Silicon wafer fixing clamp

Abstract

The utility model relates to the technical field of silicon wafer processing, in particular to a silicon wafer fixing clamp which comprises a first substrate, a second substrate is symmetrically arranged on one side of the first substrate, clamping grooves are formed in the upper ends of the first substrate and the second substrate, fixing assemblies are arranged in the first substrate and the second substrate, and the first substrate and the second substrate are provided with clamping grooves. The two ends of the fixing assembly are fixedly connected with clamp assemblies, and the clamp assemblies can be attached to the first base plate or the second base plate. According to the utility model, the electromagnetic coil is electrified to endow the electromagnet with strong magnetism, the electromagnet attracts the first electromagnetic plate and the second electromagnetic plate to approach to the electromagnet, and the approaching of the first electromagnetic plate or the second electromagnetic plate drives the clamp assembly to move inwards, so that the rubber roller is moved to a silicon wafer to fix the silicon wafer; the arrangement of the rubber roller can reduce the pressure intensity at the contact position with the silicon wafer, prevent the silicon wafer from being crushed, enable the surface of the silicon wafer to be exposed, facilitate the processing of the surface of the silicon wafer, and protect the silicon wafer from being crushed.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon slice processing, in particular to a silicon slice fixing fixture. Background Art

[0002] Silicon wafers are generally used as solar panels. In the production and processing of silicon wafers, it is usually necessary to etch the surface of the silicon wafer. The simplest and most commonly used classifications of etching are: dry etching and wet etching. Obviously, the difference between them is that the wet method uses solvents or solutions for etching. Dry etching is mainly divided into three types: metal etching, dielectric etching and silicon etching;

[0003] After searching the Chinese patent with publication number CN203391136U, a silicon wafer reprocessing fixture is disclosed.

[0004] In the above technical solution: the main structure of the fixture is a right-angled trapezoidal plane solid, the angle between its lower bottom surface and the inclined side surface is 135 degrees, and a right-angled square groove is provided at the upper bottom surface and the right-angle surface of the fixture, the bottom surface of the groove is parallel to the lower bottom surface, and baffles are provided at both ends of the groove. The utility model can fix the silicon wafer, reprocess the silicon wafer on a precision grinder, and change the silicon wafer from a substandard silicon wafer to a qualified silicon wafer without exceeding the specified standards;

[0005] However, in the above solution, the technology clamps the silicon wafer in the clamp and fixes the silicon wafer from both sides. This setting cannot process the surface of the silicon wafer, the clamping effect is poor, and the structural strength of the silicon wafer is poor. During the adjustment process, the point contact of the clamp on the silicon wafer may cause the silicon wafer to break. Due to different application scenarios, the size of silicon wafers varies greatly. A single-size clamp is not suitable for processing different silicon wafers.

[0006] To this end, we propose a silicon wafer fixing fixture. Utility Model Content

[0007] The utility model mainly solves the technical problems existing in the above-mentioned prior art and provides a silicon wafer fixing clamp.

[0008] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a silicon wafer fixing fixture, comprising a first substrate, characterized in that: a second substrate is symmetrically arranged on one side of the first substrate, a card slot is opened on the upper ends of the first substrate and the second substrate, a fixing component is arranged in each of the first substrate and the second substrate, and a clamp component is fixedly connected to both ends of the fixing component, and the clamp component can be attached to the first substrate or the second substrate;

[0009] A fixing component, the fixing component includes an electromagnet with an electromagnetic coil wound around the outside of the electromagnet, a first electromagnetic plate is arranged on one side of the electromagnet, and a second electromagnetic plate is arranged on the other side of the electromagnet, and the opposite sides of the first electromagnetic plate and the second electromagnetic plate are fixedly connected to the clamp component.

[0010] Preferably, a first spring is fixedly connected to one side of the electromagnet, and the first spring is fixedly connected to the first electromagnetic plate; a second spring is fixedly connected to the other side of the electromagnet, and the second spring is fixedly connected to the second electromagnetic plate.

[0011] Preferably, the fixing assembly further comprises a mounting groove for mounting the fixing assembly, and the clamp assembly is slidably connected in the mounting groove.

[0012] Preferably, the clamp assembly comprises a connecting rod, one end of the connecting rod extending out of the mounting slot is fixedly connected to an elbow, one end of the elbow is fixedly connected to a fixing block, and a rubber roller is rotatably connected inside the fixing block.

[0013] Preferably, a distance adjustment component is fixedly connected between the first substrate and the second substrate, and the distance adjustment component comprises a fixed tube, and a thread groove is formed in the fixed tube.

[0014] Preferably, a screw rod is threadedly connected to the thread groove, and an adjusting block is fixedly connected to one side of the screw rod.

[0015] Preferably, a support rod is fixedly connected to one side of the adjustment block, and the support rod is rotatably connected in a fixing seat.

[0016] The utility model provides a silicon wafer fixing fixture, which has the following improvements and advantages compared with the prior art:

[0017] (1) The utility model adopts a clamp component at one end of a fixing component to fix a silicon wafer, a second substrate is symmetrically arranged on one side of a first substrate, a card slot is opened on the upper ends of the first substrate and the second substrate, a fixing component is arranged inside the first substrate and the second substrate, and both ends of the fixing component are fixedly connected with a clamp component, and the clamp component can be attached to the first substrate or the second substrate; a fixing component, the fixing component includes an electromagnet, an electromagnetic coil is wound around the electromagnet, a first electromagnetic plate is arranged on one side of the electromagnet, and a second electromagnetic plate is arranged on the other side of the electromagnet, and the opposite sides of the first electromagnetic plate and the second electromagnetic plate are fixedly connected to the clamp component, a first spring is fixedly connected to one side of the electromagnet, and the first spring is fixedly connected to the first electromagnetic plate, and a second spring is fixedly connected to the other side of the electromagnet, and the second spring is fixedly connected to the second electromagnetic plate The fixing assembly also includes an installation groove for installing the fixing assembly, and the clamp assembly is slidably connected in the installation groove. The clamp assembly includes a connecting rod, and one end of the connecting rod extending out of the installation groove is fixedly connected to an elbow, and one end of the elbow is fixedly connected to a fixing block. A rubber roller is rotatably connected in the fixing block. The silicon wafer is placed on the card slot, and the electromagnetic coil is energized to give the electromagnet a strong magnetism. The electromagnet attracts the first electromagnetic plate and the second electromagnetic plate to approach it. The approach of the first electromagnetic plate or the second electromagnetic plate drives the clamp assembly to move inward, thereby moving the rubber roller to the silicon wafer to fix the silicon wafer. The setting of the rubber roller can reduce the pressure at the contact point with the silicon wafer to avoid crushing the silicon wafer, and can expose the surface of the silicon wafer to facilitate processing of the surface of the silicon wafer. The setting of the rubber roller can protect the silicon wafer from being crushed.

[0018] (2) The utility model adopts a distance adjustment component to adjust the distance between the first substrate and the second substrate. The distance adjustment component is fixedly connected between the first substrate and the second substrate. The distance adjustment component includes a fixed tube. A threaded groove is opened in the fixed tube. A screw is threadedly connected in the threaded groove. An adjustment block is fixedly connected to one side of the screw. A support rod is fixedly connected to one side of the adjustment block. The support rod is rotatably connected in the fixed seat. By rotating the adjustment block, the rotation of the adjustment block drives the screw to move on the threaded groove in the fixed tube, thereby moving the screw to the outside of the fixed tube, thereby increasing the distance between the first substrate and the second substrate. Silicon wafers of different sizes can be placed therein. The utility model has good applicability to the size of silicon wafers and can fix silicon wafers of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the implementation or the prior art description. Obviously, the drawings described below are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0020] Figure 1 It is a three-dimensional schematic diagram of the structure of the utility model;

[0021] Figure 2 It is a schematic diagram of the internal structure of the utility model;

[0022] Figure 3 It is a structural stereoscopic schematic diagram of the distance adjustment component in the utility model.

[0023] Legend:

[0024] 10. First substrate; 11. Second substrate; 12. Card slot; 20. Fixing assembly; 21. Mounting slot; 22. Electromagnet; 23. Electromagnetic coil; 24. First spring; 25. First electromagnetic plate; 26. Second spring; 27. Second electromagnetic plate; 30. Clamp assembly; 31. Connecting rod; 32. Elbow; 33. Fixing block; 34. Rubber roller; 40. Distance adjustment assembly; 41. Fixing tube; 42. Threaded groove; 43. Screw; 44. Adjusting block; 45. Support rod; 46. Fixing seat. DETAILED DESCRIPTION

[0025] Below, the invention is further described in conjunction with the accompanying drawings and specific embodiments:

[0026] Example 1

[0027] See also Figure 1 to Figure 2Embodiment 1 is described, comprising a first substrate 10, characterized in that: a second substrate 11 is symmetrically arranged on one side of the first substrate 10, the first substrate 10 cooperates with the second substrate 11 to install a silicon wafer, a card slot 12 is provided on the upper ends of the first substrate 10 and the second substrate 11, the card slot 12 is arranged to facilitate fixing the silicon wafer, a fixing component 20 is arranged in the first substrate 10 and the second substrate 11, both ends of the fixing component 20 are fixedly connected with a clamp component 30, and the clamp component 30 can be attached to the first substrate 10 or the second substrate 11; the fixing component 20, the fixing component 20 includes an electromagnet 22, the electromagnet 22 attracts a first electromagnetic plate 25 and a second electromagnetic plate 27, an electromagnetic coil 23 is wound around the outside of the electromagnet 22, the electromagnetic coil 23 gives the electromagnet 22 strong magnetism, a first electromagnetic plate 25 is arranged on one side of the electromagnet 22, the electromagnet 22 attracts the first electromagnetic plate 25 to approach, a second electromagnetic plate 27 is arranged on the other side of the electromagnet 22, the electromagnet 22 attracts the second electromagnetic plate 27 to approach, the first electromagnetic plate 25 and the second electromagnetic plate 27 are reversely moved One side of the electromagnet 22 is fixedly connected to the clamp assembly 30, the first electromagnetic plate 25 and the second electromagnetic plate 27 drive the fixing assembly 20 to move and fix the silicon wafer. One side of the electromagnet 22 is fixedly connected to the first spring 24, the first spring 24 is fixedly connected to the first electromagnetic plate 25, the function of the first spring 24 is to reset the fixing assembly 20, thereby releasing the silicon wafer, and the other side of the electromagnet 22 is fixedly connected to the second spring 26, the second spring 26 is fixedly connected to the second electromagnetic plate 27, the second spring 26 is similar, and the fixing assembly 20 also includes The fixture assembly 30 includes a mounting groove 21 for mounting the fixing assembly 20, and the fixture assembly 30 is slidably connected in the mounting groove 21. The fixture assembly 30 includes a connecting rod 31, and the connecting rod 31 is used to drive the fixture assembly 30 to move. One end of the connecting rod 31 extending out of the mounting groove 21 is fixedly connected to an elbow 32, and the elbow 32 connects a fixing block 33 and the connecting rod 31. One end of the elbow 32 is fixedly connected to a fixing block 33, and a rubber roller 34 is rotatably connected in the fixing block 33. The elasticity of the rubber roller 34 can reduce the pressure on the contact surface with the silicon wafer;

[0028] In this embodiment, the silicon wafer is placed on the card slot 12, and the electromagnetic coil 23 is energized to give the electromagnet 22 a strong magnetism. The electromagnet 22 attracts the first electromagnetic plate 25 and the second electromagnetic plate 27 to approach it. The approach of the first electromagnetic plate 25 or the second electromagnetic plate 27 drives the clamp assembly 30 to move inward, thereby moving the rubber roller 34 onto the silicon wafer to fix the silicon wafer. The setting of the rubber roller 34 can reduce the pressure at the contact point with the silicon wafer to avoid crushing the silicon wafer, and can expose the surface of the silicon wafer to facilitate processing of the silicon wafer surface. The setting of the rubber roller 34 can protect the silicon wafer from being crushed.

[0029] Example 2

[0030] See also Figure 1 and Figure 3Embodiment 2 is described, including a distance adjustment component 40 fixedly connected between the first substrate 10 and the second substrate 11, the distance adjustment component 40 controls the distance between the first substrate 10 and the second substrate 11, so as to be suitable for silicon wafers of different sizes, the distance adjustment component 40 includes a fixed tube 41, the fixed tube 41 plays a supporting and telescopic role, a thread groove 42 is opened in the fixed tube 41, a screw rod 43 is threadedly connected in the thread groove 42, the thread groove 42 cooperates with the screw rod 43 to adjust the length, an adjustment block 44 is fixedly connected to one side of the screw rod 43, the adjustment block 44 is convenient for rotating the screw 43, a support rod 45 is fixedly connected to one side of the adjustment block 44, the function of the support rod 45 is to connect the fixed seat 46 and the adjustment block 44, the support rod 45 is rotatably connected in the fixed seat 46, and the fixed seat 46 plays a supporting role;

[0031] In this embodiment, by rotating the adjusting block 44, the rotation of the adjusting block 44 drives the screw 43 to move on the thread groove 42 in the fixing tube 41, thereby moving the screw 43 to the outside of the fixing tube 41, thereby increasing the distance between the first substrate 10 and the second substrate 11, and being able to place silicon wafers of different sizes. It has good applicability to the size of silicon wafers and can fix silicon wafers of different sizes.

Claims

1. A silicon wafer fixing fixture, comprising a first substrate (10), characterized in that: A second substrate (11) is symmetrically arranged on one side of the first substrate (10); a clamping groove (12) is provided at the upper ends of the first substrate (10) and the second substrate (11); a fixing component (20) is arranged inside the first substrate (10) and the second substrate (11); both ends of the fixing component (20) are fixedly connected to a clamp component (30); and the clamp component (30) can be attached to the first substrate (10) or the second substrate (11); A fixing assembly (20), the fixing assembly (20) comprising an electromagnet (22), an electromagnetic coil (23) being wound around the outside of the electromagnet (22), a first electromagnetic plate (25) being arranged on one side of the electromagnet (22), and a second electromagnetic plate (27) being arranged on the other side of the electromagnet (22), and the opposite sides of the first electromagnetic plate (25) and the second electromagnetic plate (27) are both fixedly connected to a clamp assembly (30).

2. The silicon wafer fixing fixture according to claim 1, characterized in that: A first spring (24) is fixedly connected to one side of the electromagnet (22), and the first spring (24) is fixedly connected to a first electromagnetic plate (25). A second spring (26) is fixedly connected to the other side of the electromagnet (22), and the second spring (26) is fixedly connected to a second electromagnetic plate (27).

3. The silicon wafer fixing fixture according to claim 1, characterized in that: The fixing assembly (20) further comprises a mounting groove (21) for mounting the fixing assembly (20), and the clamp assembly (30) is slidably connected in the mounting groove (21).

4. The silicon wafer fixing fixture according to claim 3, characterized in that: The clamp assembly (30) comprises a connecting rod (31), one end of the connecting rod (31) extending out of the mounting slot (21) is fixedly connected to an elbow (32), one end of the elbow (32) is fixedly connected to a fixing block (33), and a rubber roller (34) is rotatably connected inside the fixing block (33).

5. The silicon wafer fixing fixture according to claim 1, characterized in that: A distance adjustment component (40) is fixedly connected between the first substrate (10) and the second substrate (11); the distance adjustment component (40) comprises a fixed tube (41) having a threaded groove (42) formed therein.

6. The silicon wafer fixing fixture according to claim 5, characterized in that: A screw rod (43) is threadedly connected in the thread groove (42), and an adjusting block (44) is fixedly connected to one side of the screw rod (43).

7. The silicon wafer fixing fixture according to claim 6, characterized in that: A support rod (45) is fixedly connected to one side of the adjustment block (44), and the support rod (45) is rotatably connected in a fixing seat (46).

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