Heat dissipation type packaging structure

Abstract

The utility model provides a heat dissipation type packaging structure, comprising a plastic package body having a first surface and a second surface which are oppositely arranged in a first direction; the base island is arranged on the first surface of the plastic package body, and the surface of the base island is exposed on the first surface; the chip is arranged on the surface, deviating from the first surface of the plastic package body, of the base island; the lead is arranged in the plastic package body, one end of the lead is connected with the chip, and the other end of the lead is connected with the base island outside the chip; the pins are arranged on the second surface of the plastic package body, the surfaces of the pins are exposed on the second surface, and the surfaces, deviating from the second surface, of the pins are connected with the leads on the extension paths of the leads; and the insulating part is arranged on the extension path of the lead and cuts off the lead, and the insulating part is positioned between the joint of the lead and the base island and the joint of the lead and the pin. According to the heat dissipation type packaging structure, the reliability of the heat dissipation type packaging structure can be ensured while the heat dissipation performance of the heat dissipation type packaging structure is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a heat dissipation type packaging structure. Background Art

[0002] QFN (Quad Flat No-lead) / DFN (Dual Flat No-lead Package) packaging is an advanced packaging form. It has the advantages of small size, high density, good thermal conductivity, etc., and is widely used in the field of integrated circuit packaging.

[0003] The traditional QFN / DFN has a relatively simple heat dissipation channel. Since it can only rely on the back of the base island located in the center of the bottom of the package to dissipate heat, and its heat dissipation area is small, the heat dissipation speed is slow. To improve this phenomenon, the industry has introduced reverse QFN / DFN. Reverse QFN / DFN sets the base island and the external pins on two opposite surfaces of the plastic package, so that the base island can dissipate heat upwards. However, its internal pins are an overhead structure, which is easy to cause abnormal operation or poor solder joint bonding due to jitter during wire bonding operations, causing reliability problems.

[0004] Therefore, how to improve the heat dissipation performance of the QFN / DFN packaging structure while ensuring the reliability of the packaging structure has become one of the technical problems that need to be solved urgently. Summary of the invention

[0005] The technical problem to be solved by the utility model is to provide a new heat dissipation type packaging structure, which can improve the heat dissipation performance of the heat dissipation type packaging structure while ensuring the reliability of the heat dissipation type packaging structure.

[0006] In order to solve the above problems, the utility model provides a heat dissipation packaging structure, which includes: a plastic package body, having a first surface and a second surface arranged opposite to each other in a first direction; a base island, arranged on the first surface of the plastic package body, and the surface is exposed to the first surface; a chip, arranged on the surface of the base island away from the first surface of the plastic package body; a lead, arranged in the plastic package body, one end of the lead is connected to the chip, and the other end is connected to the base island outside the chip; a pin, arranged on the second surface of the plastic package body, and the surface is exposed to the second surface, and on the extension path of the lead, the surface of the pin away from the second surface is connected to the lead; an insulating member, arranged on the extension path of the lead and cuts off the lead, and the insulating member is located between the connection between the lead and the base island and the connection between the lead and the pin.

[0007] In one embodiment, the heat dissipation packaging structure includes a plurality of insulating members spaced apart around the periphery of the chip, and one insulating member cuts off one of the leads.

[0008] In one embodiment, the heat dissipation packaging structure includes a plurality of insulating members arranged at intervals around the periphery of the chip, and a same insulating member cuts off a plurality of the leads.

[0009] In one embodiment, the heat dissipation packaging structure includes an insulating member surrounding the periphery of the chip, and the insulating member cuts off all the leads.

[0010] In one embodiment, the bottom surface and the side surface of the base island are exposed to the plastic package body.

[0011] In one embodiment, in the second direction, the side surface of the pin is flush with the side surface of the base island, or the side surface of the base island protrudes beyond the side surface of the pin, and the second direction is perpendicular to the first direction.

[0012] In one embodiment, on the second side, the surface of the plastic package body has a recessed area, a portion of the lead is exposed in the recessed area, and the pin is mounted in the recessed area to be connected to the lead.

[0013] In one embodiment, the recessed area is disposed at an edge of the second surface of the plastic package body, and one side surface of the pin is exposed to the side surface of the plastic package body.

[0014] In one embodiment, the recessed area is disposed within the edge of the second surface of the plastic package body, and the side surface of the pin is covered by the plastic package body.

[0015] In one embodiment, a highest region of the lead in the first direction is connected to a surface of the pin facing away from the second surface.

[0016] In one embodiment, on the second surface, the surface of the plastic package body is a flat surface, and the surface of the pin protrudes from the second surface.

[0017] In one embodiment, a solder block is further included. The solder block is disposed in the plastic package and located on the extension path of the lead. The pin is welded to the solder block and further connected to the lead.

[0018] In one embodiment, on the second surface, the surface of the plastic package body has a recessed area, and the solder block is arranged at the bottom of the recessed area.

[0019] In one embodiment, a groove is provided on the second surface of the plastic package body, and the groove cuts off the lead on the extension path of the lead, and the cross section of the lead is exposed to the side wall of the groove. The solder block is arranged in the groove and connected to the cross section of the lead.

[0020] In one embodiment, a groove is provided on the second surface of the plastic package body, and the lead is exposed at the bottom of the groove on the extension path of the lead. The solder block is provided in the groove and connected to the surface of the lead.

[0021] In the heat dissipation packaging structure provided by the embodiment of the utility model, the pins and the base island are located on two opposite surfaces of the plastic package body, which can realize the upward heat dissipation of the base island, and the heat can be dissipated on the surface of the base island by water cooling or other means, thereby improving the heat dissipation performance of the packaging structure. One end of the lead is connected to the chip, and the other end is connected to the base island outside the chip. On the one hand, there is no situation where the lead wire is suspended. When the wire bonding operation is performed, the wire bonding operation is stable, and there will be no abnormal operation or poor solder joint bonding due to jitter, thereby improving the reliability of the packaging structure. On the other hand, the base island occupies the position of the original pin, increasing the area of ​​the base island, thereby increasing the heat dissipation area of ​​the packaging structure, which is beneficial to the heat dissipation of the packaging structure. At the same time, the packaging structure is insulated and isolated by an insulating member, which can prevent the base island from being electrically connected to the chip through the lead. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 It is a schematic diagram of a reverse QFN / DFN package structure;

[0024] Figure 2 It is a schematic diagram of a heat dissipation packaging structure provided by an embodiment of the utility model;

[0025] Figure 3 yes Figure 2 Schematic diagram of removing pins;

[0026] Figure 4 It is a schematic diagram of a heat dissipation packaging structure provided by an embodiment of the utility model;

[0027] Figure 5 It is a schematic diagram of a heat dissipation packaging structure provided by an embodiment of the utility model;

[0028] Figure 6 yes Figure 5 Schematic diagram of removing pins, insulation and solder bumps;

[0029] Figure 7 It is a schematic diagram of a heat dissipation packaging structure provided by an embodiment of the utility model;

[0030] Figure 8 yes Figure 7 Schematic diagram of removing pins, insulation and solder bumps;

[0031] Fig. 9 It is a schematic diagram of a heat dissipation packaging structure provided by an embodiment of the utility model;

[0032] Fig.10 yes Fig. 9 Schematic diagram of removing pins, insulation and solder bumps;

[0033] Fig.11 It is a schematic diagram of a heat dissipation packaging structure provided by an embodiment of the utility model;

[0034] Fig.12 It is a schematic diagram of the distribution of insulating components in a heat dissipation packaging structure provided by an embodiment of the utility model;

[0035] Fig.13 It is a schematic diagram of the distribution of insulating components in a heat dissipation packaging structure provided by an embodiment of the utility model;

[0036] Fig.14 It is a schematic diagram of the distribution of insulating components in a heat dissipation packaging structure provided by an embodiment of the utility model;

[0037] Fig.15 It is a schematic diagram of the distribution of insulating components in a heat dissipation packaging structure provided by an embodiment of the utility model. DETAILED DESCRIPTION

[0038] like Figure 1As shown, it is a schematic diagram of a reverse QFN / DFN packaging structure, in which the base island 110 and the outer pin 111A are arranged on two opposite surfaces (such as the bottom surface and the top surface) of the plastic package 112, the inner pin 111B is arranged in the plastic package 112, and the chip 113 is arranged on the surface of the base island 110 facing the inside of the plastic package 112, and is connected to the side of the inner pin 111B facing the bottom surface of the plastic package 112 through the lead 114, wherein the inner pin 111B and the outer pin 111A are different regions of the same pin. In this packaging structure, the base island 110 can dissipate heat upward, thereby increasing the heat dissipation performance of the packaging structure. Since the inner pin 111B and the base island 110 are located at different horizontal planes, and the inner pin 111B is an overhead structure, when the wire bonding operation is performed on the side of the inner pin 111B facing the bottom surface of the plastic package 112, it is easy to cause abnormal operation or poor solder joint bonding due to jitter, affecting the reliability of the packaging structure.

[0039] In view of the above-mentioned technical problems existing in the packaging structure, the utility model provides a heat dissipation type packaging structure. In this packaging structure, the base island and the pins are arranged on opposite surfaces of the plastic package body. The base island can dissipate heat upward, and there are no overhead internal pins. The packaging structure improves the heat dissipation performance of the packaging structure while ensuring the reliability of the packaging structure.

[0040] The specific implementation of the heat dissipation packaging structure provided by the utility model is described in detail below with reference to the accompanying drawings.

[0041] Figure 2 This is a schematic diagram of a heat dissipation packaging structure provided by an embodiment of the present invention. Figure 2 The heat dissipation packaging structure includes a plastic package 200, having a first surface 201 and a second surface 202 arranged opposite to each other in a first direction D1; a base island 210, arranged on the first surface 201 of the plastic package 200, and the surface is exposed to the first surface 201; a chip 220, arranged on the surface of the base island 210 away from the first surface 201 of the plastic package 200; a lead 230, arranged in the plastic package 200, one end of the lead 230 is connected to the chip 220, and the other end is connected to the outer side of the chip 220 The base island 210 is connected; the pin 240 is arranged on the second surface 202 of the plastic package body 200, and the surface is exposed to the second surface 202, and on the extension path of the lead 230, the surface of the pin 240 away from the second surface 202 is connected to the lead 230; the insulating member 250 is arranged on the extension path of the lead 230 and cuts off the lead 230, and the insulating member 250 is located between the connection between the lead 230 and the base island 210 and the connection between the lead 230 and the pin 240.

[0042] In the heat dissipation packaging structure provided by the embodiment of the utility model, the pin 240 and the base island 210 are located on two opposite surfaces of the plastic package body 200, so that the base island 210 can dissipate heat upward, and the heat can be dissipated by water cooling or other methods on the surface of the base island 210, thereby improving the heat dissipation performance of the packaging structure. One end of the lead 230 is connected to the chip 220, and the other end is connected to the base island 210 outside the chip 220. On the one hand, there is no Figure 1 In the case where the lead wire bonding position is suspended, the bonding operation is stable during the bonding operation, and there will be no abnormal operation or poor solder joint bonding due to jitter, which improves the reliability of the package structure. On the other hand, the base island 210 occupies the position of the original pin, increasing the area of ​​the base island 210, thereby increasing the heat dissipation area of ​​the package structure, which is further beneficial to the heat dissipation of the package structure. At the same time, the package structure insulates and isolates the lead wire 230 through the insulating member 250 to prevent the base island 210 from being electrically connected to the chip 220 through the lead wire 230.

[0043] In some embodiments, the first surface 201 and the second surface 202 of the plastic packaging body 200 refer to two surfaces of the plastic packaging body 200 that are relatively arranged in the first direction D1. In this embodiment, the first surface 201 of the plastic packaging body 200 is the bottom surface of the plastic packaging body 200, and the second surface 202 of the plastic packaging body 200 is the top surface of the plastic packaging body 200.

[0044] The base island 210 dissipates heat through the exposed surface. Specifically, the bottom surface of the base island 210 is exposed to the first surface 201 of the plastic package 200, and the base island 210 dissipates heat through the bottom surface. The base island 210 occupies the position of the original pin, increasing the area of ​​the base island 210 exposed to the first surface 201 of the plastic package 200, and enhancing the heat dissipation performance of the packaging structure. In this embodiment, the side of the base island 210 is also exposed to the side of the plastic package 200, further enhancing the heat dissipation performance of the packaging structure.

[0045] The chip 220 can be arranged on the surface of the base island 210 away from the first surface 201 of the plastic package body 200 through an adhesive layer 221. Specifically, the chip 220 is arranged on the top surface of the base island 210 through the adhesive layer 221, and the top surface and the bottom surface of the base island 210 are arranged opposite to each other in the first direction D1.

[0046] In this embodiment, one end of the lead 230 is connected to the top surface of the chip 220, and the other end is connected to the top surface of the base island 210 outside the chip 220. The lead 230 is formed by a wire bonding process. The bonding position of the lead 230 is located on the base island 210. When the wire bonding operation is performed to form the lead 230, the wire bonding operation is stable, and there will be no abnormal operation or poor solder joint bonding due to jitter, thereby improving the reliability of the packaging structure.

[0047] The pin 240 is located outside the plastic package 200 and on the second surface 202 of the plastic package 200. The pin 240 can be electrically connected to an external device through the surface not covered by the plastic package 200. Specifically, the pin 240 has a top surface and a bottom surface that are relatively arranged in the first direction D1. The top surface of the pin 240 is not covered by the plastic package 200 and is used to be electrically connected to an external device. The bottom surface of the pin 240 faces the plastic package 200 and is used to connect to the lead 230. The pin 240 and the base island 210 are located on opposite sides of the plastic package 200. After the pin 240 is subsequently mounted on the PCB board, the base island 210 can dissipate heat upward, and heat can be dissipated above the base island 210 by water cooling or other means, further improving the heat dissipation performance of the packaging structure.

[0048] On the extension path of the lead 230, the surface of the pin 240 away from the second surface 202 is connected to the lead 230, wherein the extension path of the lead 230 refers to the path passed by the lead 230. In some embodiments, on the extension path of the lead 230, the highest area of ​​the lead 230 in the first direction D1 is connected to the surface of the pin 240 away from the second surface 202. Specifically, the lead 230 is arc-shaped, and the highest area of ​​the lead 230 in the first direction D1 is the highest area of ​​the arc, which is connected to the bottom surface of the pin 240.

[0049] In some embodiments, in the second direction D2, the side of the pin 240 is flush with the side of the base island 210. Specifically, in this embodiment, the side of the pin 240 is flush with the side of the base island 210, and neither is covered by the plastic package 200. On the one hand, the area of ​​the electrical connection region of the pin 240 is increased, thereby improving the reliability of the packaging structure; on the other hand, the exposed area of ​​the base island 210 is increased, thereby improving the heat dissipation performance of the packaging structure. In another embodiment, the side of the base island 210 may also protrude from the side of the pin 240. Specifically, if Figure 4As shown, the side of the base island 210 protrudes from the side of the pin 240, and the side of the pin 240 is covered by the plastic package 200, while the side of the base island 210 is not covered by the plastic package 200. On the one hand, the protection and support of the plastic package 200 on the pin 240 is increased, thereby improving the reliability of the packaging structure; on the other hand, the exposed area of ​​the base island 210 is increased, thereby improving the heat dissipation performance of the packaging structure. The second direction D2 is perpendicular to the first direction D1. In this embodiment, the first direction D1 is the Z direction in the Cartesian coordinate system, and the second direction D2 is the X direction in the Cartesian coordinate system.

[0050] In some embodiments, see Figure 2 and Figure 3 ,in, Figure 3 for Figure 2 In the schematic diagram without the pin 240, the second surface 202 of the plastic package body 200 has a recessed area 203 on the surface of the plastic package body 200, and part of the lead 230 is exposed in the recessed area 203. The pin 240 is mounted in the recessed area 203 to be connected with the lead 230. In some embodiments, the pin 240 can be adhered to the bottom of the recessed area 203 through a conductive layer (not shown in the drawings), and the bottom surface of the pin 240 is electrically connected to the lead 230 through the conductive layer.

[0051] In some embodiments, the recessed area 203 is disposed at the edge of the second surface 202 of the plastic package 200, and after the pin 240 is mounted on the recessed area 203, one side of the pin 240 is exposed to the side of the plastic package 200. In some embodiments, in the process of forming the heat dissipation packaging structure, after the plastic package 200 is formed, the edge of the plastic package 200 is ground until the lead 230 is exposed, thereby forming the recessed area 203.

[0052] In some embodiments, the recessed area 203 is disposed within the edge of the second surface 202 of the plastic package 200, and the side surface of the pin 240 is covered by the plastic package 200. Figure 4 As shown, it is a schematic diagram of a heat dissipation packaging structure provided by an embodiment of the utility model. In this embodiment, the recessed area 203 is arranged within the edge of the second surface 202 of the plastic package body 200, that is, the recessed area 203 is a groove recessed toward the plastic package body 200, and the pin 240 is arranged in the groove. The side surfaces of the pin 240 are all covered by the plastic package body 200, and only the top surface is exposed to the plastic package body 200.

[0053] In the above embodiment, the lead 230 is exposed at the bottom of the recessed area 203, and can be directly connected to the pin 240, or electrically connected through a conductive layer. In other embodiments, the heat dissipation packaging structure further includes a solder block 270 (shown in FIG. Figure 5 ), the solder block 270 is disposed in the plastic package body 200 and is located on the extension path of the lead 230 , and the pin 240 is welded to the solder block 270 and further connected to the lead 230 .

[0054] Specifically, see Figure 5 , which is a schematic diagram of a heat dissipation packaging structure provided by an embodiment of the utility model. In this embodiment, on the second surface 202, the surface of the plastic package body 200 has a recessed area 203, the solder block 270 is arranged at the bottom of the recessed area 203 and is located on the extension path of the lead 230, and the pin 240 is welded to the solder block 270 and further connected to the lead 230. The solder block 270 being located on the extension path of the lead 230 includes the solder block 270 cutting off the lead 230, or the solder block 270 contacting the surface of the lead 230.

[0055] In this embodiment, the top surface of the lead 230 is exposed to the bottom surface of the recessed area 203, the solder block 270 extends into the plastic package 200 and cuts off the lead 230, and the solder block 270 is connected to the cross section of the lead 230, and the bottom surface of the pin 240 is connected to the solder block 270, thereby electrically connecting the pin 240 to the lead 230. The solder block 270 can realize the electrical connection between the pin 240 and the lead 230, and can assist the pin 240 to be mounted on the surface of the plastic package 200. In some embodiments, a groove 204 is provided on the second surface 202 of the plastic package body 200, for example, at the bottom of the recessed area 203. On the extension path of the lead 230, the groove 204 cuts off the lead 230, and the cross section of the lead 230 is exposed to the side wall of the groove 204. The solder block 270 is provided in the groove 204 and connected to the cross section of the lead 230. Specifically, please refer to Figure 6 , which is Figure 5Schematic diagram of removing the pin 240, the insulating member 250 and the solder block 270. On the extension path of the lead 230, the groove 204 cuts off the lead 230, and the cross section of the lead 230 is exposed to the side wall of the groove 204. In some embodiments, in the process of forming the heat dissipation packaging structure, after forming the recessed area 203, the groove 204 can be formed by a through molding via (TMV) process; and then solder is filled in the groove 204 to form the solder block 270, see Figure 5 .

[0056] In other embodiments, the top surface of the lead 230 is located in the plastic package 200, that is, the top surface of the lead 230 is not exposed to the bottom surface of the recessed area 203, and the solder block 270 extends into the plastic package 200, cuts off the lead 230 and connects to the cross section of the lead 230. For example, see Figure 7 , which is a schematic diagram of a heat dissipation packaging structure provided by an embodiment of the utility model. In this embodiment, the top surface of the lead 230 is not exposed to the bottom surface of the recessed area 203, and the solder block 270 extends into the plastic package 200 and cuts off the lead 230. In the process of forming the heat dissipation packaging structure, after the plastic package 200 is formed, the edge of the plastic package 200 is ground to a preset distance from the lead 230 to form the recessed area 203, and the top surface of the lead 230 is not exposed to the bottom surface of the recessed area 203. In this embodiment, please refer to Figure 8 , which is Figure 7 Schematic diagram of removing the pin 240, the insulating member 250 and the solder block 270. A groove 204 is provided on the second surface 202 of the plastic package body 200, for example, at the bottom of the recessed area 203. The groove 204 cuts off the lead 230 on the extension path of the lead 230, and the cross section of the lead 230 is exposed to the side wall of the groove 204. In some embodiments, in the process of forming the heat dissipation packaging structure, after forming the recessed area 203, the groove 204 can be formed by a through molding via (TMV) process; and then solder is filled in the groove 204 to form the solder block 270, see Figure 7 .

[0057] In some other embodiments, the solder block 270 does not cut through the lead 230 and is connected to the surface of the lead 230. For example, see Fig. 9, which is a schematic diagram of a heat dissipation packaging structure provided by an embodiment of the utility model. In this embodiment, the top surface of the lead 230 is not exposed to the bottom surface of the recessed area 203, and the solder block 270 extends into the plastic package 200 and is connected to the surface of the lead 230. In this embodiment, please refer to Fig.10 , which is Fig. 9 Schematic diagram of removing the pin 240, the insulating member 250 and the solder block 270. A groove 204 is provided on the second surface 202 of the plastic package body 200, for example, at the bottom of the recessed area 203. The lead 230 is exposed at the bottom of the groove 204 on the extension path of the lead 230. In some embodiments, in the process of forming the heat dissipation packaging structure, after forming the recessed area 203, the groove 204 can be formed by a through molding via (TMV) process; and then solder is filled in the groove 204 to form the solder block 270. Please refer to Fig. 9 .

[0058] In some other embodiments, on the second surface 202, the surface of the plastic package body 200 is a flat surface, and the surface of the pin 240 protrudes from the second surface 202, which facilitates the welding of the pin 240 with components such as a PCB board, and the packaging structure has good solderability. Fig.11 , which is a schematic diagram of a heat dissipation packaging structure provided by an embodiment of the utility model. In this embodiment, the recessed area does not exist on the surface of the plastic package body 200, the second surface 202 is a flat surface, the highest area of ​​the lead 230 in the first direction D1 is exposed to the second surface 202, and the pin 240 is mounted on the second surface 202 and connected to the lead 230. In some embodiments, when preparing the heat dissipation packaging structure, the height of the plastic packaging mold can be controlled so that the plastic packaging material does not cover the highest area of ​​the lead 230, thereby exposing the highest area of ​​the lead 230 in the first direction D1 to the second surface 202. Alternatively, after forming the plastic packaging body 200, the plastic packaging body 200 is ground to expose the highest area of ​​the lead 230 in the first direction D1. After plastic packaging or grinding, the second surface 202 of the plastic packaging body 200 is a flat surface, and the pin 240 is mounted on the second surface 202, that is, the pin protrudes from the second surface 202 of the plastic packaging body 200, which facilitates the welding of the pin 240 with devices such as a PCB board, and the packaging structure has good solderability.

[0059] In some embodiments, on the second surface 202, the surface of the plastic package body 200 is a flat surface, and the solder block 270 may be further disposed on the second surface 202 of the plastic package body 200, and the solder block 270 is located on the extension path of the lead 230. The solder block 270 being located on the extension path of the lead 230 includes the solder block 270 cutting off the lead 230, or the solder block 270 contacting the surface of the lead 230. The specific arrangement of the solder block 270 can be found in Figure 5 , Figure 7 or Fig. 9 .

[0060] like Figure 2 As shown, the insulating member 250 cuts off the lead 230, and is used to insulate and isolate the lead 230 located on both sides of the insulating member 250, so as to prevent the base island 210 and the chip 220 from being electrically connected through the lead 230. In some embodiments, as Figure 6 As shown, on the extension path of the lead 230, between the connection between the lead 230 and the base island 210 and the connection between the lead 230 and the pin 240, a filling groove 205 is provided, and an insulating material is filled in the filling groove 205 to form the insulating member 250. In some embodiments, the filling groove 205 can be formed in the same step as the groove 204 where the solder block 270 is located to simplify the process steps. After forming the filling groove 205 and the groove 204, the insulating material is first filled to form the insulating member 250, and then the conductive material is filled to form the solder block 270; or, the conductive material is first filled to form the solder block 270, and then the insulating material is filled to form the insulating member 250.

[0061] In some embodiments, the insulating member 250 is located inside the plastic package 200, and the surface of the insulating member 250 is covered by the plastic package 200. In other embodiments, Figure 2 As shown, the insulating member 250 is located inside the plastic package body 200, and the upper surface of the insulating member 250 is located on the second surface 202 of the plastic package body 200, that is, the upper surface of the insulating member 250 is not covered by the plastic package body 200, and the pin 240 is directly connected to the upper surface of the insulating member 250 or connected to the upper surface of the insulating member 250 through a conductive layer.

[0062] In some embodiments, one insulating member 250 may cut off one of the lead wires 230 , or cut off a plurality of the lead wires 230 .

[0063] For example, in one embodiment, the heat dissipation packaging structure includes a plurality of insulating members spaced apart around the periphery of the chip, and one insulating member cuts off one lead. Fig.12 , which is a schematic diagram of the distribution of the insulating member 250 in the heat dissipation packaging structure provided by an embodiment of the utility model. The figure is a top view, and multiple insulating members 250 are arranged at intervals around the periphery of the chip 250. The multiple insulating members 250 are independent of each other, and one insulating member 250 cuts off one of the leads 230.

[0064] For another example, in another embodiment, the heat dissipation packaging structure includes a plurality of insulating members spaced apart around the periphery of the chip, and a plurality of leads are cut off by the same insulating member. Fig.13 , which is a schematic diagram of the distribution of the insulating member 250 in the heat dissipation packaging structure provided by an embodiment of the utility model. The figure is a top view, and multiple insulating members 250 are arranged at intervals around the periphery of the chip 250. The multiple insulating members 250 are independent of each other, and the same insulating member 250 cuts off multiple leads 230. In this embodiment, the length of the insulating member 250 is increased so that multiple leads 230 are cut off by the same insulating member 250.

[0065] For another example, in another embodiment, the heat dissipation packaging structure includes an insulating member surrounding the periphery of the chip, and the insulating member cuts off all the leads. Fig.14 , which is a schematic diagram of the distribution of the insulating member 250 in the heat dissipation packaging structure provided by an embodiment of the utility model. The figure is a top view. One of the insulating members 250 surrounds the periphery of the chip 250 to form a closed ring structure. The insulating member 250 cuts off all the leads 230. In this embodiment, the insulating member 250 is arranged in a ring shape so that all the leads 230 are cut off by the insulating member 250. In this embodiment, the insulating member 250 is a closed ring structure. In other embodiments, the insulating member 250 may also be a non-closed structure surrounding the periphery of the chip 250. For example, Fig.15 As shown, it is a distribution diagram of the insulating member 250 in the heat dissipation packaging structure provided in an embodiment of the utility model. The figure is a top view. In this embodiment, in the area where the lead 230 is not set, the insulating member 250 has an opening 251, and the plastic package body 200 is filled in the opening 251 to further strengthen the fixation of the insulating member 250.

[0066] The method for forming a heat dissipation packaging structure provided by an embodiment of the utility model comprises the following steps: providing a lead frame, wherein the lead frame comprises the base island 210; pasting the chip 220 on the base island 210; performing a wire bonding operation to form the lead 230, wherein one end of the lead 230 is connected to the chip 220, and the other end is connected to the base island 210; performing a plastic sealing operation to form the plastic sealing body 200, wherein the plastic sealing body 200 covers the lead 230, the chip 220, and a part of the surface of the base island 210, wherein the bottom surface and the side surface of the base island 210 are All are exposed to the plastic packaging body 200; on the second surface 202 of the plastic packaging body 200, the edge area of ​​the plastic packaging body 200 is ground to form a recessed area 203, or the second surface 202 of the plastic packaging body 200 is ground to form a flat surface, or the height of the plastic packaging mold is controlled during plastic packaging so that the plastic packaging material does not cover the highest area of ​​the lead 230; the insulating member 250 is formed on the extension path of the lead 230; the pin 240 is mounted on the recessed area 203, and the pin 240 is connected to the lead 230 on the extension path of the lead 230.

[0067] In the heat dissipation packaging structure provided by the embodiment of the utility model, the pin 240 and the base island 210 are located on two opposite surfaces of the plastic package body 200, so that the base island 210 can dissipate heat upward, and the heat can be dissipated by water cooling or other methods on the surface of the base island 210, thereby improving the heat dissipation performance of the packaging structure. One end of the lead 230 is connected to the chip 220, and the other end is connected to the base island 210 outside the chip 220. On the one hand, there is no Figure 1 In the case where the lead wire bonding position is suspended, the bonding operation is stable during the bonding operation, and there will be no abnormal operation or poor solder joint bonding due to jitter, which improves the reliability of the package structure. On the other hand, the base island 210 occupies the position of the original pin, increasing the area of ​​the base island 210, thereby increasing the heat dissipation area of ​​the package structure, which is further beneficial to the heat dissipation of the package structure. At the same time, the package structure insulates and isolates the lead wire 230 through the insulating member 250 to prevent the base island 210 from being electrically connected to the chip 220 through the lead wire 230.

[0068] It should be noted that the terms "including" and "having" and their variations involved in the documents of the present utility model are intended to cover non-exclusive inclusions. The terms "first", "second", etc. are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence, unless the context clearly indicates, and it should be understood that the data used in this way can be interchanged under appropriate circumstances. The term "one or more" depends at least in part on the context, and can be used to describe features, structures or characteristics in a singular sense, or can be used to describe a combination of features, structures or features in a plural sense. The term "based on" can be understood as not necessarily intended to express a set of exclusive factors, but can alternatively, also at least in part depending on the context, allow the presence of other factors that are not necessarily explicitly described. In addition, in the absence of conflict, the embodiments of the present utility model and the features in the embodiments can be combined with each other. In addition, in the above description, the description of known components and technologies is omitted to avoid unnecessary confusion of the concept of the present utility model. In the above embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between the embodiments can be referred to each other.

[0069] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A heat dissipation packaging structure, characterized in that: include: The plastic package body has a first surface and a second surface which are arranged opposite to each other in a first direction; A base island, disposed on the first surface of the plastic package body, and with a surface exposed to the first surface; A chip is arranged on a surface of the base island away from the first surface of the plastic package body; A lead wire is disposed in the plastic package, one end of the lead wire is connected to the chip, and the other end of the lead wire is connected to the base island outside the chip; A pin is arranged on the second surface of the plastic package body and its surface is exposed to the second surface. On the extension path of the lead, the surface of the pin facing away from the second surface is connected to the lead; an insulating member is arranged on the extension path of the lead and cuts off the lead, and the insulating member is located between the connection between the lead and the base island and the connection between the lead and the pin.

2. The heat dissipation packaging structure according to claim 1, characterized in that: The heat dissipation packaging structure includes a plurality of insulating members arranged at intervals around the periphery of the chip, and one of the insulating members cuts off one of the leads.

3. The heat dissipation packaging structure according to claim 1, characterized in that: The heat dissipation packaging structure includes a plurality of insulating members arranged at intervals around the periphery of the chip, and a same insulating member cuts off a plurality of the leads.

4. The heat dissipation packaging structure according to claim 1, characterized in that: The heat dissipation packaging structure includes an insulating member surrounding the periphery of the chip, and the insulating member cuts off all the leads.

5. The heat dissipation packaging structure according to claim 1, characterized in that: The bottom surface and the side surface of the base island are exposed to the plastic packaging body.

6. The heat dissipation packaging structure according to claim 1, characterized in that: In the second direction, the side surface of the pin is flush with the side surface of the base island, or the side surface of the base island protrudes beyond the side surface of the pin, and the second direction is perpendicular to the first direction.

7. The heat dissipation packaging structure according to claim 1, characterized in that: On the second surface, the surface of the plastic package body has a recessed area, part of the lead is exposed in the recessed area, and the pin is mounted in the recessed area to be connected with the lead.

8. The heat dissipation packaging structure according to claim 7, characterized in that: The recessed area is arranged at the edge of the second surface of the plastic package body, and one side surface of the pin is exposed to the side surface of the plastic package body.

9. The heat dissipation packaging structure according to claim 7, characterized in that: The recessed area is arranged within the edge of the second surface of the plastic package body, and the side surface of the pin is covered by the plastic package body.

10. The heat dissipation packaging structure according to claim 1, characterized in that: A highest region of the lead in the first direction is connected to a surface of the pin facing away from the second surface.

11. The heat dissipation packaging structure according to claim 1, characterized in that: On the second surface, the surface of the plastic package body is a flat surface, and the surface of the pin protrudes from the second surface.

12. The heat dissipation packaging structure according to claim 1, characterized in that: It also includes a solder block, which is arranged in the plastic package and located on the extension path of the lead. The pin is welded to the solder block and further connected to the lead.

13. The heat dissipation packaging structure according to claim 12, characterized in that: On the second surface, the surface of the plastic package body has a recessed area, and the solder block is arranged at the bottom of the recessed area.

14. The heat dissipation packaging structure according to claim 12, characterized in that: A groove is arranged on the second surface of the plastic package body, and the groove cuts off the lead on the extension path of the lead. The cross section of the lead is exposed to the side wall of the groove, and the solder block is arranged in the groove and connected to the cross section of the lead.

15. The heat dissipation packaging structure according to claim 12, characterized in that: A groove is arranged on the second surface of the plastic package body. On the extension path of the lead, the lead is exposed at the bottom of the groove. The solder block is arranged in the groove and connected to the surface of the lead.

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