Ultrathin loop heat pipe
The ultra-thin loop heat pipe addresses inefficiencies in mobile devices by using copper plates and sintered capillaries to enhance heat transfer, improving heat dissipation in mobile electronic devices.
Patent Information
- Application Number
- CN202420522027.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-18
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-03-18
AI Technical Summary
Existing loop heat pipes are inefficient for heat dissipation in mobile electronic devices due to their circular tube shape, which limits contact with the heat source and reduces heat dissipation effectiveness.
An ultra-thin loop heat pipe design featuring a lower and upper cover made of oxygen-free copper plates, filled with deionized water, ethanol, or refrigerant, and incorporating sintered capillaries and reinforcement columns to enhance heat transfer through multiple meandering channels.
The ultra-thin design improves heat conduction and dissipation capabilities, allowing efficient heat transfer from high-power mobile devices like mobile phones and notebooks.
Smart Images
Figure CN222167557U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat transfer equipment, in particular to an ultra-thin loop heat pipe. Background Art
[0002] A loop heat pipe is a closed loop heat pipe. As an efficient phase change heat transfer device, it mainly transfers heat through the two-phase change of the heat transfer medium, and it is becoming more and more important in the heat dissipation system.
[0003] However, most heat pipes are in the shape of circular tubes. When used in mobile electronic devices with high power consumption and small size, such as mobile phones and notebooks, the contact surface with the heat source is small and the heat dissipation effect is poor. Therefore, we propose an ultra-thin loop heat pipe. Utility Model Content
[0004] In view of the deficiencies of the prior art, the utility model provides an ultra-thin loop heat pipe, which solves the problems raised in the above background technology.
[0005] To achieve the above purpose, the utility model is implemented by the following technical solutions: an ultra-thin loop heat pipe, including a lower cover assembly, the top of the lower cover assembly is connected to an upper cover, the space between the lower cover assembly and the upper cover is filled with working liquid, and the material of the lower cover assembly and the upper cover are both oxygen-free copper plates;
[0006] The lower cover assembly includes a lower cover, a cavity is opened at the top of the lower cover, a heat source area, a gas phase area, a gas-liquid mixing area and a liquid area are arranged inside the cavity, and sintered capillaries are arranged inside the heat source area, the gas-liquid mixing area and the liquid area, and the material of the sintered capillary is oxygen-free copper powder.
[0007] As a further technical solution of the utility model, the size of the upper cover plate is matched with the size of the lower cover plate, and the bottom end of the upper cover plate is a planar structure.
[0008] As a further technical solution of the utility model, the sintered capillaries inside the heat source area and the gas-liquid mixing area are half the depth of the cavity, and the sintered capillaries inside the liquid area are the same as the depth of the cavity.
[0009] As a further technical solution of the utility model, a plurality of groups of reinforcing columns are arranged inside the lower cover plate and at positions corresponding to the heat source area, and the top ends of the plurality of groups of reinforcing columns are in contact with the bottom end of the upper cover plate.
[0010] As a further technical solution of the utility model, a liquid injection port is provided on the side wall of the lower cover plate at a position corresponding to the heat source area.
[0011] As a further technical solution of the utility model, the working liquid is one of deionized water, ethanol and refrigerant. Beneficial Effects
[0012] The utility model provides an ultra-thin loop heat pipe. Compared with the prior art, it has the following beneficial effects:
[0013] 1. An ultra-thin loop heat pipe forms multiple meandering channels through the cavity composed of the heat source area, gas phase area, gas-liquid mixing area and liquid area, which enhances the heat conduction and heat dissipation capabilities. Sintered capillaries are arranged inside the heat source area, gas-liquid mixing area and liquid area. By utilizing the medium phase change heat transfer principle, the heat from the heat source end can be quickly transferred to the heat dissipation area.
[0014] 2. An ultra-thin loop heat pipe, which forms an ultra-thin structure through a lower cover assembly and an upper cover, is convenient for installing the device in close proximity to a heat source. It can be used in electronic heat dissipation structures with high power consumption and small size, especially in heat dissipation scenarios of mobile electronic devices such as mobile phones and notebooks, and improve the performance of related products. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the structure of an ultra-thin loop heat pipe;
[0016] Figure 2 A schematic diagram of the disassembled structure of an ultra-thin loop heat pipe;
[0017] Figure 3 A schematic diagram of the structure of a lower cover plate assembly in an ultra-thin loop heat pipe;
[0018] In the figure: 1. lower cover plate assembly; 11. lower cover plate; 12. cavity; 13. heat source area; 14. gas phase area; 15. gas-liquid mixing area; 16. liquid area; 17. reinforcement column; 18. liquid injection port; 2. upper cover plate. DETAILED DESCRIPTION
[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0020] See also Figure 1-2The utility model provides a technical solution for an ultra-thin loop heat pipe: an ultra-thin loop heat pipe, comprising a lower cover assembly 1, the top of the lower cover assembly 1 is connected to an upper cover 2, a working liquid is filled between the lower cover assembly 1 and the upper cover 2, the lower cover assembly 1 and the upper cover 2 are both made of oxygen-free copper plates, and the working liquid is one of deionized water, ethanol and refrigerant.
[0021] See also Figure 3 The lower cover assembly 1 includes a lower cover 11, a cavity 12 is provided at the top of the lower cover 11, a heat source region 13, a gas phase region 14, a gas-liquid mixing region 15 and a liquid region 16 are arranged inside the cavity 12, sintered capillaries are arranged inside the heat source region 13, the gas-liquid mixing region 15 and the liquid region 16, and the sintered capillaries are made of oxygen-free copper powder. The size of the upper cover 2 is adapted to the size of the lower cover 11, and the bottom end of the upper cover 2 is a planar structure. The sintered capillaries inside the heat source region 13 and the gas-liquid mixing region 15 are half the depth of the cavity 12, and the sintered capillaries inside the liquid region 16 are the same as the depth of the cavity 12. A plurality of groups of reinforcing columns 17 are arranged inside the lower cover 11 and at a position corresponding to the heat source region 13, and the top ends of the plurality of groups of reinforcing columns 17 are in contact with the bottom end of the upper cover 2, and a liquid injection port 18 is provided on the side wall of the lower cover 11 and at a position corresponding to the heat source region 13.
[0022] It should be noted that the lower cover plate 11 and the upper cover plate 2 are fixedly connected by welding, the working liquid enters the lower cover plate 11 and the upper cover plate 2 through the liquid injection port 18, and the liquid injection port 18 is welded and sealed after vacuuming;
[0023] Sintered capillaries are well known in the art, and their structure and working principle will not be described in detail.
[0024] The cavity 12 is a multiple-circular channel, which enhances the heat conduction and heat dissipation capabilities, and the cavity 12 has a unidirectional flow, which can improve the transmission distance and transmission efficiency;
[0025] The heat source area 13 is placed at the position where the product actually contacts the heat source, and the liquid working medium is converted into a gaseous working medium; the presence of the capillary body is conducive to the rapid gasification of the working medium under the heating state, thereby improving the thermal cycle efficiency;
[0026] The gas phase region 14 is fully circulated in the cavity; the gaseous working medium can pass through this region without any obstruction at the maximum rate and efficiency;
[0027] The gaseous working medium in the gas-liquid mixing area 15 that has not yet been liquefied by cooling continues to pass through quickly; while the liquefied working medium can be adsorbed on the sintered capillary and pass forward by capillary tension;
[0028] The cooled and liquefied working medium in the liquid region 16 is all adsorbed in the sintered capillary, and the working medium is pushed to the heated region by the capillary tension of the capillary. The sintered capillary in the liquid region 16 has the same depth as the cavity 12, providing a sufficient capillary channel for the liquid working medium to pass through. At the same time, the sintered capillary structure on the bonding surface with the heat source region 13 can also prevent the heated gaseous working medium from flowing out, so that the gaseous working medium can only flow in one direction.
[0029] Multiple groups of reinforcement columns 17 can increase the structural strength of the heat source area 13 between the lower cover plate 11 and the upper cover plate 2; multiple groups of reinforcement columns 17 can also be set to column structures of different sizes, shapes, and arrangements.
[0030] The working principle of the utility model is as follows: when in use, the actual heat source position of the product contacts the heat source area 13 position of the lower cover plate 11 and the upper cover plate 2, and the working liquid medium is used for liquid-gas two-phase phase change heat transfer. The heat source area 13 vaporizes the liquid and dissipates heat along the inner cavity trajectory of the loop heat pipe. During the movement, the gaseous working medium passes through the gas phase area 14 and enters the gas-liquid mixing area 15, where it gradually changes phase into liquid, and the gaseous working medium that has not been liquefied due to cooling continues to pass quickly; and the liquefied working medium can be adsorbed on the sintered capillary and pass forward through the capillary tension. The gaseous working medium then enters the liquid area 16, and then the cooled and liquefied working medium is all adsorbed on the sintered capillary, and the capillary tension of the capillary pushes the working medium to move forward to the heat source area 13. In this way, the cycle alternates and the heat from the heat source end is quickly transferred to the heat dissipation end.
Claims
1. An ultra-thin loop heat pipe, characterized in that: It comprises a lower cover plate assembly (1), the top end of the lower cover plate assembly (1) is connected to an upper cover plate (2), a working liquid is filled between the lower cover plate assembly (1) and the upper cover plate (2), and the lower cover plate assembly (1) and the upper cover plate (2) are both made of oxygen-free copper plates; The lower cover plate assembly (1) comprises a lower cover plate (11), a cavity (12) is provided at the top of the lower cover plate (11), a heat source region (13), a gas phase region (14), a gas-liquid mixing region (15) and a liquid region (16) are arranged inside the cavity (12), and sintered capillaries are arranged inside the heat source region (13), the gas-liquid mixing region (15) and the liquid region (16), and the material of the sintered capillaries is oxygen-free copper powder.
2. The ultra-thin loop heat pipe according to claim 1, characterized in that: The size of the upper cover plate (2) matches the size of the lower cover plate (11), and the bottom end of the upper cover plate (2) is a planar structure.
3. The ultra-thin loop heat pipe according to claim 1, characterized in that: The sintered capillaries inside the heat source region (13) and the gas-liquid mixing region (15) have a depth dimension that is half that of the cavity (12), and the sintered capillaries inside the liquid region (16) have a depth dimension that is the same as that of the cavity (12).
4. The ultra-thin loop heat pipe according to claim 1, characterized in that: A plurality of groups of reinforcement columns (17) are arranged inside the lower cover plate (11) and at positions corresponding to the heat source area (13), and the top ends of the plurality of groups of reinforcement columns (17) are in contact with the bottom ends of the upper cover plate (2).
5. The ultra-thin loop heat pipe according to claim 1, characterized in that: A liquid injection port (18) is provided on the side wall of the lower cover plate (11) at a position corresponding to the heat source area (13).
6. The ultra-thin loop heat pipe according to claim 1, characterized in that: The working liquid is one of deionized water, ethanol and refrigerant.