Crystal turning equipment used after semiconductor wafer scribing
By using the design of driving screws and clamping blocks in semiconductor wafer flip-floping equipment, the problem of flip angle error is solved, and higher accuracy and stability are achieved.
Patent Information
- Application Number
- CN202420815771.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-19
- Publication Date
- 2024-12-31
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
After the existing crystal-flipping equipment after the scribe of semiconductor wafers is flipped, the spinous plate cannot accurately snap into the ratchet, resulting in errors in the flip angle.
A crystal turning device including a base, a support plate, a rotating rod, a drive motor, a screw, a clamping block and a clamping pad is designed. The moving block and clamping block are brought close to each other by driving the motor until the clamping pad and rubber are The sleeve is in close contact to achieve the fixing of the rotating rod and ensures the accuracy of the flip angle.
The accuracy of the flip of the semiconductor wafer is improved, ensuring that the flip angle is consistent with the predetermined angle, avoiding the rotating lever turning again during the fixing process, and enhancing the stability of the equipment.
Smart Images
Figure CN222270821U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer flipping device after semiconductor wafer dicing. Background Art
[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its original material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. Semiconductor wafers need to be flipped after slicing.
[0003] The existing patent (application number: CN202122589291.0) discloses a semiconductor wafer flipping device after dicing. After flipping, the device fixes the flipping mechanism through the cooperation between the ratchet, the ratchet plate, the threaded rod and the slider. However, after the device is flipped, the ratchet plate may not be exactly stuck in the ratchet during the downward movement, so the ratchet cannot be fixed. Subsequently, when the ratchet plate is stuck in the ratchet, there will be a certain error between the final angle and the predetermined angle. Therefore, the utility model provides a semiconductor wafer flipping device after dicing. Utility Model Content
[0004] In view of the deficiencies in the prior art, the utility model provides a semiconductor wafer flipping device after dicing, which is used to solve the problems raised in the above-mentioned background technology.
[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0006] The swivel chair is provided with a plurality of support members, each of which is provided with a plurality of support members, and the support members are provided with a plurality of support members, and a plurality of support members are provided with a plurality of support members.
[0007] Preferably, the adjustment assembly includes a first fixed plate arranged on the right side of the connecting plate, a first electric push rod is fixedly installed inside the first fixed plate, and an output end of the first electric push rod is fixedly connected to the movable plate.
[0008] Preferably, the clamping assembly includes a second fixed plate arranged on the opposite surface of the movable plate, a second electric push rod is fixedly installed inside the second fixed plate, and a pressure plate is fixedly installed at the output end of the second electric push rod.
[0009] Preferably, a supporting leg is fixedly mounted on the bottom of the base, and the number of the supporting legs is multiple.
[0010] Preferably, the screw is a bidirectional threaded rod, and the screw is made of metal.
[0011] Preferably, the clamping pad has an arc-shaped structure and is made of rubber material.
[0012] Preferably, there are multiple clamping blocks, and the multiple clamping blocks are symmetrically distributed.
[0013] Compared with the prior art, the beneficial effect of the utility model is that after the semiconductor wafer is diced, the wafer flipping device drives the screw to rotate by driving the motor after the semiconductor wafer is flipped to a suitable angle, so that the moving blocks are close to each other along the fixed frame, driving the clamping block and the clamping pad to approach each other until the clamping pad is in close contact with the rubber sleeve, thereby completing the fixation of the rotating rod, and achieving the goal of not causing the rotating rod to rotate again during the fixing process of the rotating rod, so that the flipping angle of the semiconductor wafer is the same as the predetermined angle after the rotating rod is fixed, thereby improving the accuracy of the semiconductor wafer flipping. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a three-dimensional stereogram of the structure of the utility model;
[0015] Figure 2 For this utility model Figure 1 The enlarged view of point A in the middle;
[0016] Figure 3 This is a disassembled diagram of the local structure of the utility model.
[0017] In the figure: 1. base; 2. support plate; 3. rotating rod; 4. rotating handle; 5. rubber sleeve; 6. fixed frame; 7. driving motor; 8. screw; 9. moving block; 10. clamping block; 11. clamping pad; 12. connecting plate; 13. first fixed plate; 14. first electric push rod; 15. moving plate; 16. placement plate; 17. second fixed plate; 18. second electric push rod; 19. pressure plate; 20. supporting leg. DETAILED DESCRIPTION
[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0019] Reference Figure 1-3A semiconductor wafer flipping device after dicing, comprising a base 1, a support plate 2 is fixedly installed on the top of the base 1, a rotating rod 3 is rotatably connected inside the support plate 2, a rubber sleeve 5 is fixedly installed on the surface of the rotating rod 3, a fixing frame 6 is fixedly installed on the right side of the support plate 2, a driving motor 7 is fixedly installed on the front side of the fixing frame 6, an output end of the driving motor 7 passes through the fixing frame 6 and extends to the inside of the fixing frame 6 and is fixedly installed with a screw 8, the screw 8 is a bidirectional threaded rod, and the screw 8 is made of metal material, a moving block 9 is threadedly connected on the surface of the screw 8, and the moving block 9 is slidably connected to the fixing frame 6, a clamping block 10 is fixedly installed on the opposite surface of the moving block 9, the number of the clamping blocks 10 is multiple, and the multiple clamping blocks 10 are symmetrically distributed, By setting a plurality of symmetrically distributed clamping blocks 10, the clamping blocks 10 can be moved simultaneously with each other. Clamping pads 11 are fixedly installed on the facing surfaces of the clamping blocks 10. The clamping pads 11 are in an arc-shaped structure and are made of rubber material. The setting of the clamping pads 11 made of rubber material can improve the friction between the clamping pads 11 and the rubber sleeve 5 when fixed, so as to facilitate the fixation of the rubber sleeve 5 more firmly. A rotating handle 4 is fixedly installed on the left end of the rotating rod 3, and a connecting plate 12 is fixedly installed on the right end of the rotating rod 3. An adjusting component is arranged on the right side of the connecting plate 12. A moving plate 15 is arranged on the right side of the connecting plate 12 through the adjusting component. The adjusting component includes a first fixed plate 13 arranged on the right side of the connecting plate 12, a first fixed plate 13 arranged on the right side of the connecting plate 12, and a second fixed plate 15 arranged on the right side of the connecting plate 12. A first electric push rod 14 is fixedly installed inside a fixed plate 13, and the output end of the first electric push rod 14 is fixedly connected to a moving plate 15. By setting the adjustment component, it is convenient to adjust the distance between the moving plates 15, so that the device can be suitable for semiconductor wafers of different sizes. A placement plate 16 is fixedly installed on the opposite surface of the moving plate 15. A clamping component is arranged on the opposite surface of the moving plate 15. The clamping component includes a second fixed plate 17 arranged on the opposite surface of the moving plate 15. A second electric push rod 18 is fixedly installed inside the second fixed plate 17. A pressing plate 19 is fixedly installed on the output end of the second electric push rod 18. The setting of the clamping component facilitates the fixing of the semiconductor wafer, avoiding the semiconductor wafer from being moved during operation. When flipping, the device may fall off. A supporting leg 20 is fixedly installed at the bottom of the base 1, and the number of the supporting legs 20 is multiple. The semiconductor wafer flipping device after dicing, after the semiconductor wafer is flipped to a suitable angle, drives the screw 8 to rotate by the driving motor 7, so that the moving block 9 approaches each other along the fixed frame 6, drives the clamping block 10 and the clamping pad 11 to approach each other, until the clamping pad 11 is in close contact with the rubber sleeve 5, thereby completing the fixation of the rotating rod 3, and achieving the goal of not causing the rotating rod 3 to rotate again during the fixing process of the rotating rod 3, so that the flipping angle of the semiconductor wafer is the same as the predetermined angle after the rotating rod 3 is fixed, thereby improving the accuracy of the semiconductor wafer flipping.
[0020] During use: observe the size of the semiconductor wafer, start the first electric push rod 14, so that the moving plates 15 move closer to or farther away from each other, until the moving plates 15 move closer to or farther away from each other to a suitable position, place the semiconductor wafer on the placement plate 16, start the second electric push rod 18, so that the pressure plate 19 moves downward until the pressure plate 19 is in close contact with the semiconductor wafer, thereby completing the fixation of the semiconductor wafer, and then rotate the handle 4 to rotate the rotating rod 3, so that the connecting plate 12 is rotated, which can drive the semiconductor wafer to flip, until the semiconductor wafer flips to a suitable angle, start the drive motor 7, so that the screw 8 is rotated, so that the moving blocks 9 move closer to each other along the fixing frame 6, drive the clamping blocks 10 to move closer to each other, and drive the clamping pads 11 to move closer to each other, until the clamping pads 11 move closer to each other and are in close contact with the rubber sleeve 5, thereby completing the fixation of the rotating rod 3.
[0021] To sum up, the semiconductor wafer flipping device after dicing, after the semiconductor wafer is flipped to a suitable angle, drives the screw 8 to rotate through the driving motor 7, so that the moving blocks 9 are close to each other along the fixing frame 6, driving the clamping block 10 and the clamping pad 11 to approach each other until the clamping pad 11 is in close contact with the rubber sleeve 5, thereby completing the fixation of the rotating rod 3, and achieving the goal of not causing the rotating rod 3 to rotate again during the fixing process of the rotating rod 3, so that the flipping angle of the semiconductor wafer is the same as the predetermined angle after the rotating rod 3 is fixed, thereby improving the accuracy of the semiconductor wafer flipping, and solving the problems raised in the above-mentioned background technology.
[0022] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0023] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A semiconductor wafer flipping device after dicing, comprising a base (1), characterized in that: A support plate (2) is fixedly mounted on the top of the base (1), a rotating rod (3) is rotatably connected inside the support plate (2), a rubber sleeve (5) is fixedly mounted on the surface of the rotating rod (3), a fixing frame (6) is fixedly mounted on the right side of the support plate (2), a driving motor (7) is fixedly mounted on the front side of the fixing frame (6), an output end of the driving motor (7) passes through the fixing frame (6) and extends to the inside of the fixing frame (6) and is fixedly mounted with a screw rod (8), a moving block (9) is threadedly connected on the surface of the screw rod (8), and the moving block (9) is slidably connected to the fixing frame (6). The movable block (9) is fixedly mounted with a clamping block (10) on the facing surface, and a clamping pad (11) is fixedly mounted on the facing surface of the clamping block (10). A rotating handle (4) is fixedly mounted on the left end of the rotating rod (3), and a connecting plate (12) is fixedly mounted on the right end of the rotating rod (3). An adjusting component is arranged on the right side of the connecting plate (12), and a movable plate (15) is arranged on the right side of the connecting plate (12) through the adjusting component. A placing plate (16) is fixedly mounted on the facing surface of the movable plate (15), and a pressing component is arranged on the facing surface of the movable plate (15).
2. The semiconductor wafer flipping device after dicing according to claim 1, characterized in that: The adjustment assembly comprises a first fixed plate (13) arranged on the right side of the connecting plate (12), a first electric push rod (14) is fixedly installed inside the first fixed plate (13), and an output end of the first electric push rod (14) is fixedly connected to the moving plate (15).
3. The semiconductor wafer flipping device after dicing according to claim 1, characterized in that: The clamping assembly comprises a second fixed plate (17) arranged on the opposite surface of the moving plate (15), a second electric push rod (18) is fixedly installed inside the second fixed plate (17), and a pressing plate (19) is fixedly installed at the output end of the second electric push rod (18).
4. The semiconductor wafer flipping device after dicing according to claim 1, characterized in that: A supporting leg (20) is fixedly mounted on the bottom of the base (1), and the number of the supporting legs (20) is plural.
5. The semiconductor wafer flipping device after dicing according to claim 1, characterized in that: The screw rod (8) is a bidirectional threaded rod, and the screw rod (8) is made of metal material.
6. The semiconductor wafer flipping device after dicing according to claim 1, characterized in that: The clamping pad (11) has an arc-shaped structure, and the clamping pad (11) is made of rubber material.
7. The semiconductor wafer flipping device after dicing according to claim 1, characterized in that: The number of the clamping blocks (10) is multiple, and the multiple clamping blocks (10) are symmetrically distributed.