Multi-layer structure buffer adhesive tape for SCF screen body

By using a combination of PI layer, silicone layer and copper foil layer in the SCF screen multi-layer structure buffer tape, the problem of curling and curling of existing tape when curved screen is bent, and the structure is simplified, thinner and Impact resistance.

CN222274445UActive Publication Date: 2024-12-31HANPIN (KUNSHAN) ELECTRONIC CO LTD
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Patent Information

Application Number
CN202421094803.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-20
Publication Date
2024-12-31
Estimated Expiration
2034-05-20

AI Technical Summary

Technical Problem

The existing SCF screen multi-layer structure buffer tape is prone to curling and curling problems when the curved screen is bent, and the structure is complex and the weight is large.

Method used

Using the PI layer as the base layer, silicone layers No. 1 and No. 2 and copper foil layers are provided, and a release film is provided at the lower end. The thickness of the copper foil layer is between 0.018 mm and 0.1 mm, and the thickness of the PI layer is between 0.025 mm and 0.050 mm. The thickness of the silicone layer is between 0.05mm and 0.15mm. It is completely bonded to the SCF screen through the No. 2 silicone layer. The copper foil layer resists impact and heat dissipation and prevents edge curling.

Benefits of technology

It effectively avoids curling edges, realizes the thinning and impact strength of the product, simplifies the structure, reduces the layers, and improves the bonding strength.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an SCF screen body multi-layer structure buffer adhesive tape. The SCF screen body multi-layer structure buffer adhesive tape comprises a PI layer, a first silica gel layer arranged on the upper end face of the PI layer, a second silica gel layer arranged on the lower end face of the PI layer, a copper foil layer arranged on the upper end face of the first silica gel layer and a release film arranged on the lower end face of the second silica gel layer. The adhesive tape has the advantages that the PI layer is used as the base material layer, the copper foil can be effectively supported, the whole adhesive tape only has four layers after the release film is removed, the adhesive tape is completely adhered to the SCF screen through the second silica gel layer, edge warping can be effectively avoided, impact resistance and heat dissipation can be achieved through the copper foil, and edge curling can be effectively prevented through the hardness of the copper foil.
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Description

Technical Field

[0001] The utility model relates to the field of adhesive tapes, in particular to a SCF screen body multi-layer structure buffer adhesive tape. Background Art

[0002] With the continuous advancement of technology and consumers' pursuit of high-quality life, the flexible screen market is currently in a rapid growth stage, mainly used in smart phones, wearable devices, smart homes and other fields. Since flexible screens are thin and bendable, these devices are more beautiful and portable. The existing SCF screen multi-layer structure buffer tape adopts a structural design of acrylic pressure-sensitive adhesive + PET + acrylic pressure-sensitive adhesive + acrylic foam + acrylic pressure-sensitive adhesive + copper foil. It is not only heavy, but also complex in structure. When the curved screen is bent, the tape is prone to delamination and curling and warping.

[0003] In view of this, it is necessary to provide a SCF screen multi-layer structure buffer tape. Summary of the invention

[0004] The utility model provides a SCF screen body multi-layer structure buffer tape device, which effectively solves the problem that the existing tape is prone to curling and warping.

[0005] The technical solution adopted by the utility model is

[0006] A SCF screen multilayer structure buffer tape comprises a PI layer, a No. 1 silicone layer arranged on the upper end surface of the PI layer, a No. 2 silicone layer arranged on the lower end surface of the PI layer, a copper foil layer arranged on the upper end surface of the No. 1 silicone layer and a release film arranged on the lower end surface of the No. 2 silicone layer.

[0007] Furthermore, the thickness of the copper foil is in the range of 0.018 mm to 0.1 mm.

[0008] Furthermore, the thickness of the PI layer ranges from 0.025 mm to 0.050 mm.

[0009] Furthermore, the thickness of the No. 1 silicone layer and the No. 2 silicone layer is the same, and the thickness of the No. 1 silicone layer ranges from 0.05 mm to 0.15 mm.

[0010] The beneficial effects of the utility model: by using the PI layer as the substrate layer, the copper foil can be effectively supported. The entire tape has only four layers after removing the release film. It is completely bonded to the SCF screen through the No. 2 silicone layer, which can effectively avoid warping. The copper foil can not only resist impact and dissipate heat, but also effectively prevent curling by using its own hardness. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1This is an overall schematic diagram of the SCF screen multi-layer structure buffer tape provided in an embodiment of the present application.

[0012] The markings in the figure are: 1. PI layer; 2. No. 1 silicone layer; 3. No. 2 silicone layer; 4. Copper foil layer; 5. Release film. DETAILED DESCRIPTION

[0013] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0014] like Figure 1 As shown, an SCF screen multi-layer structure buffer tape provided in an embodiment of the present application comprises a PI layer 1, a No. 1 silicone layer 2 arranged on the upper end surface of the PI layer 1, a No. 2 silicone layer 3 arranged on the lower end surface of the PI layer 1, a copper foil layer 4 arranged on the upper end surface of the No. 1 silicone layer 2, and a release film 5 arranged on the lower end surface of the No. 2 silicone layer 3.

[0015] The copper foil is electrolytic copper, rolled copper, alloy copper, high-resistance copper and other copper with a copper content of more than 99.8%. The structure of this product preferably has a rolled copper of 0.035mm. The first silicone layer 2 and the second silicone layer 3 are coated with silicone pressure-sensitive adhesive, cross-linking agent, and anchoring agent after mixing and stirring to form a silicone gel film. Compared with CC bonds, the displacement freedom of the silicon oxygen molecular chain is greater, the molecular chain is easier to rotate, and a single point impact is easier to convert into an impact on four silicon oxygen polymer chains.

[0016] In actual use, the release film 5 is torn off and the second silicone layer 3 is bonded to the SCF screen.

[0017] In the above design, by using the PI layer 1 as the substrate layer, the copper foil can be effectively supported. The entire tape has only four layers after removing the release film 5. It is completely bonded to the SCF screen through the No. 2 silicone layer 3, which can effectively avoid warping. The copper foil can not only resist impact and dissipate heat, but also effectively prevent curling by using its own hardness.

[0018] Specifically, the thickness of the copper foil is in the range of 0.018 mm to 0.1 mm.

[0019] In the above design, the thickness range of the copper foil can effectively achieve the requirement of thinning the product while also meeting the impact strength requirement.

[0020] Specifically, the thickness of the PI layer 1 is in the range of 0.025 mm to 0.050 mm.

[0021] In the above design, the thickness range of the PI layer 1 can effectively support the No. 1 silicone layer 2 and the No. 2 silicone layer 3, and can also meet the requirements of thinning the product.

[0022] Specifically, the thickness of the No. 1 silicone layer 2 and the No. 2 silicone layer 3 are the same, and the thickness of the No. 1 silicone layer 2 ranges from 0.05 mm to 0.15 mm.

[0023] In the above design, the thickness range of the No. 1 silicone layer 2 and the No. 2 silicone layer 3 can effectively achieve the bonding strength.

[0024] To further explain in detail, it should be understood that the above is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A SCF screen multi-layer structure buffer tape, characterized by: The invention comprises a PI layer (1), a first silicone layer (2) arranged on the upper end surface of the PI layer (1), a second silicone layer (3) arranged on the lower end surface of the PI layer (1), a copper foil layer (4) arranged on the upper end surface of the first silicone layer (2), and a release film (5) arranged on the lower end surface of the second silicone layer (3).

2. The SCF screen multilayer structure buffer tape according to claim 1, characterized in that: The thickness of the copper foil is in the range of 0.018 mm to 0.1 mm.

3. The SCF screen multilayer structure buffer tape according to claim 1, characterized in that: The thickness of the PI layer (1) ranges from 0.025 mm to 0.050 mm.

4. The SCF screen multilayer structure buffer tape according to claim 1, characterized in that: The first silicone layer (2) and the second silicone layer (3) have the same thickness, and the thickness of the first silicone layer (2) ranges from 0.05 mm to 0.15 mm.

Citation Information

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