Wearable device
By setting heat conductors in the wearable device and diffusing heat with the area of the wearable mounting, the problem of insufficient heat dissipation effect in the prior art is solved, and more efficient heat dissipation and better user experience are achieved.
Patent Information
- Application Number
- CN202420273475.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-04
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-02-04
AI Technical Summary
The heat dissipation effect of existing wearable devices is insufficient, resulting in heat generation of internal devices, reduced service life and poor user experience.
A wearable device including a device housing, a circuit board, a wearable mounting member and a thermal conductor is designed. The thermal conductor is connected or contacted by providing a first thermal conductor on both sides of the circuit board and connecting or contacting it with a second thermal conductor. Located in or within the wearable mount, heat is diffused into the air by the area of the wearable mount, thereby improving heat dissipation efficiency.
It significantly improves the heat dissipation efficiency and speed of wearable devices, reduces the internal temperature of the device housing, and improves the user experience.
Smart Images

Figure CN222283749U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of heat dissipation of electronic equipment, and in particular to a wearable device. Background Art
[0002] In recent years, various types of wearable devices (such as smart watches) have been continuously developed. As the functions that such devices can realize are becoming more and more abundant, the components inside the devices, such as circuit boards, may have heating problems. If the components inside the device continue to heat up, the service life of the components and the device will be reduced, and the user experience will deteriorate.
[0003] In the related art, in order to dissipate heat for wearable devices, a shell can be set on the side of the device close to human skin. The device can dissipate heat with the help of the shell. At the same time, the human skin does not directly contact the device, and the skin feel is better.
[0004] However, the heat dissipation effect of the above heat dissipation method needs to be improved. Utility Model Content
[0005] In view of this, the present disclosure provides a wearable device with good heat dissipation effect.
[0006] Specifically, the following technical solutions are included:
[0007] The present disclosure provides a wearable device, including a device housing, a circuit board, a wearable mounting member, a first heat conducting member, and a second heat conducting member;
[0008] The circuit board and the first heat-conducting member are located in the device housing, and the wearable mounting member is connected to the device housing;
[0009] The wearable mounting member carries the second heat-conducting member, and the first heat-conducting member is connected or in contact with the second heat-conducting member.
[0010] Optionally, the first heat-conducting member includes two first heat-conducting sub-layers, and the two first heat-conducting sub-layers are respectively located on two sides of the board surface of the circuit board.
[0011] Optionally, the two first heat-conducting sub-layers gradually converge in a direction extending toward the second heat-conducting member, and continue to extend until they are connected to or in contact with the second heat-conducting member.
[0012] Optionally, the wearable mounting member has a hollow chamber, and the second heat-conducting member is located in the hollow chamber.
[0013] Optionally, the wearable mounting member has a mounting groove, and the second heat conductive member is located in the mounting groove.
[0014] Optionally, two opposite sides of the wearable mounting component respectively have the mounting grooves; the second heat conductive component includes two second sub-heat conductive components, and one second sub-heat conductive component is installed in each of the mounting grooves.
[0015] Optionally, the wearable mounting piece is integrated with the device housing.
[0016] Optionally, the wearable device further includes a shielding cover, which is mounted on a first side of the circuit board, and one of the first sub-heat-conducting layers is located on a side of the shielding cover away from the circuit board.
[0017] Optionally, the wearable device further includes an insulating adhesive backing, wherein the insulating adhesive backing is arranged on a second side of the circuit board, and the second side is opposite to the first side;
[0018] Another first heat-conducting sub-layer is located on a side of the insulating adhesive away from the circuit board.
[0019] Optionally, the first heat conducting member and / or the second heat conducting member is copper foil.
[0020] Optionally, the wearable mounting member includes a first sub-mounting member and a second sub-mounting member, and the first sub-mounting member and the second sub-mounting member are respectively located on opposite sides of the device housing;
[0021] The first sub-mounting member and the second sub-mounting member respectively carry the second heat conducting member.
[0022] The disclosed embodiment provides a wearable device, wherein a circuit board and a first heat-conducting member are disposed inside the device housing of the device, and a wearable mounting member connected to the device housing also carries a second heat-conducting member, and the first heat-conducting member is connected or in contact with the second heat-conducting member, so that the first heat-conducting member can transfer the heat emitted by the circuit board and the like inside the device housing to the second heat-conducting member, and the second heat-conducting member can conduct the heat to the wearable mounting member or directly diffuse it into the air, so that the wearable device can dissipate heat with the help of the wearable mounting member, and the heat dissipation efficiency is higher. In addition, since the area of the wearable mounting member can be larger, the heat dissipation speed can be significantly improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0024] Figure 1 A schematic diagram of the structure of a wearable device provided in an embodiment of the present disclosure;
[0025] Figure 2 A perspective view of a wearable device provided in accordance with an embodiment of the present disclosure;
[0026] Figure 3 A partial structural schematic diagram of a wearable device provided in an embodiment of the present disclosure;
[0027] Figure 4 for Figure 1 A cross-sectional view of the structure shown along AA;
[0028] Figure 5 for Figure 1 A cross-sectional view of the structure shown along BB;
[0029] Figure 6 A schematic diagram of the matching relationship between a wearable mounting component and a second heat conducting component in a wearable device provided in an embodiment of the present disclosure;
[0030] Figure 7 A partial structural schematic diagram of another wearable device provided in an embodiment of the present disclosure;
[0031] Figure 8 A schematic diagram of the matching relationship between a wearable mounting member and a second heat conducting member in another wearable device provided in an embodiment of the present disclosure;
[0032] Fig. 9 for Figure 8 The structure shown is a cross-sectional view along CC.
[0033] The reference numerals in the figures represent respectively:
[0034] 1- Equipment housing;
[0035] 2- Circuit board;
[0036] 3- Wear the mounting parts;
[0037] 31 - hollow chamber;
[0038] 32-mounting slot;
[0039] 33-first sub-mounting member;
[0040] 34-second sub-mounting member;
[0041] 4- first heat conducting member;
[0042] 41- a first heat conducting sub-layer;
[0043] 5- second heat conducting member;
[0044] 51- second sub-heat conducting member;
[0045] 6- Shielding cover;
[0046] 7-Insulation adhesive.
[0047] The above drawings show clear embodiments of the present disclosure, which will be described in more detail below. These drawings and text descriptions are not intended to limit the scope of the present disclosure in any way, but to illustrate the concepts of the present disclosure to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION
[0048] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.
[0049] The directional nouns involved in the embodiments of the present disclosure, such as "upper", "lower", "side", etc., are generally based on the relative directional relationship between the structures when the wearable device is usually arranged, and these directional nouns are used only to more clearly describe the relationship between the structures, not to describe the absolute direction. When the wearable device is placed in different postures, the direction may change, for example, "upper" and "lower" may be interchangeable.
[0050] Unless otherwise defined, all technical terms used in the embodiments of the present disclosure have the same meanings as commonly understood by those of ordinary skill in the art.
[0051] In order to make the technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.
[0052] The present disclosure provides a wearable device. Figure 1-3 The wearable device comprises a device housing 1, a circuit board 2, a wearable mounting member 3, a first heat conducting member 4 and a second heat conducting member 5;
[0053] The circuit board 2 and the first heat-conducting member 4 are located in the device housing 1, and the wearable mounting member 3 is connected to the device housing 1;
[0054] The wearing mounting member 3 carries the second heat-conducting member 5 , and the first heat-conducting member 4 is connected to or in contact with the second heat-conducting member 5 .
[0055] In the disclosed embodiment, a circuit board and a first heat-conducting member are provided inside the device housing of the wearable device, and a wearable mounting member connected to the device housing also carries a second heat-conducting member, and the first heat-conducting member is connected or in contact with the second heat-conducting member, so that the first heat-conducting member can transfer the heat emitted by the circuit board and the like inside the device housing to the second heat-conducting member, and the second heat-conducting member can conduct the heat to the wearable mounting member or directly diffuse it into the air, so that the wearable device can dissipate heat with the help of the wearable mounting member, and the heat dissipation efficiency is higher. In addition, since the area of the wearable mounting member can be larger, the heat dissipation speed can be significantly improved.
[0056] In some embodiments, reference Figure 3 The first heat-conducting member 4 includes two first heat-conducting sub-layers 41 , and the two first heat-conducting sub-layers 41 are respectively located on two sides of the board surface of the circuit board 2 .
[0057] By providing a first sub-heat-conducting layer 41 on both sides of the board surface of the circuit board 2, the circuit board can be assisted to achieve effective heat dissipation on both sides of the board surface, which is beneficial to improving the heat dissipation efficiency of the internal components of the device.
[0058] It should be noted that there may be many devices inside the wearable device, among which the heating phenomenon of the circuit board is more obvious, so the circuit board is used as the main target heat sink in this application. In practice, there may be other devices with high heating levels. In this case, those skilled in the art can apply the solution of this application to the device to transfer the heat emitted by the device to the wearable mounting part. Since the wearable mounting part is generally large in size and has a large area in contact with the air, it can efficiently exchange heat with the air, thereby improving the heat dissipation efficiency of the internal devices of the device.
[0059] Optional, continue to refer to Figure 3 The two first sub-heat conducting layers 41 gradually converge in the direction of extending toward the second heat conducting member 5 , and continue to extend until they are connected to or in contact with the second heat conducting member 5 .
[0060] Based on the above arrangement, the space occupied by the first heat-conducting member inside the device housing can be gradually reduced as it extends from the inside of the housing to the outside of the housing, until it converges into one body, so as to facilitate connection or contact with the second heat-conducting member carried by the wearable mounting member. Optionally, when the wearable mounting member is connected to the device housing through a buckle structure, the first heat-conducting member and the second heat-conducting member can also be connected by a buckle or directly abutted.
[0061] In some embodiments, in combination Figure 1 and Figure 4 The wearing mounting member 3 has a hollow chamber 31 , and the second heat conducting member 5 is located in the hollow chamber 31 .
[0062] In this embodiment, the second heat-conducting member 5 is arranged inside the wearable mounting member 3, so that the wearable mounting member 3 has a more aesthetically pleasing appearance, and at the same time, it can ensure that the second heat-conducting member 5 is not easily damaged or fallen off.
[0063] In other embodiments, in combination Figure 6-7 or Figure 8-9 The wearing mounting member 3 has a mounting groove 32 , and the second heat conducting member 5 is located in the mounting groove 32 .
[0064] In this embodiment, the second heat-conducting member 5 can be directly installed in the installation groove 32 of the wearable mounting member 3. In this way, the second heat-conducting member 5 can not only transfer the heat from the inside of the device housing to the wearable mounting member 3 itself, but also directly transfer the heat to the air and perform heat exchange with the air. In this way, the heat can be dissipated more effectively and the temperature inside the device housing can be reduced.
[0065] It should be noted that in this embodiment, the second heat-conducting member may come into contact with the user or the external environment. To ensure user safety and avoid device damage, the second heat-conducting member is a non-conductive material, or the second heat-conducting member can be a conductive material, but there is an insulation design between it and the internal electronic components of the device. Optionally, when the second heat-conducting member is a non-conductive material, it can include: a thermally conductive silicone sheet, a thermally conductive ceramic sheet, etc. When the second heat-conducting member is a conductive material, it can include: copper foil, aluminum foil, gold foil, and thermally conductive members made of aluminum nitride, silicon carbide, aluminum, tungsten, graphite, zinc, and other materials.
[0066] Optional, combined Figure 6 Or 8, two opposite sides of the wearable mounting member 3 respectively have mounting grooves 32; the second heat-conducting member 5 includes two second sub-heat-conducting members 51, and a second sub-heat-conducting member 51 is installed in each mounting groove 32.
[0067] Combination Figure 8-9 , the two second sub-heat-conducting parts 51 can be located on two sides of the wearable mounting part that are approximately parallel to the surface of the human body part. In this case, the area of the second sub-heat-conducting part in direct contact with the air is larger, and the heat dissipation effect is more significant. Alternatively, the mounting groove can be set only on one side of the wearable mounting part away from the human skin (in the installed state), so that the human body has a better experience when wearing it.
[0068] Combination Figure 6-7 The two second heat-conducting sub-components 51 can be located on two opposite sides of the wearable mounting component that do not contact the human body, such as the two side end surfaces of a watch strap (which are approximately perpendicular to the human skin when installed). In this case, the second heat-conducting sub-components have a larger contact area with the air and will not contact the human skin, thereby improving the heat dissipation efficiency and ensuring a better user experience.
[0069] In practice, the above two methods may be combined, for example, mounting grooves are provided on two side end surfaces and a side surface away from human skin, and a second heat conducting member is provided in each mounting groove.
[0070] Optionally, the wearable mounting member 3 is integrated with the device housing 1. This ensures that the second heat-conducting member is easy to install on the wearable mounting member and reduces the overall manufacturing cost of the device.
[0071] In some embodiments, in combination Figure 1 and Figure 5 The wearable device further includes a shielding cover 6 , which is mounted on a first side of the circuit board 2 , and a first sub-heat-conducting layer 41 is located on a side of the shielding cover 6 away from the circuit board 2 .
[0072] With the help of the shielding cover, the working performance of the antenna and other components inside the wearable device can be better. At the same time, arranging the first sub-heat conductive layer on the side of the shielding cover away from the circuit board can ensure that most of the heat inside the device is conducted away, ensuring the heat dissipation effect.
[0073] In some embodiments, in combination Figure 1 and Figure 5 The wearable device further includes an insulating adhesive 7, which is disposed on a second side of the circuit board 2, the second side being opposite to the first side;
[0074] Another first heat-conducting sub-layer 41 is located on a side of the insulating adhesive 7 away from the circuit board 2 .
[0075] Based on the above arrangement, it can be ensured that the circuit board and the first heat-conducting sub-layer are well insulated, the first heat-conducting sub-layer does not leak electricity, and short circuits do not occur inside the device.
[0076] Optionally, the first heat conducting member 4 and / or the second heat conducting member 5 is copper foil.
[0077] Copper foil has good thermal conductivity, which can effectively ensure that the heat inside the wearable device is quickly transferred to the wearable mounting parts, thereby improving the heat dissipation efficiency.
[0078] In some embodiments, in combination Figure 1 The wearable mounting member 3 includes a first sub-mounting member 33 and a second sub-mounting member 34, and the first sub-mounting member 33 and the second sub-mounting member 34 are respectively located on opposite sides of the device housing 1;
[0079] The first sub-mounting member 33 and the second sub-mounting member 34 respectively carry the second heat conducting member 5 .
[0080] In this embodiment, there is a sub-mounting component on each of the two opposite sides of the device housing, which makes it easy to install the wearable device at the target location. At the same time, more wearable mounting components are used to dissipate heat, which can achieve more efficient heat dissipation.
[0081] Optionally, depending on the type of wearable device, the number of sub-mounting parts included in the wearable mounting part 3 may be more or less. When the wearable device is a head-mounted device (such as a helmet), the wearable mounting part may have a circular or arc-shaped sub-mounting part. In this case, the number of sub-mounting parts may be one or more, and the sub-mounting parts are arranged around the device housing. When the wearable device is a face-wearable device (such as smart glasses), the side of the wearable mounting part close to the human body may be arc-shaped, and the number may be one. Similarly, the form of the wearable mounting parts of other wearable devices can be adjusted based on demand.
[0082] Optionally, the wearable device includes a watch or a bracelet, and the wearable mounting member 3 includes a watch strap. That is, the solution based on the present disclosure can use the watch strap to dissipate heat from the electronic components inside the watch or bracelet, thereby preventing the watch or bracelet from being overheated and reducing the life of the device.
[0083] In summary, the wearable device provided by the embodiment of the present disclosure has a device housing connected to a wearable mounting piece, and the wearable mounting piece can assist the user in wearing and mounting the device on the body. A circuit board is provided inside the device housing, and various devices may be provided on the circuit board. When the wearable device is used for a long time, the circuit board and the devices thereon may generate more obvious heat. At this time, the first sub-heat conductive piece on both sides of the board surface of the circuit board can first absorb the heat emitted by the circuit board and the devices thereon, and then transfer the heat to the second heat conductive piece, which is carried by the wearable mounting piece. Since the wearable mounting piece is in direct contact with the air and has a large area, the heat can be quickly dissipated into the air, and the heat dissipation effect of the device can be significantly improved. Due to the high heat dissipation efficiency, the temperature of the device housing of the wearable device will not increase significantly, and the user will not feel the temperature increase during the wearing and use process, and the user experience is better.
[0084] In the present disclosure, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more, unless explicitly defined otherwise.
[0085] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the present disclosure disclosed herein. The present disclosure is intended to cover any variations, uses or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The description and examples are intended to be exemplary only.
[0086] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims
1. A wearable device, characterized in that: It comprises a device housing (1), a circuit board (2), a wearable mounting member (3), a first heat conducting member (4) and a second heat conducting member (5); The circuit board (2) and the first heat-conducting member (4) are located in the device housing (1), and the wearable mounting member (3) is connected to the device housing (1); The wearable mounting member (3) carries the second heat-conducting member (5), and the first heat-conducting member (4) is connected to or in contact with the second heat-conducting member (5).
2. The wearable device according to claim 1, characterized in that: The first heat-conducting member (4) comprises two first sub-heat-conducting layers (41), and the two first sub-heat-conducting layers (41) are respectively located on two sides of the board surface of the circuit board (2).
3. The wearable device according to claim 2, characterized in that: The two first sub-heat-conducting layers (41) gradually converge in a direction extending toward the second heat-conducting member (5), and continue to extend until they are connected to or in contact with the second heat-conducting member (5).
4. The wearable device according to any one of claims 1 to 3, characterized in that: The wearable mounting member (3) has a hollow chamber (31), and the second heat conducting member (5) is located in the hollow chamber (31).
5. The wearable device according to any one of claims 1 to 3, characterized in that: The wearable mounting member (3) has a mounting groove (32), and the second heat conducting member (5) is located in the mounting groove (32).
6. The wearable device according to claim 5, characterized in that: The two opposite sides of the wearable mounting member (3) are respectively provided with the mounting grooves (32); the second heat-conducting member (5) comprises two second sub-heat-conducting members (51), and one second sub-heat-conducting member (51) is installed in each of the mounting grooves (32).
7. The wearable device according to any one of claims 1 to 3 and 6, characterized in that: The wearable mounting piece (3) and the device housing (1) are integrated.
8. The wearable device according to any one of claims 2 to 3, characterized in that: The wearable device further comprises a shielding cover (6), wherein the shielding cover (6) is mounted on a first side of the circuit board (2), and a first sub-heat-conducting layer (41) is located on a side of the shielding cover (6) away from the circuit board (2).
9. The wearable device according to claim 8, characterized in that: The wearable device further comprises an insulating adhesive backing (7), wherein the insulating adhesive backing (7) is arranged on a second side of the circuit board (2), the second side being opposite to the first side; Another of the first heat-conducting sub-layers (41) is located on a side of the insulating adhesive (7) away from the circuit board (2).
10. The wearable device according to any one of claims 1-3, 6 and 9, characterized in that: The first heat conducting member (4) and / or the second heat conducting member (5) is copper foil.
11. The wearable device according to any one of claims 1 to 3, 6 and 9, characterized in that: The wearable mounting member (3) comprises a first sub-mounting member (33) and a second sub-mounting member (34), wherein the first sub-mounting member (33) and the second sub-mounting member (34) are respectively located on two opposite sides of the device housing (1); The first sub-mounting component (33) and the second sub-mounting component (34) respectively carry the second heat conducting component (5).
