Industrial water cooler for semiconductor production

Abstract

The utility model discloses an industrial water-cooling machine for semiconductor production, which comprises a casing, a mounting plate and a semiconductor water-cooling bracket, the mounting plate is mounted in the casing, the semiconductor water-cooling bracket is mounted at the top of the casing, a first cooling water pipe is mounted at the bottom of the semiconductor water-cooling bracket, and a second cooling water pipe is mounted at the bottom of the first cooling water pipe. And a second water drainage pipe is installed at the bottom of the first cooling water pipe, a first water suction pump is installed at one end of the semiconductor water cooling bracket, a motor is installed in the middle of the bottom of the mounting plate, and air guide pipes are evenly installed in the mounting plate. The air guide pipe is installed, the second cooling water pipe is arranged on the outer side of the air guide pipe in a winding mode, in the using process, air enters the air guide pipe, the contact area of cold water and the air guide pipe can be increased through the second cooling water pipe, the temperature of the air can be rapidly reduced, and therefore cold air can be blown out from the interior of the air guide pipe, and the cooling effect can be better improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor water cooling equipment, in particular to an industrial water cooling machine for semiconductor production. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, high-power power conversion and other fields. In the semiconductor production process, industrial water chillers are needed to cool and dissipate heat from production equipment and semiconductor products.

[0003] For example, the invention patent: "A water-cooled and air-cooled integrated cooling device for semiconductor production", with the announcement number: "CN111964324A", sets a mobile cleaning mechanism at the upper end of the fixed frame, and the motor is powered on to work, and the first pulley drives the belt to be transmitted at the upper end of the second pulley, so that the moving block drives the vertical plate to move in a straight line, so that the brush plate cleans the upper end of the cooling pipe and the cooling fin, achieving the advantage of being able to quickly clean the dust on the upper end of the cooling pipe and the cooling fin. However, during the implementation of this patent, only cold air can be blown out from the inside of the device, and the semiconductor cannot be directly placed on the device for cooling. In addition, during the cooling process, the cold water cannot be fully in contact with the gas, which makes it inconvenient to lower the gas temperature, and the cooling effect is greatly reduced. Therefore, a new industrial water chiller for semiconductor production is urgently needed to solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide an industrial water cooler for semiconductor production to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an industrial water-cooling machine for semiconductor production, comprising a casing, a mounting plate and a semiconductor water-cooling bracket, wherein the casing is internally mounted with the mounting plate, and the casing is topped with the semiconductor water-cooling bracket, the bottom of the semiconductor water-cooling bracket is mounted with a first cooling water pipe, and the bottom of the first cooling water pipe is mounted with a second drain pipe, one end of the semiconductor water-cooling bracket is mounted with a first water pump, a motor is mounted at the middle position of the bottom of the mounting plate, and air ducts are evenly mounted inside the mounting plate, and the air ducts are all A second cooling water pipe is arranged around the outer side of the air duct, and passes through the casing and extends to the outside of the casing. A diversion bin is installed at one end of the casing near the first water pump, and a second water pump is installed at the top of the casing near one end of the diversion bin. A first hose is installed at the input end of the second water pump, and a second water outlet pipe extending to the inside of the diversion bin is installed at the output end of the second water pump. A control panel is installed at the bottom of the casing away from the second water pump, and the output end of the control panel is electrically connected to the input ends of the first water pump, the motor and the second water pump through wires.

[0006] Preferably, a rotating shaft is installed at the output end of the motor, and fan blades are evenly installed on the outer side of the rotating shaft.

[0007] Preferably, diversion pipes are evenly installed on the outer side of the diversion chamber, and the ends of the diversion pipes away from the diversion chamber are connected to the second cooling water pipe.

[0008] Preferably, a water collecting tank is installed at the top of the end inside the casing away from the first water pump, and a first drain pipe extending to the outside of the casing is installed at the end of the water collecting tank away from the second water pump, and guide pipes are evenly installed at one end of the water collecting tank close to the diversion tank, and the ends of the guide pipes away from the water collecting tank are all connected to the second cooling water pipe.

[0009] Preferably, a second hose is installed at the input end of the first water pump, and a first water outlet pipe is installed at the output end of the first water pump. The first water outlet pipe passes through the semiconductor water cooling bracket, and one end of the first water outlet pipe away from the first water pump is connected to the first cooling water pipe.

[0010] Preferably, air cooling through holes are evenly arranged on the top of the semiconductor water cooling bracket.

[0011] Preferably, air inlets are provided at the bottoms of both ends of the casing, and screens are installed inside the air inlets.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. The industrial water chiller for semiconductor production is equipped with an air duct, and a second cooling water pipe is arranged around the outside of the air duct. When in use, the gas enters the inside of the air duct, and the contact area between the cold water and the air duct can be increased through the second cooling water pipe, so that the gas temperature can be quickly reduced, so that the cold air can be blown out from the inside of the air duct, which is conducive to improving the cooling effect;

[0014] 2. The industrial water chiller for semiconductor production is equipped with a water collection chamber, a diversion chamber and a second water pump. During use, the second water pump pumps cold water into the diversion chamber, so that the cold water is diverted to the inside of multiple groups of second cooling water pipes through multiple groups of diversion pipes. The used water in the second cooling water pipes can enter the water collection chamber through the guide pipe and can be directly discharged through the first drain pipe;

[0015] 3. The industrial water cooler for semiconductor production is equipped with a semiconductor water cooling bracket, a first cooling water pipe, a first water outlet pipe and a first water pump. During use, not only can cold air be blown directly onto the semiconductor production equipment, but semiconductor products can also be placed directly on the semiconductor water cooling bracket. The semiconductor products can be cooled not only by air through the air cooling through holes, but also by water through the first cooling water pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the front cross-sectional view of the utility model;

[0017] Figure 2 It is a schematic top view of the casing of the utility model;

[0018] Figure 3 It is a schematic cross-sectional bottom view of the semiconductor water-cooling bracket of the utility model.

[0019] In the figure: 1. casing; 2. air inlet; 3. fan blades; 4. control panel; 5. mounting plate; 6. first drain pipe; 7. guide pipe; 8. water collecting chamber; 9. air guide pipe; 10. second drain pipe; 11. semiconductor water cooling bracket; 12. first cooling water pipe; 13. first water outlet pipe; 14. air cooling through hole; 15. first water pump; 16. motor; 17. rotating shaft; 18. diversion chamber; 19. diversion pipe; 20. second water outlet pipe; 21. second cooling water pipe; 22. second water pump; 23. first hose; 24. second hose. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-3The utility model provides an embodiment: an industrial water cooling machine for semiconductor production, comprising a housing 1, a mounting plate 5 and a semiconductor water cooling bracket 11, the housing 1 is provided with a mounting plate 5, the housing 1 is provided with a semiconductor water cooling bracket 11 on the top, the semiconductor water cooling bracket 11 is provided with a first cooling water pipe 12 on the bottom, and the second drain pipe 10 on the bottom of the first cooling water pipe 12, a first water pump 15 is provided at one end of the semiconductor water cooling bracket 11, the model of the first water pump 15 here can be ISGD, a motor 16 is provided at the middle position of the bottom of the mounting plate 5, the model of the motor 16 here can be Y90S-2, the mounting plate 5 is provided with air ducts 9 evenly installed on the inside, and the air ducts 9 are all penetrated Through the casing 1 and extend to the outside of the casing 1, and the outer side of the air duct 9 is wrapped with a second cooling water pipe 21, a diversion chamber 18 is installed at one end of the casing 1 near the first water pump 15, and a second water pump 22 is installed on the top of the casing 1 near one end of the diversion chamber 18, the model of the second water pump 22 here can be ISGD, a first hose 23 is installed at the input end of the second water pump 22, and a second water outlet pipe 20 extending to the inside of the diversion chamber 18 is installed at the output end of the second water pump 22, a control panel 4 is installed at the bottom of the casing 1 away from one end of the second water pump 22, and the output end of the control panel 4 is electrically connected to the first water pump 15, the motor 16 and the input end of the second water pump 22 through wires.

[0022] In this implementation:

[0023] Furthermore, a rotating shaft 17 is installed at the output end of the motor 16, and fan blades 3 are evenly installed on the outer side of the rotating shaft 17. The motor 16 drives the fan blades 3 to rotate through the rotating shaft 17, so that the fan blades 3 cut the gas to generate airflow, so that the external gas enters the interior of the casing 1 through the air inlet 2.

[0024] Furthermore, diversion pipes 19 are evenly installed on the outside of the diversion chamber 18, and the ends of the diversion pipes 19 away from the diversion chamber 18 are connected to the second cooling water pipe 21. The second water pump 22 pumps cold water into the diversion chamber 18, so that the cold water is diverted to the inside of multiple groups of second cooling water pipes 21 through multiple groups of diversion pipes 19.

[0025] Furthermore, a water collecting tank 8 is installed at the top of the end of the casing 1 away from the first water pump 15, and a first drain pipe 6 extending to the outside of the casing 1 is installed at the end of the water collecting tank 8 away from the second water pump 22, and a guide pipe 7 is evenly installed at the end of the water collecting tank 8 close to the diversion tank 18, and the end of the guide pipe 7 away from the water collecting tank 8 is connected to the second cooling water pipe 21. The used water in the second cooling water pipe 21 can enter the water collecting tank 8 through the guide pipe 7 and can be directly discharged through the first drain pipe 6.

[0026] Furthermore, a second hose 24 is installed at the input end of the first water pump 15, and a first water outlet pipe 13 is installed at the output end of the first water pump 15. The first water outlet pipe 13 passes through the semiconductor water cooling bracket 11, and the end of the first water outlet pipe 13 away from the first water pump 15 is connected to the first cooling water pipe 12. The first water pump 15 pumps water through the second hose 24, and pumps cold water into the first cooling water pipe 12 through the first water outlet pipe 13.

[0027] Furthermore, air cooling holes 14 are evenly arranged on the top of the semiconductor water cooling bracket 11, and the cold air blown out by the air duct 9 can pass through the air cooling holes 14 and blow onto the semiconductor product, thereby air cooling the semiconductor product.

[0028] Furthermore, air inlets 2 are provided at the bottoms of both ends of the casing 1, and screens are installed inside the air inlets 2. External air can enter the casing 1 through the air inlets 2, and the screens can prevent dust from entering the casing 1 through the air inlets 2.

[0029] Working principle:

[0030] When in use, the device is powered on, and then the first hose 23 and the second hose 24 are connected to an external water source;

[0031] The staff can start the motor 16 and the second water pump 22 through the control panel 4, and the motor 16 drives the fan blades 3 to rotate through the rotating shaft 17, so that the fan blades 3 cut the gas to generate airflow, so that the external air enters the inside of the housing 1 through the air inlet 2, and enters the inside of the air duct 9, and then blows out through the air duct 9, so as to perform air cooling and heat dissipation on the semiconductor production equipment;

[0032] The second pump 22 pumps cold water into the diversion chamber 18, so that the cold water is diverted to the inside of the plurality of second cooling water pipes 21 through the plurality of diversion pipes 19. The used water in the second cooling water pipes 21 can enter the water collection chamber 8 through the guide pipe 7 and can be directly discharged through the first drain pipe 6.

[0033] The contact area between the cold water and the air duct 9 can be increased by the second cooling water pipe 21, so that the gas temperature can be quickly reduced, so that the cold air can be blown out from the inside of the air duct 9, which is beneficial to improving the cooling effect;

[0034] When the semiconductor product needs to be cooled, the semiconductor product can be placed on the semiconductor water cooling bracket 11, and the staff can start the first water pump 15 through the control panel 4, and the cold air blown out of the air duct 9 can pass through the air cooling through hole 14 and blow onto the semiconductor product, so that the semiconductor product can be cooled by air;

[0035] The first water pump 15 pumps cold water into the first cooling water pipe 12, so that the heat on the semiconductor water-cooling bracket 11 is quickly transferred to the cold water inside the first cooling water pipe 12, which can reduce the temperature of the semiconductor water-cooling bracket 11, thereby cooling the semiconductor product by water, which is beneficial to improving the cooling efficiency.

[0036] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. An industrial water cooling machine for semiconductor production, comprising a housing (1), a mounting plate (5) and a semiconductor water cooling bracket (11), characterized in that: A mounting plate (5) is installed inside the casing (1), and a semiconductor water cooling bracket (11) is installed on the top of the casing (1), a first cooling water pipe (12) is installed at the bottom of the semiconductor water cooling bracket (11), and a second drain pipe (10) is installed at the bottom of the first cooling water pipe (12), a first water pump (15) is installed at one end of the semiconductor water cooling bracket (11), a motor (16) is installed at the middle position of the bottom of the mounting plate (5), and air ducts (9) are evenly installed inside the mounting plate (5), the air ducts (9) all pass through the casing (1) and extend to the outside of the casing (1), and the outer side of the air ducts (9) is surrounded by a second cooling water pipe (21), a diversion chamber (18) is installed at one end of the casing (1) near the first water pump (15), and a second water pump (22) is installed at the top of the casing (1) near the end of the diversion chamber (18), a first hose (23) is installed at the input end of the second water pump (22), and a second water outlet pipe (20) extending to the inside of the diversion chamber (18) is installed at the output end of the second water pump (22), and a control panel (4) is installed at the bottom of the casing (1) away from the second water pump (22), and the output end of the control panel (4) is electrically connected to the first water pump (15), the motor (16) and the input end of the second water pump (22) through wires.

2. The industrial water chiller for semiconductor production according to claim 1, characterized in that: A rotating shaft (17) is installed at the output end of the motor (16), and fan blades (3) are evenly installed on the outer side of the rotating shaft (17).

3. The industrial water chiller for semiconductor production according to claim 1, characterized in that: The outer side of the diversion chamber (18) is evenly installed with diversion pipes (19), and the ends of the diversion pipes (19) away from the diversion chamber (18) are connected to the second cooling water pipe (21).

4. The industrial water chiller for semiconductor production according to claim 1, characterized in that: A water collecting chamber (8) is installed at the top of the end of the casing (1) away from the first water pump (15), and a first drainage pipe (6) extending to the outside of the casing (1) is installed at the end of the water collecting chamber (8) away from the second water pump (22), and a flow guide pipe (7) is evenly installed at the end of the water collecting chamber (8) close to the diversion chamber (18), and the end of the flow guide pipe (7) away from the water collecting chamber (8) is connected to the second cooling water pipe (21).

5. The industrial water chiller for semiconductor production according to claim 1, characterized in that: A second hose (24) is installed at the input end of the first water pump (15), and a first water outlet pipe (13) is installed at the output end of the first water pump (15); the first water outlet pipe (13) passes through the semiconductor water cooling bracket (11), and one end of the first water outlet pipe (13) away from the first water pump (15) is connected to the first cooling water pipe (12).

6. The industrial water chiller for semiconductor production according to claim 1, characterized in that: The top of the semiconductor water-cooling bracket (11) is evenly provided with air-cooling through holes (14).

7. The industrial water chiller for semiconductor production according to claim 1, characterized in that: The bottoms of both ends of the casing (1) are provided with air inlets (2), and screens are installed inside the air inlets (2).

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