Piezoelectric heat dissipation mechanism, heat dissipation device and embedded equipment

Abstract

The utility model provides a piezoelectric heat dissipation mechanism, a heat dissipation device and embedded equipment. The piezoelectric heat dissipation mechanism comprises a piezoelectric crystal, a diaphragm and a fan blade disc, the diaphragm and the fan blade disc are fixedly connected with the piezoelectric crystal, the edge of the diaphragm and the edge of the fan blade disc extend out of the edge of the piezoelectric crystal, and the edge of the fan blade disc is in a suspended state; the diaphragm is used for vibrating along with vibration of the piezoelectric crystal so as to give out sound of a preset frequency, and the fan blade disc is used for vibrating along with vibration of the piezoelectric crystal so as to accelerate flowing of surrounding air. According to the utility model, the heat dissipation efficiency of the embedded equipment can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a piezoelectric radiator mechanism, a radiator device and an embedded device. Background Art

[0002] As modern industrial production continues to increase the computing power of embedded devices, the required processor power is also increasing, which makes the heating problem of embedded devices more prominent. If the embedded devices cannot be effectively cooled, the performance and life of the embedded devices will be greatly affected.

[0003] In addition, due to the restrictions on the size of embedded devices in the installation environment, most embedded devices do not install traditional cooling fans. The main reason is that traditional cooling fans are not only large in size, but also occupy most of the space of the embedded device, which is not conducive to the application of embedded devices to devices with small installation space. At the same time, the cooling fan also needs to rely on an electric motor to drive the fan blades to rotate, which is easy to cause electromagnetic interference to the components inside the embedded device.

[0004] In order to solve the heat dissipation problem of embedded devices, embedded devices will use natural convection to dissipate heat, but the heat dissipation efficiency of natural convection is low and will still limit the performance of embedded devices. Utility Model Content

[0005] To solve the above problems, the piezoelectric heat dissipation mechanism, heat dissipation device and embedded device provided by the utility model drive the diaphragm and the fan blade disk to vibrate through the vibration of the piezoelectric crystal, so that the fan blade disk can accelerate the flow of surrounding air when vibrating, thereby improving the heat dissipation efficiency of the embedded device.

[0006] In a first aspect, the utility model provides a piezoelectric heat dissipation mechanism, the piezoelectric heat dissipation mechanism comprising: a piezoelectric crystal, a diaphragm and a fan blade disk;

[0007] The diaphragm and the fan blade disk are both fixedly connected to the piezoelectric crystal, the edges of the diaphragm and the edges of the fan blade disk extend beyond the edges of the piezoelectric crystal, and the edge of the fan blade disk is in a suspended state;

[0008] The diaphragm is used to vibrate with the vibration of the piezoelectric crystal to emit sound of a preset frequency, and the fan blade disk is used to vibrate with the vibration of the piezoelectric crystal to speed up the flow of surrounding air.

[0009] Optionally, the piezoelectric heat dissipation mechanism further includes: a connecting column;

[0010] One end of the connecting column is fixedly connected to the fan blade disk, and the other end of the connecting column is fixedly connected to the piezoelectric crystal.

[0011] Optionally, the diaphragm and the fan disk are located on the same side of the piezoelectric crystal.

[0012] Optionally, the diaphragm is located on the side of the fan disk facing the piezoelectric crystal, a through hole is provided on the diaphragm, the other end of the connecting column passes through the diaphragm through the through hole, the diaphragm and the connecting column are gap-matched, and the diaphragm fits the piezoelectric crystal.

[0013] Optionally, the connecting column is coaxial with the impeller disk, and the diaphragm is coaxial with the connecting column.

[0014] Optionally, the piezoelectric heat dissipation mechanism further includes: a substrate;

[0015] A concave groove is formed on the surface of the substrate, the piezoelectric crystal is located in the concave groove, and the edge of the diaphragm is fixedly connected to the substrate;

[0016] A heat insulation pad is arranged on the side of the piezoelectric crystal facing away from the diaphragm.

[0017] Optionally, an annular protrusion is provided on the diaphragm, and the annular protrusion is located on the outer peripheral side of the piezoelectric crystal.

[0018] In a second aspect, the utility model provides a heat dissipation device, comprising: a bottom plate, heat dissipation fins and a piezoelectric heat dissipation mechanism as described in any one of the above items, a plurality of heat dissipation fins are fixed on the surface of the bottom plate, and the piezoelectric heat dissipation mechanism is fixedly arranged on the bottom plate or the heat dissipation fins;

[0019] The fan disk is also used to vibrate with the vibration of the piezoelectric crystal to speed up the flow of air between the multiple heat sink fins.

[0020] Optionally, a plurality of heat dissipation fins are recessed toward the bottom plate to form a device cavity, and the piezoelectric heat dissipation mechanism is located in the device cavity.

[0021] Optionally, the cross-section of the device cavity along a direction perpendicular to the bottom plate is a trapezoidal shape that is narrow at the bottom and wide at the top.

[0022] In a third aspect, the utility model provides an embedded device, comprising: a chassis and a heat dissipation device as described in any one of the above items, wherein the heat dissipation device is fixedly connected to the chassis.

[0023] Optionally, the embedded device further includes: a signal processing chip;

[0024] The signal processing chip is electrically connected to the piezoelectric crystal;

[0025] The signal processing chip is used to output a pulse signal so that the piezoelectric crystal drives the fan blade disk to vibrate according to the pulse signal, and converts the received audio signal into an alternating electrical signal so that the piezoelectric crystal drives the diaphragm to vibrate according to the alternating electrical signal, causing the diaphragm to emit a sound corresponding to the audio signal.

[0026] The piezoelectric heat dissipation mechanism, heat dissipation device and embedded device provided by the embodiments of the utility model can connect the diaphragm and the fan blade disk with the piezoelectric crystal so that the piezoelectric crystal can drive the diaphragm and the fan blade disk to vibrate together when vibrating, so that the fan blade disk can accelerate the flow of surrounding air when vibrating, thereby improving the heat dissipation efficiency of the embedded device installed with the piezoelectric heat dissipation mechanism, and the vibration of the diaphragm can be converted into sound waves of a preset frequency, that is, sound audible to the human ear, so that the piezoelectric heat dissipation mechanism can play voice, such as playing the heat dissipation status of the current embedded device or playing a reminder voice, etc., making the function of the piezoelectric heat dissipation mechanism more diversified. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 is a schematic cross-sectional view of a piezoelectric heat dissipation mechanism according to an embodiment of the present application;

[0029] Figure 2 A schematic exploded view of an embedded device according to an embodiment of the present application;

[0030] Figure 3 This is a schematic structural diagram of a rectangular fan blade disk according to an embodiment of the present application;

[0031] Figure 4 This is a schematic structural diagram of a clover-shaped impeller disk according to an embodiment of the present application;

[0032] Figure 5 This is a schematic structural diagram of a cross-shaped impeller disk according to an embodiment of the present application;

[0033] Figure 6 is a schematic structural diagram of a diaphragm according to an embodiment of the present application;

[0034] Figure 7 is a schematic cross-sectional view of a heat dissipation device according to an embodiment of the present application;

[0035] Figure 8 A schematic circuit diagram of a signal processing chip according to an embodiment of the present application.

[0036] Reference numerals:

[0037] 1. Piezoelectric crystal; 2. Diaphragm; 21. Through hole; 22. Annular protrusion; 3. Fan blade disk; 4. Connecting column; 5. Base; 51. Recessed groove; 61. Bottom plate; 62. Heat sink fin; 63. Device cavity; 64. Support platform; 71. Chassis; 72. Signal processing chip. DETAILED DESCRIPTION

[0038] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0040] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," and the like may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, an element or feature described as "under other elements" or "under it" or "under it" will be oriented as being "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0041] It should be noted that when an element is referred to as being "fixedly connected" to another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be a central element at the same time. In contrast, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0042] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" etc. specify the presence of stated features, wholes, steps, operations, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.

[0043] In the first aspect, an embodiment of the present invention provides a piezoelectric heat dissipation mechanism, see Figure 1 and Figure 2 The piezoelectric heat dissipation mechanism includes: a piezoelectric crystal 1, a diaphragm 2 and a fan blade disk 3.

[0044] The diaphragm 2 and the blade disk 3 are both fixedly connected to the piezoelectric crystal 1. The edges of the diaphragm 2 and the blade disk 3 extend beyond the edges of the piezoelectric crystal 1, and the edge of the blade disk 3 is suspended. The diaphragm 2 is used to vibrate with the vibration of the piezoelectric crystal 1 to emit a sound of a preset frequency, and the blade disk 3 is used to vibrate with the vibration of the piezoelectric crystal 1 to accelerate the flow of surrounding air.

[0045] See also Figure 3 , Figure 4 and Figure 5 , the shape of the diaphragm 2 is circular or a regular polygon, the shape of the piezoelectric crystal 1 is circular or rectangular, and the shape of the blade disk 3 is circular, rectangular, clover-shaped or cross-shaped. In this embodiment, the diaphragm 2, the piezoelectric crystal 1 and the blade disk 3 are all circular structures, and the diaphragm 2, the piezoelectric crystal 1 and the blade disk 3 are coaxial.

[0046] It should be noted that the diaphragm 2 and the blade disk 3 can be fixedly connected to the piezoelectric crystal 1 by adhesive, screws, top pressure pieces or clamps; the diaphragm 2 and the blade disk 3 can be located on the same side of the piezoelectric crystal 1, or on the opposite sides of the piezoelectric crystal 1. When the diaphragm 2 and the blade disk 3 are located on the opposite sides of the piezoelectric crystal 1, the diaphragm 2 and the blade disk 3 are respectively fitted with the corresponding surfaces of the piezoelectric crystal 1. When the diaphragm 2 and the blade disk 3 are located on the same side of the piezoelectric crystal 1, the diaphragm 2 can be located on the side of the blade disk 3 facing the piezoelectric crystal 1, or on the side of the blade disk 3 away from the piezoelectric crystal 1.

[0047] When the diaphragm 2 is located on the side of the blade disk 3 away from the piezoelectric crystal 1, the diaphragm 2 can be fixedly connected to the piezoelectric crystal 1 through at least one vibration transmission member through the blade disk 3. At the same time, a reinforcement ring is fixedly arranged around the diaphragm 2, and the reinforcement ring is connected to a support frame to fix the diaphragm 2 in a corresponding position. Among them, the support frame and the blade disk 3 do not interfere with each other in spatial position, and this embodiment does not make specific limitations on this.

[0048] In this embodiment, the diaphragm 2 and the blade disk 3 are both located on the upper side of the piezoelectric crystal 1, and the blade disk 3 is located on the upper side of the diaphragm 2. Figure 1 The piezoelectric heat dissipation mechanism also includes: a connecting column 4.

[0049] The connecting column 4 is coaxial with the fan blade disk 3, one end of the connecting column 4 is fixedly connected to the fan blade disk 3 by adhesive or screws, and the other end of the connecting column 4 is fixedly connected to the piezoelectric crystal 1 by adhesive or screws. Figure 1 and Figure 6 The diaphragm 2 has a through hole 21 at its center. The other end of the connecting post 4 passes through the diaphragm 2 through the through hole 21. The diaphragm 2 and the connecting post 4 are gap-matched. The diaphragm 2 and the fan blade disk 3 are spaced apart in the vertical direction. The diaphragm 2 fits the piezoelectric crystal 1.

[0050] In this embodiment, the connecting column 4 is fixedly connected to the fan blade disc 3 and the piezoelectric crystal 1 respectively by adhesive; the diaphragm 2 is fixedly connected to the piezoelectric crystal 1 by adhesive; the edge of the fan blade disc 3 extends out of the edge of the diaphragm 2. It should be noted that during the vibration of the fan blade disc 3, it is mainly the area where the fan blade disc 3 extends out of the diaphragm 2 that vibrates greatly to accelerate the flow of air.

[0051] Specifically, the fan blade disc 3 is made of a material with good flexibility such as Mylar sheet or metal sheet, and the amplitude at the edge is much greater than the amplitude at the center, so as to effectively fan the surrounding air flow.

[0052] An annular protrusion 22 is provided on the diaphragm 2. The annular protrusion 22 is located on the outer peripheral side of the piezoelectric crystal 1 and is coaxial with the through hole 21. The single-side cross-sectional shape of the annular protrusion 22 is semicircular. By providing the annular protrusion 22, the deformation amount of the diaphragm 2 can be increased, which is conducive to extending the service life of the diaphragm 2.

[0053] Furthermore, the piezoelectric heat dissipation mechanism further includes a substrate 5 . A concave groove 51 is formed on the upper surface of the substrate 5 , the piezoelectric crystal 1 is fixedly located in the concave groove 51 , and the edge of the diaphragm 2 is fixedly connected to the substrate 5 .

[0054] The piezoelectric crystal 1 can be fixedly connected to the base 5 via a shock-absorbing pad. In this embodiment, the base 5 and the concave groove 51 are both circular in shape; the bottom surface of the piezoelectric crystal 1 is directly fixedly connected to the base 5 via an adhesive; and the diaphragm 2 is adapted to the opening of the concave groove 51.

[0055] In an optional embodiment, a thermal insulation pad is provided on the side of the piezoelectric crystal 1 facing away from the diaphragm 2. The thermal insulation pad can be located in the recessed groove 51, and the piezoelectric crystal 1 is fixedly connected to the substrate 5 through the thermal insulation pad, or through the thermal insulation pad and the shock-absorbing pad. Similarly, the thermal insulation pad can also be located on the lower side of the substrate 5 and fixedly connected to the substrate 5. In this optional embodiment, the thermal insulation pad is located on the lower side of the substrate 5 and fixedly connected to the substrate 5 by an adhesive.

[0056] By providing the heat insulation pad, after the piezoelectric heat dissipation mechanism is installed on the heat dissipation device, it is possible to effectively prevent the embedded device from generating high temperature and affecting the life of the piezoelectric crystal 1 and the diaphragm 2.

[0057] The piezoelectric heat dissipation mechanism provided in this embodiment has a simple and compact structure and can accelerate the flow rate of the surrounding air without a motor, thereby improving the heat dissipation efficiency of the embedded device installed with the piezoelectric heat dissipation mechanism, and the vibration of the diaphragm 2 can be converted into sound waves of a preset frequency, that is, sound audible to the human ear. In this way, the piezoelectric heat dissipation mechanism can play voice, such as playing the heat dissipation status of the current embedded device or playing a reminder voice, etc., realizing the function of a speaker, making the function of the piezoelectric heat dissipation mechanism more diversified.

[0058] In a second aspect, an embodiment of the present invention provides a heat dissipation device, Figure 1 , Figure 2 and Figure 7 The heat dissipation device includes: a bottom plate 61, heat dissipation fins 62 and the piezoelectric heat dissipation mechanism in the first aspect. A plurality of heat dissipation fins 62 are fixed on the surface of the bottom plate 61, and the piezoelectric heat dissipation mechanism is fixedly arranged on the bottom plate 61 or the heat dissipation fins 62; the fan blade disk 3 is also used to vibrate with the vibration of the piezoelectric crystal 1 to accelerate the flow of air between the plurality of heat dissipation fins 62.

[0059] Specifically, a plurality of heat dissipation fins 62 are arranged at equal intervals on the upper surface of the bottom plate 61 . The piezoelectric heat dissipation mechanism may be located on one side of the plurality of heat dissipation fins 62 , or may be located inside the plurality of heat dissipation fins 62 .

[0060] In this embodiment, the piezoelectric heat dissipation mechanism is located inside the plurality of heat dissipation fins 62. Specifically, the plurality of heat dissipation fins 62 are cut to form a device cavity 63, and the piezoelectric heat dissipation mechanism is located inside the device cavity 63.

[0061] The bottom of the device cavity 63 may be formed by the heat dissipation fins 62 or by the bottom plate 61. It is understandable that when the bottom of the device cavity 63 is formed by the heat dissipation fins 62, the piezoelectric heat dissipation mechanism is fixedly arranged on the heat dissipation fins 62; when the bottom of the device cavity 63 is formed by the bottom plate 61, the piezoelectric heat dissipation mechanism is fixedly arranged on the bottom plate 61.

[0062] In this embodiment, the bottom of the device cavity 63 is formed by heat dissipation fins 62. Meanwhile, the heat dissipation fins 62 forming the bottom of the device cavity 63 are filled with dielectric material to form a support platform 64 adapted to the substrate 5, on which the substrate 5 is fixedly disposed.

[0063] Furthermore, the cross section of the device cavity 63 along the direction perpendicular to the bottom plate 61 is an isosceles trapezoidal shape that is narrow at the bottom and wide at the top. The minimum diameter of the device cavity 63 is 2 to 3 mm larger than the diameter of the fan blade disk 3. By limiting the device cavity 63 to an isosceles trapezoidal shape that is narrow at the bottom and wide at the top, the wind generated by the vibration of the fan blade disk 3 can evenly enter the gap formed by the multiple heat dissipation fins 62, avoiding the generation of eddies in the device cavity 63 and affecting the flow of wind in the gap.

[0064] The heat dissipation device provided in this embodiment has a simple structure, and the heat dissipation efficiency of the heat dissipation fins 62 is effectively improved by installing a piezoelectric heat dissipation mechanism.

[0065] In a third aspect, an embodiment of the present utility model provides an embedded device, see Figure 1 and Figure 2 The embedded device includes: a chassis 71 and a heat dissipation device as in the second aspect, and the heat dissipation device is fixedly connected to the chassis 71.

[0066] Specifically, the bottom plate 61 in the heat dissipation device and the chassis 71 together form the housing of the embedded device. In this embodiment, the bottom plate 61 is used as the top cover of the embedded device, but it is not limited thereto.

[0067] Furthermore, the embedded device further includes: a signal processing chip 72. The signal processing chip 72 is electrically connected to the piezoelectric crystal 1; the signal processing chip 72 is used to output a pulse signal so that the piezoelectric crystal 1 drives the fan blade disk 3 to vibrate according to the pulse signal, converts the received audio signal into an alternating electrical signal, so that the piezoelectric crystal 1 drives the diaphragm 2 to vibrate according to the alternating electrical signal, and causes the diaphragm 2 to emit a sound corresponding to the audio signal.

[0068] In this embodiment, the signal processing chip 72 is a DSP (digital signal processing) chip. Specifically, the chassis 71 is provided with high-power devices, including a CPU (central processing unit), a GPU (graphics processing unit) and a MOS tube (metal-oxide semiconductor field effect transistor). The high-power device conducts the heat generated by itself to the heat dissipation device by means of a temperature plate and a heat pipe.

[0069] When the temperature of the high-power device or mainboard in the chassis 71 exceeds the set value, the piezoelectric crystal 1 starts to be powered on. Among them, the input voltage and frequency of the piezoelectric crystal 1 are related to the temperature of the heat sink, and the amplitude and vibration frequency of the fan blade disk 3 are respectively related to the input voltage and frequency of the piezoelectric crystal 1. The higher the temperature of the heat sink, the faster the amplitude and vibration frequency of the fan blade disk 3. In addition, the input voltage and frequency of the piezoelectric crystal 1 are related to the temperature of the high-power device or mainboard. The higher the temperature of the high-power device or mainboard, the higher the voltage and frequency need to be applied to the piezoelectric crystal 1, so that the piezoelectric crystal 1 has a higher amplitude and frequency. Since the fan blade disk 3 is rigidly connected to the piezoelectric crystal 1 in structure, the fan blade disk 3 will fan with a larger amplitude and frequency at this time to ensure that the temperature of the high-power device or mainboard is within the specified operating temperature range.

[0070] At the same time, when the temperature of the high-power device or the mainboard reaches the threshold, the piezoelectric heat dissipation mechanism can also issue an alarm, such as alerting relevant technical personnel to perform operation and maintenance. Voice broadcasting can also be performed when the device temperatures in the chassis 71 are normal. Specifically, if the embedded device is used in public places, such as subway gates, the piezoelectric heat dissipation mechanism can prompt the visually impaired and other people to perform relevant operations through its own speaker function; for another example, if the embedded device is used at a cash register, the piezoelectric heat dissipation mechanism can use its own speaker function to broadcast how much money should be collected and how much money is actually collected.

[0071] In an optional embodiment, when the heat dissipation of the embedded device is less than the heat generation, when the temperature of any component in the embedded device reaches a threshold, an alarm module in the embedded device will be triggered, and the alarm module will send an audio signal, which will be amplified by the audio power amplifier module in the embedded device until it can drive the piezoelectric crystal 1 to vibrate, thereby driving the diaphragm 2 to vibrate.

[0072] The implementation principle is as follows:

[0073] Combination Figure 8 , the positive and negative electrodes of piezoelectric crystal 1 are connected to pins 47 and 41 of the DSP chip respectively. Pin 12 is the power input to power the DSP chip. Pins 8 and 9 are used to receive microphone signals, and pins 10 and 11 are used to receive audio signals. Pins 18 and 19 communicate with the CPU via the USB (Universal Serial Bus) protocol, allowing the CPU to modify the program in the DSP chip. Pins 30 and 31 are used to communicate with the BIOS (Basic Input Output System) chip to obtain temperature information of high-power devices such as the CPU, hard disk, and the motherboard.

[0074] Based on this control circuit, DSP can monitor the temperature of high-power devices such as CPU, hard disk and motherboard in real time. When the temperature of high-power device or motherboard exceeds the set value, pin 47 will output a pulse voltage of 50-100kHz, and the piezoelectric crystal 1 will continue to vibrate under the action of the pulse voltage, and drive the fan blade disk 3 to vibrate, providing heat to the heat dissipation fins 62. If the temperature of high-power device or motherboard is higher, the frequency of CPU output pulse voltage will be higher, and the fan blade disk 3 will fan faster. Since the vibration frequency at this time is beyond the frequency received by human ears, the fan blade disk 35 basically does not generate vibration noise when fanning.

[0075] In addition, when the DSP chip detects that there is an audio signal input to pins 10 and 11, the signal is amplified by the built-in audio amplifier module and output to pin 47. Since the audio signal is an alternating electrical signal, the piezoelectric crystal 1 will vibrate with the change of the voltage of the electrical signal, and drive the diaphragm 2 to vibrate, so as to convert the electrical signal into sound for playback.

[0076] The embedded device provided in this embodiment has a compact structure and high space utilization. By installing a piezoelectric heat dissipation mechanism, the fan blade disk 3 can fan the surrounding air into the space formed by the heat dissipation fins 62. Compared with natural convection, the convection heat transfer coefficient is greatly improved, the heat transfer resistance of the heat dissipation device is reduced, and the heat dissipation performance of the embedded device is improved. The problem that the embedded device is difficult to meet the heat dissipation requirements by natural convection alone is solved, and the function of the traditional speaker is realized at the same time.

[0077] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", "ideal embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0078] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0079] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A piezoelectric heat dissipation mechanism, characterized in that: The piezoelectric heat dissipation mechanism comprises: a piezoelectric crystal, a diaphragm and a fan blade disk; The diaphragm and the fan blade disk are both fixedly connected to the piezoelectric crystal, the edges of the diaphragm and the edges of the fan blade disk extend beyond the edges of the piezoelectric crystal, and the edges of the fan blade disk are in a suspended state; The diaphragm is used to vibrate along with the vibration of the piezoelectric crystal to emit a sound of a preset frequency, and the fan blade disk is used to vibrate along with the vibration of the piezoelectric crystal to accelerate the flow of surrounding air.

2. The piezoelectric heat dissipation mechanism according to claim 1, characterized in that: The piezoelectric heat dissipation mechanism further includes: a connecting column; One end of the connecting column is fixedly connected to the fan blade disk, and the other end of the connecting column is fixedly connected to the piezoelectric crystal.

3. The piezoelectric heat dissipation mechanism according to claim 2, characterized in that: The diaphragm and the fan blade disk are located on the same side of the piezoelectric crystal.

4. The piezoelectric heat dissipation mechanism according to claim 3, characterized in that: The diaphragm is located on the side of the fan disk facing the piezoelectric crystal. A through hole is provided on the diaphragm. The other end of the connecting column passes through the diaphragm through the through hole. The diaphragm and the connecting column are loosely matched, and the diaphragm is in contact with the piezoelectric crystal.

5. The piezoelectric heat dissipation mechanism according to claim 4, characterized in that: The connecting column is coaxial with the fan blade disk, and the diaphragm is coaxial with the connecting column.

6. The piezoelectric heat dissipation mechanism according to claim 4, characterized in that: The piezoelectric heat dissipation mechanism further includes: a substrate; A concave groove is formed on the surface of the substrate, the piezoelectric crystal is located in the concave groove, and the edge of the diaphragm is fixedly connected to the substrate; A heat insulation pad is arranged on the side of the piezoelectric crystal facing away from the diaphragm.

7. The piezoelectric heat dissipation mechanism according to any one of claims 1 to 6, characterized in that: The diaphragm is provided with an annular protrusion, and the annular protrusion is located on the outer peripheral side of the piezoelectric crystal.

8. A heat dissipation device, characterized in that: The heat dissipation device comprises: a bottom plate, heat dissipation fins and a piezoelectric heat dissipation mechanism as claimed in any one of claims 1 to 7, a plurality of the heat dissipation fins are fixed on the surface of the bottom plate, and the piezoelectric heat dissipation mechanism is fixedly arranged on the bottom plate or the heat dissipation fins; The fan blade disk is also used to vibrate along with the vibration of the piezoelectric crystal to speed up the flow of air between the plurality of heat dissipation fins.

9. The heat dissipation device according to claim 8, characterized in that: The plurality of heat dissipation fins are recessed toward the bottom plate to form a device cavity, and the piezoelectric heat dissipation mechanism is located in the device cavity.

10. The heat dissipation device according to claim 9, characterized in that: The cross section of the device cavity along the direction perpendicular to the bottom plate is a trapezoidal shape that is narrow at the bottom and wide at the top.

11. An embedded device, characterized in that: The embedded device comprises: a chassis and a heat dissipation device according to any one of claims 8 to 10, wherein the heat dissipation device is fixedly connected to the chassis.

12. The embedded device according to claim 11, characterized in that: The embedded device further includes: a signal processing chip; The signal processing chip is electrically connected to the piezoelectric crystal; The signal processing chip is used to output a pulse signal so that the piezoelectric crystal drives the fan blade disk to vibrate according to the pulse signal, and converts the received audio signal into an alternating electrical signal so that the piezoelectric crystal drives the diaphragm to vibrate according to the alternating electrical signal, and the diaphragm emits a sound corresponding to the audio signal.

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