Chip cleaning device

Abstract

The utility model discloses a chip cleaning device, and belongs to the technical field of cleaning equipment. The chip cleaning device comprises a box body, a clamping assembly, a first driving part, a filtering device and an air extracting device, the box body is provided with a cavity, an air inlet and an air outlet, the air inlet and the air outlet are communicated with the cavity, the filtering device is installed on the air inlet, cleanliness of the cavity is guaranteed, and it is avoided that external dirt enters the cavity to pollute a chip; the first driving part drives the clamping assembly to rotate, the to-be-cleaned chip is installed on the clamping assembly, the chip rotates together, dirt on the chip is separated from the chip under the action of centrifugal force, and the function of cleaning the chip is achieved. Besides, the projection of the air outlet on the clamping assembly at least partially coincides with the clamping assembly in the direction perpendicular to the rotating shaft of the clamping assembly, so that smudginess thrown out of the chip can be sucked out by the air outlet in time, the separated smudginess is prevented from floating in the cavity to a certain extent, and the cleaning effect is guaranteed.

Description

Technical Field

[0001] The present application belongs to the technical field of cleaning equipment, and in particular, relates to a chip cleaning device. Background Art

[0002] Although the chip is manufactured in a clean room during the device manufacturing process, dirt may still be introduced onto the external surface during many process steps. The main types of dirt include hair, particles, dust, cracked debris, residual glue, water stains, etc. Therefore, the chip needs to be cleaned.

[0003] Due to the precise structure of the chip, the high surface quality requirements, and the brittle nature of the surface film, there are limited ways to clean the chip surface. Currently, there are two main chip surface cleaning technologies: (1) manual wiping with a cotton swab or adhesive stick; (2) purging with gas or gas-solid mixed media. These two methods have the following shortcomings that are difficult to solve: 1) Manual wiping with dust-free cotton swabs or sticky sticks: This method has high requirements on operating skills and low cleaning efficiency. Large-scale production requires training of a large number of skilled workers and has high labor costs. At the same time, it is easy to cause scratches on the surface layer, affecting the quality of the surface film layer, resulting in chip scrapping. Dust-free cotton swabs are disposable items and cannot be reused after wiping. Long-term consumables lead to increased costs. After wiping with an adhesive stick, there may be residual glue on the surface, thereby introducing new dirt, resulting in chip scrapping, and the quality stability of the adhesive stick is required to be high; 2) Gas purging: The cleaning effect is poor and can only blow away a small part of the floating dust. The cleaning effect of gas-solid mixed medium (such as dry ice cleaning) purging is better than gas purging, but the solid granular medium can easily destroy the film structure on the chip surface, resulting in film peeling or cracking, causing the chip to be scrapped.

[0004] Therefore, there is a technical problem in the related art that the chip cleaning effect is not good. Utility Model Content

[0005] The present application aims to at least to some extent solve the technical problem of poor chip cleaning effect in the related art. To this end, the present application provides a chip cleaning device.

[0006] The embodiment of the present application provides a chip cleaning device, comprising:

[0007] A box body, comprising a cavity and an air inlet and an air outlet communicated with the cavity;

[0008] A clamping assembly and a first driving member, wherein the clamping assembly is located in the cavity and is used to clamp the chip; the first driving member is in transmission connection with the clamping assembly so that the clamping assembly drives the chip to rotate; along a direction perpendicular to the rotation axis of the clamping assembly, the projection of the air outlet on the clamping assembly at least partially overlaps with the clamping assembly;

[0009] A filtering device, arranged at the air inlet;

[0010] An air extraction device is arranged at the air outlet.

[0011] In some embodiments, along the height direction of the cavity, a projection of the air inlet on the clamping component at least partially overlaps with the clamping component.

[0012] In some embodiments, the air inlet is located directly above the clamping assembly.

[0013] In some embodiments, the chip cleaning device further comprises an air blowing pipe, which passes through the box body, wherein the outlet of the air blowing pipe is located in the cavity and faces the clamping assembly, and the inlet of the air blowing pipe is located outside the cavity for connection with an air source.

[0014] In some embodiments, the clamping assembly includes a first fixing plate and a second fixing plate, and the first fixing plate and the second fixing plate are detachably connected; when the first fixing plate and the second fixing plate are connected, the first fixing plate and the second fixing plate are combined to form a fixing groove for fixing the chip.

[0015] In some embodiments, the box body further has an observation hole connected to the cavity, and the chip cleaning device further includes a detection device, which is installed on the box body, and an observation head of the detection device is located in the observation hole.

[0016] In some embodiments, the observation hole is located above the air outlet.

[0017] In some embodiments, the air inlet is higher than the observation hole.

[0018] In some embodiments, the chip cleaning device has a plurality of clamping components, and the plurality of clamping components are sequentially arranged along the height direction of the cavity.

[0019] In some embodiments, the chip cleaning device further includes a screw rod, a guide rod, a slider, and a second driving member;

[0020] The screw and the guide rod are arranged along the height direction of the cavity, the screw is rotatably connected to the box, and the guide rod is fixedly connected to the box; the slider is threadedly connected to the screw and slidably connected to the guide rod along the height direction of the cavity; the second driving member is installed on the box and is drivingly connected to the screw;

[0021] The first driving member is installed on the sliding block, and the output end of the first driving member is fixedly connected to the clamping assembly.

[0022] The utility model has at least the following beneficial effects:

[0023] The chip cleaning device of the present application includes a housing, a clamping assembly, a first driving member, a filtering device and an exhaust device. The housing has a cavity and an air inlet and an air outlet connected to the cavity. The filtering device is installed on the air inlet to ensure the cleanliness of the cavity and prevent external dirt from entering the cavity and contaminating the chip; the first driving member drives the clamping assembly to rotate, and the chip to be cleaned is installed on the clamping assembly, so that the chip rotates together, and then the dirt on the chip is separated from the chip under the action of centrifugal force, thereby realizing the function of cleaning the chip; in addition, since the projection of the air outlet on the clamping assembly at least partially overlaps with the clamping assembly along the direction perpendicular to the rotation axis of the clamping assembly, the dirt thrown off the chip can be sucked out by the air outlet in time, which to a certain extent prevents the detached dirt from floating in the cavity, thereby ensuring the cleaning effect.

[0024] In summary, the chip cleaning device of the present application ensures the cleanliness of the cavity through a filtering device, separates the dirt on the chip through centrifugal action, and ensures that the dirt separated by centrifugation is quickly extracted and removed from the cavity through an air outlet and a vacuum device, thereby preventing the dirt separated by centrifugation from floating in the cavity and re-attaching to the chip to cause secondary pollution. The cleaning efficiency is high and the cleaning effect is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 A schematic diagram of the structure of a chip cleaning device in one or more embodiments of the present application is shown.

[0027] Figure 2 Shows Figure 1 A half-section schematic diagram showing the vacuum device and the filter device hidden and the clamping assembly aligned with the air outlet.

[0028] Figure 3 Shows Figure 1 A half-section diagram showing the vacuum device and the filter device hidden and the clamping assembly aligned with the observation hole.

[0029] Figure 4 Shows Figure 2 Schematic diagram of the structure after the upper box, support frame, detection device and air blowing pipe are hidden Figure 1 .

[0030] Figure 5 Shows Figure 4 Enlarged view of point A in the middle.

[0031] Figure 6 Shows Figure 2 Schematic diagram of the structure after the upper box, support frame, detection device and air blowing pipe are hidden Figure 2 .

[0032] Figure markings: 100-chip cleaning device, 105-box, 1051-upper box, 1052-lower end cover, 105a-cavity, 105b-air inlet, 105c-air outlet, 105d-observation hole, 110-clamping assembly, 110a-fixing groove, 111-first fixed plate, 112-second fixed plate, 115-first driving member, 1151-output end, 120-filtering device, 125-exhaust device, 130-support frame, 135-blowing pipe, 140-screw, 145-guide rod, 150-slider, 155-second driving member, 160-detection device. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0034] It should be noted that all directional indications in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0035] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] In addition, in the present utility model, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0037] Although the chip is manufactured in a clean room during the device manufacturing process, dirt may still be introduced onto the external surface during many process steps. The main types of dirt include hair, particles, dust, cracked debris, residual glue, water stains, etc. Therefore, the chip needs to be cleaned.

[0038] Due to the precise structure of the chip, the high surface quality requirements, and the brittle nature of the surface film, there are limited ways to clean the chip surface. Currently, there are two main chip surface cleaning technologies: (1) manual wiping with a cotton swab or adhesive stick; (2) purging with gas or gas-solid mixed media. These two methods have the following shortcomings that are difficult to solve: 1) Manual wiping with dust-free cotton swabs or sticky sticks: This method has high requirements on operating skills and low cleaning efficiency. Large-scale production requires training of a large number of skilled workers and has high labor costs. At the same time, it is easy to cause scratches on the surface layer, affecting the quality of the surface film layer, resulting in chip scrapping. Dust-free cotton swabs are disposable items and cannot be reused after wiping. Long-term consumables lead to increased costs. After wiping with an adhesive stick, there may be residual glue on the surface, thereby introducing new dirt, resulting in chip scrapping, and the quality stability of the adhesive stick is required to be high; 2) Gas purging: The cleaning effect is poor and can only blow away a small part of the floating dust. The cleaning effect of gas-solid mixed medium (such as dry ice cleaning) purging is better than gas purging, but the solid granular medium can easily destroy the film structure on the chip surface, resulting in film peeling or cracking, causing the chip to be scrapped.

[0039] Therefore, there is a technical problem in the related art that the chip cleaning effect is not good.

[0040] In the related art, there is a technical problem that the chip cleaning effect is not good. The embodiment of the present application provides a chip cleaning device, which can at least solve the technical problem of the chip cleaning effect being not good to a certain extent.

[0041] The present application is described below with reference to the accompanying drawings and specific embodiments:

[0042] The embodiment of the present application provides a chip cleaning device, and the chip cleaning device provided by the embodiment of the present application can improve the chip cleaning efficiency and chip cleaning effect.

[0043] like Figure 1 and Figure 2 As shown, the chip cleaning device 100 includes a housing 105 , a clamping assembly 110 , a first driving member 115 , a filtering device 120 and an exhaust device 125 .

[0044] The housing 105 has a cavity 105a and an air inlet 105b and an air outlet 105c connected to the cavity 105a. The clamping assembly 110 is located in the cavity 105a and is used to clamp the chip. The first driving member 115 is in transmission connection with the clamping assembly 110 so that the clamping assembly 110 drives the chip to rotate. Along the direction perpendicular to the rotation axis of the clamping assembly 110, the projection of the air outlet 105c on the clamping assembly 110 at least partially overlaps with the clamping assembly 110. The filtering device 120 is arranged at the air inlet 105b, and the air extraction device 125 is arranged at the air outlet 105c.

[0045] The filter device 120 filters the gas entering the air inlet 105. Its structure is diverse and is well known to those skilled in the art, so it will not be described in detail here. In some embodiments, the filter device 120 is an ion blower with a 100-level filter element to filter the gas and also to supply air to the cavity 105a to ensure sufficient air intake at the air inlet 105b.

[0046] The air suction device 125 is connected to the air outlet 105 to suck dirt detached from the chip out of the cavity 105a. In some embodiments, the air suction device 125 is a dust removal fan.

[0047] The clamping assembly 110 clamps the chip to fix the chip and prevent the chip from flying out when the first driving member 115 rotates. The structure of the clamping assembly 110 is diverse and is not limited in this application. For example, a mounting groove can be provided on the clamping assembly 110, and the chip can be clamped and fixed by the mounting groove; for another example, the clamping assembly includes a clamping plate and an elastic sheet located on the clamping plate, one end of the elastic sheet is fixedly connected to the clamping plate, and the other end is used to clamp the chip, and the chip is fixed on the clamping plate under the action of the elastic force of the elastic sheet.

[0048] Along the direction perpendicular to the rotation axis of the clamping assembly 110, the projection of the air outlet 105c on the clamping assembly 110 at least partially overlaps with the clamping assembly 110. That is to say, when the clamping assembly 110 rotates around the rotation axis, the air outlet 105c is projected toward the clamping assembly 110 along the direction perpendicular to the rotation axis, and the projection of the air outlet 105c will overlap with the clamping assembly 110. In this way, the air outlet 105c and the clamping assembly 110 at least partially overlap in the height direction, and the air outlet 105c is closer to the clamping assembly 110. After the dirt on the chip is thrown out tangentially under the action of centrifugal force, it can be discharged to the outside of the cavity 105a in time through the air outlet 105c.

[0049] After such design, the filter device 120 filters the gas entering the cavity 105a from the air inlet 105b, thereby ensuring the cleanliness of the gas in the cavity 105a; the first driving member 115 drives the clamping assembly 110 to rotate, thereby driving the chip on the clamping assembly 110 to rotate, so that the dirt on the chip is separated from the chip under the action of centrifugal force, so as to clean the dirt on the chip and improve the cleaning efficiency; in addition, since the projection of the air outlet 105c on the clamping assembly 110 is at least partially aligned with the clamping assembly 110 in a direction perpendicular to the rotation axis of the clamping assembly 110, The holding component 110 overlaps, so that the air outlet 105c and the clamping component 110 at least partially overlap in the height direction. The air outlet 105c is close to the clamping component 110, which shortens the movement distance of dirt out of the cavity 105a. Therefore, the dirt thrown out tangentially from the chip can be discharged to the outside of the cavity 105a through the air outlet 105c in time, which to a certain extent prevents the dirt from floating in the cavity 105a and re-attaching to the chip to cause secondary pollution, thereby ensuring the cleaning effect of the chip cleaning device 100 and also helping to improve the cleaning efficiency.

[0050] In some embodiments, along the height direction of the cavity 105a, the projection of the gas inlet 105b on the clamping assembly 110 at least partially overlaps with the clamping assembly 110. In this way, the gas entering from the gas inlet 105b can be directly blown on the clamping assembly 110, thereby blowing and cleaning the chip on the clamping assembly 110, which helps to quickly separate dirt from the chip surface, thereby enhancing the cleaning efficiency and cleaning effect.

[0051] In some embodiments, Figure 2 As shown, the air inlet 105b is located directly above the clamping assembly 110. This design increases the area of ​​the clamping assembly 110 that is swept by the air inlet 105b, further enhancing the cleaning efficiency and cleaning effect.

[0052] In some embodiments, when the chip is clamped on the clamping assembly 110, the surface of the chip to be cleaned faces the air inlet 105b, so that the gas entering the air inlet 105b directly acts on the surface of the chip to be cleaned, thereby ensuring the cleaning effect.

[0053] In some embodiments, the chip cleaning device 100 further includes an air blow pipe 135, which runs through the housing 105, the outlet of the air blow pipe 135 is located in the cavity 105a and faces the clamping assembly 110, and the inlet of the air blow pipe 135 is located outside the cavity 105a for connection with a gas source. In other words, the air blow pipe 135 extends into the cavity 105a, the gas outlet thereon is also located in the cavity 105a, and the inlet of the air blow pipe 135 is located outside the cavity 105a for connection with a gas source, so that the gas can purge the chip on the clamping assembly 110. With this design, the chip can be purged through the air blow pipe 135 before or after centrifugal cleaning to enhance the cleaning effect.

[0054] In some embodiments, Figure 4 and Figure 5 As shown, the clamping assembly 10 includes a first fixed disk 111 and a second fixed disk 112, and the first fixed disk 111 and the second fixed disk 112 are detachably connected. When the first fixed disk 111 and the second fixed disk 112 are connected, the first fixed disk 111 and the second fixed disk 112 are surrounded to form a fixed groove 110a for fixing the chip. After such a design, when installing the chip, the chip is first placed on the first fixed disk 111 or the second fixed disk 112, and then the first fixed disk 111 and the second fixed disk 112 are connected together, and the chip is located in the fixed groove 110a and fixed between the first fixed disk 111 and the second fixed disk 112 under the action of the fixed groove 110a. When disassembling the chip, the first fixed disk 111 and the second fixed disk 112 can be disassembled and removed. Under the action of centrifugal force, the dirt on the surface of the chip is thrown out through the notch of the fixed groove 110a.

[0055] like Figure 4 and Figure 5 As shown, in some embodiments, the first fixed disk 111 and the second fixed disk 112 are both circular disks with the same diameter, a circle of through holes is provided along the edge of the first fixed disk 111, and a groove is provided along the edge of the second fixed disk 112, the number of the grooves and the through holes is the same, and their positions correspond to each other, and the first fixed disk 111 and the second fixed disk 112 are detachably connected by bolts. When the first fixed disk 111 and the second fixed disk 112 are fixed by bolts, the relative through holes and grooves are surrounded to form a fixed groove 110a, and a plurality of fixed grooves 110a are formed to fix multiple chips at the same time, so as to improve the cleaning efficiency of the chip cleaning device 100.

[0056] In order to observe the effect of chip cleaning, in some embodiments, Figure 2As shown, the box 105 also has an observation hole 105d connected to the cavity 105a, and the chip cleaning device 100 also includes a detection device 160, which is installed in the box 105, and the observation head of the detection device 160 is located in the observation hole 105d. The detection device 160 can be a microscope or the like.

[0057] In some embodiments, the detection device 160 is an automatic optical inspection system (AOI system), and the AOI lens of the AOI system is located in the observation hole 105d to automatically observe the cleaning effect of the chip.

[0058] In some embodiments, in order to prevent the dirt thrown off by centrifugal action from adhering to the observation head of the detection device 160 and affecting the observation effect, the observation hole 105d is located above the air outlet 105c, such as Figure 2 shown.

[0059] In some implementations, the height of the air inlet 105b is higher than the observation hole 105d. With this design, the gas entering the air inlet 105b flows from top to bottom and is discharged from the air outlet 105c, which helps to prevent the dirt thrown away from floating upward and contaminating the detection device 160 in the observation hole 105d.

[0060] In some embodiments, the chip cleaning device 100 has a plurality of clamping assemblies 110, and the plurality of clamping assemblies 110 are sequentially arranged along the height direction of the box body 105. The arrangement of the plurality of clamping assemblies 110 helps to increase the number of chips cleaned by the chip cleaning device 100 at a time, thereby helping to improve the cleaning efficiency. Figure 2 As shown, two clamping assemblies 110 are provided.

[0061] In some embodiments, the chip cleaning device 100 further includes a screw 140, a guide rod 145, a slider 150, and a second driving member 155. The screw 140 and the guide rod 145 are arranged along the height direction of the cavity 105a, the screw 140 is rotatably connected to the box 105, and the guide rod 145 is fixedly connected to the box 105; the slider 150 is threadedly connected to the screw 140 and slidably connected to the guide rod 145 along the height direction of the cavity 105a; the second driving member 155 is installed on the box 105 and is transmission-connected to the screw 140. The first driving member 115 is installed on the slider 150, and the output end 1151 of the first driving member 115 is fixedly connected to the clamping assembly 110.

[0062] With this design, since the output end 1151 of the first driving member 115 is fixedly connected to the clamping assembly 110, the rotation of the first driving member 115 can drive the clamping assembly 110 to rotate, so that the chip rotates, thereby centrifugally separating the dirt on the chip.

[0063] With this design, when the observation hole 105d is located above the air outlet 105c, the second driving member 155 can be controlled to rotate, which can drive the screw rod 140 to rotate, and then drive the slider 150 to slide upward along the guide rod 145, and then drive the first driving member 115 and the clamping assembly 110 to move upward, so that the clamping assembly 110 is aligned with the observation hole 105d, so that the detection device 160 can detect the cleaning effect of the chip. When the chip is centrifugally cleaned, the second driving member 155 can be controlled to rotate, which can drive the screw rod 140 to rotate, and then drive the slider 150 to slide downward along the guide rod 145, and then drive the first driving member 115 and the clamping assembly 110 to move downward, so that the clamping assembly 110 is aligned with the air outlet 105c, so that the separated dirt can be sucked out from the air outlet 105c in time.

[0064] With this design, when the second driving member 155 is controlled to rotate so that the clamping assembly 110 is aligned with the observation hole 105d, the first driving member 115 can also be controlled to rotate slowly, so that the clamping assembly 110 drives the chip thereon to rotate slowly, so that the detection device 160 can detect each chip in turn. When it is detected that the cleaning of a chip does not meet the standard, it can be purged through the blowing pipe 135 to enhance the cleaning.

[0065] The working principle of the chip cleaning device of the present application is as follows: first, fix the chips into each fixing groove 110a in turn; then, turn on the filtering device 120 and the exhaust device 125; then, turn on the first driving member 115 to drive the chip to rotate so that the dirt is centrifuged and separated; after the centrifugation is completed, turn on the second driving member 155 to make the clamping assembly 110 rise to align with the observation hole 105d; then, slowly rotate the first driving member 115 to make the clamping assembly 110 rotate slowly; then, detect each chip in turn through the detection device 160. If the cleaning effect of a chip is not good, blow it through the blowing pipe 135. If the cleaning effect of multiple chips is not good, turn on the second driving member 155 to make the clamping assembly 110 descend to align with the air outlet 105c, and start the first driving member 115 again for centrifugal separation until the chip cleaning effect meets the requirements.

[0066] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0067] In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0068] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A chip cleaning device, characterized in that: include: A box body (105) having a cavity (105a) and an air inlet (105b) and an air outlet (105c) in communication with the cavity (105a); A clamping assembly (110) and a first driving member (115), wherein the clamping assembly (110) is located in the cavity (105a) and is used to clamp the chip; the first driving member (115) is transmission-connected to the clamping assembly (110) so that the clamping assembly (110) drives the chip to rotate; along a direction perpendicular to the rotation axis of the clamping assembly (110), a projection of the air outlet (105c) on the clamping assembly (110) at least partially overlaps with the clamping assembly (110); A filtering device (120) is arranged at the air inlet (105b); The air extraction device (125) is arranged at the air outlet (105c).

2. The chip cleaning device according to claim 1, characterized in that: Along the height direction of the cavity (105a), a projection of the air inlet (105b) on the clamping component (110) at least partially overlaps with the clamping component (110).

3. The chip cleaning device according to claim 2, characterized in that: The air inlet (105b) is located directly above the clamping assembly (110).

4. The chip cleaning device according to claim 1, characterized in that: The chip cleaning device (100) further comprises an air blowing pipe (135), wherein the air blowing pipe (135) passes through the box (105), wherein the outlet of the air blowing pipe (135) is located in the cavity (105a) and faces the clamping assembly (110), and the inlet of the air blowing pipe (135) is located outside the cavity (105a) for connection with an air source.

5. The chip cleaning device according to claim 1, characterized in that: The clamping assembly (110) comprises a first fixing plate (111) and a second fixing plate (112), wherein the first fixing plate (111) and the second fixing plate (112) are detachably connected; when the first fixing plate (111) and the second fixing plate (112) are connected, the first fixing plate (111) and the second fixing plate (112) are combined to form a fixing groove (110a) for fixing the chip.

6. The chip cleaning device according to claim 1, characterized in that: The box (105) also has an observation hole (105d) connected to the cavity (105a), and the chip cleaning device (100) also includes a detection device (160). The detection device (160) is installed on the box (105), and the observation head of the detection device (160) is located in the observation hole (105d).

7. The chip cleaning device according to claim 6, characterized in that: The observation hole (105d) is located above the air outlet (105c).

8. The chip cleaning device according to claim 7, characterized in that: The height of the air inlet (105b) is higher than the observation hole (105d).

9. The chip cleaning device according to claim 1, characterized in that: The chip cleaning device (100) comprises a plurality of clamping assemblies (110), and the plurality of clamping assemblies (110) are arranged in sequence along the height direction of the cavity (105a).

10. The chip cleaning device according to any one of claims 1 to 9, characterized in that: The chip cleaning device (100) further comprises a screw rod (140), a guide rod (145), a slider (150) and a second driving member (155); The screw rod (140) and the guide rod (145) are arranged along the height direction of the cavity (105a); the screw rod (140) is rotatably connected to the box (105), and the guide rod (145) is fixedly connected to the box (105); the slider (150) is threadedly connected to the screw rod (140) and is slidably connected to the guide rod (145) along the height direction of the cavity (105a); the second driving member (155) is installed on the box (105) and is drivingly connected to the screw rod (140); The first driving member (115) is mounted on the sliding block (150), and an output end (1151) of the first driving member (115) is fixedly connected to the clamping assembly (110).

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