Polishing pad for wafer polishing

Abstract

The utility model discloses a polishing pad for wafer polishing, which relates to the technical field of polishing pads and comprises a base plate, an elastic layer is mounted on the upper side of the base plate, a polishing layer is mounted on the upper side of the elastic layer, a sponge layer is mounted on the upper side of the polishing layer, and a frosted layer is mounted on one side of the sponge layer. A plurality of sliding grooves are formed in the surface of the base plate, sliding blocks are slidably installed on the inner walls of the sliding grooves, scraping blocks are installed on the upper sides of the sliding blocks, a plurality of first avoiding grooves are formed in the upper side of the elastic layer, and a plurality of second avoiding grooves are formed in the polishing layer. According to the device, the pull block is pulled, the pull block drives the connecting rods to move at the same time, the connecting rods drive the corresponding sliding blocks to slide, the sliding blocks drive the corresponding scraping blocks to move, the scraping blocks are driven by the sliding blocks to move, the scraping blocks are driven by the sliding blocks to move, the scraping blocks are driven by the sliding blocks to move, and the scraping blocks are driven by the sliding blocks to move. And the baffle, the second avoiding groove of the polishing layer and the first avoiding groove of the elastic layer are scraped and cleaned, and the effect of facilitating cleaning is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of polishing pads, in particular to a polishing pad for wafer polishing. Background Art

[0002] Polishing pads, also known as polishing leather, polishing cloth or polishing sheets, are usually made of hard porous polyurethane foam with narrow high-aspect ratio groove patterns. They are mainly used to achieve flattening polishing of silicon wafers, metals, ceramics and other materials. In the process of crystal processing, in order to make the crystal surface smoother and brighter, polishing pads are needed for processing.

[0003] In the prior art, such as publication number CN215547806U, a polishing pad for polishing a single wafer is disclosed, which includes the field of single wafer processing technology. The key points of its technical solution are that it includes a polishing layer, one side of the polishing layer is provided with radially distributed grooves, the side of the groove away from the center of the polishing layer penetrates the polishing layer, and the side of the polishing layer close to the groove is sprayed with a frosted layer, and the frosted layer is located in the area surrounded by two adjacent grooves. The effect is that by setting the frosted layer, the surface of the object is polished using the frosted layer, so that only the frosted layer is worn each time, and only frosted particles need to be sprayed each time, which greatly improves the service life of the polishing pad.

[0004] However, the device still has some problems. The surface of an object is polished by a frosted layer, which gradually becomes thinner during the polishing process, so that only the frosted layer is consumed, thereby extending the service life of the polishing pad. However, the frosted layer will fall off from the polishing pad during use, and the detached fine sand will remain in the groove. Since the groove is small, it is difficult to clean it. Therefore, we disclose a polishing pad for wafer polishing to meet people's needs. Utility Model Content

[0005] The purpose of the present application is to provide a polishing pad for wafer polishing, so as to solve the problem in the background art that the abrasive sand will be detached from the polishing pad during use, and the detached fine sand will remain in the groove, which is difficult to clean due to its small size.

[0006] To achieve the above-mentioned objectives, the present application provides the following technical solutions: a polishing pad for wafer polishing, comprising a chassis, an elastic layer is installed on the upper side of the chassis, a polishing layer is installed on the upper side of the elastic layer, a sponge layer is installed on the upper side of the polishing layer, a frosting layer is installed on one side of the sponge layer, a plurality of slide grooves are provided on the surface of the chassis, sliding blocks are slidably installed on the inner walls of a plurality of the slide grooves, scraping blocks are installed on the upper sides of a plurality of the sliding blocks, a plurality of first avoidance grooves are provided on the upper side of the elastic layer, a plurality of second avoidance grooves are provided on the polishing layer, a plurality of scraping blocks correspond to a plurality of the second avoidance grooves, and a convergence unit is rotatably installed on the lower sides of a plurality of the sliding blocks.

[0007] Preferably, the bunching unit comprises a plurality of connecting rods, and the plurality of connecting rods are rotatably mounted on the lower sides of the plurality of sliding blocks, and the same pulling block is rotatably mounted on the opposite ends of the plurality of connecting rods.

[0008] Preferably, a first mounting hole is provided on the surface of the chassis, a second mounting hole is provided on the surface of the elastic layer, a third mounting hole is provided on the surface of the polishing layer, a screw is installed in the first mounting hole, a first rubber ring is installed on one side of the screw, and a second rubber ring is installed on the other side of the screw.

[0009] Preferably, a plurality of baffles are installed on the surface of the polishing layer, and the baffles are matched with the scraping blocks.

[0010] In summary, the technical effects and advantages of the utility model are:

[0011] 1. In the utility model, by pulling the pulling block, the pulling block drives a plurality of connecting rods to move at the same time, the plurality of connecting rods drive their respective sliding blocks to slide, and the plurality of sliding blocks drive their respective scraping blocks to move, so as to scrape and clean the baffle plate, the second avoidance groove of the polishing layer and the first avoidance groove of the elastic layer, thereby achieving the effect of easy cleaning.

[0012] 2. In the utility model, by providing a sponge layer, the sponge layer can absorb moisture before polishing, and can provide moisture during the polishing process, thereby preventing the problem of spark splashing and improving the safety of polishing. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0014] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0015] Figure 2 It is a schematic diagram of the explosion structure of the utility model;

[0016] Figure 3 This is a schematic diagram of the chassis of the utility model and its related structures;

[0017] Figure 4 It is a structural schematic diagram of the spiral tube of the utility model.

[0018] In the figure: 1, chassis; 2, elastic layer; 3, polishing layer; 4, sponge layer; 5, frosted layer; 6, baffle; 7, screw tube; 8, sliding block; 9, scraper block; 10, connecting rod; 11, pull block; 12, first rubber ring; 13, second rubber ring. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Example: Reference Figure 1-4 A polishing pad for wafer polishing shown in the figure comprises a chassis 1, an elastic layer 2 is installed on the upper side of the chassis 1, a polishing layer 3 is installed on the upper side of the elastic layer 2, a sponge layer 4 is installed on the upper side of the polishing layer 3, a frosting layer 5 is installed on one side of the sponge layer 4, a plurality of slide grooves are provided on the surface of the chassis 1, sliding blocks 8 are slidably installed on the inner walls of the plurality of slide grooves, scraping blocks 9 are installed on the upper sides of the plurality of sliding blocks 8, a plurality of first avoidance grooves are provided on the upper side of the elastic layer 2, a plurality of second avoidance grooves are provided on the polishing layer 3, a plurality of scraping blocks 9 correspond to the plurality of second avoidance grooves, and a convergence unit is rotatably installed on the lower sides of the plurality of sliding blocks 8.

[0021] Based on the above structure, the chassis 1 is a hard iron chassis 1, which is convenient for subsequent installation. The main raw material of the elastic layer 2 is soft plastic material. The polishing layer 3 is used to install the sponge layer 4. The sponge layer 4 is hard but can absorb cooling water. The frosted layer 5 is a loss layer and can be re-sprayed after loss. It is consistent with the technology used in the above-mentioned reference documents. When using it, first install the polishing pad on the polishing disk. Before polishing, the sponge layer 4 can absorb moisture, and the frosted layer 5 is polished close to the wafer that needs to be polished. During the polishing process, the elastic layer 2 can make the frosted layer 5 close to the uneven position of the wafer surface, and then it is polished by the frosted layer 5. After the polishing is completed, the convergence unit can drive several sliding blocks 8, and the sliding blocks 8 drive the scraper 9 for cleaning.

[0022] Example 1

[0023] like Figure 2 and 3As shown, the convergence unit includes a plurality of connecting rods 10, which are rotatably installed on the lower sides of a plurality of sliding blocks 8, and the opposite ends of the plurality of connecting rods 10 are rotatably installed with the same pulling block 11, and a plurality of baffles 6 are installed on the surface of the polishing layer 3, and the baffles 6 are adapted to the scraping blocks 9. The connecting rods 10 are radially arranged and a pulling block 11 is installed at the center position. When cleaning is required, the polishing pad needs to be removed first to facilitate pulling the pulling block 11. At the same time, during the polishing process of the polishing pad, the sliding block 8 will always fit the inner wall of the slide groove due to the centrifugal force, and will not be lifted or displaced. When the pulling block 11 is pulled, the pulling block 11 drives the plurality of connecting rods 10 to move at the same time, and the plurality of connecting rods 10 drive their respective sliding blocks 8 to slide respectively, and the plurality of sliding blocks 8 drive their respective scraping blocks 9 to move, so as to scrape and clean the baffle 6, the second avoidance groove of the polishing layer 3 and the first avoidance groove of the elastic layer 2, thereby achieving the effect of easy cleaning.

[0024] Example 2

[0025] like Figure 2 and 4 As shown, a first mounting hole is provided on the surface of the chassis 1, a second mounting hole is provided on the surface of the elastic layer 2, a third mounting hole is provided on the surface of the polishing layer 3, a screw tube 7 is installed in the first mounting hole, a first rubber ring 12 is installed on one side of the screw tube 7, and a second rubber ring 13 is installed on the other side of the screw tube 7. A thread is provided on the inner wall of the screw tube 7 to cooperate with bolts to mount the polishing pad on the grinding disc for use. A first rubber ring 12 is provided on one side of the screw tube 7, and a second rubber ring 13 is provided on the other side of the screw tube 7 to facilitate improving the fit of the installation. The pull block 11 is sleeved on the surface of the screw tube 7 after installation, which is convenient for limiting the pull block 11.

[0026] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A polishing pad for wafer polishing, comprising a base plate (1), characterized in that: An elastic layer (2) is installed on the upper side of the chassis (1), a polishing layer (3) is installed on the upper side of the elastic layer (2), a sponge layer (4) is installed on the upper side of the polishing layer (3), and a frosting layer (5) is installed on one side of the sponge layer (4). A plurality of sliding grooves are provided on the surface of the chassis (1), and sliding blocks (8) are slidably installed on the inner walls of the plurality of sliding grooves. Scraping blocks (9) are installed on the upper sides of the plurality of sliding blocks (8). A plurality of first avoidance grooves are provided on the upper side of the elastic layer (2), and a plurality of second avoidance grooves are provided on the polishing layer (3). The plurality of scraping blocks (9) correspond to the plurality of second avoidance grooves, and a convergence unit is rotatably installed on the lower sides of the plurality of sliding blocks (8).

2. The polishing pad for wafer polishing according to claim 1, characterized in that: The bunching unit comprises a plurality of connecting rods (10), wherein the plurality of connecting rods (10) are rotatably mounted on the lower sides of the plurality of sliding blocks (8), and the opposite ends of the plurality of connecting rods (10) are rotatably mounted with the same pulling block (11).

3. The polishing pad for wafer polishing according to claim 1, characterized in that: A first mounting hole is provided on the surface of the chassis (1), a second mounting hole is provided on the surface of the elastic layer (2), and a third mounting hole is provided on the surface of the polishing layer (3). A screw tube (7) is installed in the first mounting hole, a first rubber ring (12) is installed on one side of the screw tube (7), and a second rubber ring (13) is installed on the other side of the screw tube (7).

4. The polishing pad for wafer polishing according to claim 1, characterized in that: A plurality of baffles (6) are installed on the surface of the polishing layer (3), and the baffles (6) are matched with the scraping blocks (9).

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