Sucker assembly
By adding a cap on the top of the fixing member of the suction cup assembly to make its top surface flush with the suction cup fixing part, the problem of groove formation in the traditional suction cup assembly is solved, and the cleanliness of the reaction chamber and the yield of the wafer are improved.
Patent Information
- Application Number
- CN202420647439.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-29
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-03-29
AI Technical Summary
During semiconductor manufacturing, the grooves formed between the traditional electrostatic suction cup and the fixture cause unevenness in the reaction chamber, affecting the quality of plasma etching, leading to by-product adhesion and settlement, and reducing the yield of wafer products.
A suction cup assembly is designed, including a suction cup, a base, a fixing member and a cap. By adding a cap on the top of the fixing member, the top surface of the cap is flush with the top surface of the suction cup fixing part, avoiding the formation of grooves at the position of the fixing member, thereby Prevent side reaction products from accumulating and improve the cleanliness of the reaction chamber.
It effectively avoids the formation of grooves when the suction cup is fixed, improves the cleanliness of the reaction chamber, and improves the yield of the wafer.
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Figure CN222168369U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a suction cup assembly. Background Art
[0002] In semiconductor manufacturing, the internal structure of the reaction chamber where the wafer is located needs to minimize the presence of grooves: during the plasma etching process of the wafer, the by-products generated by the reaction will adhere to the grooves in the form of attachments. These attachments will be suspended or settled on the surface of the wafer during the plasma reaction or when the gas pressure inside the reaction chamber changes, causing the required plasma to fail to meet the process requirements, resulting in the formation of wafer defects and reducing the yield of the wafer product.
[0003] When a conventional electrostatic chuck is fixed to a base, several grooves are formed between the electrostatic chuck and the fixing member. How to reduce these grooves and improve the flatness of the interior of the reaction chamber is an urgent problem to be solved. Utility Model Content
[0004] The present application provides a suction cup assembly, which can prevent a groove from being formed between the suction cup and the fixing member when the suction cup is fixed to a base.
[0005] An embodiment of the present application provides a suction cup assembly, comprising: a suction cup, wherein the suction cup includes an adsorption portion for adsorbing a wafer; and a fixing portion, wherein the fixing portion is provided with a first connecting hole penetrating the fixing portion; a base, used to support the suction cup, wherein the base is provided with a second connecting hole matching the first connecting hole; a fixing piece, configured to be inserted into the first connecting hole and the second connecting hole in sequence to connect the suction cup to the base; and a cap, which is covered on the top of the fixing piece, wherein the cap is interference fit with the first connecting hole, and the top surface of the cap is flush with the top surface of the fixing portion.
[0006] In some embodiments, the fixing member includes a head portion, the head portion is provided with a slot; and a rod portion, the rod portion is integrally connected to the head portion, and an outer surface of the rod portion is provided with a thread.
[0007] In some embodiments, the cap includes a cap portion, which contacts the top surface of the head; and a clamping portion, which is integrally connected to the cap portion and matches the clamping slot.
[0008] In some embodiments, the surface of the cap is a polished surface.
[0009] In some embodiments, the first connecting hole includes a wide hole section and a narrow hole section that are integrally connected, the wide hole section is used to accommodate the cap and the head of the fixing member, and the narrow hole section is used to accommodate the rod portion of the fixing member.
[0010] In some embodiments, a threaded sleeve matching the rod is disposed in the second connecting hole.
[0011] In some embodiments, a cross section of the slot perpendicular to the slot axis is a regular hexagon.
[0012] In some embodiments, the fixing member is provided with a first through hole penetrating the fixing member along a central axis of the fixing member.
[0013] In some embodiments, the cap is provided with a second through hole penetrating the cap along a central axis of the cap, and the second through hole is aligned with the first through hole.
[0014] In some embodiments, there are multiple first connection holes, and the multiple first connection holes are centrally symmetrically distributed about the center of the suction cup.
[0015] The beneficial effects of the suction cup assembly provided by the present application include but are not limited to the following:
[0016] The suction cup assembly provided in the present application includes a suction cup, a base, a fixing member and a cap. The suction cup is fixedly connected to the base through the fixing member, and the cap is arranged on the top of the fixing member.
[0017] By adding the cap on the top of the fixing part and making the top surface of the cap flush with the top surface of the suction cup fixing part, it is avoided that a groove is formed at the position of the fixing part when the suction cup is fixed to the base, thereby avoiding the accumulation of side reaction products, improving the cleanliness of the reaction chamber, and thus improving the yield of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The following figures describe in detail the exemplary embodiments disclosed in this application. The same reference numerals represent similar structures in several views of the drawings. Those skilled in the art will understand that these embodiments are non-limiting, exemplary embodiments, and the drawings are only for the purpose of illustration and description, and are not intended to limit the scope of this application. Other embodiments may also accomplish the inventive intent in this application. It should be understood that the drawings are not drawn to scale.
[0019] in:
[0020] Figure 1 is a schematic structural diagram of a suction cup assembly according to some embodiments of the present application;
[0021] Figure 2 is a top view of a suction cup according to some embodiments of the present application;
[0022] Figure 3 for Figure 1 A magnified view of the structure in box A;
[0023] Figure 4 is a schematic structural diagram of a fixing member according to some embodiments of the present application;
[0024] Figure 5 is a top view of a fixing member according to some embodiments of the present application;
[0025] Figure 6 It is a schematic diagram of the structure of a cap according to some embodiments of the present application;
[0026] Figure 7 A top view of a cap according to some embodiments of the present application; and
[0027] Figure 8 It is a bottom view of a cap according to some embodiments of the present application. DETAILED DESCRIPTION
[0028] The following description provides specific application scenarios and requirements of the present application, with the purpose of enabling those skilled in the art to make and use the content in the present application. It will be apparent to those skilled in the art that various local modifications to the disclosed embodiments are apparent, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the present application. Therefore, the present application is not limited to the embodiments shown, but to the widest scope consistent with the claims.
[0029] The present application provides a suction cup assembly, comprising: a suction cup, wherein the suction cup comprises a suction portion for sucking a wafer; and a fixing portion, wherein the fixing portion is provided with a first connecting hole penetrating the fixing portion; a base, used to support the suction cup, wherein the base is provided with a second connecting hole matching the first connecting hole; a fixing member, configured to be inserted into the first connecting hole and the second connecting hole in sequence to connect the suction cup to the base; and a cap, which is covered on the top of the fixing member, wherein the cap is interference fit with the first connecting hole, and the top surface of the cap is flush with the top surface of the fixing portion.
[0030] The suction cup assembly provided in the present application avoids the formation of a groove at the position of the fixing part when the suction cup is fixed to the base by adding a cap on the top of the fixing part and making the top surface of the cap flush with the top surface of the fixing part, thereby avoiding the accumulation of side reaction products, improving the cleanliness of the reaction chamber, and thus improving the yield of the wafer.
[0031] The suction cup assembly provided by the present application will be described in detail below in conjunction with the embodiments and drawings.
[0032] refer to Figure 1 and 3The present application provides a suction cup assembly, including a suction cup 100, a base 200, a fixing member 300 and a cap 400, wherein the suction cup 100 is fixedly connected to the base 200 via the fixing member 300, and the cap 400 is disposed on the top of the fixing member 300.
[0033] refer to Figure 2 In some embodiments, the suction cup 100 includes an adsorption portion 101 for adsorbing the wafer. The adsorption portion 101 can be connected to a power source. When the wafer needs to be processed, the power source is turned on, and the adsorption cup adsorbs the wafer under the action of static electricity, thereby fixing the wafer to the surface of the adsorption portion 101. When the processing of the wafer is completed, the power source is turned off, and the adsorption portion 101 can release the electrostatic adsorption of the wafer.
[0034] In some embodiments, the suction cup 100 further includes a fixing portion 102 , which is disposed around the adsorption portion 101 and is used to fix the suction cup 100 to the base 200 .
[0035] In some embodiments, the fixing portion 102 is provided with a first connection hole 102 a penetrating through the fixing portion 102 for accommodating the fixing member 300 .
[0036] In some embodiments, there are multiple first connection holes 102 a , and the multiple first connection holes 102 a are centrally symmetrically distributed about the center of the adsorption portion 101 to balance the centrifugal force of the suction cup 100 during the rotation process.
[0037] In some embodiments, the first connecting hole 102 a includes a wide hole section and a narrow hole section that are integrally connected to each other, respectively accommodating different parts of the fixing member 300 .
[0038] In some embodiments, the narrow hole section is provided with a threaded hole matching the fixing member 300 , so that the fixing member 300 is threadedly connected to the fixing portion 102 .
[0039] In some embodiments, the base 200 is used to support the suction cup 100, and the base 200 is provided with a second connection hole 201 matching the first connection hole 102a, and the fixing member 300 passes through the first connection hole 102a and the second connection hole 201 in sequence, thereby connecting the suction cup 100 to the base 200.
[0040] In some embodiments, a threaded sleeve (not shown) matching the fixing member 300 is disposed in the second connection hole 201. During the process of threaded connection between the fixing member 300 and the base 200, if the thread matching the fixing member 300 is disposed on the inner wall of the second connection hole 201, when the thread on the inner wall of the second connection hole 201 is worn, the entire base 200 needs to be replaced, which is costly. However, by providing the threaded sleeve, the thread wear problem can be solved by replacing the threaded sleeve, which is simple to operate and low in cost.
[0041] In some embodiments, the fixing member 300 is provided with a first through hole 301 that penetrates the fixing member 300 along the central axis of the fixing member 300. In some processes, the suction cup 100 assembly will be in a vacuum environment. If there is gas between the bottom of the fixing member 300 and the second connecting hole 201, the fixing member 300 will loosen or fly out of the second connecting hole 201 under the effect of the gas pressure difference, which will affect the fixation of the suction cup 100 and may also cause safety problems. Therefore, it is necessary to set the first through hole 301. When the reaction chamber where the suction cup 100 assembly is located is vacuumed, the gas between the bottom of the fixing member 300 and the second connecting hole 201 can escape through the first through hole 301, so that the gas pressure at the top and bottom of the fixing member 300 is consistent, and the fixing member 300 is prevented from loosening.
[0042] In some embodiments, the diameter of the first through hole 301 is less than or equal to 1 mm.
[0043] refer to Figures 3 to 5 In some embodiments, the fixing member 300 includes a head 302 and a rod 303 , the head 302 and the rod 303 are integrally connected, and a diameter of the rod 303 is smaller than a diameter of the head 302 .
[0044] In some embodiments, the head 302 matches the wide end of the first connection hole 102a, and the height of the head 302 is 1-4 mm. In some embodiments, the height of the head 302 is 1 mm, 3 mm or 4 mm.
[0045] In some embodiments, the head 302 is provided with a slot 302 a , and an external tightening tool can be inserted into the slot 302 a and screw the fixing member 300 to connect the fixing member 300 with the suction cup 100 and the base 200 .
[0046] In some embodiments, a cross section of the slot 302a perpendicular to the axis of the slot 302a is a regular hexagon to match the cross section of a common tightening tool on the market.
[0047] In some embodiments, the side length of the regular hexagon is 0.5-1.5 mm. Optionally, the side length of the regular hexagon is 0.5 mm, 1 mm or 1.5 mm.
[0048] In some embodiments, the top surface of the head 302 is a polished surface to reduce the contact gap with the cap 400 .
[0049] In some embodiments, the rod portion 303 matches the narrow hole section of the first connection hole 102 a , and the outer surface of the rod portion 303 is provided with threads to be threadedly connected with the suction cup 100 and the base 200 .
[0050] In some embodiments, the height of the rod portion 303 is 5 to 10 mm. Optionally, the height of the rod portion 303 is 5 mm, 8 mm or 10 mm.
[0051] refer to Figure 3 as well as Figures 6 to 8 In some embodiments, the cap 400 is interference fit with the first connecting hole 102a, and the top surface of the cap 400 is flush with the top surface of the fixing portion 102 to avoid forming a groove on the top surface of the fixing portion 102, thereby avoiding the accumulation of reaction by-products on the surface of the fixing portion 102.
[0052] In some embodiments, the cap 400 is provided with a second through hole 401 that penetrates the cap 400 along the central axis of the cap 400, and the second through hole 401 is aligned with the first through hole 301. Similar to the principle of providing the first through hole 301, the purpose of providing the second through hole 401 is to prevent the cap 400 from loosening or falling off during the vacuuming of the reaction chamber due to the presence of gas between the cap 400 and the fixing member 300.
[0053] In some embodiments, the cap 400 includes a cap portion 402 , and the cap portion 402 contacts the top surface of the head portion 302 .
[0054] In some embodiments, the surface of the cap portion 402 is a polished surface to reduce the accumulation of side reaction products on the surface of the cap portion 402 , further improve the cleanliness of the reaction chamber, and also reduce the contact gap between the cap portion 402 and the head portion 302 .
[0055] In some embodiments, the cap 400 also includes a snap-on portion 403, which is integrally connected to the cap portion 402 and matches the slot 302a. When the snap-on portion 403 is inserted into the slot 302a, the bottom surface of the cap portion 402 contacts the top surface of the head portion 302.
[0056] In some embodiments, the material of the cap 400 includes metal or ceramic. In some embodiments, the material of the cap 400 includes quartz.
[0057] In some embodiments, the fixing process of the suction cup 100 assembly is as follows: place the suction cup 100 on the base 200, and align the first connecting hole 102a with the second connecting hole 201, insert the fixing member 300 into the first connecting hole 102a and the second connecting hole 201, and tighten the fixing member 300 using a tightening tool, align the snap-fit portion 403 of the cap 400 with the slot 302a of the fixing member 300, and snap the cap 400 to the top of the fixing member 300.
[0058] The beneficial effects of the suction cup assembly provided by the present application include but are not limited to the following:
[0059] The suction cup assembly provided in the present application includes a suction cup, a base, a fixing member and a cap. The suction cup is fixedly connected to the base through the fixing member, and the cap is arranged on the top of the fixing member.
[0060] By adding the cap on the top of the fixing part and making the top surface of the cap flush with the top surface of the suction cup fixing part, it is avoided that a groove is formed at the position of the fixing part when the suction cup is fixed to the base, thereby avoiding the accumulation of side reaction products, improving the cleanliness of the reaction chamber, and thus improving the yield of the wafer.
[0061] It should be noted that different embodiments may produce different beneficial effects. In different embodiments, the beneficial effects that may be produced may be any one or a combination of the above, or any other beneficial effects that may be obtained.
[0062] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only for example and does not constitute a limitation of this specification. Although not explicitly stated here, those skilled in the art may make various modifications, improvements and corrections to this application. Such modifications, improvements and corrections are suggested in this specification, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of this application.
[0063] It should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", and "fix" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a rotating connection or a sliding connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood in combination with specific circumstances.
[0064] In addition, when terms such as "first", "second", and "third" are used in the specification of this application to describe various features, these terms are only used to distinguish these features and cannot be understood as indicating or implying the relationship between the features, the relative importance, or implicitly indicating the number of features indicated.
[0065] In addition, the present specification describes exemplary embodiments by reference to idealized exemplary cross-sectional views and / or plan views and / or stereograms. Therefore, differences from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are foreseeable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but should include deviations in shapes caused by, for example, manufacturing. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device nor to limit the scope of the exemplary embodiments.
[0066] At the same time, the present application uses specific words to describe the embodiments of this specification. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in the present application does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.
[0067] Similarly, it should be noted that in order to simplify the description of the disclosure of this application and thus help understand one or more embodiments of the invention, in the above description of the embodiments of this application, multiple features are sometimes combined into one embodiment, figure or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than the features mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiment disclosed above.
[0068] Finally, it should be understood that the embodiments described in this application are only used to illustrate the principles of the embodiments of the present application. Other variations may also fall within the scope of the present application. Therefore, as an example and not a limitation, the alternative configurations of the embodiments of the present application may be considered to be consistent with the teachings of the present application. Accordingly, the embodiments of the present application are not limited to the embodiments explicitly introduced and described in the present application.
Claims
1. A suction cup assembly, characterized in that: include: A suction cup, the suction cup comprising a suction portion for sucking the wafer; and a fixing portion, wherein the fixing portion is provided with a first connecting hole penetrating the fixing portion; A base, used to support the suction cup, the base being provided with a second connection hole matching the first connection hole; a fixing member, configured to be inserted into the first connection hole and the second connection hole in sequence to connect the suction cup to the base; as well as A cover cap is provided to cover the top of the fixing member, the cover cap is interference fit with the first connecting hole, and the top surface of the cover cap is flush with the top surface of the fixing part.
2. The suction cup assembly according to claim 1, characterized in that: The fixing member comprises a head portion, the head portion is provided with a clamping groove; and a rod portion, the rod portion is integrally connected with the head portion, and the outer surface of the rod portion is provided with a thread.
3. The suction cup assembly according to claim 2, characterized in that: The cap comprises a cap portion, which contacts the top surface of the head portion; and a clamping portion, which is integrally connected with the cap portion and matches the clamping slot.
4. The suction cup assembly according to claim 3, characterized in that: The surface of the cap portion is a polished surface.
5. The suction cup assembly according to claim 3, characterized in that: The first connecting hole comprises a wide hole section and a narrow hole section which are integrally connected, the wide hole section is used to accommodate the cap and the head of the fixing member, and the narrow hole section is used to accommodate the rod of the fixing member.
6. The suction cup assembly according to claim 2, characterized in that: A threaded sleeve matching the rod is arranged in the second connecting hole.
7. The suction cup assembly according to claim 2, characterized in that: The cross section of the slot perpendicular to the slot axis is a regular hexagon.
8. The suction cup assembly according to claim 1, characterized in that: The fixing member is provided with a first through hole penetrating the fixing member along the central axis of the fixing member.
9. The suction cup assembly according to claim 8, characterized in that: The cap is provided with a second through hole penetrating the cap along a central axis of the cap, and the second through hole is aligned with the first through hole.
10. The suction cup assembly according to claim 1, characterized in that There are a plurality of first connection holes, and the plurality of first connection holes are centrally symmetrically distributed about the center of the suction cup.
