Circuit board with improved heat dissipation air channel

Abstract

The utility model discloses a circuit board with an improved heat dissipation air duct, which comprises a circuit board body, a shunting channel is fixedly arranged on one side of the bottom end of the circuit board body, a plurality of uniformly distributed U-shaped heat conduction pieces are fixedly arranged on one side of the shunting channel, and the plurality of U-shaped heat conduction pieces are fixedly connected with the circuit board body. According to the circuit board with the improved heat dissipation air duct, the shunting channel made of the heat conduction material, the plurality of U-shaped heat conduction pieces and the plurality of heat dissipation fins are arranged at the bottom of the circuit board body, so that the heat dissipation effect on the circuit board body can be improved; and external air filtered by the dust screen is guided into the shunting channel through the plurality of miniature fans, then the air is rapidly shunted into the plurality of heat dissipation air channels through the plurality of ventilation openings, and heat dissipation of the circuit board body is accelerated through contact heat exchange between the air and the circuit board body.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, in particular to a circuit board with an improved heat dissipation air duct. Background Art

[0002] Circuit boards are indispensable in almost all electronic devices we can see, from small electronic watches, calculators, general-purpose computers to large electronic components such as computer communication electronic equipment. The electrical interconnection between them all requires printed circuit boards. However, many existing circuit boards can only dissipate heat by themselves, and do not have heat dissipation structures such as heat dissipation ducts, resulting in poor heat dissipation of the circuit board, which in turn affects the service life of the circuit board.

[0003] In order to solve the above problems, a circuit board with improved heat dissipation duct is proposed. Utility Model Content

[0004] The purpose of the utility model is to provide a circuit board with improved heat dissipation duct to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a circuit board with improved heat dissipation duct, comprising a circuit board body, a shunt channel is fixedly arranged on one side of the bottom end of the circuit board body, a plurality of evenly distributed U-shaped heat conductive parts are fixedly arranged on one side of the shunt channel, the plurality of U-shaped heat conductive parts are fixedly connected to the circuit board body, a heat dissipation duct is formed between the plurality of U-shaped heat conductive parts and the circuit board body, a plurality of placement grooves are provided on the side of the shunt channel away from the heat dissipation duct, a plurality of placement grooves are provided inside the plurality of placement grooves, micro fans and dustproof nets are respectively fixedly installed at both ends of the inner sides of the plurality of placement seats, a guide groove is provided on the top of the inner sides of the plurality of placement grooves, a plurality of guide blocks are slidably arranged inside the plurality of guide grooves, and the plurality of guide blocks are respectively fixedly connected to the plurality of placement seats.

[0006] The circuit board is provided with a shunt channel made of heat-conducting material, a plurality of U-shaped heat-conducting parts and a plurality of heat-dissipating fins at the bottom of the circuit board body, so that the heat dissipation effect of the circuit board body can be improved, and the outside air filtered by the dust-proof net is introduced into the shunt channel through a plurality of micro fans, and then the air is quickly shunted into a plurality of heat-dissipating air ducts through a plurality of ventilation ports, and the heat exchange between the air and the circuit board body is carried out through contact, thereby accelerating the heat dissipation of the circuit board body and improving the heat dissipation effect and heat dissipation efficiency.

[0007] Preferably, a socket and a pin are fixedly provided on one side of the top of the circuit board body, and ventilation holes are provided at the connection between the diversion channel and several U-shaped heat conducting parts. The provision of several ventilation holes facilitates the introduction of air in the diversion channel into several heat dissipation ducts.

[0008] Preferably, the bottom ends of the plurality of U-shaped heat conducting members and the bottom ends of the diversion channels are fixedly connected with a plurality of heat dissipating fins. The arrangement of the plurality of U-shaped heat conducting members and the plurality of heat dissipating fins can improve the heat dissipation effect of the circuit board body.

[0009] Preferably, auxiliary handles are fixedly provided on the outer sides of several of the dustproof nets, and the fan assembly can be easily disassembled by pulling the auxiliary handles.

[0010] Preferably, several of the guide grooves are provided with connecting slots on their inner sides, several of the connecting slots are provided with connecting blocks inside, several of the connecting blocks are fixedly connected to several guide blocks respectively, and several fan assemblies can be stably installed by limiting the engagement of several connecting slots with several connecting blocks respectively.

[0011] Preferably, fixing parts are fixedly provided at both ends of both sides of the circuit board body, mounting holes are opened in the middle of the four fixing parts, and fixing bolts are provided inside the four mounting holes. The arrangement of four fixing parts and four fixing bolts facilitates the fixed installation of the circuit board body.

[0012] Preferably, the bottom ends of the four fixing members are each provided with an installation groove, and elastic pads are fixedly arranged inside the four installation grooves, and upward elastic force is applied to the fixing member through the elastic pad, thereby applying upward force to the fixing bolt, thereby ensuring stable installation of the fixing bolt.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] The circuit board is provided with a shunt channel made of heat-conducting material, a plurality of U-shaped heat-conducting parts and a plurality of heat-dissipating fins at the bottom of the circuit board body, so that the heat dissipation effect of the circuit board body can be improved, and the outside air filtered by the dust-proof net is introduced into the shunt channel through a plurality of micro fans, and then the air is quickly shunted into a plurality of heat-dissipating air ducts through a plurality of ventilation ports, and the heat exchange between the air and the circuit board body is carried out through contact, thereby accelerating the heat dissipation of the circuit board body and improving the heat dissipation effect and heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional diagram of the utility model;

[0016] Figure 2 It is a front cross-sectional view of the utility model;

[0017] Figure 3 It is an enlarged view of the local structure of the utility model;

[0018] Figure 4 It is an enlarged view of part A of the utility model;

[0019] Figure 5 It is an enlarged view of part B of the utility model.

[0020] In the figure: 1. circuit board body; 2. shunt channel; 3. U-shaped heat conductor; 4. heat dissipation duct; 5. vent; 6. fixing part; 7. heat dissipation fin; 8. mounting seat; 9. dust screen; 10. auxiliary handle; 11. micro fan; 12. mounting groove; 13. guide groove; 14. guide block; 15. connecting card slot; 16. connecting card block; 17. mounting groove; 18. elastic pad; 19. mounting hole; 20. fixing bolt; 21. socket; 22. pin. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0022] See also Figure 1-5 The utility model provides a circuit board with improved heat dissipation duct, including a circuit board body 1, a shunt channel 2 is fixedly arranged on one side of the bottom end of the circuit board body 1, a plurality of evenly distributed U-shaped heat conducting members 3 are fixedly arranged on one side of the shunt channel 2, the plurality of U-shaped heat conducting members 3 are fixedly connected to the circuit board body 1, a heat dissipation duct 4 is formed between the plurality of U-shaped heat conducting members 3 and the circuit board body 1, a plurality of placement grooves 12 are provided on one side of the shunt channel 2 away from the heat dissipation duct 4, a plurality of placement grooves 12 are provided inside the plurality of placement grooves 12, micro fans 11 and dustproof nets 9 are fixedly installed at both ends of the inner sides of the plurality of placement seats 8, and guide grooves are provided on the tops of the inner sides of the plurality of placement grooves 12 13, guide blocks 14 are slidably arranged inside the guide grooves 13, and the guide blocks 14 are fixedly connected to the mounting seats 8 respectively. The circuit board is provided with a shunt channel 2 made of heat-conducting material, a plurality of U-shaped heat-conducting parts 3 and a plurality of heat-dissipating fins 7 at the bottom of the circuit board body 1, so as to improve the heat dissipation effect of the circuit board body 1, and introduce the external air filtered by the dust-proof net 9 into the shunt channel 2 through a plurality of micro fans 11, and then the air is quickly shunted into a plurality of heat-dissipating air ducts 4 through a plurality of ventilation ports 5, and the air is contacted and heat-exchanged with the circuit board body 1, thereby accelerating the heat dissipation of the circuit board body 1 and improving the heat dissipation effect and heat dissipation efficiency.

[0023] A socket 21 and a pin 22 are fixedly provided on one side of the top of the circuit board body 1, a vent 5 is provided at the connection between the shunt channel 2 and the plurality of U-shaped heat conducting members 3, a plurality of heat dissipating fins 7 are fixedly connected to the bottom ends of the plurality of U-shaped heat conducting members 3 and the bottom ends of the shunt channel 2, and an auxiliary handle 10 is fixedly provided on the outer sides of the plurality of dustproof nets 9;

[0024] When in use, the air in the shunt channel 2 is conveniently introduced into the heat dissipation ducts 4 by the arrangement of the plurality of vents 5, and the heat dissipation effect of the circuit board body 1 can be improved by the arrangement of the plurality of U-shaped heat conducting members 3 and the plurality of heat dissipation fins 7. The fan assembly can be conveniently disassembled by pulling the auxiliary handle 10;

[0025] A connecting card slot 15 is provided on the inner side of the plurality of guide slots 13, and a connecting card block 16 is provided inside the plurality of connecting card slots 15, and the plurality of connecting card blocks 16 are fixedly connected to the plurality of guide blocks 14 respectively. Fixing members 6 are fixedly provided at both ends of both sides of the circuit board body 1, and mounting holes 19 are provided in the middle of the four fixing members 6, and fixing bolts 20 are provided inside the four mounting holes 19, and mounting slots 17 are provided at the bottom ends of the four fixing members 6, and elastic pads 18 are fixedly provided inside the four mounting slots 17;

[0026] When in use, several fan assemblies can be stably installed by limiting engagement of several connecting slots 15 with several connecting blocks 16 respectively. The circuit board body 1 can be fixedly installed by setting four fixing members 6 and four fixing bolts 20. An upward elastic force is applied to the fixing member 6 through the elastic pad 18, and then an upward force is applied to the fixing bolt 20, thereby ensuring the stable installation of the fixing bolt 20.

[0027] When the embodiment of the present application is in use: the circuit board is provided with a diversion channel 2 made of heat-conducting material, a plurality of U-shaped heat-conducting parts 3 and a plurality of heat-dissipating fins 7 at the bottom of the circuit board body 1, so as to improve the heat dissipation effect of the circuit board body 1, and the outside air filtered by the dustproof net 9 is introduced into the diversion channel 2 through a plurality of micro fans 11, and then the air is quickly diverted to a plurality of heat-dissipating ducts 4 through a plurality of ventilation ports 5, and the heat exchange between the air and the circuit board body 1 is carried out in contact, thereby accelerating the heat dissipation of the circuit board body 1, and improving the heat dissipation effect and heat dissipation efficiency. During use, a plurality of connecting card slots 15 are respectively engaged with a plurality of connecting card blocks 16 to facilitate the stable installation of a plurality of fan assemblies, and the connecting card block 16 is separated from the connecting card slot 15 by pulling the auxiliary handle 10, so as to facilitate the disassembly of the fan assembly.

[0028] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A circuit board with improved heat dissipation duct, comprising a circuit board body (1), characterized in that: A shunt channel (2) is fixedly arranged on one side of the bottom end of the circuit board body (1), and a plurality of evenly distributed U-shaped heat conducting members (3) are fixedly arranged on one side of the shunt channel (2). The plurality of U-shaped heat conducting members (3) are fixedly connected to the circuit board body (1), and a heat dissipation duct (4) is formed between the plurality of U-shaped heat conducting members (3) and the circuit board body (1). A plurality of placement grooves (12) are provided on a side of the shunt channel (2) away from the heat dissipation duct (4), and a placement seat (8) is provided inside the plurality of placement grooves (12). Micro fans (11) and dustproof nets (9) are fixedly installed at both ends of the inner sides of the plurality of placement seats (8), and guide grooves (13) are provided on the tops of the inner sides of the plurality of placement grooves (12). Guide blocks (14) are slidably provided inside the plurality of guide grooves (13), and the plurality of guide blocks (14) are fixedly connected to the plurality of placement seats (8), respectively.

2. A circuit board with improved heat dissipation duct according to claim 1, characterized in that: A socket (21) and a plug pin (22) are fixedly provided on one side of the top of the circuit board body (1), and ventilation holes (5) are provided at the connection points between the diversion channel (2) and a plurality of U-shaped heat conducting members (3).

3. The circuit board with improved heat dissipation duct according to claim 1, characterized in that: The bottom ends of the plurality of U-shaped heat conducting members (3) and the bottom end of the flow diversion channel (2) are both fixedly connected with a plurality of heat dissipation fins (7).

4. The circuit board with improved heat dissipation duct according to claim 1, characterized in that: Auxiliary handles (10) are fixedly arranged on the outer sides of the plurality of dustproof nets (9).

5. The circuit board with improved heat dissipation duct according to claim 1, characterized in that: A connection card slot (15) is provided on the inner side of a plurality of the guide slots (13), a connection card block (16) is provided inside a plurality of the connection card slots (15), and a plurality of the connection card blocks (16) are fixedly connected to a plurality of the guide blocks (14) respectively.

6. The circuit board with improved heat dissipation duct according to claim 1, characterized in that: Fixing members (6) are fixedly provided at both ends of both sides of the circuit board body (1), four fixing members (6) are provided with mounting holes (19) in the middle, and fixing bolts (20) are provided inside the four mounting holes (19).

7. A circuit board with improved heat dissipation duct according to claim 6, characterized in that: The bottom ends of the four fixing members (6) are each provided with a mounting groove (17), and elastic pads (18) are fixedly arranged inside the four mounting grooves (17).

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