Magnetic stirring assisted jet electrodeposition processing device
Through the magnetic stirring assisted jet electrodeposition processing device, the magnetic stirrer generates eddy current and turbulent flow effects, which solves the problem of uneven distribution of nanoparticles, improves the uniformity and quality of the plating, and realizes dense nucleation and growth of the plating.
Patent Information
- Application Number
- CN202421021142.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-12
- Publication Date
- 2024-12-31
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The uneven distribution of nanoparticles in the existing jet electrodeposition technology leads to uneven thickness and cracks of the coating, reducing the binding force and mass of the coating.
The magnetic stirring assisted jet electrodeposition processing device is used to drive the magnetic rotor to rotate at high speed and stir the electroplating solution through a magnetic stirrer to generate eddy current and turbulent effects to prevent nanoparticles from agglomeration, and the cathode workpiece is fixed through a fixture to ensure the uniformity and quality of the plating layer.
Effectively prevent nanoparticles from agglomerating, maintain uniform dispersion of particles in the plating solution, improve the crystallinity and grain size of the plating layer, improve the nucleation rate and growth rate of the plating layer, and form a dense and uniform plating layer.
Smart Images

Figure CN222274752U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of electrochemical deposition, in particular to a magnetic stirring auxiliary jet electrochemical deposition processing device. Background Art
[0002] Jet electrodeposition is a process in which the electroplating liquid is sprayed at high speed from the anode nozzle to the cathode workpiece surface under the action of an electric field to achieve deposition. It is widely used in the fields of microelectronics, chemical industry, and automobile industry due to its high localization and fast deposition rate. However, the pure metal coating prepared by jet electrodeposition is difficult to meet the increasingly complex working environment in terms of hardness and corrosion resistance. In order to solve these problems, scholars have introduced reinforcing phase nano-ceramic particles. However, due to the high electrochemical activity of nanoparticles, there are a large number of unsaturated bonds on the surface, so nanoparticles are easy to agglomerate in the electroplating solution. The uneven distribution of nanoparticles will lead to uneven coating thickness and even cracks, which not only reduces the bonding force between the coating and the substrate, but also greatly reduces the quality and performance of the coating. Therefore, a magnetic stirring assisted jet electrodeposition processing device with simple structure and convenient operation is proposed to effectively solve the above problems. Summary of the invention
[0003] Technical issues to be solved
[0004] In view of the shortcomings of the above-mentioned prior art, the utility model provides a magnetic stirring assisted jet electrodeposition processing device, which uses a magnetic stirrer to drive a magnetic rotor to rotate at high speed to stir the electroplating solution, so that the electroplating solution produces eddy currents, turbulence and other effects, which can effectively solve the phenomenon of nanoparticle agglomeration in the electroplating solution.
[0005] Technical Solution
[0006] In order to solve the above problems, the utility model adopts the following technical solutions:
[0007] A magnetic stirring assisted jet electrodeposition processing device, characterized in that: the device is mainly composed of: a mobile platform, a gusset plate, an anode rod, a connecting device, a spraying device, a latex tube, a stage, an electroplating solution, an electroplating tank, a cathode workpiece, a cathode power-on device, a guide tube, a beaker, a water pump, a magnetic rotor, a magnetic stirrer, a sealing gasket, and a clamp; the clamp is composed of a threaded handle, a baffle, a threaded sleeve, a rubber gasket, and a fastening bolt; the connecting device is connected to the mobile platform by welding through the gusset plate to form an integrated structure; the anode rod is located above the connecting device and is connected to the connecting device Coaxial matching; the injection device is located below the connecting device and is connected to the connecting device by bolts; the stage is located on the upper surface of the electroplating tank containing the electroplating solution; the cathode power-on device is located on the upper surface of the stage and below the cathode workpiece, and is fixed to the upper surface of the stage by bonding with the stage; the cathode workpiece is located above the cathode power-on device and is clamped and fixed by clamps on the left and right sides; the beaker is located above the magnetic stirrer; a magnetic rotor and a water pump are contained in the beaker; the water pump is immersed in the electroplating solution in the beaker and is connected to the injection device through a latex tube.
[0008] As a preferred embodiment of the magnetic stirring assisted jet electrodeposition processing device of the utility model, the mobile platform is an X, Y, and Z three-coordinate mobile platform; the connecting device is connected to the mobile platform by welding through a gusset plate to form an integrated structure; the anode rod is located above the connecting device and adopts a coaxial interference fit with the connecting device; the injection device is located below the connecting device and is connected to the connecting device by four bolts.
[0009] As a preferred embodiment of the magnetic stirring assisted jet electrodeposition processing device of the utility model, the anode rod passes through the connecting device and the injection device, is flush with the end of the injection device, and the anode rod and the injection device maintain good alignment with the cathode workpiece; the latex tube is located on the right side of the injection device and is connected to the water pump in the beaker above the magnetic stirrer.
[0010] As a preferred embodiment of the magnetic stirring assisted jet electrodeposition processing device of the utility model, the worktable is located in an electroplating tank containing an electroplating solution, the cathode power-on device is located on the upper surface of the worktable and below the cathode workpiece, and is fixed to the upper surface of the worktable by bonding with the worktable; the cathode workpiece is located above the cathode power-on device and is clamped and fixed by clamps on the left and right sides; the clamps fix the baffles on the left and right sides of the worktable by fastening bolts, and the threaded sleeve and the baffle are fixed by welding; the front end of the threaded handle has a rubber gasket, and the rubber gasket is nested on the threaded handle to prevent the threaded handle from damaging the cathode workpiece when clamping, the rear threaded handle rod has an external thread, and the threaded sleeve has an internal thread, and the internal thread and the external thread cooperate to achieve tightening and fixing according to the size of the cathode workpiece; the outer surface of the clamp is specially treated to effectively ensure the corrosion resistance of the clamp during processing.
[0011] As a preferred embodiment of a magnetic stirring assisted jet electrodeposition processing device of the utility model, there is a guide tube at the lower right side of the electroplating tank, and the guide tube and the upper and lower surfaces of the electroplating tank are respectively sealed with sealing gaskets to ensure sealing; the sealing gaskets are bonded to the upper and lower surfaces of the electroplating tank; the upper port of the guide tube is slightly higher than the upper surface of the electroplating tank and the upper port is always located below the electroplating liquid in the electroplating tank, so that the electroplating liquid in the electroplating tank can flow into the beaker through the guide tube, and the lower end of the guide tube extends into the beaker.
[0012] As a preferred embodiment of a magnetic stirring assisted jet electrodeposition processing device of the utility model, the magnetic stirrer includes a magnetic rotor, and the rotation speed of the magnetic rotor is adjusted by the magnetic stirrer; the beaker is located above the magnetic stirrer; the magnetic rotor and the water pump are located in the beaker containing the electroplating solution.
[0013] As a preferred embodiment of the magnetic stirring assisted jet electrodeposition processing device of the utility model, the anode rod is connected to the anode of the power supply, and the cathode power-on device is connected to the cathode of the power supply.
[0014] The beneficial effects of the utility model are as follows: the utility model provides a magnetic stirring assisted jet electrodeposition processing device. On the one hand, the electroplating solution is stirred by adjusting the rotation speed of the magnetic rotor using a magnetic stirrer, which can not only effectively prevent the agglomeration of nanoparticles in the solution and maintain the uniform dispersion of particles in the plating solution, but also promote the material transfer rate in the plating solution, improve the crystallinity and grain size of the coating, thereby increasing the nucleation rate and growth rate of the coating grains, and helping to form a dense and uniform coating. On the other hand, the fixture can effectively fix the position of the cathode workpiece to avoid the movement of the cathode workpiece due to the excessive spray speed of the injection system. In order to meet the diversity of workpiece sizes, the sizes of different workpieces can be met by the cooperation of the threaded handle and the threaded sleeve. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 The utility model is a structural schematic diagram of a magnetic stirring assisted jet electrodeposition processing device.
[0016] Figure 2 It is a front view of a threaded handle in a fixture of a magnetic stirring assisted jet electrodeposition processing device and a cross-sectional view of a threaded sleeve of the utility model.
[0017] Figure 3 The utility model is a cross-sectional view of a jet device of a magnetic stirring assisted jet electrodeposition processing device.
[0018] Figure 4 The utility model is a side view of the installation of a moving platform, a connecting device and a gusset plate of a magnetic stirring assisted jet electrodeposition processing device.
[0019] Figure 5 It is a partial enlarged view of a flow guide tube and a sealing gasket of a magnetic stirring assisted jet electrodeposition processing device of the utility model.
[0020] Description of the numbers in the figure:
[0021] 1-mobile platform, 2-gusset plate, 3-anode rod, 4-connecting device, 5-injection device, 6-latex tube, 7-stage, 8-electroplating solution, 9-electroplating tank, 10-cathode workpiece, 11-cathode power-on device, 12-clamp, 13-flow guide tube, 14-beaker, 15-water pump, 16-magnetic rotor, 17-magnetic stirrer, 18-threaded handle, 19-baffle, 20-threaded sleeve, 21-rubber gasket, 22-fastening bolt, 23-sealing gasket.
[0022] Specific implementation method.
[0023] In order to enable those skilled in the art to better understand the technical solution provided by the present invention, the technical solution in the embodiment of the present invention will be further described below in conjunction with the accompanying drawings in the implementation case of the present invention.
[0024] A magnetic stirring assisted jet electrodeposition processing device, the device mainly consists of: a mobile platform 1, a gusset plate 2, an anode rod 3, a connecting device 4, a spray device 5, a latex tube 6, a stage 7, an electroplating solution 8, an electroplating tank 9, a cathode workpiece 10, a cathode power-on device 11, a guide tube 13, a beaker 14, a water pump 15, a magnetic rotor 16, a magnetic stirrer 17, a sealing gasket 23, and a clamp 12; the clamp 12 is composed of a threaded handle 18, a baffle 19, a threaded sleeve 20, a rubber gasket 21, and a fastening bolt 22; the connecting device 4 is connected to the mobile platform 1 by welding through the gusset plate 2 to form an integrated structure; the anode rod 3 is located above the connecting device 4 and is connected to the connecting device 4 are coaxially matched; the injection device 5 is located below the connecting device 4 and is connected to the connecting device 4 by bolts; the stage 7 is located on the upper surface of the electroplating tank 9 containing the electroplating solution 8; the cathode power-on device 11 is located on the upper surface of the stage 7 and below the cathode workpiece 10, and is fixed to the upper surface of the stage 7 by bonding with the stage 7; the cathode workpiece 10 is located above the cathode power-on device 11 and is clamped and fixed by the clamps 12 on the left and right sides; the beaker 14 is located above the magnetic stirrer 17; the beaker 14 contains a magnetic rotor 16 and a water pump 15; the water pump 15 is immersed in the electroplating solution 8 in the beaker 14 and is connected to the injection device 5 through the latex tube 6.
[0025] Specifically, the mobile platform 1 is an X, Y, and Z three-coordinate mobile platform; the connecting device 4 is welded to the mobile platform 1 through the gusset plate 2 to form an integrated structure; the anode rod 3 is located above the connecting device 4 and adopts a coaxial interference fit with the connecting device 4; the injection device 5 is located below the connecting device 4 and is connected to the connecting device 4 with four bolts.
[0026] Specifically, the anode rod 3 passes through the connecting device 4 and the injection device 5, is flush with the end of the injection device 5, and the anode rod 3 and the injection device 5 maintain good alignment with the cathode workpiece 10; the latex tube 6 is located on the right side of the injection device 5 and is connected to the water pump 15 in the beaker 14 above the magnetic stirrer 17.
[0027] Specifically, the stage 7 is located in the electroplating tank 9 containing the electroplating solution 8, the cathode power-on device 11 is located on the upper surface of the stage 7 and below the cathode workpiece 10, and is fixed to the upper surface of the stage 7 by bonding with the stage 7; the cathode workpiece 10 is located above the cathode power-on device 11, and is clamped and fixed by the clamps 12 on the left and right sides; the clamps 12 fix the baffle 19 on the left and right sides of the stage 7 by fastening bolts 22, and the threaded sleeve 20 is fixed to the baffle 19 by welding; the front end of the threaded handle 18 has a rubber gasket 21, and the rubber gasket 21 is nested on the threaded handle 18 to prevent the threaded handle 18 from damaging the cathode workpiece 10 when clamping, and the rear threaded handle 18 rod has an external thread, and the threaded sleeve 20 has an internal thread, and the internal thread and the external thread cooperate to achieve tightening and fixing according to the size of the cathode workpiece 10; the outer surface of the clamp 12 is specially treated to effectively ensure the corrosion resistance of the clamp 12 during processing.
[0028] Specifically, there is a guide tube 13 at the lower right side of the electroplating tank 9, and the guide tube 13 and the upper and lower surfaces of the electroplating tank 9 are respectively sealed with sealing gaskets 23; the sealing gaskets 23 are bonded to the upper and lower surfaces of the electroplating tank 9; the upper port of the guide tube 13 is slightly higher than the upper surface of the electroplating tank 9 and the upper port is always located below the electroplating solution 8 in the electroplating tank 9, so that the electroplating solution 8 in the electroplating tank 9 can flow into the beaker 14 through the guide tube 13, and the lower end of the guide tube 13 extends into the beaker 14.
[0029] Specifically, the magnetic stirrer 17 includes a magnetic rotor 16 , and the rotation speed of the magnetic rotor 16 is adjusted by the magnetic stirrer 17 ; the beaker 14 is located above the magnetic stirrer 17 ; the magnetic rotor 16 and the water pump 15 are located in the beaker 14 containing the electroplating solution 8 .
[0030] Specifically, the anode rod 3 is connected to the anode of the power supply, and the cathode power-on device 12 is connected to the cathode of the power supply.
[0031] Working principle: Place the water pump 15 and the magnetic rotor 16 in the beaker 14, pour the prepared plating solution 8 into the beaker 14, and then place the beaker 14 on the magnetic stirrer 17 that is powered on. Connect the upper end of the latex tube 6 to the interface on the side of the injection device 5, and the lower end to the interface of the water pump 15. Connect the upper end of the guide tube 13 to the stage 7 and seal with a sealing ring 23 on the upper and lower surfaces of the stage 7 to ensure sealing. The lower end of the guide tube 13 extends into the beaker 14. The function of the guide tube 13 is to reflow the plating solution 8 in the plating tank 9 into the beaker 14, thereby forming a cycle. The stage 7 is placed on the upper surface of the electroplating tank 9, the cathode power-on device 11 is adhered to the stage 7 by bonding, the cathode workpiece 10 is placed on the cathode power-on device 11, and the cathode workpiece 10 is clamped by adjusting the clamps 12 on the left and right sides of the stage 7 to prevent the cathode workpiece 10 from being displaced by the high injection speed of the injection device 5. The injection device 5 and the anode rod 3 are ensured to be well centered with the cathode workpiece 10 by moving the platform 1, the anode rod 3 is connected to the positive pole of the power supply, and the cathode power-on device 11 is connected to the negative pole of the power supply. The rotation speed of the magnetic rotor 16 is adjusted by adjusting the button on the magnetic stirrer 17, so that the magnetic rotor 16 rotates at a high speed to stir the electroplating solution 8, so that the electroplating solution 8 produces eddy currents, turbulence and other effects, which can effectively solve the phenomenon of nanoparticle agglomeration in the electroplating solution 8 and achieve the purpose of processing.
[0032] The above is only a preferred specific implementation method of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the utility model according to the technical solution and improved ideas of the utility model, which should be covered by the protection scope of the utility model.
Claims
1. A magnetic stirring assisted jet electrodeposition processing device, characterized in that: The device mainly comprises: a mobile platform (1), a gusset plate (2), an anode rod (3), a connecting device (4), a spray device (5), a latex tube (6), a stage (7), an electroplating solution (8), an electroplating tank (9), a cathode workpiece (10), a cathode electrification device (11), a flow guide tube (13), a beaker (14), a water pump (15), a magnetic rotor (16), a magnetic stirrer (17), a sealing gasket (23), and a fixture (12); the fixture (12) comprises a threaded handle (18), a baffle (19), a threaded sleeve (20), a rubber gasket (21), and a fastening bolt (22); the connecting device (4) is connected to the mobile platform (1) by welding through the gusset plate (2) to form an integrated structure; the anode rod (3) is located above the connecting device (4) and is coaxial with the connecting device (4). The spray device (5) is located below the connecting device (4) and is connected to the connecting device (4) by bolts; the stage (7) is located on the upper surface of the electroplating tank (9) containing the electroplating solution (8); the cathode power-on device (11) is located on the upper surface of the stage (7) and below the cathode workpiece (10), and is fixed to the upper surface of the stage (7) by bonding; the cathode workpiece (10) is located above the cathode power-on device (11) and is clamped and fixed by the clamps (12) on the left and right sides; the beaker (14) is located above the magnetic stirrer (17); the beaker (14) contains a magnetic rotor (16) and a water pump (15); the water pump (15) is immersed in the electroplating solution (8) in the beaker (14) and is connected to the spray device (5) through a latex tube (6).
2. A magnetic stirring assisted jet electrodeposition processing device according to claim 1, characterized in that: The mobile platform (1) is an X, Y, and Z three-coordinate mobile platform; the connecting device (4) is connected to the mobile platform (1) by welding through a gusset plate (2) to form an integrated structure; the anode rod (3) is located above the connecting device (4) and is coaxially interference fit with the connecting device (4); the injection device (5) is located below the connecting device (4) and is connected to the connecting device (4) by four bolts.
3. The magnetic stirring assisted jet electrodeposition processing device according to claim 1, characterized in that: The anode rod (3) passes through the connecting device (4) and the injection device (5) and is flush with the end of the injection device (5), and the anode rod (3) and the injection device (5) maintain good alignment with the cathode workpiece (10); the latex tube (6) is located on the right side of the injection device (5) and is connected to the water pump (15) in the beaker (14) above the magnetic stirrer (17).
4. The magnetic stirring assisted jet electrodeposition processing device according to claim 1, characterized in that: The stage (7) is located in a plating tank (9) containing a plating solution (8); the cathode power-on device (11) is located on the upper surface of the stage (7) and below the cathode workpiece (10), and is fixed to the upper surface of the stage (7) by bonding with the stage (7); the cathode workpiece (10) is located above the cathode power-on device (11) and is clamped and fixed by clamps (12) on the left and right sides; the clamps (12) are used to fix the baffle (19) on the left and right sides of the stage (7) by fastening bolts (22), and the threaded sleeve (20) is fixed to the baffle (19) is fixed by welding; the front end of the threaded handle (18) is provided with a rubber gasket (21), and the rubber gasket (21) is nested on the threaded handle (18) to prevent the threaded handle (18) from damaging the cathode workpiece (10) when clamping; the rear threaded handle (18) rod has an external thread, and the threaded sleeve (20) has an internal thread, and the internal thread and the external thread cooperate to achieve tightening and fixing according to the size of the cathode workpiece (10); and the outer surface of the clamp (12) is specially treated to effectively ensure the corrosion resistance of the clamp (12) during the processing process.
5. The magnetic stirring assisted jet electrodeposition processing device according to claim 1, characterized in that: A guide tube (13) is provided at the lower right side of the electroplating tank (9), and the guide tube (13) and the upper and lower surfaces of the electroplating tank (9) are respectively sealed by sealing gaskets (23); the sealing gasket (23) is bonded to the upper and lower surfaces of the electroplating tank (9); the upper end of the guide tube (13) is slightly higher than the upper surface of the electroplating tank (9) and the upper end is always located below the electroplating solution (8) in the electroplating tank (9), so that the electroplating solution (8) in the electroplating tank (9) can flow into the beaker (14) through the guide tube (13), and the lower end of the guide tube (13) extends into the beaker (14).
6. The magnetic stirring assisted jet electrodeposition processing device according to claim 1, characterized in that: The magnetic stirrer (17) comprises a magnetic rotor (16), and the rotation speed of the magnetic rotor (16) is adjusted by the magnetic stirrer (17); the beaker (14) is located above the magnetic stirrer (17); and the magnetic rotor (16) and the water pump (15) are located in the beaker (14) containing the electroplating solution (8).
7. The magnetic stirring assisted jet electrodeposition processing device according to claim 1, characterized in that: The anode rod (3) is connected to the anode of the power supply, and the cathode power-on device (11) is connected to the cathode of the power supply.