Semiconductor device production positioning mechanism

Abstract

The utility model discloses a semiconductor device production positioning mechanism which comprises a bottom plate, a mounting plate is fixedly arranged at the top of the bottom plate, a supporting plate is fixedly arranged at the top of the mounting plate, a driving shaft and a driven shaft are rotationally arranged on the front side of the supporting plate, and a transmission chain is arranged on the surface of the driving shaft in a meshed mode. The interior of the transmission chain is connected with a driven shaft in a meshed mode, a connecting plate is fixedly arranged on the surface of the driven shaft, a fixing frame is fixedly arranged on the surface of the connecting plate, a moving assembly is arranged in the fixing frame, the fixing frame is provided with a moving plate through the moving assembly, and a supporting shaft is rotationally arranged in the moving plate. According to the semiconductor device production positioning mechanism, a semiconductor device can be driven to rotate in two different directions, the flexibility and adaptability of the device are improved, and operation on the surface of the semiconductor device is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor device production, in particular to a semiconductor device production positioning mechanism. Background Art

[0002] Semiconductor devices are electronic devices with conductivity between that of good conductors and insulators. They use the special electrical properties of semiconductor materials to perform specific functions. They can be used to generate, control, receive, transform, amplify signals and perform energy conversion. During the production process, semiconductor devices are positioned and clamped by a positioning mechanism to facilitate operations on their surface.

[0003] The "semiconductor device production positioning mechanism" disclosed in the Chinese patent (application number: 202222247817.1) has two threads with opposite rotation directions on the surface of the clamping screw, so that the two thread blocks arranged on the surface of the clamping screw can approach or move away from each other, ensuring that during the rotation of the clamping screw, the two clamping blocks will move relative to or towards each other, better ensuring the accuracy of the movement of the two clamping blocks, and ensuring that during the clamping process of the semiconductor components, there will be no uneven clamping force causing the semiconductor device to break. However, when in use, the above patent can only drive the clamped semiconductor device to rotate in one direction, and cannot adjust the semiconductor device in multiple directions. It is inconvenient to operate in actual use and has certain limitations. Utility Model Content

[0004] In view of the deficiencies of the prior art, the utility model provides a semiconductor device production positioning mechanism, which is used to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A semiconductor device production positioning mechanism comprises a base plate, a mounting plate is fixedly provided on the top of the base plate, a supporting plate is fixedly provided on the top of the mounting plate, a driving shaft and a driven shaft are rotatably provided on the front side of the supporting plate, a driving assembly is provided on the top of the mounting plate, a transmission chain is meshedly provided on the surface of the driving shaft, the interior of the transmission chain is meshed and connected with the driven shaft, a connecting plate is fixedly provided on the surface of the driven shaft, a fixing frame is fixedly provided on the surface of the connecting plate, a moving assembly is provided inside the fixing frame, a moving plate is provided on the fixing frame through the moving assembly, a supporting shaft is rotatably provided inside the moving plate, a clamping plate is fixedly provided on one end of the supporting shaft close to the center of the base plate, a first hand wheel is fixedly provided on the right side of the moving plate on the right side, and the first hand wheel is fixedly connected to the supporting shaft.

[0007] Preferably, the driving assembly includes a connecting block fixedly arranged on the top of the mounting plate, a connecting rod is rotatably arranged inside the connecting block, a second hand wheel is fixedly arranged at the front end of the connecting rod, and the rear end of the connecting rod is fixedly connected to the driving shaft.

[0008] Preferably, the moving component includes a rotating motor fixedly arranged on the right side of the fixed frame, the output end of the rotating motor passes through the fixed frame, extends to the interior of the fixed frame and is fixedly provided with a screw, the surface thread of the screw is provided with a moving block, the front side of the moving block is fixedly provided with a fixed plate, and the front side of the fixed plate is fixedly connected to the moving plate.

[0009] Preferably, an anti-skid pad is fixedly provided on one side of the clamping plate away from the supporting shaft, and the anti-skid pad is made of rubber.

[0010] Preferably, a support pad is fixedly provided at the bottom of the base plate, and the number of the support pads is multiple.

[0011] Preferably, the surface of the screw rod is provided with two kinds of threads, and the rotation directions of the two threads are opposite.

[0012] Preferably, there are two clamping plates, and the two clamping plates are symmetrically distributed.

[0013] Compared with the prior art, the beneficial effects of the utility model are: the semiconductor device production positioning mechanism drives the active shaft to rotate through the driving component, the active shaft drives the driven shaft to rotate through the transmission chain, the driven shaft drives the connecting plate to rotate, so that the semiconductor device rotates in one direction, when the semiconductor device needs to be rotated in another direction, it is only necessary to rotate the first hand wheel to rotate the support shaft on the right side, the support shaft on the right side drives the clamping plate and the anti-skid pad on the right side to rotate, and the semiconductor device drives the anti-skid pad on the left side to rotate, the anti-skid pad on the left side drives the clamping plate and the support shaft on the left side to rotate, so that the semiconductor device rotates in another direction, the device can drive the semiconductor device to rotate in two different directions, improves the flexibility and adaptability of the device, and is convenient for operation on the surface of the semiconductor device. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is the structural survey drawing of the utility model;

[0015] Figure 2 It is a right sectional view of the structure of the utility model;

[0016] Figure 3 It is a front cross-sectional view of the local structure of the utility model.

[0017] In the figure: 1, base plate; 2, mounting plate; 3, support plate; 4, driven shaft; 5, driving shaft; 6, transmission chain; 7, connecting rod; 8, connecting block; 9, second hand wheel; 10, connecting plate; 11, rotating motor; 12, screw; 13, moving block; 14, fixed plate; 15, moving plate; 16, support shaft; 17, clamping plate; 18, anti-slip pad; 19, first hand wheel; 20, fixed frame; 21, support pad. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] Reference Figure 1-3A semiconductor device production positioning mechanism includes a base plate 1, a mounting plate 2 is fixedly arranged on the top of the base plate 1, a support plate 3 is fixedly arranged on the top of the mounting plate 2, a driving shaft 5 and a driven shaft 4 are rotatably arranged on the front side of the support plate 3, a driving assembly is arranged on the top of the mounting plate 2, and the driving assembly includes a connecting block 8 fixedly arranged on the top of the mounting plate 2, a connecting rod 7 is rotatably arranged inside the connecting block 8, a second hand wheel 9 is fixedly arranged on the front end of the connecting rod 7, and the rear end of the connecting rod 7 is fixedly connected to the driving shaft 5, and the second hand wheel 9 is rotated to drive the connecting rod 7 to rotate The driving shaft 5 is driven to rotate through the connecting rod 7, so that the driving device flips over. The surface of the driving shaft 5 is meshed with a transmission chain 6, and the interior of the transmission chain 6 is meshed and connected with the driven shaft 4. The surface of the driven shaft 4 is fixedly provided with a connecting plate 10, and the surface of the connecting plate 10 is fixedly provided with a fixing frame 20. The interior of the fixing frame 20 is provided with a moving component. The fixing frame 20 is provided with a moving plate 15 through the moving component. The interior of the moving plate 15 is rotatably provided with a support shaft 16, and one end of the support shaft 16 close to the center of the bottom plate 1 is fixedly provided with a clamping plate 17. The clamping plate 17 is fixedly provided at the end of the support shaft 16 close to the center of the bottom plate 1. There are two plates 17, and the two clamping plates 17 are symmetrically distributed. A non-slip pad 18 is fixedly provided on one side of the clamping plate 17 away from the support shaft 16. The non-slip pad 18 is made of rubber. A first hand wheel 19 is fixedly provided on the right side of the movable plate 15 on the right side. The first hand wheel 19 is fixedly connected to the support shaft 16. The semiconductor device production positioning mechanism drives the active shaft 5 to rotate through the driving component, and the active shaft 5 drives the driven shaft 4 to rotate through the transmission chain 6. The driven shaft 4 rotates and drives the connecting plate 10 to rotate, so that the semiconductor device rotates in one direction. When When the semiconductor device needs to be rotated in another direction, it is only necessary to rotate the first hand wheel 19 to rotate the support shaft 16 on the right side, and the support shaft 16 on the right side drives the clamping plate 17 and the anti-skid pad 18 on the right side to rotate, and drives the anti-skid pad 18 on the left side to rotate through the semiconductor device, and the anti-skid pad 18 on the left side drives the clamping plate 17 and the support shaft 16 on the left side to rotate, so that the semiconductor device rotates in the other direction. The device can drive the semiconductor device to rotate in two different directions, thereby improving the flexibility and adaptability of the device and facilitating operations on the surface of the semiconductor device.

[0020] Specifically, the moving component includes a rotating motor 11 fixedly arranged on the right side of the fixing frame 20, the output end of the rotating motor 11 passes through the fixing frame 20 and extends to the inside of the fixing frame 20 and is fixedly arranged with a screw 12, the surface of the screw 12 is provided with two kinds of threads, and the rotation directions of the two threads are opposite, the surface thread of the screw 12 is provided with a moving block 13, the front side of the moving block 13 is fixedly provided with a fixing plate 14, the front side of the fixing plate 14 is fixedly connected with the moving plate 15, the rotating motor 11 is started to drive the screw 12 to rotate, the rotation of the screw 12 drives the moving block 13 to rotate, the rotation of the moving block 13 drives the moving plate 15 to move through the fixing plate 14, and the moving plate 15 drives the rubber pad 18 to approach each other through the support shaft 16 and the clamping plate 17 to clamp the semiconductor device.

[0021] Specifically, a support pad 21 is fixedly provided at the bottom of the base plate 1 . There are multiple support pads 21 , and the device is supported by the support pads 21 .

[0022] The electrical components mentioned in this article are all connected to an external main controller and 220V mains electricity, and the main controller can be a conventional known device for controlling a computer or the like.

[0023] When in use: place the semiconductor device between the two anti-skid pads 18, clamp and fix the semiconductor device by bringing the two anti-skid pads 18 close to each other, rotate the second hand wheel 9, drive the connecting rod 7 to rotate inside the connecting block 8, the connecting rod 7 rotates to drive the driving shaft 5, the driving shaft 5 rotates to drive the transmission chain 6, the transmission chain 6 rotates to drive the driven shaft 4, the driven shaft 4 rotates to drive the connecting plate 10, the connecting plate 10 drives the support shaft 16 and the clamping plate 16 through the fixing frame 20, the moving block 13, the fixing plate 14 and the moving plate 15. The plate 17 rotates, driving the anti-skid pad 18 and the semiconductor device to rotate through the clamping plate 17. When the semiconductor device needs to be rotated in another direction, it is only necessary to rotate the first hand wheel 19 to rotate the support shaft 16 on the right side. The support shaft 16 on the right side drives the clamping plate 17 and the anti-skid pad 18 on the right side to rotate. The anti-skid pad 18 on the right side drives the anti-skid pad 18 on the left side to rotate through the semiconductor device. The anti-skid pad 18 on the left side drives the support shaft 16 to rotate inside the movable plate 15 through the clamping plate 17 on the left side, so that the semiconductor device rotates in another direction.

[0024] To sum up, the semiconductor device production positioning mechanism drives the active shaft 5 to rotate through the driving component, and the active shaft 5 drives the driven shaft 4 to rotate through the transmission chain 6. The rotation of the driven shaft 4 drives the connecting plate 10 to rotate, so that the semiconductor device rotates in one direction. When the semiconductor device needs to be rotated in another direction, it is only necessary to rotate the first hand wheel 19 to rotate the support shaft 16 on the right side, and the support shaft 16 on the right side drives the clamping plate 17 and the anti-skid pad 18 on the right side to rotate, and drives the anti-skid pad 18 on the left side to rotate through the semiconductor device, and the anti-skid pad 18 on the left side drives the clamping plate 17 and the support shaft 16 on the left side to rotate, so that the semiconductor device rotates in another direction. The device can drive the semiconductor device to rotate in two different directions, thereby improving the flexibility and adaptability of the device and facilitating operations on the surface of the semiconductor device.

[0025] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0026] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor device production positioning mechanism, comprising a base plate (1), characterized in that: A mounting plate (2) is fixedly arranged on the top of the base plate (1), a support plate (3) is fixedly arranged on the top of the mounting plate (2), a driving shaft (5) and a driven shaft (4) are rotatably arranged on the front side of the support plate (3), a driving assembly is arranged on the top of the mounting plate (2), a transmission chain (6) is meshedly arranged on the surface of the driving shaft (5), the interior of the transmission chain (6) is meshedly connected with the driven shaft (4), a connecting plate (10) is fixedly arranged on the surface of the driven shaft (4), and the connecting plate (10) ) is fixedly provided on the surface of the base plate (1), a moving assembly is provided inside the fixed frame (20), a moving plate (15) is provided on the fixed frame (20) through the moving assembly, a support shaft (16) is rotatably provided inside the moving plate (15), a clamping plate (17) is fixedly provided at one end of the support shaft (16) close to the center of the base plate (1), a first hand wheel (19) is fixedly provided on the right side of the moving plate (15), and the first hand wheel (19) is fixedly connected to the support shaft (16).

2. A semiconductor device production positioning mechanism according to claim 1, characterized in that: The driving assembly comprises a connecting block (8) fixedly arranged on the top of the mounting plate (2), a connecting rod (7) is rotatably arranged inside the connecting block (8), a second hand wheel (9) is fixedly arranged at the front end of the connecting rod (7), and the rear end of the connecting rod (7) is fixedly connected to the driving shaft (5).

3. A semiconductor device production positioning mechanism according to claim 1, characterized in that: The moving assembly comprises a rotating motor (11) fixedly arranged on the right side of a fixing frame (20); an output end of the rotating motor (11) penetrates the fixing frame (20) and extends to the inside of the fixing frame (20) and is fixedly provided with a screw rod (12); a moving block (13) is threadedly arranged on the surface of the screw rod (12); a fixing plate (14) is fixedly arranged on the front side of the moving block (13); and the front side of the fixing plate (14) is fixedly connected to the moving plate (15).

4. A semiconductor device production positioning mechanism according to claim 1, characterized in that: An anti-skid pad (18) is fixedly provided on one side of the clamping plate (17) away from the supporting shaft (16), and the anti-skid pad (18) is made of rubber.

5. A semiconductor device production positioning mechanism according to claim 1, characterized in that: A support pad (21) is fixedly arranged at the bottom of the base plate (1), and the number of the support pads (21) is plural.

6. A semiconductor device production positioning mechanism according to claim 3, characterized in that: The surface of the screw rod (12) is provided with two kinds of threads, and the rotation directions of the two kinds of threads are opposite.

7. A semiconductor device production positioning mechanism according to claim 1, characterized in that: The number of the clamping plates (17) is two, and the two clamping plates (17) are symmetrically distributed.

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