Industrial energy optimization device

Abstract

The utility model discloses an industrial energy optimizing device which comprises a supporting frame, a water storage tank arranged at the upper end of the supporting frame, semiconductor chilling plates penetrating through the left side and the right side of the outer wall of the water storage tank, cooling fans installed on the left side and the right side of the outer wall of the water storage tank, and a water suction pump installed on one side of the upper end of the outer wall of the water storage tank. The other side of the upper end of the outer wall of the water storage tank is communicated with a water return pipe, a cold guide box with an opening in the rear end is arranged above one side of the outer wall of the water storage tank, a condensation pipe is arranged at the front end of the inner wall of the cold guide box, a water outlet of the water suction pump is communicated with a water outlet pipe, and the other end of the condensation pipe is communicated with a circulating pipe. The open end of the cold guide box is covered with a box cover, an air blowing fan is installed in the middle of the box cover, and a control panel is arranged on one side of the outer wall of the water storage tank. The heat dissipation structure solves the problems that a heat dissipation structure of an industrial energy comprehensive device is not high in heat dissipation efficiency, and rapid heat dissipation of the industrial energy comprehensive device is not convenient, and the service life of the industrial energy comprehensive device is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of industrial devices, in particular to an industrial energy optimization device. Background Art

[0002] Industry is the lifeblood of national economic development. Reducing environmental pollution in the process of industrial energy use while ensuring sustainable social energy supply is a concern in the current industrial production process. There are many energy users in industrial parks and the energy demand is large, which will cause energy-consuming equipment to generate a lot of heat. Although the heat dissipation structure of the current industrial energy comprehensive optimization device is of many types and quantities, there are still certain problems.

[0003] The heat dissipation structure of most industrial energy comprehensive optimization devices only has one heat dissipation method, which is fan heat dissipation. The heat dissipation efficiency is low and it is inconvenient to dissipate the heat quickly, which affects the service life of the industrial energy device. Utility Model Content

[0004] The purpose of the utility model is to provide an industrial energy optimization device, which solves the problem that the heat dissipation efficiency of the heat dissipation structure of the industrial energy comprehensive device is low and it is inconvenient to dissipate heat quickly, thereby prolonging the service life of the industrial energy device.

[0005] The above technical objectives of the utility model are achieved through the following technical solutions:

[0006] An industrial energy optimization device, comprising a support frame, a water tank with a heat preservation function which is arranged on the upper end of the support frame and is hollow inside, positioning grooves are opened inwardly on both sides of the outer wall of the water tank, and cooling components which are sealed and connected to the corresponding positioning grooves are arranged on both sides of the inner wall of the water tank, and each positioning groove is installed with a semiconductor refrigeration plate whose cold end contacts the corresponding cooling component, and cooling fans corresponding to the hot ends of the semiconductor refrigeration plates are installed on both sides of the outer wall of the water tank, and a water pump is installed on one side of the upper end of the outer wall of the water tank, and the water inlet of the water pump is connected with a water inlet pipe extending to the bottom of the inner wall of the water tank, and a return water pipe which is connected with the water inlet pipe and extends into the inner wall of the water tank is arranged on the other side of the upper end of the outer wall of the water tank, and a water inlet groove is opened downward on the other side of the upper end of the outer wall of the water tank, and a plug which matches with the water inlet groove is detachably connected to the water inlet groove;

[0007] A cooling box with a rear end opening is arranged above one side of the outer wall of the water storage tank, a condenser arranged in a serpentine shape is arranged at the front end of the inner wall of the cooling box, a water outlet pipe connected to one end of the condenser is arranged between the water outlet of the water pump and a water outlet pipe connected thereto, a circulation pipe connected thereto is arranged between the other end of the condenser and the upper end of the return pipe, the open end of the cooling box is covered with a box cover matched therewith, a through hole is arranged through the middle position of the box cover, an air blowing fan connected thereto is installed in the through hole, a plurality of air holes distributed in an array are arranged inwardly on the outer wall of the box cover at the edge of the through hole, a control panel is arranged on one side of the outer wall of the water storage tank, and the semiconductor refrigeration plate, the water pump, the cooling fan and the air blowing fan are all electrically connected to the control panel.

[0008] By adopting the above technical solution, when in use, first move the support frame to the corresponding position and fix it, then fix the cold conduction box to the heat dissipation position of the industrial energy device, then remove the plug, add an appropriate amount of coolant into the water tank through the water inlet groove, plug the plug, power on the device, operate the control panel to make the semiconductor refrigeration plate and the water pump in the positioning groove work, the cold energy generated by the cold end of the semiconductor refrigeration plate is heat exchanged with the coolant through the cold conduction component, so as to reduce the temperature of the coolant, at the same time, the water pump extracts the coolant through the water inlet pipe and transports it to the condenser from the water outlet pipe, the condenser achieves the heat dissipation effect by lowering the temperature of the cold conduction box to exchange heat with the hot end of the industrial energy equipment, at the same time, the cooling fan can dissipate the heat of the hot end of the semiconductor refrigeration plate to speed up its cooling efficiency, the blowing fan on the box cover can blow the cold energy of the condenser tube to the entire cold conduction box, so that it can achieve the effect of uniform heat dissipation, and the gas in the cold conduction box can exchange gas with the outside through the air vents to avoid the temperature increase in the cold conduction box affecting the heat dissipation efficiency.

[0009] The utility model is further configured as follows: the outer wall of each heat dissipation fan and the outer wall of the air blowing fan are covered with a hollow-shaped shield that matches with them.

[0010] By adopting the above technical solution, not only can the staff avoid accidental touches that may cause safety accidents, but also foreign objects can be prevented from falling into the cooling fan or the air blowing fan and causing damage thereto.

[0011] The utility model is further configured as follows: the cooling assembly comprises a cooling plate, a plurality of cooling fins arranged on the inner wall of the cooling plate and distributed at equal intervals, and the cooling fins of two cooling assemblies are opposite and staggered.

[0012] By adopting the above technical solution, the contact area between the coolant and the cooling component can be increased, thereby reducing the cooling time of the coolant.

[0013] The utility model is further configured as follows: a front end of the inner wall of the cold conduction box is provided with a plurality of cold conduction blocks connected to the outer wall of the vertical section of the condenser tube.

[0014] By adopting the above technical solution, as much cold energy conducted by the condenser tube as possible can be heat exchanged with the cold conduction box, thereby improving the utilization rate of its cold energy.

[0015] The utility model is further configured as follows: a water dispersion assembly is arranged on the outer wall of one end of the water return pipe extending into the water storage tank, and the water dispersion assembly comprises a connecting frame and a water dispersion wheel rotatably connected to the bottom of the inner wall of the connecting frame.

[0016] By adopting the above technical solution, the circulated coolant can be further dispersed so that it can be mixed with the low-temperature condensate as quickly as possible.

[0017] The utility model is further configured as follows: fixing buckles are provided at both upper and lower ends of the left and right sides of the outer wall of the cold conduction box.

[0018] In summary, the utility model has the following beneficial effects:

[0019] Firstly, the utility model solves the problem that the heat dissipation efficiency of the heat dissipation structure of the industrial energy comprehensive device is low and it is inconvenient to quickly dissipate the heat, thereby prolonging the service life of the industrial energy device;

[0020] Secondly, the utility model uses heat exchange of the condenser tube and cooperates with the air cooling of the air blowing fan to not only evenly distribute the cold in the cold conduction box but also accelerate the heat dissipation efficiency of the cold conduction box;

[0021] Thirdly, the water dispersion component of the utility model can disperse the coolant that is used for heat exchange and circulated into the water storage tank, thereby accelerating the mixing range with the coolant in the water storage tank and improving the refrigeration efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0023] Figure 2 It is mainly used to show the position and connection relationship of each component;

[0024] Figure 3 It is mainly used to display condenser tubes and cooling blocks;

[0025] Figure 4 It is a structural schematic diagram of the cooling conduction component of the utility model;

[0026] Figure 5 It is a structural schematic diagram of the water dispersion assembly of the utility model.

[0027] In the figure: 1. Support frame; 11. Water storage tank; 12. Water inlet groove; 13. Plug; 14. Positioning groove; 15. Cooling assembly; 16. Cooling plate; 17. Cooling sheet; 18. Semiconductor refrigeration sheet; 19. Cooling fan; 2. Water pump; 21. Water inlet pipe; 22. Water return pipe; 23. Diffuser assembly; 24. Connecting frame; 25. Diffuser wheel; 26. Cooling box; 27. Condenser; 28. Cooling block; 29. ​​Water outlet pipe; 3. Circulation pipe; 31. Box cover; 32. Through hole; 33. Air fan; 34. Shield; 35. Air vent; 36. Fixing buckle; 37. Control panel. DETAILED DESCRIPTION

[0028] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0029] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", "front", "back", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0030] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0031] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] Example, see Figure 1-5An industrial energy optimization device includes a support frame 1, a water tank 11 with a heat preservation function and a hollow interior arranged at the upper end of the support frame 1, a positioning groove 14 is opened inwardly on both sides of the outer wall of the water tank 11, and a cooling assembly 15 is provided on both sides of the inner wall of the water tank 11 and sealed and connected with the corresponding positioning groove 14. The cooling assembly 15 includes a cooling plate 16, and a plurality of cooling fins 17 arranged on the inner wall of the cooling plate 16 and distributed at equal intervals. The cooling fins 17 of the two cooling assemblies 15 are opposite and The positioning grooves 14 are staggered, with each of the positioning grooves 14 being provided with a semiconductor refrigeration plate 18 whose cold end contacts the corresponding cold conduction plate 16. The left and right sides of the outer wall of the water tank 11 are provided with a cooling fan 19 corresponding to the hot end of the semiconductor refrigeration plate 18. A water pump 2 is provided on one side of the upper end of the outer wall of the water tank 11. The water inlet of the water pump 2 is connected to a water inlet pipe 21 extending to the bottom of the inner wall of the water tank 11. The other side of the upper end of the outer wall of the water tank 11 is provided with a return pipe 22 connected to the water inlet pipe 21 and extending to the inside thereof.

[0033] A water dispersion assembly 23 is provided on the outer wall of one end of the return water pipe 22 extending into the water storage tank 11. The water dispersion assembly 23 includes a connecting frame 24 and a water dispersion wheel 25 rotatably connected to the bottom of the inner wall of the connecting frame 24. A water inlet groove 12 is downwardly opened on the other side of the upper end of the outer wall of the water storage tank 11. The water inlet groove 12 is detachably connected to a plug 13 that cooperates with it. A cold conduction box 26 with a rear end opening is provided above one side of the outer wall of the water storage tank 11. A fixing buckle 36 is provided at both upper and lower ends of the left and right sides of the outer wall of the cold conduction box 26. A condensing tube 27 arranged in a serpentine shape is provided at the front end of the inner wall of the cold conduction box 26. A plurality of cold conduction blocks 28 connected to the outer wall of the vertical section of the condensing tube 27 are provided at the front end of the inner wall of the cold conduction box 26.

[0034] A water outlet pipe 29 connected to the water outlet of the water pump 2 and one end of the condenser 27 is provided between them, and a circulation pipe 3 connected to the other end of the condenser 27 and the upper end of the return pipe 22 is provided between them. The open end of the cooling box 26 is covered with a box cover 31 matched with it, and a through hole 32 is provided in the middle position of the box cover 31. A blowing fan 33 connected to it is installed in the through hole 32. The outer wall of each cooling fan 19 and the outer wall of the blowing fan 33 are covered with a hollow baffle 34 matched with it. The outer wall of the box cover 31 is provided with a plurality of air holes 35 distributed in an array inwardly at the edge of the through hole 32. A control panel 37 is provided on one side of the outer wall of the water storage tank 11. The semiconductor refrigeration plate 18, the water pump 2, the cooling fan 19 and the blowing fan 33 are all electrically connected to the control panel 37.

[0035] Usage: When in use, first move the support frame 1 to the corresponding position and fix it, then fix the cooling box 26 to the heat dissipation position of the industrial energy device through the fixing buckle 36, then remove the plug 13, add an appropriate amount of coolant into the water storage tank 11 through the water inlet groove 12, plug the plug 13, power on the device, operate the control panel 37 to make the semiconductor refrigeration sheet 18 and the water pump 2 in the positioning groove 14 work, the cold energy generated by the cold end of the semiconductor refrigeration sheet 18 is heat exchanged with the coolant through the cooling assembly 15, and the cooling plate 16 and the cooling sheet 17 can increase the contact range of the cooling component 15 for conducting cold, reduce the temperature of the coolant and shorten the cooling time. At the same time, the water pump 2 draws the coolant through the water inlet pipe 21 and transports it to the condenser 27 from the water outlet pipe 29. Finally, the coolant flows back into the water storage tank 11 through the circulation pipe 3 and the return pipe 22. The coolant will impact the water dispersion wheel 25 in the water dispersion component 23 to make it rotate, and the water dispersion wheel 25 rotating on the connecting frame 24 will further disperse the coolant, thereby accelerating the mixing rate and range with the coolant in the water storage tank 11.

[0036] The cold energy conducted by the condenser 27 will be conducted to the cold conduction box 26 through the cold conduction block 28 to reduce the temperature of the cold conduction box 26 and exchange heat with the hot end of the industrial energy equipment to achieve the heat dissipation effect. At the same time, the cooling fan 19 can dissipate the heat from the hot end of the semiconductor refrigeration plate 18 to speed up its cooling efficiency. The blowing fan 33 on the box cover 31 can blow the cold energy of the condenser 27 into the entire cold conduction box 26 to achieve the effect of uniform heat dissipation. The gas in the cold conduction box 26 can exchange gas with the outside through the air vents 35 to prevent the temperature increase in the cold conduction box 26 from affecting the heat dissipation efficiency. The shield 34 can not only prevent the staff from accidentally touching it and causing a safety accident, but also prevent external objects from falling into the cooling fan 19 or the blowing fan 33 and causing damage to them.

[0037] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. An industrial energy optimization device, comprising a support frame (1), and a water storage tank (11) which is arranged at the upper end of the support frame (1) and has a hollow interior and has a heat preservation function, characterized in that: Positioning grooves (14) are provided inwardly on both left and right sides of the outer wall of the water storage tank (11); cooling components (15) are provided on both left and right sides of the water storage tank (11) and are sealedly connected to the corresponding positioning grooves (14); each positioning groove (14) is provided with a semiconductor cooling plate (18) whose cold end contacts the corresponding cooling component (15); and cooling fans (19) corresponding to the hot ends of the semiconductor cooling plates (18) are provided on both left and right sides of the outer wall of the water storage tank (11). A water pump (2) is installed on one side of the upper end of the outer wall of the water storage tank (11), and the water inlet of the water pump (2) is connected to a water inlet pipe (21) extending to the bottom of the inner wall of the water storage tank (11). A return pipe (22) is provided on the other side of the upper end of the outer wall of the water storage tank (11) and is connected to the water inlet pipe and extends into the interior of the water storage tank. A water inlet groove (12) is provided downwardly on the other side of the upper end of the outer wall of the water storage tank (11), and the water inlet groove (12) is detachably connected to a plug (13) that matches with the water inlet groove (12); A cooling box (26) with a rear end opening is arranged above one side of the outer wall of the water storage tank (11), and a condenser (27) arranged in a serpentine shape is arranged at the front end of the inner wall of the cooling box (26). A water outlet pipe (29) is arranged between the water outlet of the water pump (2) and one end of the condenser (27), and both are connected thereto. A circulation pipe (3) is arranged between the other end of the condenser (27) and the upper end of the return water pipe (22), and both are connected thereto. The open end of the cooling box (26) is covered with a box cover ( 31), a through hole (32) is provided in the middle of the box cover (31), an air blowing fan (33) connected thereto is installed in the through hole (32), a plurality of air vents (35) distributed in an array are provided inwardly from the edge of the through hole (32) on the outer wall of the box cover (31), a control panel (37) is provided on one side of the outer wall of the water storage tank (11), the semiconductor cooling sheet (18), the water pump (2), the cooling fan (19) and the air blowing fan (33) are all electrically connected to the control panel (37).

2. An industrial energy optimization device according to claim 1, characterized in that: The outer wall of each heat dissipation fan (19) and the outer wall of the air blowing fan (33) are covered with a hollow-shaped shield (34) that matches with them.

3. The industrial energy optimization device according to claim 1, characterized in that: The cooling assembly (15) comprises a cooling plate (16), and a plurality of cooling fins (17) arranged on the inner wall of the cooling plate (16) and distributed at equal intervals. The cooling fins (17) of the two cooling assemblies (15) are arranged opposite to each other and staggered.

4. The industrial energy optimization device according to claim 1, characterized in that: A plurality of cooling blocks (28) connected to the outer wall of the vertical section of the condenser tube (27) are arranged at the front end of the inner wall of the cooling box (26).

5. The industrial energy optimization device according to claim 1, characterized in that: A water dispersion assembly (23) is provided on the outer wall of one end of the water return pipe (22) extending into the water storage tank (11), and the water dispersion assembly (23) comprises a connecting frame (24) and a water dispersion wheel (25) rotatably connected to the bottom of the inner wall of the connecting frame (24).

6. The industrial energy optimization device according to claim 1, characterized in that: Fixing buckles (36) are provided at both upper and lower ends of the left and right sides of the outer wall of the cold conduction box (26).

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