Grinding and polishing equipment for wafer packaging

Abstract

The utility model belongs to the technical field of wafer manufacturing and processing, and particularly relates to grinding and polishing equipment for wafer packaging. Comprising a workbench, a polishing solution storage cavity and a waste liquid collection cavity are formed in the workbench, a polishing solution conveying mechanism and a waste liquid collection mechanism are arranged in the workbench, and a wafer grinding assembly is arranged on the workbench and surrounds the polishing solution conveying mechanism and the waste liquid collection mechanism. According to the utility model, the fan is arranged, and a polished polishing solution is quickly blown down from a wafer through quick airflow, so that the effect is similar to that of a scraper, the waste liquid of the blown wafer can be quickly discharged, the mixing proportion of the waste liquid and the polishing solution is reduced, and the polishing effect and efficiency are higher; in addition, through the design of a waste liquid collecting mechanism, the environment in the workbench is more clean and tidy, and the problem that sewage flows away is solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer manufacturing and processing, and specifically relates to a grinding and polishing device for wafer packaging. Background Art

[0002] Wafer packaging and polishing is an important process in the semiconductor manufacturing process. The quality of wafer packaging and polishing has an important impact on the performance, integration and reliability of the chip. As chips become thinner and more integrated, the requirements for wafer grinding technology are also increasing, and the process needs to be continuously improved to solve new problems. For example, in the traditional polishing method, after the polishing liquid is delivered to the wafer, it is dispersed through the fluidity of the polishing liquid itself, so that the processed polishing liquid and the unprocessed polishing liquid will be mixed to a certain extent, affecting the normal processing and grinding of the wafer. In response to the above problems, an efficient grinding and polishing equipment for wafer packaging is proposed. Utility Model Content

[0003] In order to solve the problems existing in the background technology, the utility model provides a grinding and polishing device for wafer packaging; it is capable of quickly draining the polishing liquid after being processed, so that the mixing amount of waste liquid and polishing liquid is reduced.

[0004] The utility model provides a grinding and polishing device for wafer packaging, comprising a workbench, wherein a polishing liquid storage chamber and a waste liquid collection chamber are arranged in the workbench, a polishing liquid conveying mechanism and a waste liquid collection mechanism are arranged in the workbench, and a wafer grinding assembly is arranged on the workbench around the polishing liquid conveying mechanism and the waste liquid collection mechanism; the wafer grinding assembly comprises a motor 1 located in the workbench, a turntable is fixedly installed at the output end of the motor 1, a cavity is arranged in the turntable, an electric hydraulic rod 1 is fixedly installed in the cavity, and a movable end of the electric hydraulic rod 1 is fixedly installed There is a control disk, a support plate is provided on the control disk, one end of the support plate extends out of the turntable, a fan is provided on the workbench, a filter is provided at the air inlet position of the fan, a connecting pipe is provided on the inner top surface of the workbench corresponding to the turntable, a plurality of manifolds are connected to the connecting pipe, the other end of the manifold is connected to a transfer pipe, a plurality of flat air outlets are evenly connected to the transfer pipe, an electric hydraulic rod 2 is fixedly installed on the inner top surface of the workbench, a motor 2 is fixedly installed on the movable end of the electric hydraulic rod 2, and a grinding disc is fixedly installed on the output end of the motor 2.

[0005] Furthermore, the polishing liquid delivery mechanism includes a water pump located in the polishing liquid storage chamber, a pipeline is fixedly installed in the workbench, a gooseneck is connected to the pipeline, a nozzle is connected to the gooseneck, and the water pump and the pipeline are connected to each other.

[0006] Furthermore, the waste liquid collection mechanism includes an arc-shaped groove located in the workbench and arranged around the turntable, and a through hole is provided on the workbench corresponding to the arc-shaped groove, and the through hole is communicated with the waste liquid collection chamber.

[0007] Furthermore, a water supply pipe and a drainage pipe are respectively provided on both sides of the workbench corresponding to the polishing liquid storage chamber and the waste liquid collection chamber.

[0008] Furthermore, a plurality of suction cups are evenly arranged on the turntable.

[0009] Furthermore, a trapezoidal platform is provided on the workbench corresponding to motor 1.

[0010] Furthermore, the transfer tube is at an angle of 45° to the inner wall of the workbench.

[0011] Beneficial effects of the utility model:

[0012] The utility model uses a fan to quickly blow the polishing liquid that has been ground off the wafer through a rapid airflow, which is similar to the effect of a scraper, so that the waste liquid of the wafer that has been blown can be quickly discharged, reducing the proportion of mixing with the polishing liquid, so that the polishing effect and efficiency are higher; in addition, the design of the waste liquid collection mechanism also makes the environment inside the workbench cleaner and alleviates the problem of sewage dispersion. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a left-side stereoscopic diagram of a grinding and polishing device for wafer packaging according to the utility model.

[0014] Figure 2 This is a right side stereogram of a grinding and polishing device for wafer packaging according to the utility model.

[0015] Figure 3 It is a partial cross-sectional view of a front view of a grinding and polishing device for wafer packaging according to the utility model.

[0016] Figure 4 The utility model is a partial cross-sectional view of a grinding and polishing device for wafer packaging, viewed from above.

[0017] Figure 5 The utility model is a cross-sectional view of a turntable of a grinding and polishing device for wafer packaging.

[0018] As shown in the figure:

[0019] 1. Workbench, 2. Polishing liquid storage chamber, 3. Waste liquid collection chamber, 4. Motor 1, 5. Turntable, 6. Cavity, 7. Electric hydraulic rod 1, 8. Control panel, 9. Support plate, 10. Fan, 11. Filter, 12. Connecting pipe, 13. Manifold, 14. Transfer pipe, 15. Flat air outlet, 16. Electric hydraulic rod 2, 17. Motor 2, 18. Grinding disc, 19. Water pump, 20. Pipeline, 21. Gooseneck pipe, 22. Nozzle, 23. Arc groove, 24. Through hole, 25. Water supply pipe, 26. Drain pipe, 27. Suction cup, 28. Trapezoidal table. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] In the description of the utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the utility model can be understood according to specific circumstances.

[0022] Please see all instructions drawings:

[0023] A wafer packaging grinding and polishing device comprises a workbench 1, a polishing liquid storage chamber 2 and a waste liquid collection chamber 3 are arranged in the workbench 1, a polishing liquid conveying mechanism and a waste liquid collection mechanism are arranged in the workbench 1, and a wafer grinding assembly is arranged on the workbench 1 around the polishing liquid conveying mechanism and the waste liquid collection mechanism;

[0024] The wafer grinding assembly includes a motor 4 located in the workbench 1, a turntable 5 is fixedly installed at the output end of the motor 4, a cavity 6 is provided in the turntable 5, an electric hydraulic rod 7 is fixedly installed in the cavity 6, a control disk 7 is fixedly installed on the movable end of the electric hydraulic rod 7, a support plate 9 is provided on the control plate 8, one end of the support plate 9 extends out of the turntable 5, a fan 10 is provided on the workbench 1, a filter screen 11 is provided at the air inlet position of the fan 10, a connecting pipe 12 is provided on the inner top surface of the workbench 1 corresponding to the turntable 5, a plurality of manifolds 13 are connected to the connecting pipe 12, the other end of the manifold 13 is connected to a transfer pipe 14, and a plurality of flat air outlets 15 are evenly connected to the transfer pipe 14, an electric hydraulic rod 2 16 is fixedly installed on the inner top surface of the workbench 1, a motor 2 17 is fixedly installed on the movable end of the electric hydraulic rod 2 16, and a grinding disk 18 is fixedly installed on the output end of the motor 2 17;

[0025] From the above description, it can be seen that when in use, the wafer is placed on the turntable 5, and the wafer is kept in a horizontal position through the support of the support plate 9. When grinding in the later stage, the finished product effect is better; then the power is turned on, the polishing liquid delivery mechanism works to deliver the polishing liquid to the wafer, the electric hydraulic rod 16 drives the grinding disc 18 to a suitable position, and the control motor 17 works to drive the grinding disc 18 to rotate. A part of the waste liquid after grinding will remain on the wafer, and the fan 10 is controlled to work so that a fast airflow passes through the flat air outlet 15 through the upper surface of the wafer, forming a scraper-like effect, which quickly blows the waste liquid off the wafer, reduces the amount of mixing of waste liquid and polishing liquid, and improves the quality of grinding and polishing.

[0026] As a technical optimization solution of the utility model, the polishing liquid delivery mechanism includes a water pump 19 located in the polishing liquid storage chamber 2, a pipeline 20 is fixedly installed in the workbench 1, a gooseneck tube 21 is connected to the pipeline 20, a nozzle 22 is connected to the gooseneck tube 21, and the water pump 19 and the pipeline 20 are connected to each other;

[0027] From the above description, it can be seen that the polishing liquid is pumped up by the water pump 19, and is transported to the wafer through the pipeline 20, the gooseneck 21 and the nozzle 22, and is coordinated with the rotation of the motor 1 4 and the rotation of the motor 2 17 to perform efficient polishing and grinding.

[0028] As a technical optimization solution of the utility model, the waste liquid collection mechanism includes an arc-shaped groove 23 located in the workbench 1 and arranged around the turntable 5, and a through hole 24 is provided on the workbench 1 corresponding to the arc-shaped groove 23, and the through hole 24 is connected to the waste liquid collection chamber 3;

[0029] From the above description, it can be seen that the arc groove 23 can collect the waste liquid dripping around the turntable 5 and flow into the waste liquid collection chamber 3 through the through hole 24. The overall collection effect is relatively ideal, which optimizes the phenomenon of waste liquid flowing everywhere on the table surface of the workbench 1.

[0030] As a technical optimization solution of the utility model, a water supply pipe 25 and a drainage pipe 26 are respectively provided on both sides of the workbench 1 corresponding to the polishing liquid storage chamber 2 and the waste liquid collection chamber 3;

[0031] It can be seen from the above description that the water replenishment pipe 25 can replenish the polishing liquid storage chamber 2 with polishing liquid; and the drainage pipe 26 can discharge the waste liquid that cannot be reused in time.

[0032] As a technical optimization solution of the utility model, a plurality of suction cups 27 are evenly arranged on the turntable 5;

[0033] It can be seen from the above description that the vacuum adsorption capability of the suction cup 27 can adsorb the wafer well, and the support plate 9 can be adjusted to ensure that the wafer has a certain horizontal position.

[0034] As a technical optimization solution of the utility model, a trapezoidal platform 28 is provided on the workbench 1 corresponding to the motor 1 4;

[0035] From the above description, it can be seen that the trapezoidal platform 28 can prevent the waste liquid from soaking into the motor 4, and can effectively protect the motor 4.

[0036] As a technical optimization solution of the utility model, the transfer tube 14 is at 45° with the inner wall of the workbench 1;

[0037] From the above description, it can be seen that, compared with the design perpendicular to the turntable 5, blowing the waste liquid on the wafer at an angle, combined with the rotation of the wafer itself, can better blow the waste liquid off.

[0038] Working principle:

[0039] When in use, the wafer is placed on the turntable 5, and initially adsorbed by the suction cup 27, and then the electric hydraulic rod 7 is controlled to work, and the wafer is kept in a horizontal position through the support of the support plate 9, so that the finished product effect is better during the later grinding; then the power is turned on, the polishing liquid delivery mechanism works to deliver the polishing liquid to the wafer, the electric hydraulic rod 2 16 drives the grinding disc 18 to a suitable position, and the motor 17 is controlled to work to drive the grinding disc 18 to rotate. A part of the waste liquid after grinding will remain on the wafer, and the fan 10 is controlled to work so that a fast airflow passes through the upper surface of the wafer through the flat air outlet 15, forming a scraper-like effect, which quickly blows the waste liquid off the wafer, reduces the amount of mixing of the waste liquid and the polishing liquid, and improves the quality of grinding and polishing.

[0040] The above describes the utility model and its implementation methods, which are not restrictive. The specific implementation method is only one of the implementation methods of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it, without departing from the purpose of the invention of the utility model, they can design a structure and embodiment similar to the technical solution without creativity, which should belong to the protection scope of the utility model.

Claims

1. A grinding and polishing device for wafer packaging, comprising a workbench, characterized in that: A polishing liquid storage chamber and a waste liquid collection chamber are provided in the workbench, a polishing liquid conveying mechanism and a waste liquid collection mechanism are provided in the workbench, and a wafer grinding assembly is provided on the workbench around the polishing liquid conveying mechanism and the waste liquid collection mechanism; the wafer grinding assembly includes a motor 1 located in the workbench, a turntable is fixedly installed at the output end of the motor 1, a cavity is provided in the turntable, an electric hydraulic rod 1 is fixedly installed in the cavity, a control disk is fixedly installed on the movable end of the electric hydraulic rod 1, a support plate is provided on the control plate, one end of the support plate extends out of the turntable, a fan is provided on the workbench, a filter is provided at the air inlet position of the fan, a connecting pipe is provided on the inner top surface of the workbench corresponding to the turntable, a plurality of manifolds are connected to the connecting pipe, the other end of the manifold is connected to a transfer pipe, and a plurality of flat air outlets are evenly connected to the transfer pipe, an electric hydraulic rod 2 is fixedly installed on the inner top surface of the workbench, a motor 2 is fixedly installed on the movable end of the electric hydraulic rod 2, and a grinding disk is fixedly installed on the output end of the motor 2.

2. The grinding and polishing equipment for wafer packaging according to claim 1, characterized in that: The polishing liquid conveying mechanism includes a water pump located in the polishing liquid storage chamber. A pipeline is fixedly installed in the workbench. The pipeline is connected with a gooseneck pipe, and the gooseneck pipe is connected with a nozzle. The water pump and the pipeline are connected with each other.

3. The grinding and polishing equipment for wafer packaging according to claim 2, characterized in that: The waste liquid collection mechanism comprises an arc-shaped groove located in the workbench and arranged around the turntable, and a through hole is arranged on the workbench corresponding to the arc-shaped groove, and the through hole is communicated with the waste liquid collection chamber.

4. The grinding and polishing equipment for wafer packaging according to claim 3, characterized in that: A water supply pipe and a drainage pipe are respectively provided on both sides of the workbench corresponding to the polishing liquid storage chamber and the waste liquid collection chamber.

5. The grinding and polishing equipment for wafer packaging according to claim 1, characterized in that: A plurality of suction cups are evenly arranged on the rotating disk.

6. The grinding and polishing equipment for wafer packaging according to claim 1, characterized in that: A trapezoidal platform is arranged on the workbench corresponding to the motor 1.

7. The grinding and polishing equipment for wafer packaging according to claim 1, characterized in that: The transfer tube is at an angle of 45° to the inner wall of the workbench.

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