Silicon steel sheet separating mechanism

Abstract

The utility model relates to a silicon steel sheet separating mechanism, and belongs to the technical field of new energy motor preparation. Comprising a fragmentation material taking mechanism and a fragmentation mechanism, the fragmentation material taking mechanism is located below the fragmentation mechanism, the fragmentation mechanism comprises a fragmentation bottom plate and a fragmentation top plate, and the fragmentation bottom plate and the fragmentation top plate are fixedly connected through a plurality of supporting columns; an upper piece separating mechanism mounting plate is arranged between the piece separating bottom plate and the piece separating top plate and is parallel to the piece separating bottom plate and the piece separating top plate, the upper piece separating mechanism mounting plate is connected to the multiple supporting columns in a sleeving mode and can slide up and down, and an upper piece separating clamping jaw is mounted on the bottom face of the front side of the upper piece separating mechanism mounting plate. A lower piece separating clamping jaw is arranged under the upper piece separating clamping jaw and is symmetrical to the upper piece separating clamping jaw. The automatic slicing and feeding process of the silicon steel sheets is integrally realized, the labor intensity of workers is greatly reduced, the working efficiency is improved, and a guarantee is provided for realizing automatic production in subsequent processes.

Description

Technical Field

[0001] The utility model relates to a silicon steel sheet slicing mechanism and belongs to the technical field of new energy motor preparation. Background Art

[0002] At present, the existing large-scale motor stator silicon steel sheets are all stacked in ingots. Since the thickness of a single sheet is less than 1mm, it is difficult to separate and load the sheets. Therefore, manual separation and loading are basically adopted. The workers have high workload and low work efficiency, which seriously affects the subsequent stacking process.

[0003] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a silicon steel sheet segmentation mechanism to make it more valuable for industrial use. Summary of the invention

[0004] In order to solve the above technical problems, the purpose of the utility model is to provide a silicon steel sheet slicing mechanism.

[0005] The utility model discloses a silicon steel sheet slicing mechanism, comprising a slicing material taking mechanism and a slicing mechanism, wherein the slicing material taking mechanism is located below the slicing mechanism and is used for taking materials for silicon wafers to be sliced; the slicing mechanism comprises a slicing bottom plate and a slicing top plate, wherein the slicing bottom plate and the slicing top plate are fixedly connected via a plurality of supporting columns, an upper slicing mechanism mounting plate is arranged between the slicing bottom plate and the slicing top plate and parallel to the two, the upper slicing mechanism mounting plate can be slidably sleeved on the plurality of supporting columns up and down, an upper slicing clamp is installed on the bottom surface of the front side of the upper slicing mechanism mounting plate, and a lower slicing clamp is arranged symmetrically to the upper slicing clamp directly below the upper slicing clamp.

[0006] Furthermore, the slicing material picking mechanism comprises a material picking installation plate arranged in the vertical direction, a material picking slide rail is arranged vertically on the front surface of the material picking installation plate, a material picking slider is slidably sleeved on the surface of the material picking slide rail, and the material picking slider is connected to the material picking drive motor through a screw rod. The material picking drive motor drives the material picking slider to move up and down along the material picking slide rail.

[0007] Furthermore, a material picking positioning rod is fixedly connected to the top of the material picking slide along the vertical direction, and a material picking claw is provided on the top of the material picking positioning rod, and the material picking claw is matched with the hole on the surface of the silicon wafer to be separated, so that the material picking claw can stably grasp the silicon wafer to be separated, which is convenient for transportation.

[0008] Furthermore, a pair of upper slice mechanism driving cylinders are symmetrically installed on the bottom surfaces of both sides of the upper slice mechanism mounting plate, and the output ends of the upper slice mechanism driving cylinders are fixedly connected to the upper surface of the slice bottom plate. The upper slice mechanism driving cylinders drive the upper slice mechanism mounting plate to move up and down along the direction of the support column.

[0009] Furthermore, the bottom of the lower wafering clamp is fixedly mounted on the upper surface of the wafering bottom plate. The upper wafering clamp and the lower wafering clamp can both clamp and release the silicon wafer to be separated by contracting and opening toward each other.

[0010] Furthermore, a pair of infrared detection mechanisms are symmetrically arranged on both sides of the upper and lower wafering clamps to detect the number of silicon wafers to be separated, so as to facilitate timely replenishment.

[0011] Furthermore, a silicon wafer loading guide column is fixedly installed in the middle position between the upper wafering clamping jaw and the lower wafering clamping jaw.

[0012] Furthermore, a guide plate is provided inside the silicon wafer feeding guide column, and the guide plate matches the slot on the silicon wafer to be separated, so that the silicon wafer to be separated can be accurately fed along the direction of the guide plate.

[0013] Furthermore, the upper wafering clamp and the lower wafering clamp are both provided with a clearance groove, which can accommodate the silicon wafer feeding guide column so that the upper wafering clamp and the lower wafering clamp can directly contact and grasp the silicon wafer to be separated.

[0014] By means of the above scheme, the present invention has at least the following advantages:

[0015] The silicon steel sheet slicing mechanism of the utility model realizes the automatic slicing and feeding process of silicon steel sheets as a whole, greatly reduces the labor intensity of workers, improves work efficiency, and jointly provides guarantee for the realization of automated production in subsequent processes.

[0016] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solution of the embodiment of the utility model, the drawings required for use in the embodiment will be briefly introduced below. It should be understood that the following drawings only show a certain embodiment of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a schematic diagram of the overall structure of the silicon steel sheet separation mechanism of the utility model;

[0019] Figure 2 It is a structural schematic diagram of a slice taking mechanism in a silicon steel slice slice mechanism of the utility model;

[0020] Figure 3 It is a structural schematic diagram of the slicing mechanism in the silicon steel sheet slicing mechanism of the utility model;

[0021] Figure 4 It is a structural schematic diagram of the slicing mechanism in the silicon steel sheet slicing mechanism of the utility model;

[0022] Among them, in the figure;

[0023] 1. Slicing and material taking mechanism; 2. Slicing mechanism; 3. Silicon wafers to be separated;

[0024] 11. Material retrieving mounting plate; 12. Material retrieving slide rail; 13. Material retrieving drive motor; 14. Material retrieving slide block; 15. Material retrieving positioning rod;

[0025] 21. Slicing bottom plate; 22. Slicing top plate; 23. Support column; 24. Upper slicing mechanism mounting plate; 25. Upper slicing mechanism driving cylinder; 26. Silicon wafer feeding guide column; 27. Upper slicing clamp; 28. Lower slicing clamp; 29. ​​Infrared detection mechanism;

[0026] 261. Guide plate; 271. Yield groove. DETAILED DESCRIPTION

[0027] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0028] See also Figure 1 and Figure 2 A silicon steel sheet slicing mechanism according to a preferred embodiment of the utility model comprises a slicing and taking mechanism 1 and a slicing mechanism 2, wherein the slicing and taking mechanism 1 is located below the slicing mechanism 2 and is used to take silicon wafers 3 to be sliced;

[0029] The slicing and picking mechanism 1 includes a picking installation plate 11 arranged in the vertical direction, a picking slide rail 12 is vertically arranged on the front surface of the picking installation plate 11, a picking slider 14 is slidably sleeved on the surface of the picking slide rail 12, the picking slider 14 is transmission-connected with a picking drive motor 13 through a screw rod, and the picking drive motor 13 drives the picking slider 14 to move up and down along the picking slide rail 12, a picking positioning rod 15 is fixedly connected to the top of the picking slider 14 in the vertical direction, and a picking claw is arranged on the top of the picking positioning rod 15, and the picking claw is matched with the hole on the surface of the silicon wafer 3 to be separated, so that the picking claw can stably grab the silicon wafer 3 to be separated, which is convenient for transportation;

[0030] The slicing mechanism 2 includes a slicing bottom plate 21 and a slicing top plate 22, which are fixedly connected by a plurality of support columns 23, and an upper slicing mechanism mounting plate 24 is arranged between the slicing bottom plate 21 and the slicing top plate 22 and parallel to the two, and the upper slicing mechanism mounting plate 24 can be slidably sleeved on the plurality of support columns 23 up and down, and a pair of upper slicing mechanism driving cylinders 25 are symmetrically installed on the bottom surfaces of both sides of the upper slicing mechanism mounting plate 24, and the output end of the upper slicing mechanism driving cylinder 25 is fixedly connected to the upper surface of the slicing bottom plate 21, and the upper slicing mechanism mounting plate 24 is driven by the upper slicing mechanism driving cylinder 25 to move up and down along the direction of the support columns 23, and an upper slicing mechanism clamping claw 27 is installed on the bottom surface of the front side of the upper slicing mechanism mounting plate 24, and a lower slicing clamping claw 28 is arranged symmetrically with the upper slicing clamping claw 27 directly below the upper slicing clamping claw 27, and the bottom of the lower slicing clamping claw 28 is fixedly installed On the upper surface of the slicing bottom plate 21, the upper slicing jaws 27 and the lower slicing jaws 28 can achieve the clamping and loosening of the silicon wafers 3 to be separated by contracting and opening in opposite directions. A pair of infrared detection mechanisms 29 are symmetrically arranged on both sides of the upper slicing jaws 27 and the lower slicing jaws 28 for detecting the number of silicon wafers 3 to be separated, so as to facilitate timely replenishment. A silicon wafer feeding guide column 26 is fixedly installed in the middle position of the upper slicing jaws 27 and the lower slicing jaws 28. A guide plate 261 is arranged on the inner side of the silicon wafer loading guide column 26, and the guide plate 261 matches the slot on the silicon wafer 3 to be separated, so that the silicon wafer 3 to be separated can be accurately loaded along the direction of the guide plate 261, and the upper wafering jaw 27 and the lower wafering jaw 28 are both provided with a clearance groove 271, and the clearance groove 271 can accommodate the silicon wafer loading guide column 26 so that the upper wafering jaw 27 and the lower wafering jaw 28 can directly contact and grasp the silicon wafer 3 to be separated.

[0031] The working principle of the utility model is as follows:

[0032] During actual use of the utility model, firstly, the lower slicing clamp 28 is started to shrink and clamp, and the silicon wafers 3 to be separated are dropped downward from the top of the silicon wafer feeding guide column 26 through the feeding mechanism and stacked on the upper surface of the lower slicing clamp 28. Then, the slicing picking mechanism 1 is started to make the picking positioning rod 15 rise to the picking position, and the lower slicing clamp 28 is released. At this time, the picking positioning rod 15 drops to the specified position after receiving the material. At this time, the upper slicing clamp 27 rises to the specified position according to the thickness parameters of the slicing required, driven by the upper slicing mechanism driving cylinder 25, and clamps the silicon steel sheets. The picking positioning rod 15 drives the separated silicon steel sheets to fall to the specified workstation, and the specified number of silicon steel sheets are separated. Such a cycle can complete the silicon steel sheet slicing operation.

[0033] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;

[0034] Secondly: In the drawings of the embodiments disclosed in the present utility model, only the structures related to the embodiments disclosed in the present utility model are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present utility model can be combined with each other;

[0035] Finally: The above description is only a preferred implementation mode of the utility model and is not used to limit the utility model. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the protection scope of the utility model.

Claims

1. A silicon steel sheet slicing mechanism, comprising a slicing material taking mechanism and a slicing mechanism, characterized in that: The slice picking mechanism is located below the slice mechanism, and the slice mechanism includes a slice bottom plate and a slice top plate, which are fixedly connected by a plurality of supporting columns, and an upper slice mechanism mounting plate is arranged between the slice bottom plate and the slice top plate and parallel to the two, and the upper slice mechanism mounting plate can be slidably sleeved on the plurality of supporting columns up and down, and an upper slice clamp is installed on the bottom surface of the front side of the upper slice mechanism mounting plate, and a lower slice clamp is arranged symmetrically with the upper slice clamp directly below the upper slice clamp.

2. A silicon steel sheet separation mechanism according to claim 1, characterized in that: The piece-by-piece material picking mechanism includes a material picking mounting plate arranged in the vertical direction, a material picking slide rail is vertically arranged on the front surface of the material picking mounting plate, a material picking slider is slidably sleeved on the surface of the material picking slide rail, and the material picking slider is connected to the material picking drive motor through a screw rod.

3. A silicon steel sheet separation mechanism according to claim 2, characterized in that: A material picking positioning rod is fixedly connected to the top of the material picking sliding block in the vertical direction, and a material picking claw is arranged on the top of the material picking positioning rod. The material picking claw is matched with the hole on the surface of the silicon wafer to be separated.

4. The silicon steel sheet separation mechanism according to claim 1, characterized in that: A pair of upper slice mechanism driving cylinders are symmetrically installed on the bottom surfaces of both sides of the upper slice mechanism installation plate, and the output ends of the upper slice mechanism driving cylinders are fixedly connected to the upper surface of the slice bottom plate.

5. The silicon steel sheet separation mechanism according to claim 1, characterized in that: The bottom of the lower slice clamping jaw is fixedly mounted on the upper surface of the slice bottom plate.

6. The silicon steel sheet separation mechanism according to claim 1, characterized in that: A pair of infrared detection mechanisms are symmetrically arranged on both sides of the upper slice-cutting clamping jaw and the lower slice-cutting clamping jaw.

7. The silicon steel sheet separation mechanism according to claim 1, characterized in that: A silicon wafer loading guide column is fixedly installed in the middle position of the upper wafer splitting clamping jaw and the lower wafer splitting clamping jaw.

8. The silicon steel sheet separation mechanism according to claim 7, characterized in that: A guide plate is arranged on the inner side of the silicon wafer feeding guide column, and the guide plate matches the clamping groove on the silicon wafer to be separated.

9. The silicon steel sheet separation mechanism according to claim 1, characterized in that: The upper slice-splitting clamping jaw and the lower slice-splitting clamping jaw are both provided with a yielding groove.

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