at various places, which improves the temperature uniformity of the first shell 100. At the same time, the condensed liquid circulating medium flows along the side wall of the heat dissipation fins 221 to the bottom of the first protrusion 210 of the second shell 200, which is conducive to the reflux and uniform distribution of the liquid circulating medium, so that the liquid circulating medium that flows back to the bottom of the temperature equalizing plate can evenly receive the heat transferred by the heat source. The flow port is set to connect the second channels between the heat dissipation fins 221, and the circulating medium that evaporates into a gas state can pass through the flow port and freely diffuse in the second channel formed between the heat dissipation fins 221, so that the heat conduction between the gaseous circulating medium and the first shell 100 is more uniform, which is also conducive to the uniform distribution of pressure at various places in the accommodating cavity of the temperature equalizing plate, and there will be no situation where the temperature is higher or the pressure is higher at a certain place. There can be one, two, three, etc. flow ports, which can be selected according to actual conditions, and this embodiment does not limit this.

[0037] like Figure 5As shown, optionally, the heat dissipation component 220 includes a first copper column 222 and a second copper column 223, the second copper column 223 is dispersedly arranged between adjacent first copper columns 222, the height dimension of the second copper column 223 is smaller than the height dimension of the first copper column 222, the radial dimension of the second copper column 223 is smaller than the radial dimension of the first copper column 222, and the end of the first copper column 222 abuts against the internal component 110. The first copper column 222 increases the contact area between the second shell 200 and the circulating medium in the accommodating cavity, so that the second shell 200 can transfer the heat of the heat source to the circulating medium as soon as possible, thereby causing the liquid circulating medium that flows back to the bottom to evaporate sequentially, thereby improving the heat transfer efficiency. The second copper column 223 is provided, further increasing the contact area between the second shell 200 and the circulating medium in the accommodating cavity, so that the second shell 200 can transfer the heat of the heat source to the circulating medium faster, thereby causing the liquid circulating medium that flows back to the bottom to evaporate sequentially, thereby further improving the heat transfer efficiency. And further improve the structural strength of the second shell 200, thereby improving the structural strength of the temperature evaporating plate. The size of the second copper column 223 is set to facilitate the circulation of the circulating medium.

[0038] like Figure 6 As shown, the heat dissipation component 220 includes a third copper column 224 and a first dividing rib 225. The plurality of first dividing ribs 225 separate the plurality of third copper columns 224 respectively. The end of the third copper column 224 abuts against the internal component 110. The height dimension of the first dividing rib 225 is smaller than the height dimension of the third copper column 224. The third copper column 224 increases the contact area between the second shell 200 and the circulating medium in the accommodating cavity, so that the second shell 200 can transfer the heat of the heat source to the circulating medium as soon as possible, and then make the liquid circulating medium flowing back to the bottom evaporate in sequence, thereby improving the heat transfer efficiency. The first dividing rib 225 is provided to divide the interior of the first protrusion 210 into various areas, so that the liquid circulating medium flowing back to the bottom of the first protrusion 210 is heated and evaporated at a uniform temperature, thereby increasing the uniformity of the heat transfer of the temperature equalizing plate. The height dimension of the first dividing rib 225 is smaller than the height dimension of the third copper column 224, so that the liquid circulating medium in each area can evaporate and rise and then quickly diffuse to the entire accommodating cavity.

[0039] In this embodiment, the height of the first dividing rib 225 is less than or equal to 5 mm. For example, it can be 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, etc. The height of the first dividing rib 225225 can be set according to actual conditions and is not specifically limited in the present invention.

[0040] like Figure 7As shown, the heat dissipation component 220 includes a fourth copper column 226 and a second dividing rib 227. The fourth copper column 226 is located at the intersection of the second dividing rib 227, and the end of the fourth copper column 226 abuts against the internal component 110. The fourth copper column 226 increases the contact area between the second shell 200 and the circulating medium in the accommodating cavity, so that the second shell 200 can transfer the heat of the heat source to the circulating medium as quickly as possible, thereby causing the liquid circulating medium that flows back to the bottom to evaporate sequentially, thereby improving the heat transfer efficiency. The second dividing rib 227 is provided to divide the interior of the first protrusion 210 into various areas, so that the liquid circulating medium that flows back to the bottom of the first protrusion 210 is heated and evaporated at a uniform temperature, thereby increasing the uniformity of the heat transfer of the temperature equalizing plate.

[0041] In this embodiment, the height of the second dividing rib 227 is less than or equal to 5 mm. For example, it can be 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, etc. The height of the second dividing rib 227227 can be set according to actual conditions and is not specifically limited in the present invention.

[0042] It should be noted that the temperature plate can also include a capillary structure located on the top wall of the first shell 100 and on the bottom of the second shell 200. The capillary structure is a mesh structure, and the capillary structure is made of copper material. The capillary structure can increase the gas-liquid flow and heat transfer rate of the circulating medium in the temperature plate. The first copper column 222, the third copper or the third copper column 224 are provided with the capillary structure, so that the capillary structure and the first shell 100 can be better contacted together.

[0043] The temperature homogenizing plate also includes a heat pipe 300, which is located on the outer wall of the first shell 100. The arrangement of the heat pipe 300 increases the contact area between the first shell 100 and the cooling liquid outside the temperature homogenizing plate, thereby improving the heat transfer efficiency. At the same time, a boiling layer can appear at the heat pipe 300, thereby increasing the boiling intensity of the cooling liquid outside the first shell 100 and increasing the disturbance of the cooling liquid, which is beneficial to the heat exchange between the first shell 100 of the temperature homogenizing plate and the cooling liquid.

[0044] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A temperature equalizing plate, comprising a first shell (100) and a second shell (200) connected to each other, wherein a receiving cavity is formed between the first shell (100) and the second shell (200), wherein the receiving cavity is used to circulate a circulating medium, and the second shell (200) is provided with a first protruding portion (210) protruding outwardly, and an outer wall of the first protruding portion (210) contacts a heat source, wherein: An internally connected component (110) is disposed on the inner wall of the first shell (100), a heat dissipation component (220) is disposed inside the first protruding portion (210), one end of the heat dissipation component (220) is connected to the inner wall of the first protruding portion (210), and the other end is in contact with the internally connected component (110).

2. The temperature equalizing plate according to claim 1, characterized in that: The internal connection component (110) is a groove body (111) of the first shell (100) which is recessed into the accommodating cavity.

3. The temperature homogenizing plate according to claim 1, characterized in that: The internal connection component (110) is a copper block (112) abutting against the inner wall of the first shell (100).

4. The temperature homogenizing plate according to claim 1, characterized in that: The heat dissipation component (220) comprises a plurality of heat dissipation fins (221); one end of the heat dissipation fin (221) abutting against the internal component (110) is provided with a flow opening, and the flow opening is configured to allow a circulating medium to flow between the heat dissipation fins (221).

5. The temperature homogenizing plate according to claim 1, characterized in that: The heat dissipation component (220) comprises a first copper column (222) and a second copper column (223), wherein the second copper column (223) is dispersedly arranged between adjacent first copper columns (222), the height dimension of the second copper column (223) is smaller than the height dimension of the first copper column (222), the radial dimension of the second copper column (223) is smaller than the radial dimension of the first copper column (222), and the end of the first copper column (222) abuts against the internally connected component (110).

6. The temperature homogenizing plate according to claim 1, characterized in that: The heat dissipation component (220) comprises a third copper column (224) and a first separation rib (225), wherein a plurality of the first separation ribs (225) separate a plurality of the third copper columns (224) respectively, and the ends of the third copper columns (224) abut against the internally connected component (110), and the height dimension of the first separation rib (225) is smaller than the height dimension of the third copper column (224).

7. The temperature equalizing plate according to claim 6, characterized in that: The height of the first dividing rib (225) is less than or equal to 5 mm.

8. The temperature homogenizing plate according to claim 1, characterized in that: The heat dissipation component (220) comprises a fourth copper column (226) and a second separation rib (227); the fourth copper column (226) is located at the intersection of the second separation rib (227); and the end of the fourth copper column (226) abuts against the internal connection component (110).

9. The temperature equalizing plate according to claim 8, characterized in that: The height of the second dividing rib (227) is less than or equal to 5 mm.

10. The temperature homogenizing plate according to claim 1, characterized in that: The temperature homogenizing plate further comprises a heat pipe (300), and the heat pipe (300) is located on the outer wall of the first shell (100).

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