Electroplating device

Abstract

The utility model relates to an electroplating device which comprises an electroplating bath, a tray and two electrode assemblies, and the electroplating bath is provided with a containing groove with an opening at one end; the tray is movably arranged in the accommodating groove, and the tray is used for supporting the battery piece; the two electrode assemblies are arranged on the electroplating bath, each electrode assembly is electrically connected with an external power supply, and each electrode assembly can move in the direction close to the tray; wherein the back surface of the battery piece is provided with a first film opening area and a second film opening area, and the cathode electrode on one electrode assembly is in contact with the first film opening area, so that a first electrode is formed in the second film opening area; and the cathode electrode on the other electrode assembly is in contact with the first electrode formed on the second film opening area, so that a second electrode is formed in the first film opening area. Current conduction is realized through direct contact between the cathode electrode and the film opening area of the battery piece, so that the preparation process of the seed layer is reduced, and the electroplating process is simpler.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaic cells, in particular to an electroplating device. Background Art

[0002] With the development of photovoltaic technology, the photoelectric conversion efficiency of batteries has gradually increased and the cost has gradually decreased. However, due to the high price of silver paste used in the screen printing process, the cost of silver paste accounts for about 40% of the non-silicon cost of the battery, making the cost of the battery high. Through electroplating, chemical plating and other technologies, the silver in the metallization process is replaced with cheap metals such as copper, making electroplating and chemical plating technology a new way to solve the problem of reducing costs. Among them, the back-contact battery has a higher light absorption than other types of batteries because there is no grid line blocking the front, so its conversion efficiency is higher. Therefore, metallizing the back-contact battery by electroplating gives it a higher cost advantage.

[0003] Since the positive and negative electrodes of back-contact solar cells are on the back, it is difficult to ensure contact between the electrodes and the cell during the electroplating process. Currently, for back-contact cells, a metal seed layer is prepared on the back, and then the subsequent metal grid lines are grown by hanging plating. This method of metallization requires the preparation of a metal seed layer, which is a cumbersome process. Utility Model Content

[0004] Based on this, it is necessary to provide an electroplating device to address the technical problem that in the prior art, back-contact solar cells require preparation of a metal seed layer in the form of hanging plating, which leads to a complicated electroplating process.

[0005] An electroplating device, comprising:

[0006] The electroplating tank is provided with a containing tank with an open end;

[0007] A tray is movably disposed in the accommodating groove, and the tray is used to support the battery sheet;

[0008] Two electrode assemblies are disposed on the electroplating tank, each of the electrode assemblies is electrically connected to an external power source, and each of the electrode assemblies can move toward the tray;

[0009] In which, a first film-opening area and a second film-opening area are provided on the back side of the battery cell, and a cathode electrode on one electrode assembly is used to contact with the first film-opening area to form a first electrode in the second film-opening area; and a cathode electrode on another electrode assembly is used to contact with the first electrode formed on the second film-opening area to form a second electrode in the first film-opening area.

[0010] In one embodiment, the electroplating device comprises:

[0011] The support frame is arranged above the electroplating tank, and the electrode assembly is arranged on the support frame.

[0012] In one embodiment, the electrode assembly comprises:

[0013] A fixing plate, movably connected to the supporting frame, wherein the fixing plate is provided with a plurality of spaced through slots;

[0014] A plurality of anode electrodes, corresponding to the through slots one by one, the anode electrodes being arranged in the through slots;

[0015] The cathode electrode is arranged on the side of the fixing plate facing the electroplating tank, and the cathode electrode protrudes from the side of the fixing plate facing the electroplating tank.

[0016] In one embodiment, the electrode assembly further comprises:

[0017] A plurality of electrode protection structures correspond to the cathode electrodes one by one, and the electrode protection structures are arranged around the cathode electrodes to prevent the cathode electrodes from contacting the electroplating solution.

[0018] In one embodiment, the surface of the cathode electrode in contact with the first film-opening area is a plane.

[0019] In one embodiment, the surface of the cathode electrode in contact with the first electrode on the second film-opening area is constructed as a concave surface that is recessed in a direction away from the support frame.

[0020] In one embodiment, the electrode assembly further comprises:

[0021] The first motor is arranged on the support frame, the fixing plate is fixedly connected to the output shaft of the first motor, and the first motor can drive the fixing plate to move towards or away from the support frame.

[0022] In one of the embodiments, a cell protection structure is provided on the periphery of the side surface of the fixing plate facing the support frame, and the height of the cell protection structure is lower than the height of the cathode electrode.

[0023] In one of the embodiments, a limiting structure is provided on the periphery of the support frame to limit the position of the battery cell.

[0024] In one of the embodiments, the electroplating device further includes a transmission assembly, and the support frame is connected to the transmission assembly so that the support frame can switch between positions corresponding to different electrode assemblies.

[0025] Beneficial effects of the utility model:

[0026] The utility model provides an electroplating device, wherein the container in the electroplating tank is used to contain the electroplating solution, as well as a tray, an electrode assembly, etc. The tray is movably arranged in the container, so that the tray can be switched between positions corresponding to different motor assemblies, and the tray can be moved in the direction close to the electrode assembly to expose the liquid surface of the electroplating solution. Two electrode assemblies are arranged above the electroplating tank, and each electrode assembly can be moved in the direction close to the tray until the cathode electrode on the electrode assembly contacts the film opening area on the battery cell, thereby realizing electroplating of other film opening areas. By directly contacting the cathode electrode with the film opening area of ​​the battery cell to achieve current conduction, the preparation process of the seed layer is reduced, thereby making the electroplating process simpler. Through the above structural form, the preparation process of the seed layer is saved in the electroplating process, making the electroplating process simpler. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] FIG1 is a cross-sectional view of an electroplating device provided by an embodiment of the present invention;

[0028] FIG2 is a partial enlarged view of a first electrode assembly in an electroplating device provided in an embodiment of the present invention;

[0029] FIG. 3 is a partial enlarged view of the second electrode assembly in the electroplating device provided in one embodiment of the present invention.

[0030] Reference numerals:

[0031] Electroplating tank 100; tray 200; limiting structure 210; first electrode assembly 300; first fixed plate 310; battery cell protection structure 311; first anode electrode 320; first cathode electrode 330; first electrode protection structure 340; second electrode assembly 400; second fixed plate 410; second anode electrode 420; second cathode electrode 430; second electrode protection structure 440; support frame 500; first motor 600; second motor 700; transmission assembly 800; transverse motor 810; transverse screw 820; drive block 830. DETAILED DESCRIPTION

[0032] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0033] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0035] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0037] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0038] Referring to Figures 1 to 3, an embodiment of the utility model provides an electroplating device, which includes an electroplating tank 100, a tray 200 and two electrode assemblies. The electroplating tank 100 is provided with a containing tank with an opening at one end; the tray 200 is movably arranged in the containing tank, and the tray 200 is used to support the battery cell; the two electrode assemblies are arranged on the electroplating tank 100, each electrode assembly is electrically connected to an external power supply, and each electrode assembly can move toward the tray 200; wherein, the back of the battery cell is provided with a first film opening area and a second film opening area, the cathode electrode on one electrode assembly is used to contact with the first film opening area to form a first electrode in the second film opening area; the cathode electrode on the other electrode assembly is used to contact with the first electrode formed on the second film opening area to form a second electrode in the first film opening area.

[0039] The technical solution provides an electroplating device, wherein the container in the electroplating tank 100 is used to contain the electroplating solution, as well as the tray 200, the electrode assembly, etc. The tray 200 is movably arranged in the container, so that the tray 200 can be switched between the positions corresponding to different motor assemblies, and the tray 200 can be moved in the direction close to the electrode assembly to expose the liquid surface of the electroplating solution. Two electrode assemblies are arranged above the electroplating tank 100, and each electrode assembly can be moved in the direction close to the tray 200 until the cathode electrode on the electrode assembly contacts the film opening area on the battery cell, thereby realizing electroplating of other film opening areas. By directly contacting the cathode electrode with the film opening area of ​​the battery cell to achieve current conduction, the preparation process of the seed layer is reduced, thereby making the electroplating process simpler. Through the above structural form, the preparation process of the seed layer is saved in the electroplating process, making the electroplating process simpler.

[0040] It can be understood that by contacting the cathode electrode with the corresponding film-opening area to achieve current conduction, the first film-opening area can correspond to the positive electrode of the battery cell, and the second film-opening area can correspond to the negative electrode of the battery cell. When the cathode electrode on an electrode assembly contacts the first film-opening area, the plating solution does not enter the first film-opening area, and the second film-opening area is plated to form the first electrode, that is, the negative electrode of the battery cell. After the second film-opening area is plated, the tray 200 moves to the position of another electrode assembly, and the cathode electrode on the electrode assembly is made to fit the first electrode formed on the second film-opening area. At this time, the plating solution does not enter the second film-opening area, and the plating solution plates the first film-opening area to form the second electrode in the first film-opening area.

[0041] 1 to 3 for ease of understanding, in this application the electrode assembly corresponding to the cathode electrode in contact with the first film opening area is referred to as the first electrode assembly 300, and the electrode assembly corresponding to the cathode electrode in contact with the second film opening area is referred to as the second electrode assembly 400.

[0042] Referring to FIG. 1 to FIG. 3, in one embodiment, the electroplating device includes a support frame 500, which is arranged above the electroplating tank 100, and the electrode assembly is arranged on the support frame 500. The electrode assembly is installed and supported by arranging the support frame 500 above the electroplating tank 100. Specifically, the support frame 500 is a plate-like structure, which is arranged above the electroplating tank 100 and is spaced a certain distance from the electroplating tank 100 to provide an operable space for the electrode assembly and the tray 200 to be covered.

[0043] Referring to Figures 1 to 3, in one embodiment, the electrode assembly includes a fixed plate and a plurality of anode electrodes, the fixed plate is movably connected to the support frame 500, and the fixed plate is provided with a plurality of spaced through grooves; the plurality of anode electrodes correspond one-to-one to the through grooves, and the anode electrodes are arranged in the through grooves; the cathode electrode is arranged on the side of the fixed plate facing the electroplating tank 100, and the cathode electrode protrudes from the side of the fixed plate facing the electroplating tank 100.

[0044] By movably connecting the fixed plate to the support frame 500, the fixed plate can be moved toward the direction close to the electroplating tank 100 to cover the tray 200, and can be moved into the electroplating solution together with the tray 200, so as to realize the electroplating of the battery cell. By opening a through groove on the fixed plate to install the anode electrode in the through groove, the electroplating solution can flow through the through groove. The cathode electrode is arranged on the side of the fixed plate facing the electroplating tank 100, and the cathode electrode is arranged to protrude from the side so that the cathode electrode can contact the corresponding film opening area, so as to realize current conduction. It should be noted that the fixed plate in the first electrode assembly 300 corresponds to the first fixed plate 310, and the first anode electrode 320 is arranged in the through groove on the first fixed plate 310; the fixed plate in the second electrode assembly 400 corresponds to the second fixed plate 410, and the second anode electrode 420 is arranged in the through groove on the second fixed plate 410.

[0045] Referring to FIGS. 1 to 3 , in one embodiment, the electrode assembly further includes a plurality of electrode protection structures, which correspond to the cathode electrodes one by one, and the electrode protection structures are arranged around the periphery of the cathode electrode to prevent the cathode electrode from contacting the electroplating solution. The electrode protection structure is made of a soft insulating material, such as corrosion-resistant rubber. By providing a soft electrode protection structure around the cathode electrode, the electroplating solution is prevented from entering the area where the cathode electrode is located, thereby protecting the cathode electrode. It should be noted that the electrode protection structure in the first electrode assembly 300 corresponds to the first electrode protection structure 340; the electrode protection structure in the second electrode assembly 400 corresponds to the second electrode protection structure 440.

[0046] As shown in Fig. 2, in one embodiment, the surface of the cathode electrode in contact with the first film opening area is a plane. Specifically, the surface of the first cathode electrode 330 of the first electrode assembly 300 in contact with the first film opening area is set to a plane, so that the area of ​​the first cathode electrode 330 on the first electrode assembly 300 in contact with the first film opening area is larger, thereby ensuring the reliability of the conductive performance of the first cathode electrode 330 and the first film opening area.

[0047] As shown in FIG3 , in one embodiment, the surface of the cathode electrode in contact with the first electrode on the second film opening area is constructed as a concave surface that is recessed in a direction away from the support frame 500. Specifically, the surface of the second cathode electrode 430 of the second electrode assembly 400 that is in contact with the first electrode formed on the second film opening area is set as a concave surface, so that the second cathode electrode 430 can fit with the first electrode, on the one hand, it can realize the conduction of current, and at the same time, it can protect the prepared first electrode to prevent the first electrode from contacting with the electroplating solution and causing corrosion of the gate line.

[0048] As shown in FIG1 , in one embodiment, the electrode assembly further includes a first motor 600, the first motor 600 is disposed on the support frame 500, the fixing plate is fixedly connected to the output shaft of the first motor 600, and the first motor 600 can drive the fixing plate to move toward or away from the support frame 500. By arranging the first motor 600 on the support frame 500 and connecting the fixing plate to the first motor 600, the fixing plate is driven to move relative to the support frame 500 by the first motor 600, thereby providing a driving force for the movement of the fixing plate, and improving the degree of automation of the electroplating device.

[0049] As shown in FIG1 , in one embodiment, a cell protection structure 311 is provided on the periphery of the fixed plate facing the side of the support frame 500, and the height of the cell protection structure 311 is lower than the height of the cathode electrode. The cell protection structure 311 is made of a flexible material and is provided on the periphery of the support frame 500. The height of the cell protection structure 311 is slightly lower than the height of the cathode electrode. When the cell contacts the cathode electrode, the cell protection structure 311 reduces the descending distance of the electrode assembly, avoids damage to the cell due to excessive contact between the cathode electrode and the cell, and thus protects the cell.

[0050] As shown in FIG1 , in one embodiment, a limiting structure 210 is provided on the periphery of the support frame 500 to limit the position of the battery cell. The limiting structure 210 is used to limit the position of the battery cell when placing the battery cell, so as to facilitate alignment of the electrode assembly and the battery cell when the electrode assembly and the tray 200 are covered.

[0051] As shown in FIG. 1 , in one embodiment, the electroplating device further includes a transmission assembly 800, and the support frame 500 is connected to the transmission assembly 800 so that the support frame 500 can switch between positions corresponding to different electrode assemblies. In this embodiment, the transmission assembly 800 adopts a screw transmission structure. Specifically, the transmission assembly 800 includes a transverse motor 810, a drive block 830 and a transverse screw 820, the transverse motor 810 is fixed on the electroplating tank 100, the transverse screw 820 is rotatably connected to the electroplating tank 100, and the transverse screw 820 is connected to the output end of the transverse motor 810 to drive the transverse screw 820 to rotate. The drive block 830 is transmission-connected to the transverse screw 820, and the transverse screw 820 drives the drive block 830 to move along the axis of the transverse screw 820. A second motor 700 is provided on the driving block 830, and the output end of the second motor 700 is fixedly connected to the tray 200. The second motor 700 can drive the tray 200 to move relative to the support frame 500, so that the tray 200 extends out of the liquid surface of the electroplating solution, and can also retract the tray 200 below the liquid surface of the electroplating solution.

[0052] Referring to FIG. 1 to FIG. 3 , the method for electroplating a battery cell using the electroplating device provided by the utility model is as follows:

[0053] The unmetallized cell is metallized by laser film opening, mask exposure, etc., so as to expose the bottom conductive substrate to form the corresponding first film opening area and second film opening area; the tray 200 is moved to the loading position by the second motor 700, so that the tray 200 is exposed to the plating solution as a whole, and then the cell is placed on the cell tray 200 with the electroplated surface facing up. The tray 200 is moved to the bottom of the first electrode assembly 300 by the transmission group, and the first electrode assembly 300 is lowered onto the cell by the first motor 600 corresponding to the first electrode assembly 300, and the first cathode electrode 330 is overlapped with the first film opening area by the limit device.

[0054] It should be noted that, in the present application, a plurality of spaced grooves are provided on the tray 200 , and light sources are arranged in the grooves, and the light sources are used for light-induced electroplating of the battery cells.

[0055] Start the first motor 600 and the second motor 700 to lower the assembly into the electroplating solution, and perform electroplating preparation of the metal grid line on the second film opening area to form the first electrode. After the first electrode is prepared, start the first motor 600 and the second motor 700 to lift the assembly out of the electroplating solution, continue to start the first motor 600, separate the first electrode assembly 300 from the tray 200, and then move the tray 200 to the corresponding position of the second electrode assembly 400. The second electrode assembly 400 is lowered onto the battery cell by the first motor 600 corresponding to the second electrode assembly 400, and the second cathode electrode 430 is overlapped with the first electrode formed in the second film opening area through the limiting device, and the second cathode electrode 430 completely covers the prepared first electrode. Start the first motor 600 and the second motor 700 to lower the assembly into the electroplating solution, perform electroplating preparation of the metal grid line, and form the second electrode. After the second electrode is prepared, the first motor 600 and the second motor 700 are started to lift the assembly out of the electroplating solution, and the first motor 600 is continued to be started to separate the second electrode assembly 400 from the cell, and then the electroplated cell is taken out. During the electroplating process, the light source can be turned on and off according to the selection.

[0056] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0057] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An electroplating device, characterized in that: The electroplating device comprises: The electroplating tank is provided with a containing tank with an open end; A tray is movably disposed in the accommodating groove, and the tray is used to support the battery sheet; Two electrode assemblies are disposed on the electroplating tank, each of the electrode assemblies is electrically connected to an external power source, and each of the electrode assemblies can move toward the tray; In which, a first film-opening area and a second film-opening area are provided on the back side of the battery cell, and a cathode electrode on one electrode assembly is used to contact with the first film-opening area to form a first electrode in the second film-opening area; and a cathode electrode on another electrode assembly is used to contact with the first electrode formed on the second film-opening area to form a second electrode in the first film-opening area.

2. The electroplating device according to claim 1, characterized in that: The electroplating device comprises: The support frame is arranged above the electroplating tank, and the electrode assembly is arranged on the support frame.

3. The electroplating device according to claim 2, characterized in that: The electrode assembly comprises: A fixing plate, movably connected to the supporting frame, wherein the fixing plate is provided with a plurality of spaced through slots; A plurality of anode electrodes, corresponding to the through slots one by one, the anode electrodes being arranged in the through slots; The cathode electrode is arranged on the side of the fixing plate facing the electroplating tank, and the cathode electrode protrudes from the side of the fixing plate facing the electroplating tank.

4. The electroplating device according to claim 3, characterized in that: The electrode assembly further comprises: A plurality of electrode protection structures correspond to the cathode electrodes one by one, and the electrode protection structures are arranged around the cathode electrodes to prevent the cathode electrodes from contacting the electroplating solution.

5. The electroplating device according to claim 4, characterized in that: The surface of the cathode electrode in contact with the first film-opening area is a plane.

6. The electroplating device according to claim 4, characterized in that: The surface of the cathode electrode in contact with the first electrode on the second film-opening area is constructed as a concave surface that is recessed in a direction away from the support frame.

7. The electroplating device according to claim 3, characterized in that: The electrode assembly further comprises: The first motor is arranged on the support frame, the fixing plate is fixedly connected to the output shaft of the first motor, and the first motor can drive the fixing plate to move towards or away from the support frame.

8. The electroplating device according to claim 3, characterized in that: A cell protection structure is disposed on the periphery of the side surface of the fixing plate facing the support frame, and the cell protection structure is lower than the height of the cathode electrode.

9. The electroplating device according to any one of claims 2 to 8, characterized in that: A limiting structure is arranged on the periphery of the support frame to limit the position of the battery cell.

10. The electroplating device according to any one of claims 2 to 8, characterized in that: The electroplating device also includes a transmission assembly, and the support frame is connected to the transmission assembly so that the support frame can switch between positions corresponding to different electrode assemblies.

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