Optical device carrier chip lead bonding fixing jig

Abstract

The utility model discloses an optical device carrier chip lead bonding fixing jig, which comprises a bottom plate and a cover plate, the cover plate is adsorbed on the upper surface of the bottom plate, the bottom plate is provided with a plurality of positioning grooves, the positioning grooves are used for placing optical device carrier chips to be bonded, and the positioning grooves are used for positioning the optical device carrier chips to be bonded. The cover plate covers the surface of the optical device carrier chip and enables the optical device carrier chip to be kept in the positioning groove, the cover plate is provided with a plurality of bonding windows, and a to-be-bonded area on the surface of the optical device carrier chip is exposed from the bonding windows. According to the utility model, the gland damage of the optical device carrier chip during packaging and bonding is reduced, and the bonding yield is improved.

Description

Technical Field

[0001] The utility model relates to a semiconductor bonding jig and belongs to the technical field of semiconductor installation carriers. Background Art

[0002] In the optical device carrier chip packaging process, the product needs to be fixed in the wire bonding equipment track during the wire bonding packaging stage. The traditional method uses a device pressure plate to fix the product. However, the carrier chip substrate is very small, difficult to fix, and the material is fragile. The equipment pressure plate force is difficult to control for tiny products, and it is easy to cause pressure, scratches, cracks, and broken corners on the surface of the carrier chip substrate. In addition, due to the inability to fix the chip, poor wire bonding accounts for a large proportion in production. Utility Model Content

[0003] In view of the defects of the above-mentioned prior art, the utility model provides a lead bonding fixing fixture for an optical device carrier chip, which aims to solve the problem of low yield caused by pressure damage, scratches, cracks and broken corners on the substrate of the optical device carrier chip during bonding and packaging.

[0004] The technical solution of the utility model is as follows: A lead bonding fixing fixture for an optical device carrier chip, comprising a base plate and a cover plate, wherein the cover plate is adsorbed on the upper surface of the base plate, the base plate is provided with a plurality of positioning grooves, the positioning grooves are used to place the optical device carrier chip to be bonded, the cover plate is pressed on the surface of the optical device carrier chip and keeps the optical device carrier chip in the positioning grooves, the cover plate is provided with a plurality of bonding windows, and the surface area of ​​the optical device carrier chip to be bonded is exposed from the bonding window.

[0005] Furthermore, in order to facilitate observation of the bonding condition of the optical device carrier chip through a microscope, the bonding window includes a rectangular area and an extension groove, the extension groove includes a first extension groove and a second extension groove, the first extension groove extends in a direction perpendicular to the first side of the rectangular area, the second extension groove extends in a direction perpendicular to the second side of the rectangular area, and the first side and the second side are two adjacent sides of the rectangular area.

[0006] Furthermore, the bonding window is rounded at the contour corners.

[0007] Furthermore, in order to facilitate the clamping of the optical device carrier chip so as to take it out and put it in the positioning groove, the corners of the positioning groove are provided with outwardly expanded clamping notches.

[0008] Furthermore, in order to reduce possible scratches on the optical device carrier chip caused by the edge of the positioning groove during placement, the top edge of the positioning groove is chamfered.

[0009] Furthermore, in order to facilitate the covering and positioning, the bottom plate and the cover plate are provided with positioning pins and positioning holes that cooperate with each other.

[0010] Furthermore, in order to improve the closing efficiency, a magnet is embedded on the surface of the bottom plate, and the cover plate is made of a steel sheet that can be adsorbed by the magnet.

[0011] Furthermore, the magnet is not higher than the surface of the bottom plate.

[0012] Compared with the prior art, the advantages of the technical solution provided by the utility model are:

[0013] The utility model utilizes a bottom plate with a positioning groove to carry an optical device carrier chip, and an adsorption-type cover plate covers the bottom plate and simultaneously presses the optical device carrier chip to complete fixation. The operation is simple and can greatly improve efficiency. Through 1000pcs of production tests, the entire production process effectively prevents the optical device carrier chip from being scratched, damaged, broken, and other problems. The product yield is increased from the previous 75% to 98%. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] FIG. 1 is an exploded schematic diagram of a fixture for fixing a lead wire bonding of an optical device carrier chip according to an embodiment of the present invention.

[0015] FIG. 2 is a schematic top view of a fixture for fixing the optical device carrier chip wire bonding according to an embodiment of the present invention.

[0016] Figure 3 Schematic diagram of the positioning groove and clamping notch outline of the base plate.

[0017] Figure 4 Schematic diagram of the bonding window outline of the cover plate.

[0018] Figure 5 This is a schematic diagram of the structure of a cover plate pressing a single optical device carrier chip. DETAILED DESCRIPTION

[0019] The present invention is further described below in conjunction with embodiments. It should be understood that these embodiments are only used to illustrate the present invention and are not used to limit the scope of the present invention. After reading this description, various equivalent modifications to the description by those skilled in the art fall within the scope defined by the claims attached to this application.

[0020] Please combine Figures 1 to 5As shown, the optical device carrier chip lead bonding fixture of this embodiment includes a base plate 1 and a cover plate 2. The base plate 1 has a smooth and flat bottom surface and can be fixed on the surface of the equipment welding platform by vacuum adsorption. The surface of the base plate 1 is provided with a plurality of positioning grooves 101. The contours of the positioning grooves 101 are processed according to the contours of the optical device carrier chip 3 so that the optical device carrier chip 3 can be accurately placed in the positioning grooves 101. In order to improve efficiency, the positioning grooves 101 are arranged in a matrix on the base plate 1 to increase the number of single bonding.

[0021] As a preferred embodiment, the present embodiment has circular clamping notches 102 respectively expanded outwardly at the four corners of the positioning groove 101, so that through the two opposite clamping notches 102, a clamp (such as tweezers) can be inserted into the clamping notch 102 to clamp the optical device carrier chip 3 from both sides, so that the optical device carrier chip 3 can be placed in the positioning groove 101 or taken out from the positioning groove 101 more conveniently. On the one hand, the clamping can be completed quickly to improve efficiency, and on the other hand, scratches can be avoided when loading and unloading the optical device carrier chip 3. In order to further reduce damage during loading and unloading, the top edge of the positioning groove 101 is chamfered to avoid damage and scratches on the edge of the substrate of the optical device carrier chip 3. The depth of the positioning groove 101 is equivalent to the thickness of the substrate of the optical device carrier chip 3.

[0022] The cover plate 2 is attracted to the surface of the base plate 1 by adsorption, and at the same time, the cover plate 2 is pressed on the surface of the optical device carrier chip 3 to fix the optical device carrier chip 3 in the positioning groove 101. A bonding window 201 corresponding to the position of the positioning groove 101 is provided on the cover plate 2, and the area on the optical device carrier chip 3 that needs to be bonded is exposed by the bonding window 201. The bonding operation is performed on the optical device carrier chip 3 by the wire bonding machine through the cover bonding window 201. Since the optical device carrier chip 3 is small in size and the bonding area is even smaller, the position of the bonding window 201 needs to be accurately guaranteed when the cover plate 2 is pressed. Two limiting holes 103 are provided on the base plate 1 and the positioning pins 4 are inserted. Correspondingly, a positioning hole 202 that cooperates with the positioning pins 4 is provided on the cover plate 2. When pressing, the positioning pins 4 are used to position the cover plate 2 to ensure the accurate position of the cover plate 2. The cover plate 2 is made of a steel sheet that can be adsorbed by the magnet 5. A plurality of magnet mounting holes 104 are provided on the bottom plate 1. Magnets are embedded in the magnet mounting holes 104, and the magnets are not higher than the surface of the bottom plate 1. The cover plate 2 is adsorbed by magnetism, which is convenient for operation. The magnets are arranged around the positioning groove 101, so that the optical device carrier chip 3 has a certain magnetic attraction to the cover plate 2 all around, so as to ensure the stability of the cover plate 2 and improve the stability.

[0023] The main body of the bonding window 201 on the cover plate 2 is a rounded rectangle 201a. During the wire bonding process of the optical device carrier chip 3, the path of the lead when the equipment porcelain nozzle is welded can be effectively avoided to ensure that it has sufficient space. At the same time, two extension grooves are extended from both sides of the rounded rectangle 201a. The extension grooves include a first extension groove 201b and a second extension groove 201c. The first extension groove 201b extends in a direction perpendicular to the first side of the rectangular 201a area, and the second extension groove 201c extends in a direction perpendicular to the second side of the rectangular 201a area. The first side and the second side are two adjacent sides of the rectangular 201a area. The first extension groove 201b and the second extension groove 201c provide moving space for the equipment microscope. During the production process, the welding situation in front can be clearly seen through the equipment microscope, making the field of vision wider. In addition, the extension groove can also avoid the equipment porcelain nozzle welding process in the front and back and left and right directions, so that the wire drawing stroke space of the wire bonding machine porcelain nozzle is more sufficient.

[0024] Through the jig of this embodiment, 1000 pieces were invested in production verification in the production of wire bonding packaging of optical device carrier chip 3. The product yield was improved from 75% to 98%. The whole production process effectively prevented the problems of substrate scratches, breakage, and fracture. During the process of loading and unloading the welding wire, it is only necessary to clamp the material to the positioning area and then cover the high-elastic cover plate 2 to accurately fix the optical device carrier chip 3 substrate. The operation is relatively simple, and the design of the jig matrix arrangement greatly improves the production efficiency.

Claims

1. An optical device carrier chip lead wire bonding fixture, characterized in that: It includes a base plate and a cover plate, wherein the cover plate is adsorbed on the upper surface of the base plate, the base plate is provided with a plurality of positioning grooves, the positioning grooves are used to place the optical device carrier chip to be bonded, the cover plate presses on the surface of the optical device carrier chip and keeps the optical device carrier chip in the positioning grooves, and the cover plate is provided with a plurality of bonding windows, and the surface area of ​​the optical device carrier chip to be bonded is exposed from the bonding windows.

2. The optical device carrier chip lead wire bonding fixture according to claim 1, characterized in that: The bonding window includes a rectangular area and an extension groove, the extension groove includes a first extension groove and a second extension groove, the first extension groove extends in a direction perpendicular to a first side of the rectangular area, the second extension groove extends in a direction perpendicular to a second side of the rectangular area, and the first side and the second side are two adjacent sides of the rectangular area.

3. The optical device carrier chip lead wire bonding fixture according to claim 1 or 2, characterized in that: The bonding window is rounded at the outline corners.

4. The optical device carrier chip lead wire bonding fixture according to claim 1, characterized in that: The corners of the positioning groove are provided with outwardly expanded clamping notches.

5. The optical device carrier chip lead wire bonding fixture according to claim 1, characterized in that: The top edge of the positioning groove is chamfered.

6. The optical device carrier chip lead wire bonding fixture according to claim 1, characterized in that: The bottom plate and the cover plate are provided with positioning pins and positioning holes which cooperate with each other.

7. The optical device carrier chip lead wire bonding fixture according to claim 1, characterized in that: A magnet is embedded on the surface of the bottom plate, and the cover plate is made of a steel sheet that can be adsorbed by the magnet.

8. The optical device carrier chip lead wire bonding fixture according to claim 7, characterized in that: The magnet is not higher than the surface of the bottom plate.

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