Chip assembly, drum box and developing assembly

Abstract

The utility model discloses a chip assembly which is detachably installed in a drum box or imaging equipment, and comprises a chip which is provided with electric contact surfaces which are arranged in a first direction; the chip is provided with electric contact surfaces, and the electric contact surfaces are arranged in a first direction; the chip rack is provided with a chip mounting part for supporting the electric contact surface; the chip rack further includes a positioning protrusion located on a side of the electrical contact surface in the first direction, and the positioning protrusion extends in a second direction crossing the first direction. The electrical connection stability of the chip and the imaging equipment is greatly improved, and by adopting the design, the chip is not limited to be only arranged on the developing box, so that the chip is convenient to upgrade and replace.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic photographic imaging, in particular to a chip component, a drum box and a developing component. Background Art

[0002] The processing box in the prior art generally includes a drum box and a developer box installed in the drum box, and the two can be installed in the printer as an integral unit to perform a printing operation, wherein the drum box includes a photosensitive drum, and the developer box includes a developer roller. When the processing box performs a developing operation, the developer roller and the photosensitive drum maintain close contact and perform a developing operation to perform a normal printing operation. However, as a storage component electrically connected to the printer, its installation accuracy needs to be guaranteed, otherwise the storage component may be disconnected from the printer, causing the developer box to be unable to be recognized by the printer. However, since the above-mentioned developer box needs to be constantly swung around the drum box, the storage component installed on the developer box will also swing with the developer box. In this way, the positional relationship between the storage component and the printer will change, and there is a high probability that the storage component will be disconnected from the printer. In addition, the movement of the storage component will constantly rub the printer, which will cause the electrical contact surface on the storage component to wear, and the problem of disconnection from the printer is also prone to occur. For the above-mentioned situations, both manufacturers and end users are unwilling to see them, so it is urgent to design a new processing box to solve the above-mentioned problems. Utility Model Content

[0003] In order to solve the above problems, the utility model provides a storage component mounting frame, a drum box and a developing assembly, which are mainly achieved through the following technical solutions:

[0004] A chip assembly, detachably mounted in a drum cartridge or an imaging device, comprising:

[0005] A chip having electrical contact surfaces, wherein the electrical contact surfaces are arranged in a first direction;

[0006] A chip having electrical contact surfaces, wherein the electrical contact surfaces are arranged in a first direction;

[0007] a chip holder having a chip mounting portion supporting the electrical contact surface;

[0008] The chip frame further includes a positioning protrusion located at one side of the electrical contact surface in the first direction, and the positioning protrusion extends along a second direction intersecting the first direction.

[0009] Furthermore, in the first direction, a positioning groove is formed between the electrical contact surface and the positioning protrusion.

[0010] Furthermore, a convex rib is provided on the side wall of the positioning groove, and the convex rib is formed by protruding from the side wall of the positioning groove in the first direction.

[0011] Furthermore, at least one pair of fixing protrusions is provided on the side wall of the positioning groove, and the fixing protrusions have guiding slopes, and the guiding slopes guide the protrusion of the imaging device to enter the positioning groove.

[0012] Furthermore, the chip rack further comprises a fixing groove, which is concavely formed in a third direction intersecting the first direction and the second direction, and the fixing groove is positioned and connected to the drum box in the third direction.

[0013] Furthermore, the chip assembly further comprises an elastic member, which is installed below the chip frame so that the electrical contact surface can move in a third direction intersecting the first direction and the second direction.

[0014] In another aspect, a drum cartridge is provided, comprising:

[0015] The drum frame includes a left side wall and a right side wall which are arranged opposite to each other in a first direction;

[0016] A photosensitive drum rotatably supported on the drum frame;

[0017] Also included is a chip assembly detachably mounted on the left side wall.

[0018] On the other hand, a developing assembly is also provided, which is detachably mounted in a drum cartridge or an imaging device, and the developing assembly comprises:

[0019] A developing cartridge, and a chip assembly independent of the developing cartridge;

[0020] The developing box comprises:

[0021] A developing frame, which can accommodate a developer;

[0022] A developing roller is rotatably supported on the developing frame, and the developing roller can rotate around a developing roller rotation axis extending along the first direction;

[0023] When the developing assembly is installed in a drum cartridge or an image forming apparatus, the electrical contact surface is spaced apart from the developing cartridge in the first direction.

[0024] The utility model detachably mounts the chip assembly on the drum box, so that when the processing box is in use, the storage component and the imaging device can remain in a relatively static state. Compared with the prior art, the electrical connection stability between the chip and the imaging device will be greatly improved. By adopting this design, it is not necessary to limit the chip to be only set on the developer box, which facilitates the upgrade and replacement of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of a certain angle of the developing box installed in the drum box in Example 1 of the utility model;

[0026] Figure 2 It is a schematic diagram of a chip assembly installed in a drum box at a certain angle in Example 1 of the utility model;

[0027] Figure 3 It is a schematic diagram of another angle of the chip assembly separated from the drum box in Example 1 of the utility model;

[0028] Figure 4 It is a schematic diagram of a chip assembly in Embodiment 1 of the present utility model from a certain angle;

[0029] Figure 5 This is a schematic diagram of the chip assembly in Embodiment 1 of the utility model from another angle;

[0030] Figure 6 It is an exploded schematic diagram of the chip assembly in Embodiment 1 of the present utility model;

[0031] Figure 7 It is a schematic diagram of a certain angle of the developing box installed in the drum box in Embodiment 2 of the present utility model;

[0032] Figure 8 It is a schematic diagram of the position of the developing box and the chip at a certain angle in Embodiment 2 of the present utility model;

[0033] Fig. 9 It is a schematic diagram of a chip assembly in Embodiment 2 of the present utility model from a certain angle;

[0034] Fig.10 It is an exploded schematic diagram of the chip assembly in Embodiment 2 of the present utility model;

[0035] Fig.11 It is a schematic diagram of the installation of the chip assembly and the imaging device at a certain angle in Embodiment 2 of the present utility model;

[0036] Fig.12 This is a schematic diagram of the installation of the chip assembly and the imaging device from another angle in Example 2 of the utility model. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical scheme and technical effect of the embodiment of the utility model clearer, the technical scheme of the processing box of the utility model will be described clearly and completely in conjunction with the accompanying drawings. Obviously, the described embodiment is only a preferred embodiment of the utility model, not all embodiments. Based on the embodiment of the utility model, other embodiments obtained by those skilled in the art without creative work belong to the protection scope of the utility model. Example 1

[0038] like Figure 1-6 As shown, a chip assembly 100, a developing box A, a drum box B and a processing box in the utility model are shown, wherein the processing box includes a drum box B and a developing box A which are separately arranged, and the developing box A can be detachably installed in the drum box B, and the two can be installed in the imaging device as an integral unit.

[0039] like Figure 1 As shown, the developing box A includes a developing frame 210 that can accommodate a developer, and a developing roller 220 rotatably supported on the developing frame 210. The developing box A also includes a developing box driving member 230 arranged at the left end of the developing frame 210. The developing box driving member 230 can receive a driving force from the outside of the developing box A and then drive the developing roller 220 to rotate around a developing roller rotation axis extending in the left-right direction (first direction). In addition, the developing box A also includes a detected protrusion 240 and a developing electrode 250 arranged at the right end of the developing frame 210. The detected protrusion 240 0 and the developing electrode 250 are arranged at intervals in the front-to-back direction (the second direction), and the detected protrusion 240 is closer to the developing roller 220 than the developing electrode 250 in the front-to-back direction, that is, the developing electrode 250 is arranged on the front side of the detected protrusion 240 in the front-to-back direction, the developing electrode 250 can receive power from the imaging device and can supply power to the developing roller 220, the detected protrusion 240 can be detected by the imaging device to form a detection signal, and the imaging device can then determine whether the developing box A is a new box and the capacity of the developing box A and other information by identifying the detection signal.

[0040] As a drum cartridge B used in conjunction with the above-mentioned developer cartridge A, the drum cartridge B includes a drum frame 310, on which a developer cartridge accommodating portion for accommodating the developer cartridge A is provided, and a photosensitive drum 320 rotatably supported on the drum frame 310, and the photosensitive drum 320 can also rotate around a photosensitive drum rotation axis extending in the left-right direction. The developer cartridge accommodating portion of the drum frame 310 has a left side wall 310a and a right side wall 310b that are separated and arranged in the left-right direction. When the developer cartridge A is installed in the drum cartridge B, the left side wall 310a corresponds to the left end of the developer cartridge A, and the right side wall 310b corresponds to the right end of the developer cartridge B.

[0041] like Figure 2 and 3As shown, further, in order to solve the problems existing in the prior art, the chip 10 is installed on the drum box B. As a corresponding, a chip rack 20 for mounting the chip 10 is also installed on the drum box B. A chip mounting groove for mounting the chip 10 is provided on the chip rack 20. Specifically, the chip 10 includes a substrate 10a that is roughly constructed in a plate shape, and an electrical contact surface 10b and a storage portion (not shown) are provided on two opposite surfaces of the substrate 10a. The electrical contact surface 10b can be electrically connected to the imaging device, and the storage portion stores information such as the model and capacity of the developing box A. The chip 10 can establish a communication connection with the imaging device through the electrical connection of the electrical contact surface 10b with the imaging device, and then the relevant parameter information of the developing box A can be identified through the storage unit. In the left-right direction, the electrical contact surface 10b is arranged on the left side wall 310a of the drum frame 310, and in the front-to-back direction, the electrical contact surface 10b is arranged at a position closer to the rear end of the drum frame 310 relative to the front end of the drum frame 310, and at least a part of the electrical contact surface 10b is arranged on the outside of the left side wall 310a of the drum frame 310 in the left-right direction. When the chip 10 needs to be upgraded or replaced, in order not to affect the normal printing of the processing box, the old chip needs to be removed from the drum frame, replaced with a new chip and then installed on the drum frame. However, because the chip 10 is a small and precise component, and the installation space of the drum frame 310 for installing the chip 10 is relatively small, it is not only difficult for the operator to disassemble and install, but also easy to damage the chip 10 during the disassembly process. Therefore, it is preferred that the chip frame 20 and the drum frame 310 are separately arranged, that is, the chip frame 20 is detachable. It is installed on the drum frame 310. This structure allows the user to install the chip 10 on the chip holder 20 in a simpler and faster manner, and then install the two together on the drum frame 310. When the chip 10 needs to be removed, it can be removed from the drum frame 310 together. It is worth mentioning that the chip holder 20 can be installed as an accessory independent of the drum box B, that is, the chip holder 20 may not be a part of the drum box B. However, optionally, the chip holder 20 may also be integrally formed with the drum frame 310, which is not a limitation.

[0042] like Figure 4-6As shown, the chip rack 20 includes a main body 21, a chip mounting portion 22, a positioning protrusion 23 and a fixing groove 24. The chip mounting portion 22 is extended from the main body 21 in the left and right direction. In the up and down direction (third direction), the chip mounting portion 22 is above the main body. The upper surface of the chip mounting portion 22 is concavely formed with a mounting groove 22a. The size of the mounting groove 22a matches the size and shape of the chip. The chip 10 is mounted in the mounting groove 22a. The chip can be adhered to the mounting groove 22a by, for example, gluing. However, this is not limited. The chip 10 can also be restricted to the mounting groove 22a by providing an elastic buckle structure on the chip mounting portion 22. There are many ways to implement it, as long as the chip 10 can be firmly mounted on the mounting groove 22a. The positioning protrusion 23 is formed by extending from the main body 21 in the up-down direction, and the imaging device is provided with a recess at the corresponding position. When the chip assembly 100 is installed on the imaging device, the positioning protrusion 23 enters the recess and limits the displacement of the chip assembly 100 in the left-right direction. At the same time, the end of the positioning protrusion 23 is set to a shape with a gradually decreasing width, which can guide the installation of the chip assembly 100. A positioning groove 25 is also formed between the positioning protrusion 23 and the chip mounting portion 22. Similarly, the imaging device is provided with a convex portion at the corresponding position. When the chip assembly 100 is installed on the imaging device, the convex portion enters the positioning groove 25 for positioning. Further, a convex rib is provided on the side wall of the positioning groove 25, and the convex rib is formed to protrude in the left-right direction. When the chip assembly 100 and the drum assembly B are installed in the imaging device together, the interference fit between the positioning groove 25 and the convex portion of the imaging device can be achieved, thereby improving the stability of the chip assembly 100, so that the contacts of the chip 10 and the imaging device can be stably electrically connected. The chip assembly 100 is installed on the left side wall of the drum assembly 310. Specifically, the left side wall 310a is formed with a V-shaped groove 310c, the shape of the lower end of the main body 21 is adapted to the V-shaped groove 310c, and the lower end of the main body 21 is recessed with a fixing groove 24 in the up and down directions, and the side wall of the V-shaped groove 310c enters the fixing groove 24 for positioning. After adopting the above structure, the chip rack 20 of the utility model is installed along a direction roughly parallel to the up and down directions. More specifically, the chip rack 20 is installed from top to bottom, but the installation direction is also not fixed, and it can still choose to adopt other positioning structures to realize the installation of the chip rack 20; in order to further improve the positioning stability of the chip rack 20 and prevent the chip rack 20 from detaching from the drum frame 310, the chip rack 20 is installed on the drum frame 310 in an interference fit manner, and the interference fit of the two can be achieved through the cooperation of the above-mentioned left side wall and the fixing groove 24.Furthermore, an elastic component (not shown) is provided between the chip rack 20 and the left side wall 310a. The elastic component is constructed to shrink downward after the chip 10 receives external force from, for example, an imaging device, so as to maintain elastic contact with the electrical contacts of the imaging device. This can not only effectively prevent the electrical contacts of the chip 10 and the imaging device from making hard contact during installation and damaging the electrical contacts of the chip 10 and the imaging device, but also prevent the chip 10 from being unable to be electrically connected to the imaging device or causing installation interference between the two when a large deviation occurs between the actual installation position of the chip 10 and the correct installation position due to manufacturing errors of the chip rack 20. Furthermore, when observed in a direction perpendicular to the left-right direction, the electrical contact surface 10b of the chip is spaced apart from the developing frame 210. Furthermore, to further avoid interference, when observed in a direction perpendicular to the left-right direction, the chip rack 20 is spaced apart from the developing frame 210.

[0043] Although the positioning structure of the fixing groove 24 and how it positions the chip rack 20 on the drum frame 310 have been described in detail above, the structure described above is only a preferred embodiment of the present invention. After adopting this structure, there is no need to redesign the existing drum frame or to re-open the mold. The chip rack 20 in the present invention can be universally installed on the existing drum frame 310, which greatly reduces the production cost. Example 2

[0044] Figure 7-12 The chip rack structure provided in the second embodiment of the present application is shown, which is different from the first embodiment in that the structure and installation method of the chip rack are different.

[0045] like Figure 7 and 8 As shown, the chip holder 30 is detachably mounted on the imaging device C. When installing the developing box A and the drum box B into the imaging device C, the chip holder 30 is first mounted on the imaging device C so that the chip 10 mounted on the chip holder 30 can be stably electrically connected to the electrical contact C1 on the imaging device C. Then, the developing box A and the drum box B are installed into the imaging device C to complete the installation of the developing box A and the drum box B, so that the imaging device C can print normally. The chip assembly 300 is installed separately from the developing box A and the drum box B, and a modular structural design is adopted, which facilitates the replacement of the chip 10 when the chip 10 is upgraded, and simplifies the design structure of the developing box A and the drum box B.

[0046] like Fig. 9 and 12As shown, specifically, the chip assembly 300 includes a chip frame 30 and a chip 10 mounted on the chip frame 30, the chip frame 30 includes a main body 31, a chip mounting portion 32 and a positioning portion 33, and the chip assembly 300 can be mounted on an imaging device C and electrically connected to the imaging device C. The main body 31 is configured as a square base, and the chip mounting portion 32 is formed by extending from the main body 31 in the left-right direction. In the up-down direction, the chip mounting portion 32 is above the main body 31, and a mounting groove 32a is formed on the upper surface of the chip mounting portion 32. The size of the mounting groove 32a matches the size and shape of the chip 10, and the chip 10 is mounted in the mounting groove 32a. The chip 10 can be adhered to the mounting groove 32a by, for example, gluing, however, this is not limited, and the chip 10 can also be restricted to the mounting groove 32a by providing an elastic buckle structure on the chip mounting portion 32. There are many implementation methods, as long as the chip 10 can be firmly mounted on the mounting groove 32a. The positioning portion 33 is extended from the main body portion 31 in the up and down directions, and the imaging device C is provided with a recessed portion at the corresponding position. When the chip assembly 300 is installed on the imaging device C, the positioning portion 33 enters the recessed portion and limits the displacement of the chip assembly 300 in the left and right directions. At the same time, the end of the positioning portion 33 is set to a shape with a gradually decreasing width, which can guide the installation of the chip assembly 300. A positioning groove 34 is also formed between the positioning portion 33 and the chip mounting portion 32. Similarly, the imaging device C is provided with a convex portion C2 at the corresponding position. When the chip assembly 300 is installed on the imaging device C, the convex portion C2 enters the positioning groove 34 for positioning. Furthermore, the positioning groove 34 has a first side wall (unnumbered) and a second side wall (unnumbered) that are relatively arranged in the left and right directions. At least one pair of fixing protrusions 34a are arranged on the first side wall and the second side wall. The imaging device is correspondingly provided with a fixing hole C21. Each pair of fixing protrusions 34a is arranged corresponding to the fixing hole C21. When the chip component 300 is installed on the imaging device C, the fixing protrusions 34a enter the fixing hole C21 from both sides of the fixing hole C21 to position the chip component 300. The fixing protrusion 34a has a guiding slope to guide the convex portion C2 of the imaging device C into the positioning groove 34.

[0047] like Fig.11 and 12As shown, in actual use, the chip assembly 300 needs to be used in conjunction with the corresponding developer box A. The chip 10 in the chip assembly 300 corresponds to the developer box A one-to-one. The chip 10 includes a substrate 10a that is roughly constructed in a plate shape. An electrical contact surface 10b and a storage unit are provided on two opposite surfaces of the substrate 10a. The electrical contact surface 10b can be electrically connected to the electrical contact C1 of the imaging device C. The storage unit stores relevant parameter information of the corresponding developer box A, such as model and capacity size. The chip 10 can establish a communication connection with the imaging device C through the electrical connection between the electrical contact surface 10b and the imaging device C, and then the relevant parameter information of the developer box A can be identified through the storage unit. When the chip assembly 300 is installed in the imaging device C together with the corresponding developer box A for use, the electrical contact surface 10b and the chip assembly 300 are separated from the developer box A in the left-right direction, and the electrical contact surface 10b and the chip assembly 300 are located on the left side of the developer box A. In the front-to-back direction, the electrical contact surface 10b and the chip assembly 300 are closer to the rear end of the developer box A relative to the front end of the developer box A.

[0048] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip assembly, removably mounted in a drum cartridge or an imaging device, comprising: A chip having electrical contact surfaces, wherein the electrical contact surfaces are arranged in a first direction; a chip holder having a chip mounting portion supporting the electrical contact surface; It is characterized in that the chip frame further comprises a positioning protrusion, the positioning protrusion is located at one side of the electrical contact surface in the first direction, and the positioning protrusion extends along a second direction intersecting the first direction.

2. The chip assembly according to claim 1, characterized in that: In the first direction, a positioning groove is further formed between the electrical contact surface and the positioning protrusion.

3. The chip assembly according to claim 2, characterized in that: A convex rib is disposed on the side wall of the positioning groove, and the convex rib is formed by protruding from the side wall of the positioning groove in the first direction.

4. The chip assembly according to claim 2, characterized in that: At least one pair of fixing protrusions is arranged on the side wall of the positioning groove, and the fixing protrusions have guiding slopes, and the guiding slopes guide the protrusion of the imaging device to enter the positioning groove.

5. The chip assembly according to claim 1, characterized in that: The chip frame further includes a fixing groove, which is concavely formed in a third direction intersecting the first direction and the second direction, and the fixing groove is positioned and connected to the drum box in the third direction.

6. The chip assembly according to claim 1, characterized in that: The chip assembly further includes an elastic member installed below the chip frame so that the electrical contact surface can move in a third direction intersecting the first direction and the second direction.

7. A drum box comprising: The drum frame includes a left side wall and a right side wall which are arranged opposite to each other in a first direction; A photosensitive drum rotatably supported on the drum frame; It is characterized in that it also includes a chip assembly as described in any one of claims 1 to 6 that is detachably mounted on the left side wall.

8. A developing assembly, detachably mounted in a drum cartridge or an imaging device, the developing assembly comprising: A developing cartridge, and a chip assembly according to any one of claims 1 to 6 independent of the developing cartridge, the chip being configured to store information about the developing cartridge; The developing box comprises: A developing frame, which can accommodate a developer; A developing roller is rotatably supported on the developing frame, and the developing roller can rotate around a developing roller rotation axis extending along the first direction; It is characterized in that when the developing assembly is installed in a drum box or an imaging device, the electrical contact surface is separated from the developing box in the first direction.

Images