Alloy resistor with efficient heat dissipation

Abstract

The utility model relates to the technical field of alloy resistors, in particular to an efficient heat dissipation alloy resistor. The alloy resistor comprises a mounting assembly, and further comprises a clamping assembly, a cooling assembly, an auxiliary assembly, a heat dissipation assembly, a resistor body and a circuit board, a mounting assembly is arranged above the circuit board, a resistor body is arranged in the mounting assembly, a clamping assembly with a clamping function is arranged above the mounting assembly, a cooling assembly with a cooling function is arranged on one side of the mounting assembly, an auxiliary assembly is arranged in the mounting assembly, and a heat dissipation assembly with a heat dissipation function is arranged on the side wall of the resistor body. According to the alloy resistor, air is cooled through the device, ventilation and heat dissipation are conducted on the resistor through the device, and therefore the purpose of efficient heat dissipation is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of alloy resistors, in particular to an alloy resistor with high-efficiency heat dissipation. Background Art

[0002] Alloy resistors are a type of resistor used for sampling large currents in circuits. As current carriers, their resistance values ​​are accurate, and their temperature stability, product safety, and stability are significantly higher than those of ordinary ceramic resistors. Based on these functional characteristics, alloy resistors are also widely used, especially in the field of new energy, such as automotive instruments, electronic instruments, etc.

[0003] The heat dissipation structure of conventional alloy resistors is usually simply set up. Most alloy resistors only have the function of current sampling and cannot actively dissipate heat. Generally, they can only dissipate heat through heat sinks. The sealed structure of alloy resistors leads to poor heat dissipation of conventional alloy resistors, which ultimately affects work efficiency. Utility Model Content

[0004] In order to overcome the problem that most existing alloy resistors are of integral type and can only dissipate heat through heat sinks, the sealed structure of the alloy resistors leads to poor heat dissipation of the alloy resistors, thus affecting work efficiency.

[0005] The technical solution of the utility model is:

[0006] An alloy resistor with high efficiency in heat dissipation comprises a mounting assembly, a clamping assembly, a cooling assembly, an auxiliary assembly, a heat dissipation assembly, a resistor body and a circuit board; the mounting assembly is arranged above the circuit board, the resistor body is arranged inside the mounting assembly, a clamping assembly with a clamping function is arranged above the mounting assembly, a cooling assembly with a cooling function is arranged on one side of the mounting assembly, an auxiliary assembly is arranged inside the mounting assembly, and a heat dissipation assembly with a heat dissipation function is arranged on the side wall of the resistor body.

[0007] Preferably, the air is cooled by a cooling component, and the cooled air enters the installation component. The resistor is supported by an auxiliary component, and a space is formed under the resistor. The air circulates through this space, which can increase the contact area between the air and the resistor, and increase the heat dissipation effect. The resistor can be cooled and dissipated through multiple sets of heat dissipation components, thereby achieving the purpose of efficient heat dissipation.

[0008] Preferably, the installation component includes an installation frame, an installation slot and contacts; an installation frame is arranged above the circuit board, an installation slot is opened inside the installation frame, a contact is arranged at one end of the resistor, and two groups of contacts are arranged; the resistor is installed and accommodated through the installation slot, and the two ends of the resistor are respectively in contact with the two contacts.

[0009] Preferably, the locking assembly includes a locking block, a locking slot and a locking plate; a locking plate is arranged above the mounting frame, a locking slot is provided below the locking plate, and a locking block is arranged inside the locking slot; the locking plate cooperates with the locking slot through the locking block, so that the resistor can be fixedly installed inside the mounting frame.

[0010] Preferably, the cooling component includes a heat sink and a ventilation plate; a heat sink is provided on one side of the mounting frame, two groups of heat sinks are provided, and a ventilation plate is provided on one side of the heat sink; air enters the interior of the heat sink through the ventilation plate, thereby achieving a cooling effect.

[0011] Preferably, the cooling component also includes a heat dissipation pipe and ventilation holes; ventilation holes are opened on the side wall of the ventilation plate, and there are multiple groups of ventilation holes, and a heat dissipation pipe is arranged inside the heat dissipation box; air enters the interior of the heat dissipation box through the multiple groups of ventilation holes and is cooled by the heat dissipation pipe.

[0012] Preferably, the auxiliary components include support blocks and connecting holes; support blocks are arranged inside the installation frame, and multiple groups of support blocks are arranged; connecting holes are opened on the side walls of the installation frame, and multiple groups of connecting holes are opened; the cooled air enters the installation frame through the connecting holes, and the resistor body is supported by multiple groups of support blocks, and a space is formed under the resistor body. Air circulates through this space, which can increase the contact area between the air and the resistor body, thereby achieving the purpose of efficient heat dissipation.

[0013] Preferably, the heat dissipation assembly includes a heat dissipation plate and heat dissipation holes; a heat dissipation plate is arranged on the side wall of the support block, another heat dissipation plate is arranged under the card plate, and heat dissipation holes are opened on the side wall of the mounting frame, and multiple groups of heat dissipation holes are opened; the heat dissipation and cooling effect of the resistor can be increased by using multiple groups of heat dissipation plates, and air is ventilated and dissipated through the multiple groups of heat dissipation holes.

[0014] Beneficial effects of the utility model:

[0015] 1. The traditional alloy resistor only has the function of current sampling, but does not have the function of efficient heat dissipation, which is inconvenient to use. The alloy resistor of the utility model cools the air through the device, and then ventilates and dissipates the heat of the resistor through the device, thereby achieving the purpose of efficient heat dissipation;

[0016] 2. The air enters the heat dissipation box through multiple sets of ventilation holes, and is cooled by the heat dissipation pipe. The cooled air enters the installation frame through the connection holes. The resistor is supported by multiple sets of support blocks, and a space is formed under the resistor. The air circulates through this space, which can increase the contact area between the air and the resistor, and increase the heat dissipation and cooling effect of the resistor. The resistor is cooled and dissipated by multiple sets of heat dissipation plates, and the air is ventilated and dissipated through multiple sets of heat dissipation holes, thereby achieving the purpose of efficient heat dissipation;

[0017] 3. The air enters the heat sink through multiple sets of ventilation holes and is cooled by the heat pipe. The cooled air enters the installation frame through the connecting holes, increasing the contact area between the air and the resistor, thereby achieving a cooling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the three-dimensional structure of an alloy resistor with high efficiency heat dissipation of the utility model;

[0019] Figure 2 This is a schematic diagram of the first partial three-dimensional structure of an alloy resistor with high efficiency heat dissipation of the utility model;

[0020] Figure 3 It is a schematic diagram of the second partial three-dimensional structure of an alloy resistor with high efficiency heat dissipation of the utility model;

[0021] Figure 4 It is a schematic diagram of the third partial three-dimensional structure of an alloy resistor with high efficiency heat dissipation of the utility model;

[0022] Explanation of the accompanying drawings: 1. Installation component; 2. Snap-fit ​​component; 3. Cooling component; 4. Auxiliary component; 5. Heat dissipation component; 6. Resistor; 7. Circuit board; 101. Installation frame; 102. Installation slot; 103. Contact; 201. Card board; 202. Card slot; 203. Card block; 301. Heat dissipation box; 302. Ventilation plate; 303. Heat dissipation pipe; 304. Ventilation hole; 401. Support block; 402. Connection hole; 501. Heat dissipation plate; 502. Heat dissipation hole. DETAILED DESCRIPTION

[0023] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0024] See also Figure 1 , an alloy resistor with efficient heat dissipation, including a mounting component 1, a clamping component 2, a cooling component 3, an auxiliary component 4, a heat dissipation component 5, a resistor body 6 and a circuit board 7; the mounting component 1 is arranged above the circuit board 7, the resistor body 6 is arranged inside the mounting component 1, the clamping component 2 with a clamping function is arranged above the mounting component 1, the cooling component 3 with a cooling function is arranged on one side of the mounting component 1, the auxiliary component 4 is arranged inside the mounting component 1, and the heat dissipation component 5 with a heat dissipation function is arranged on the side wall of the resistor body 6.

[0025] See also Figure 2The mounting assembly 1 includes a mounting frame 101, a mounting slot 102 and a contact 103; the mounting frame 101 is arranged above the circuit board 7, the mounting slot 102 is opened inside the mounting frame 101, one end of the resistor 6 is provided with a contact 103, and the contact 103 is provided with two groups; the resistor 6 is installed and accommodated through the mounting slot 102, and the two ends of the resistor 6 are respectively in contact with the two contacts 103; the clamping assembly 2 includes a clamping block 203, a clamping slot 202 and a clamping plate 201; the clamping plate 201 is arranged above the mounting frame 101, and the clamping plate 201 A card slot 202 is provided at the bottom, and a card block 203 is provided inside the card slot 202; the card plate 201 cooperates with the card slot 202 through the card block 203, so that the resistor 6 can be fixedly installed inside the installation frame 101; the cooling component 3 includes a heat dissipation box 301 and a ventilation plate 302; a heat dissipation box 301 is provided on one side of the installation frame 101, and the heat dissipation box 301 is provided with two groups, and a ventilation plate 302 is provided on one side of the heat dissipation box 301; air enters the interior of the heat dissipation box 301 through the ventilation plate 302, so that the cooling effect can be achieved.

[0026] See also Figure 3-4 In this embodiment, the cooling component 3 also includes a heat pipe 303 and a ventilation hole 304; the ventilation hole 304 is opened on the side wall of the ventilation plate 302, and the ventilation hole 304 is opened in multiple groups, and the heat pipe 303 is arranged inside the heat dissipation box 301; the air enters the interior of the heat dissipation box 301 through the multiple groups of ventilation holes 304, and is cooled by the heat dissipation pipe 303; the auxiliary component 4 includes a support block 401 and a connecting hole 402; the support block 401 is arranged inside the installation frame 101, and the support block 401 is arranged in multiple groups, and the connecting hole 402 is opened on the side wall of the installation frame 101, and the connecting hole 402 is opened in multiple groups; the cooled air enters through the connecting hole 402 In the installation frame 101, the resistor 6 is supported by multiple groups of support blocks 401, and a space is formed under the resistor 6. Air circulates through this space, which can increase the contact area between the air and the resistor 6, thereby achieving the purpose of efficient heat dissipation; the heat dissipation component 5 includes a heat dissipation plate 501 and a heat dissipation hole 502; a heat dissipation plate 501 is arranged on the side wall of the support block 401, another heat dissipation plate 501 is arranged under the card plate 201, and a heat dissipation hole 502 is opened on the side wall of the installation frame 101, and a plurality of heat dissipation holes 502 are opened; the heat dissipation and cooling effect of the resistor 6 can be increased by using the plurality of heat dissipation plates 501, and the air is ventilated and dissipated through the plurality of heat dissipation holes 502.

[0027] During operation, air enters the interior of the heat dissipation box 301 through the multiple sets of ventilation holes 304, the air is cooled through the heat dissipation pipe 303, and the cooled air enters the installation frame 101 through the connecting hole 402. The resistor 6 is supported by the multiple sets of support blocks 401, and a space is formed under the resistor 6. The air circulates through this space, which can increase the contact area between the air and the resistor 6 and the effect of cooling the resistor 6. The resistor 6 can be cooled and dissipated through the multiple sets of heat dissipation plates 501, and the air is ventilated and dissipated through the multiple sets of heat dissipation holes 502, thereby achieving the purpose of efficient heat dissipation.

[0028] Through the above steps, the air is cooled by the cooling component 3, and the cooled air enters the installation component 1. The resistor 6 is supported by the auxiliary component 4, and a space is formed under the resistor 6. The air circulates through this space, which can increase the contact area between the air and the resistor 6 and increase the heat dissipation effect. The resistor 6 can be cooled and dissipated through multiple groups of heat dissipation components 5, thereby achieving the purpose of efficient heat dissipation.

[0029] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the purpose of the present invention.

Claims

1. An alloy resistor with high heat dissipation efficiency, comprising a mounting assembly (1); characterized in that: The invention also comprises a snap-fitting component (2), a cooling component (3), an auxiliary component (4), a heat dissipation component (5), a resistor (6) and a circuit board (7); a mounting component (1) is arranged above the circuit board (7); a resistor (6) is arranged inside the mounting component (1); a snap-fitting component (2) with a snap-fitting function is arranged above the mounting component (1); a cooling component (3) with a cooling function is arranged on one side of the mounting component (1); an auxiliary component (4) is arranged inside the mounting component (1); and a heat dissipation component (5) with a heat dissipation function is arranged on the side wall of the resistor (6).

2. The alloy resistor with high heat dissipation efficiency according to claim 1, characterized in that: The mounting assembly (1) comprises a mounting frame (101), a mounting groove (102) and a contact (103); the mounting frame (101) is arranged above the circuit board (7), the mounting groove (102) is provided inside the mounting frame (101), and a contact (103) is arranged at one end of the resistor (6), and two groups of contacts (103) are arranged.

3. The alloy resistor with high heat dissipation efficiency according to claim 2, characterized in that: The engaging assembly (2) comprises a card block (203), a card slot (202) and a card board (201); the card board (201) is arranged above the installation frame (101), the card slot (202) is provided below the card board (201), and the card block (203) is arranged inside the card slot (202).

4. The alloy resistor with high heat dissipation efficiency according to claim 2, characterized in that: The cooling component (3) comprises a heat dissipation box (301) and a ventilation plate (302); a heat dissipation box (301) is arranged on one side of the installation frame (101), two groups of heat dissipation boxes (301) are arranged, and a ventilation plate (302) is arranged on one side of the heat dissipation box (301).

5. The alloy resistor with high heat dissipation efficiency according to claim 4, characterized in that: The cooling component (3) further comprises a heat dissipation pipe (303) and ventilation holes (304); the ventilation holes (304) are provided on the side wall of the ventilation plate (302), and the ventilation holes (304) are provided in a plurality of groups; and the heat dissipation box (301) is provided with a heat dissipation pipe (303) inside.

6. The alloy resistor with high efficiency heat dissipation according to claim 5, characterized in that: The auxiliary component (4) comprises a support block (401) and a connection hole (402); the support block (401) is arranged inside the installation frame (101), and a plurality of groups of the support blocks (401) are arranged; the side wall of the installation frame (101) is provided with a connection hole (402), and a plurality of groups of the connection holes (402) are arranged.

7. The alloy resistor with high heat dissipation efficiency according to claim 6, characterized in that: The heat dissipation assembly (5) comprises a heat dissipation plate (501) and heat dissipation holes (502); a heat dissipation plate (501) is arranged on the side wall of the support block (401), another heat dissipation plate (501) is arranged below the card plate (201), and a heat dissipation hole (502) is opened on the side wall of the installation frame (101), and a plurality of groups of heat dissipation holes (502) are opened.

Images