Temperature acquisition plate for thermal forming die

Abstract

The utility model relates to a thermoforming die temperature acquisition board, comprising a PCB, a first module, a second module and a third module, the first module, the second module and the third module are all arranged on the surface of the PCB, the first module is connected with a plurality of thermocouples, the second module is electrically connected with a power supply, and the power supply is electrically connected with the PCB. The third module is connected with a solid-state relay; the first module comprises a signal receiving unit, a signal amplification unit and a plurality of interfaces, the output ends of the plurality of thermocouples are detachably connected with the plurality of interfaces respectively, and the signal amplification unit is electrically connected with the third module; according to the temperature acquisition board for the thermal forming die, the signal receiving unit, the signal amplifying unit and the processor are arranged, so that the real-time temperature of the thermal forming die can be acquired, the temperature of the die is further controlled, and the purposes of rapid temperature rise, accurate temperature control and heat preservation of the die are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of mold processing, in particular to a temperature collection plate for a hot forming mold. Background Art

[0002] Hot stamping forming technology uses the principle of metal thermoplastic forming. It can achieve quenching heat treatment of sheet materials while forming, improve the forming performance of materials, greatly improve the strength of parts, and produce stamping parts with a strength of up to 1500MPa. When the workpiece is hot stamped, the mold used is also in a high temperature state. Because the sizes of parts that need to be stamped are different for different models, the hot stamping mold needs to be replaced according to different models. The different designs of the mold according to the heating process or size will generate the demand for the mold heating control system.

[0003] Therefore, the utility model provides a thermoforming mold temperature collection plate, which can effectively collect the real-time temperature of the thermoforming mold, and then control the temperature of the mold, so as to achieve the purpose of rapid temperature rise, precise temperature control and heat preservation of the mold. Utility Model Content

[0004] The utility model aims to provide a temperature collection plate for a hot forming mold in view of the deficiencies in the prior art.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] A thermoforming mold temperature acquisition board comprises: a PCB board, a first module, a second module and a third module, wherein the first module, the second module and the third module are all arranged on the surface of the PCB board, the first module is connected to a plurality of thermocouples, the second module is electrically connected to a power supply, and the third module is connected to a solid-state relay.

[0007] Furthermore, the first module includes a signal receiving unit, a signal amplifying unit and a plurality of interfaces, the output ends of the plurality of thermocouples are detachably connected to the plurality of interfaces respectively, and the signal amplifying unit is electrically connected to the third module.

[0008] Furthermore, the signal amplifying unit adopts an optical coupler.

[0009] Furthermore, the second module includes a voltage stabilizing unit, a power interface and a dip switch, the power interface is detachably connected to the input end of the power supply, and the dip switch is connected to a plurality of communication stations.

[0010] Furthermore, the voltage stabilizing unit is electrically connected to the first module and the third module.

[0011] Furthermore, the third module includes a signal acquisition unit, a processor and a signal transmitting unit.

[0012] Furthermore, the input end of the signal acquisition unit is electrically connected to the output end of the signal amplification unit, and the signal transmission unit is electrically connected to the solid-state relay.

[0013] Furthermore, temperature parameters are pre-stored in the processor.

[0014] The utility model adopts the above technical solution, and compared with the prior art, has the following technical effects:

[0015] The thermoforming mold temperature collection board of the utility model can collect the real-time temperature of the thermoforming mold by providing a signal receiving unit, a signal amplifying unit and a processor, and then control the temperature of the mold, so as to achieve the purpose of rapidly heating up the mold, accurately controlling the temperature and keeping the mold warm. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the principle of the temperature collection plate of the thermoforming mold of the utility model;

[0017] Figure 2 This is a schematic diagram of the circuit principle of the first module of the utility model;

[0018] Figure 3 This is a schematic diagram of the circuit principle of the second module of the utility model;

[0019] Figure 4 This is a schematic diagram of the circuit principle of the third module of the utility model; DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0022] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0023] Example

[0024] See also Figure 1-4The utility model of the thermoforming mold temperature acquisition board comprises: a PCB board, a first module, a second module and a third module, wherein the first module, the second module and the third module are all arranged on the surface of the PCB board, the first module is connected to a plurality of thermocouples, the second module is electrically connected to a power supply, and the third module is connected to a solid-state relay;

[0025] The first module includes a signal receiving unit, a signal amplifying unit and a plurality of interfaces, the output ends of the plurality of thermocouples are detachably connected to the plurality of interfaces respectively, and the signal amplifying unit is electrically connected to the third module;

[0026] The signal amplification unit adopts an optical coupler;

[0027] The second module includes a voltage stabilizing unit, a power interface and a dip switch, wherein the power interface is detachably connected to the input end of the power supply, and the dip switch is connected to a plurality of communication stations;

[0028] The voltage stabilizing unit is electrically connected to the first module and the third module;

[0029] The third module includes a signal acquisition unit, a processor and a signal transmission unit;

[0030] The input end of the signal acquisition unit is electrically connected to the output end of the signal amplification unit, the signal transmission unit is electrically connected to the solid-state relay, and the solid-state relay is connected to a heating rod;

[0031] The processor has temperature parameters pre-stored therein.

[0032] Working principle: When working, first connect the power interface of the second module to the external power supply, and then convert the voltage of the external power supply to a voltage suitable for the working of the PCB board through the voltage stabilizing unit, so as to power the first module and the third module; then set the rated temperature parameters in the processor of the third module, and then connect the working end of the thermocouple to the mold, and the cold end to the interface of the first module. At this time, the signal receiving module receives the temperature signal transmitted by the thermocouple, and then amplifies the signal through the signal amplification unit and transmits it to the signal acquisition unit of the third module. The signal acquisition unit transmits the obtained temperature signal to the processor, and the processor compares the obtained temperature signal with the rated temperature parameter. Finally, the signal transmitting unit sends instructions to control the conduction of the corresponding solid-state relay, and then controls the operation of the corresponding heating rod, so as to realize the control of the mold temperature.

[0033] To sum up, the thermoforming mold temperature collection board of the utility model can collect the real-time temperature of the thermoforming mold by providing a signal receiving unit, a signal amplifying unit and a processor, and then control the temperature of the mold, so as to achieve the purpose of quickly heating up the mold, accurately controlling the temperature and keeping the mold warm.

[0034] The above description is only a preferred embodiment of the present invention, and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A thermoforming mold temperature collection plate, characterized in that: include: A PCB board, a first module, a second module and a third module, wherein the first module, the second module and the third module are all arranged on the surface of the PCB board, the first module is connected to a plurality of thermocouples, the second module is electrically connected to a power source, and the third module is connected to a solid-state relay; The first module includes a signal receiving unit, a signal amplifying unit and a plurality of interfaces, the output ends of the plurality of thermocouples are detachably connected to the plurality of interfaces respectively, and the signal amplifying unit is electrically connected to the third module; The second module includes a voltage stabilizing unit, a power interface and a dip switch, wherein the power interface is detachably connected to the input end of the power supply, and the dip switch is connected to a plurality of communication stations; The third module includes a signal acquisition unit, a processor and a signal transmission unit.

2. The thermoforming mold temperature collection plate according to claim 1, characterized in that: The signal amplifying unit adopts an optical coupler.

3. The thermoforming mold temperature collection plate according to claim 1, characterized in that: The voltage stabilizing unit is electrically connected to the first module and the third module.

4. The thermoforming mold temperature collection plate according to claim 1, characterized in that: The input end of the signal acquisition unit is electrically connected to the output end of the signal amplification unit, and the signal transmission unit is electrically connected to the solid-state relay.

5. The thermoforming mold temperature collection plate according to claim 1, characterized in that: The processor has temperature parameters pre-stored therein.

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