Anti-pollution wafer spin-drying device

Abstract

The utility model provides an anti-pollution wafer spin-drying device. The anti-pollution wafer spin-drying device comprises a driving structure, a transmission mechanism and a spin-drying mechanism which are connected in sequence, the driving mechanism comprises a rotating motor, and the output end of the rotating motor is connected with a speed reducer; the transmission mechanism comprises a shell, a rotating main shaft is rotatably arranged in the shell through a bearing assembly, and one end of the rotating main shaft is connected with the output end of the speed reducer; a sealing assembly is arranged between the transmission mechanism and the spin-drying mechanism. Through the above mode, the sealing performance of the interior of the generation cavity is improved through the sealing assembly, and pollutants are effectively prevented from entering the sealing cavity and polluting the wafers in the sealing cavity.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to an anti-pollution wafer drying device. Background Art

[0002] Wafer refers to the silicon chip used in the production process of semiconductor circuits. In the semiconductor manufacturing process, the wafer will stick to some metals, particles, organic matter and other impurities, which need to be removed by a cleaning machine. Wafer cleaning is a very important part of the semiconductor manufacturing process. Without damaging the surface and electrical properties of the wafer, chemical solutions, gases, water and other media are used to set the appropriate temperature and speed to achieve the cleaning purpose. After the wafer is cleaned, it needs to be spun dry to prevent the cleaning medium from adhering to the wafer and damaging it.

[0003] A common spin-drying device usually includes a driving mechanism, a transmission mechanism and a spin-drying mechanism. The transmission mechanism includes a rotating spindle. During the spin-drying process, friction will be generated during the rotation of the rotating spindle. The frictional heat will cause the gas inside the transmission mechanism to rise, which can easily drive some particles to rise into the cavity of the spin-drying mechanism and easily adhere to the circumference of the internal wafer, causing wafer contamination. Utility Model Content

[0004] In order to solve the above problems, the utility model proposes a wafer drying device which has a simple structure and can effectively prevent pollution.

[0005] The main contents of the utility model include: a driving mechanism, a transmission mechanism and a drying mechanism connected in sequence;

[0006] The driving mechanism comprises a rotating motor, and the output end of the rotating motor is connected to a reducer;

[0007] The transmission mechanism comprises a housing, a rotating main shaft is rotatably arranged inside the housing through a bearing assembly, and one end of the rotating main shaft is connected to the output end of the reducer;

[0008] A sealing assembly is arranged between the transmission mechanism and the spin-drying mechanism, and the sealing assembly includes a sealing support seat embedded in the inside of the shell port, a center hole is opened in the sealing support seat, the rotating main shaft passes through the center hole and can rotate relative to the center hole, a first sealing ring is correspondingly embedded on the upper end surface of the sealing support seat, and a second sealing ring is correspondingly embedded on the lower end surface, the first sealing ring and the second sealing ring are both in contact with the rotating main shaft, and a plurality of vacuum channels are opened on the sealing support seat, and the vacuum channels extend horizontally from the direction of the center hole to the outer wall direction of the sealing support seat.

[0009] Preferably, a guide channel is opened in the circumferential direction of the outer edge of the sealing support seat, and the guide channel is connected to a plurality of the vacuum channels.

[0010] Preferably, the side wall of the shell is correspondingly provided with an air extraction hole, and the air extraction hole is connected with the guide channel.

[0011] Preferably, the spin-drying mechanism includes a supporting platform, which is fixed to one end of the shell away from the driving mechanism. A generating chamber is formed in the middle of the supporting platform. A rotating platform that can rotate relative to the supporting platform is arranged in the generating chamber. The rotating platform is connected to one end of the rotating main shaft away from the driving mechanism, and the rotating platform is used to place wafers.

[0012] Preferably, the bearing assemblies are provided in two groups, respectively arranged at the upper end and the lower end of the shell, and each group of the bearing assemblies includes at least two bearings.

[0013] Preferably, a second sealing assembly is arranged between the transmission mechanism and the driving mechanism, the second sealing assembly includes a second sealing support seat embedded in the lower port of the shell, a second center hole is opened in the center of the second sealing support seat, the lower end of the rotating main shaft passes through the second center hole, and the upper end surface and the lower end surface of the second sealing support seat are correspondingly embedded with a third sealing ring and a fourth sealing ring, and the third sealing ring and the fourth sealing ring are in fit with the rotating main shaft.

[0014] Preferably, the shell is circumferentially provided with an oil filling hole, and the oil filling hole extends inwardly to the rotating main shaft.

[0015] Preferably, a worm gear assembly is connected between the rotating motor and the reducer.

[0016] The beneficial effect of the utility model is that a vacuum channel is opened on the sealing support seat, one end of the vacuum channel passes through the central hole, and the other end is connected to a vacuum pump. The vacuum channel is evacuated by the vacuum pump to put the vacuum channel in a negative pressure state, and tiny particles generated by the friction of the rotating spindle during the rotation process are extracted to the outside to prevent the particles from rising to the upper part of the cavity and causing contamination to the wafer inside. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the three-dimensional structure of a preferred embodiment;

[0018] Figure 2 This is a schematic diagram of a three-dimensional structure from another viewing angle of a preferred embodiment;

[0019] Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure of AA;

[0020] Figure 4 for Figure 3 A schematic diagram of the local enlarged structure at a in the middle;

[0021] Reference numerals:

[0022] 1. Driving mechanism; 11. Rotating motor; 12. Speed ​​reducer; 13. Worm gear assembly;

[0023] 2. Transmission mechanism; 21. Housing; 22. Rotating spindle; 23. Bearing; 24. Oil filling hole;

[0024] 3. Drying mechanism; 31. Support platform; 32. Generating chamber; 33. Rotating platform;

[0025] 4. Sealing assembly; 41. Sealing support seat; 42. First sealing ring; 43. Second sealing ring; 44. Vacuum channel; 45. Guide channel; 46. Exhaust hole. DETAILED DESCRIPTION

[0026] The technical solution protected by the utility model is described in detail below with reference to the accompanying drawings.

[0027] like Figure 1 As shown, the present application is an anti-pollution wafer drying device, which mainly includes a driving mechanism 1, a transmission mechanism 2 and a drying mechanism 3 connected in sequence. When the driving mechanism 1 is actuated, the transmission mechanism 2 transmits the rotational force to the drying mechanism 3. The drying mechanism 3 is used to place wafers, and the drying mechanism 3 rotates to realize the wafer drying action.

[0028] like Figure 1-3 As shown, the driving mechanism 1 includes a rotary motor 11 and a reducer 12. The reducer 12 is correspondingly arranged at the output end of the rotary motor 11. The rotary motor 11 outputs rotary power, and transmits the force to the transmission mechanism 2 through the reducer 12. Preferably, in this embodiment, the placement directions of the rotary motor 11 and the transmission mechanism 2 are perpendicular to each other, and a worm gear assembly 13 can be arranged between the rotary motor 11 and the transmission mechanism 2 to convert the horizontal rotational force output by the rotary motor 11 into a vertical rotational force and then transmit it to the reducer 12.

[0029] like Figure 1-3As shown, the transmission mechanism 2 specifically includes a housing 21 and a rotating main shaft 22 rotatably arranged inside the housing 21. The rotating main shaft 22 is connected to the housing 21 through a bearing assembly. The bearing assemblies are correspondingly arranged at the upper and lower ends of the housing 21. The bearing assemblies maintain the stability of the rotating main shaft 22 during the rotation process to prevent the rotating main shaft from shaking easily when the torque is too large. Preferably, each bearing assembly includes at least two groups of bearings 23 to improve stability. One end of the rotating main shaft 22 is connected to the output end of the reducer 12. After the rotating motor 11 outputs power, the rotating torque is reduced through the reducer 12 to drive the rotating main shaft 22 to rotate synchronously.

[0030] like Figure 1-3 As shown, the drying mechanism 3 includes a support platform 31 correspondingly fixed to the end of the housing 21 away from the driving mechanism 1, and a generating chamber 32 is formed inside the support platform 31. A rotating platform 33 that can rotate relative to the support platform 31 is arranged in the generating chamber 32. The rotating platform 33 is used to place the wafers to be dried, and the rotating platform 33 rotates to drive the internal wafers to complete the drying action. The bottom of the rotating platform 33 is fixedly connected to the rotating main shaft 22, and the rotating main shaft 22 rotates synchronously to drive the rotating platform 33 to rotate.

[0031] like Figure 1-4 As shown, in order to ensure the cleanliness of the inside of the generating chamber 32, a sealing assembly 4 is arranged between the transmission mechanism 2 and the spin-drying mechanism 3. It is placed in the rotating process. The fine particles generated by the rotational friction of the rotating main shaft 22 enter the inside of the generating chamber 32 and pollute the internal wafer. Specifically, the sealing assembly 4 includes a sealing support seat 41 arranged inside the port of the shell 21. The sealing support seat 41 is correspondingly engaged with the port of the shell 21. The center of the sealing support seat 41 is correspondingly provided with a center hole. The end of the rotating main shaft 22 passes through the center hole and can rotate relative to the center hole. A sealing ring is correspondingly arranged at the inner ring of the sealing support seat 41 near the center hole. The sealing ring is embedded in the sealing support seat 41 and corresponds to the sealing fit with the rotating main shaft 22. Preferably, the sealing ring is correspondingly engaged with the upper and lower ends of the sealing support seat 41 to prevent the tiny particles generated by the friction of the rotating main shaft 22 during the rotation process from entering the upper generating chamber 32. Preferably, a first sealing ring 42 is correspondingly provided on the upper end surface of the sealing support seat 41 to prevent particles generated by friction between the rotating main shaft 22 and the sealing support seat 41 from entering the generating chamber 32, and a second sealing ring 43 is correspondingly provided on the lower end surface of the sealing support seat 41 to prevent contaminated particles inside the shell 21 from rising into the generating chamber 32.

[0032] like Figure 1-4As shown, a vacuum channel 44 is also provided between the corresponding first sealing ring 42 and the second sealing ring 43. The vacuum channel 44 extends horizontally from the central hole of the sealing support seat 41 to the outer wall. A vacuum pump is connected to the end of the vacuum channel 44. The vacuum pump is operated to evacuate the interior of the vacuum channel 44, so that a negative pressure is formed in the vacuum channel 44. Preferably, at least two groups of vacuum channels 44 are provided on the sealing support seat 41, and a guide channel 45 extending in an annular shape is provided on the outer ring of the sealing support seat 41. The guide channel 45 corresponds to the outer rings of several vacuum channels 44, so that when vacuum extraction is performed on any of the vacuum channels 44, the remaining vacuum channels 44 are in a negative pressure state, and the particles generated by the friction between the rotating spindle 22 and the sealing support seat 41 during the rotation are extracted to prevent contamination of the upper cavity.

[0033] like Figure 1-4 As shown, a horizontally extending exhaust hole 46 is correspondingly opened on the outer wall of the shell 21, and the exhaust hole 46 is interconnected with the guide channel 45. The exhaust hole 46 is used to install a vacuum pump to achieve vacuum exhaust of the vacuum channel 44 during the rotation of the rotating spindle 22.

[0034] like Figure 1-3 As shown, preferably, a second sealing assembly is arranged between the transmission mechanism and the driving mechanism, and the second sealing assembly includes a second sealing support seat embedded in the lower port of the housing 21, a second center hole is opened in the center of the second sealing support seat, the lower end of the rotating main shaft 22 passes through the second center hole, and the upper end surface and the lower end surface of the second sealing support seat are correspondingly embedded with a third sealing ring and a fourth sealing ring, and the third sealing ring and the fourth sealing ring are in contact with the rotating main shaft 22. The second sealing assembly is used to achieve the sealing between the transmission mechanism 2 and the driving mechanism 1 to prevent the lubricating oil inside the transmission mechanism 2 from leaking.

[0035] like Figure 1-3 As shown, preferably, in this embodiment, an oil filling hole 24 is opened circumferentially corresponding to the shell 21, and the oil filling hole 24 extends inwardly to the rotating main shaft 22, so as to inject lubricating oil between the rotating main shaft 22 and the inside of the shell 21, thereby lubricating the rotation of the rotating main shaft 22.

[0036] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A wafer drying device for preventing pollution, characterized in that: Mainly include: A driving mechanism, a transmission mechanism and a drying mechanism connected in sequence; The driving mechanism comprises a rotating motor, and the output end of the rotating motor is connected to a reducer; The transmission mechanism comprises a housing, a rotating main shaft is rotatably arranged inside the housing through a bearing assembly, and one end of the rotating main shaft is connected to the output end of the reducer; A sealing assembly is arranged between the transmission mechanism and the spin-drying mechanism, and the sealing assembly includes a sealing support seat embedded in the inside of the shell port, a center hole is opened in the sealing support seat, the rotating main shaft passes through the center hole and can rotate relative to the center hole, a first sealing ring is correspondingly embedded on the upper end surface of the sealing support seat, and a second sealing ring is correspondingly embedded on the lower end surface, the first sealing ring and the second sealing ring are both in contact with the rotating main shaft, and a plurality of vacuum channels are opened on the sealing support seat, and the vacuum channels extend horizontally from the direction of the center hole to the outer wall direction of the sealing support seat.

2. The anti-pollution wafer drying device according to claim 1, characterized in that: A guide channel is provided in the circumferential direction of the outer edge of the sealing support seat, and the guide channel is connected to a plurality of the vacuum channels.

3. The anti-pollution wafer drying device according to claim 2, characterized in that: The side wall of the shell is correspondingly provided with an air extraction hole, and the air extraction hole is connected with the guide channel.

4. The anti-pollution wafer drying device according to claim 1, characterized in that: The spin-drying mechanism includes a supporting platform, which is fixed to one end of the shell away from the driving mechanism. A generating chamber is formed in the middle of the supporting platform. A rotating platform that can rotate relative to the supporting platform is arranged in the generating chamber. The rotating platform is connected to one end of the rotating main shaft away from the driving mechanism, and the rotating platform is used to place wafers.

5. The anti-pollution wafer drying device according to claim 1, characterized in that: The bearing assemblies are provided in two groups, respectively arranged at the upper end and the lower end inside the shell, and each group of the bearing assemblies includes at least two bearings.

6. The anti-pollution wafer drying device according to claim 1, characterized in that: A second sealing assembly is arranged between the transmission mechanism and the driving mechanism, and the second sealing assembly includes a second sealing support seat embedded in the lower port of the shell, a second center hole is opened in the center of the second sealing support seat, and the lower end of the rotating main shaft passes through the second center hole, and the upper end surface and the lower end surface of the second sealing support seat are correspondingly embedded with a third sealing ring and a fourth sealing ring, and the third sealing ring and the fourth sealing ring are in contact with the rotating main shaft.

7. The anti-pollution wafer drying device according to claim 1, characterized in that: The shell is circumferentially provided with an oil filling hole, and the oil filling hole extends inwardly to the rotating main shaft.

8. The anti-pollution wafer drying device according to claim 1, characterized in that: A worm gear assembly is connected between the rotating motor and the reducer.

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