Laser projection equipment

Abstract

The embodiment of the utility model provides laser projection equipment, and relates to the technical field of projection. The laser projection device comprises: a support frame; the optical engine is supported on the supporting frame; the optical engine comprises a laser light source, a display chip and a lens, the laser light source and the display chip extend in the height direction of the optical engine and are located on the left side and the right side of the optical engine, and the lens is arranged on the front side of the display chip; the mainboard assembly is arranged at the top of the optical engine and connected to the supporting frame; the power panel is arranged between the mainboard assembly and the optical engine; the heat dissipation system comprises a first heat dissipation device, a second heat dissipation device, a third heat dissipation device and at least one heat dissipation fan; the first radiator, the second radiator and the third radiator are attached to the surfaces of the laser light source, the display chip and the power panel respectively. The cooling fan is arranged on the side, away from the lens, of the laser light source and the display chip. Different heat dissipation assemblies are designed for all the core assemblies, and efficient heat dissipation of the equipment is achieved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of projection technology, and in particular to a laser projection device. Background Art

[0002] Laser projection equipment has the advantages of high brightness, high definition, color accuracy and long life. Laser projection equipment is widely used in education and training, smart home, stage performances and other fields.

[0003] The core components of laser projection equipment include optical engine, mainboard, power board and other components. Among them, the laser in the optical engine will generate a lot of heat when generating laser light; the display chip of the optical engine receives the laser light emitted by the laser and needs to withstand heat radiation; the mainboard and power board also generate heat when working. If the internal heat dissipation of the laser projection equipment is not good, it will cause the laser to burn, the display chip to have bad pixels, and the mainboard and power board to burn out. These core components are usually designed with heat sinks to dissipate heat.

[0004] Since the radiator of the core component of the laser projection equipment is usually arranged in the central area of ​​the equipment, the cold air from the outside cannot directly exchange heat with the radiator of the cooling system, resulting in low heat exchange efficiency of the laser projection equipment and affecting the normal operation of the laser projection equipment. Utility Model Content

[0005] In view of the above problems, an embodiment of the present application provides a laser projection device, which has independent heat dissipation solutions designed for core components in different positions, thereby achieving efficient heat dissipation of the entire system and ensuring the safe operation of the laser projection device.

[0006] In order to achieve the above-mentioned purpose, the embodiment of the present application provides a laser projection device, including:

[0007] Support frame;

[0008] An optical engine is supported on a support frame; the optical engine includes a laser light source, a display chip and a lens, the laser light source and the display chip both extend along the height direction of the optical engine, and the laser light source and the display chip are located on the left and right sides of the optical engine, and the lens is arranged on the front side of the display chip;

[0009] A mainboard assembly is disposed on the top of the optical engine and connected to the support frame;

[0010] A power board, disposed between the mainboard assembly and the optical engine;

[0011] The heat dissipation system includes a first heat sink, a second heat sink, a third heat sink and at least one heat dissipation fan; the first heat sink is bonded to the surface of the laser light source, the second heat sink is bonded to the surface of the display chip, and the third heat sink is attached to the side of the power board away from the mainboard assembly; the heat dissipation fan is arranged on the side of the laser light source and the display chip away from the lens.

[0012] In some embodiments, the first heat sink includes a heat conducting plate, heat dissipation fins and a heat pipe, the heat conducting plate is attached to the surface of the laser light source, the heat dissipation fins are located on the side of the laser light source away from the lens, and the heat pipe is connected between the heat conducting plate and the heat dissipation fins;

[0013] The heat dissipation fan is arranged between the heat dissipation fins and the laser light source and the display chip.

[0014] In some embodiments, the side of the heat dissipation fins facing the lens is the air inlet side of the heat dissipation fins, and the side of the heat dissipation fins facing away from the lens is the air outlet side of the heat dissipation fins.

[0015] In some embodiments, the heat conducting plate is attached to a surface of the laser light source facing the lens.

[0016] In some embodiments, the heat dissipation fan abuts against a surface of the heat dissipation fin facing the lens.

[0017] In some embodiments, the second heat sink is attached to a surface of the display chip facing away from the lens;

[0018] The second heat sink includes a heat-conducting substrate and a plurality of heat-dissipating parts. The heat-conducting substrate is attached to the surface of the display chip. The heat-dissipating parts are vertically arranged on a side of the heat-conducting substrate away from the display chip, and the heat-dissipating parts are arranged at intervals.

[0019] In some embodiments, the heat dissipation portion is a columnar portion.

[0020] In some embodiments, at least one protrusion is disposed on a surface of the thermally conductive substrate facing the display chip, and the protrusion is tightly fitted to the surface of the display chip.

[0021] In some embodiments, the third heat sink includes a heat dissipation substrate and a plurality of heat dissipation fins. The heat dissipation substrate is attached to the surface of the power board. The heat dissipation fins are vertically arranged on a side surface of the heat dissipation substrate away from the power board, and the heat dissipation fins are arranged at intervals.

[0022] In some embodiments, the heat sinks all extend along the first direction, and the heat sinks are spaced apart along the second direction;

[0023] Wherein, along the extension direction of the heat sink, the heat sink has at least one partition opening.

[0024] In some embodiments, the mainboard assembly includes a mainboard and a mainboard bracket, the mainboard is connected to a side of the mainboard bracket facing away from the optical engine, and the mainboard bracket is connected to the support frame.

[0025] In some embodiments, the mainboard bracket has at least one protrusion, and the protrusion is in close contact with a corresponding component on the mainboard.

[0026] In some embodiments, the laser projection device further comprises:

[0027] The outer shell is arranged outside the supporting frame;

[0028] At least one of the left and right sides of the housing and the bottom of the support frame is provided with an air inlet, and the side of the housing facing away from the lens is provided with an air outlet.

[0029] In some embodiments, the laser projection device further comprises:

[0030] The support gimbal is movably connected to the shell.

[0031] A laser projection device provided in an embodiment of the present application, wherein the optical engine of the laser projection device includes a laser light source, a display chip and a lens. The laser light source and the display chip both extend in the height direction of the optical engine, and the laser light source and the display chip are located on the left and right sides of the optical engine, and the lens is arranged on the front side of the display chip, so that the layout of the light line design is simple and the optical engine is small. The mainboard assembly is arranged on the top of the optical engine, the power board is arranged between the mainboard assembly and the optical engine, and is installed on the mainboard assembly, and the optical engine, the mainboard assembly and the housing are all arranged on the support frame, so that the space is compact and the utilization rate is high.

[0032] The laser projection device is designed with a heat dissipation system to dissipate heat. The heat dissipation system includes a first heat sink, a second heat sink, a third heat sink and a heat dissipation fan. The first heat sink is bonded to the surface of the laser light source, the second heat sink is bonded to the surface of the display chip, the third heat sink is bonded to the side of the power board away from the mainboard assembly, and the heat dissipation fan is set on the side of the laser light source and the display chip away from the lens. The laser light source, the display chip, and the power board transfer heat to the first heat sink, the second heat sink, and the third heat sink respectively through heat conduction. When the heat dissipation fan rotates, forced convection is generated, and the generated airflow enters from the air inlet of the shell, takes away the heat of the first heat sink, the second heat sink, and the third heat sink, and blows out from the air outlet of the shell, thereby reducing the temperature of the laser light source, the display chip, and the power board. As a result, the core components at different positions of the laser projection device are designed with heat dissipation solutions, which improves the heat dissipation efficiency of the laser projection device and ensures the normal operation of the laser projection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the implementation methods in the embodiments of the present application or the related technologies, the drawings required for use in the description of the embodiments or the related technologies will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application, and a person skilled in the art can also obtain other drawings based on these drawings.

[0034] Figure 1 An exploded structural diagram of a laser projection device provided in an embodiment of the present application;

[0035] Figure 2 A schematic diagram of the structure of an optical engine provided by an embodiment of the present application from a viewing angle;

[0036] Figure 3 A schematic diagram of the structure of the optical engine provided by an embodiment of the present application from another perspective;

[0037] Figure 4 A structural diagram of the cooperation between the heat dissipation system and the optical engine provided in an embodiment of the present application;

[0038] Figure 5 A schematic diagram of the structure of a laser projection device provided in an embodiment of the present application;

[0039] Figure 6 for Figure 5 A side view of a laser projection device in FIG.

[0040] Figure 7 A structural diagram of a first radiator provided in an embodiment of the present application;

[0041] Figure 8 A top view of the structure of the heat dissipation system and the optical engine provided in an embodiment of the present application;

[0042] Fig. 9 A structural diagram of a second radiator provided in an embodiment of the present application;

[0043] Fig.10 A front structural diagram of a second radiator provided in an embodiment of the present application;

[0044] Fig.11 This is a structural diagram of the third heat sink provided in an embodiment of the present application.

[0045] Reference numerals:

[0046] 1-Laser projection equipment;

[0047] 10-support frame; 20-optical engine; 30-mainboard assembly; 40-power board; 50-cooling system; 70-support gimbal; 80-sound system;

[0048] 210-laser light source; 220-display chip; 230-lens;

[0049] 310-mainboard; 320-mainboard bracket; 321-raised part;

[0050] 510-first radiator; 520-second radiator; 530-third radiator; 540-cooling fan; 511-heat conducting plate; 512-cooling fins; 513-heat pipe; 521-heat conducting substrate; 522-heat dissipation portion; 523-protrusion; 531-heat dissipation substrate; 532-heat dissipation fin; 5321-partition opening;

[0051] 610-air inlet; 620-air outlet. DETAILED DESCRIPTION

[0052] As described in the background technology, in the related art, the radiator of the laser projection equipment is usually arranged in the center of the equipment, which makes it impossible for the external cold air to directly exchange heat with the radiator of the cooling system, resulting in low heat exchange efficiency of the laser projection equipment and affecting the normal operation of the laser projection equipment.

[0053] In view of this, an embodiment of the present application provides a laser projection device, wherein the optical engine of the laser projection device includes a laser light source, a display chip and a lens. The laser light source and the display chip both extend in the height direction of the optical engine, and the laser light source and the display chip are located on the left and right sides of the optical engine, and the lens is arranged on the front side of the display chip, so that the layout of the light line design is simple and the optical engine is small. The mainboard assembly is arranged on the top of the optical engine, the power board is arranged between the mainboard assembly and the optical engine, and is installed on the mainboard assembly, and the optical engine, the mainboard assembly and the housing are all arranged on the support frame, so that the space is compact and the utilization rate is high.

[0054] The laser projection device is designed with a heat dissipation system to dissipate heat. The heat dissipation system includes a first heat sink, a second heat sink, a third heat sink and a heat dissipation fan. The first heat sink is bonded to the surface of the laser light source, the second heat sink is bonded to the surface of the display chip, the third heat sink is bonded to the side of the power board away from the mainboard assembly, and the heat dissipation fan is set on the side of the laser light source and the display chip away from the lens. The laser light source, the display chip, and the power board transfer heat to the first heat sink, the second heat sink, and the third heat sink respectively through heat conduction. When the heat dissipation fan rotates, forced convection is generated, and the generated airflow enters from the air inlet of the shell, takes away the heat of the first heat sink, the second heat sink, and the third heat sink, and blows out from the air outlet of the shell, thereby reducing the temperature of the laser light source, the display chip, and the power board. As a result, the core components at different positions of the laser projection device are designed with heat dissipation solutions, which improves the heat dissipation efficiency of the laser projection device and ensures the normal operation of the laser projection device.

[0055] In order to make the purpose, implementation mode and advantages of the present application clearer, the exemplary implementation mode of the present application will be clearly and completely described below in conjunction with the drawings in the exemplary embodiments of the present application. Obviously, the described exemplary embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0056] It should be noted that the brief description of terms in this application is only for the convenience of understanding the embodiments described below, and is not intended to limit the embodiments of this application. Unless otherwise specified, these terms should be understood according to their common and usual meanings.

[0057] In addition, the terms "include" and "have" and any variations thereof are intended to cover but not exclude inclusion, for example, a product or device comprising a list of components is not necessarily limited to those components expressly listed but may include other components not expressly listed or inherent to such products or devices.

[0058] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or device referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0059] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0060] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two devices. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0061] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0062] The laser projection device 1 projects images using laser beams. For example, the laser projection device 1 can project movies and TV series onto a large screen, and can also be used to play games and watch sports games, etc., providing a high-quality home entertainment experience.

[0063] Figure 1 This is a diagram of the exploded structure of the laser projection device provided in the embodiment of the present application. Figure 1 As shown, the laser projection device 1 includes a support frame 10. The support frame 10 provides support for multiple components and parts inside the laser projection device 1.

[0064] In some embodiments, the support frame 10 is made of a thin plate by bending, and the support frame 10 can have a higher strength. Alternatively, the support frame 10 is made of plastic, and the support frame 10 has a lighter weight and can meet specific shape requirements, and the parts can be more compact.

[0065] refer to Figure 1 As shown, the laser projection device 1 further includes an optical engine 20 , which is mounted on the support frame 10 .

[0066] Figure 2 A schematic diagram of a structure of an optical engine provided by an embodiment of the present application from a viewing angle. Figure 2 As shown, the optical engine 20 includes a laser light source 210. The laser light source 210 provides a light source for the laser projection device 1 by emitting light of a specific wavelength. The laser light source 210 generates a large amount of heat during operation.

[0067] The laser light source 210 is a light source that utilizes the photoelectric effect to cause excited particles to emit light under the action of stimulated radiation.

[0068] In some embodiments, the laser light source 210 can be configured as a monochromatic laser, and the laser light source 210 can emit composite white light. Monochromatic laser is a laser using a single wavelength, which produces multiple colors by rotating a color wheel or the like. At this time, a color wheel (not shown in the figure) can also be provided on the light-emitting side of the laser light source 210, and the composite white light emitted by the laser light source 210 is decomposed into red, green, and blue light by the color wheel.

[0069] In some other embodiments, the laser light source 210 can be configured as a three-color laser, using three lasers with different wavelengths to emit light, which can better restore the color of the picture. For example, the laser light source can emit red, green, and blue light.

[0070] Figure 3 This is a schematic diagram of the structure of the optical engine provided by the embodiment of the present application from another perspective. Figure 3 As shown, in some embodiments, the optical engine 20 further includes a display chip 220, which is responsible for converting light into a visible image. The display chip 220 receives the laser beam and needs to withstand the heat brought by the laser beam.

[0071] In some embodiments, the display chip 220 can use a digital micromirror device (DMD). The DMD chip is covered with hundreds of thousands to millions of tiny mirrors. The mirrors are made of aluminum, for example. Each mirror represents a pixel. By controlling the tilt angle of the mirror (on or off), the brightness of the corresponding pixel can be controlled, thereby forming an image on the projection screen.

[0072] Reference Figure 2 As shown, in some embodiments, the optical engine 20 further includes a lens 230, which can clearly project the image formed on the display chip 220 onto the screen to ensure a clear picture. For example, the lens 230 can have a zoom function, and the size of the projected picture can be adjusted as needed to adapt to screens of different sizes.

[0073] The optical engine 20 also includes an optical lens group, which is mainly used for light splitting, focusing, reflection, and speckle reduction.

[0074] For ease of explanation, the front-to-back direction of the optical engine is defined by the axis direction of the lens 230, the side where the light-emitting surface of the lens 230 is located is the front side of the optical engine, and the side opposite to the front side of the optical engine is the rear side of the optical engine. The optical engine also includes a top and a bottom located at the upper and lower sides in the height direction, and a left side and a right side located at the left and right sides in the horizontal direction.

[0075] In this embodiment, the laser light source 210 and the display chip 220 both extend along the height direction of the optical engine 20. The laser light source 210 and the display chip 220 are located on the left and right sides of the optical engine 20. The lens 230 is disposed at the front end of the display chip 220.

[0076] In some embodiments, the laser light source 210 emits laser light to the optical lens group, which is then processed and irradiated to the display chip 220. The display chip 220 adjusts the light to carry image information and projects it onto an object such as a screen through the lens 230, completing the entire laser projector display process. With this arrangement, the light path design is simple, the integration is high, and the optical engine 20 is small in size.

[0077] Reference Figure 1 As shown, in some embodiments, the laser projection device 1 includes a mainboard assembly 30. The mainboard assembly 30 is disposed on the top of the optical engine 20, and the mainboard assembly 30 is mounted on the support frame 10.

[0078] In some embodiments, the laser projection device 1 includes a power board 40 . The power board 40 supplies power to the inside of the laser projection device 1 through voltage conversion, overvoltage protection, etc. The power board 40 may be disposed between the mainboard assembly 30 and the optical engine 20 .

[0079] The power board 40 can convert the input AC or DC power into the working voltage and current required by the laser projection device 1. The power board 40 can automatically cut off the power supply of the laser projection device 1 when the device is overloaded to avoid damage to the laser projection device 1 or dangerous situations such as fire. The power board 40 can also detect whether a short circuit occurs inside the laser projection device 1. If a short circuit occurs in the laser projection device 1, the power board 40 will automatically cut off the power supply to protect the laser projection device 1 from damage.

[0080] As described above, by designing the laser light source and the display chip side by side and setting the mainboard assembly 30 on the top of the optical engine 20, the power board 40 can be set between the mainboard assembly 30 and the optical engine 20. The internal space of the laser projection device 1 is reasonably arranged and the components are compact. The volume of the laser projection device 1 can be made relatively small, which increases the applicable scenarios.

[0081] In some embodiments, the laser projection device 1 includes a heat dissipation system 50. The heat dissipation system 50 dissipates heat for the laser projection device 1 to ensure the normal operation of the laser projection device 1.

[0082] Figure 4 This is a structural diagram of the heat dissipation system and the optical engine provided in the embodiment of the present application. Figure 1 and Figure 4 As shown, in some embodiments, the heat dissipation system 50 includes a first heat sink 510, which is bonded to the surface of the laser light source 210, and the heat generated by the laser light source 210 in the process of emitting light is transferred to the first heat sink 510 through heat conduction.

[0083] In some embodiments, the heat dissipation system 50 includes a second heat sink 520 , which is attached to the surface of the display chip 220 , and the heat generated by the display chip 220 in the process of receiving the light beam is transferred to the second heat sink 520 through heat conduction.

[0084] refer to Figure 1 As shown, in some embodiments, the heat dissipation system 50 includes a third heat sink 530, which is attached to the power board 40 and is located between the power board 40 and the optical engine 20. The heat generated by the power board 40 when working is transferred to the third heat sink 530 by heat conduction.

[0085] In some embodiments, the heat dissipation system 50 includes a heat dissipation fan 540, which is disposed behind the laser light source 210 and the display chip 220. One, two or more heat dissipation fans 540 may be provided. The heat dissipation fan 540 generates a directional enhanced airflow in the laser projection device 1.

[0086] In some embodiments, the cooling fan 540 can be configured as an axial flow fan. When the axial flow fan is working, the blades push the air to flow in the same direction as the axis. The axial flow fan has the characteristics of simple installation and low price.

[0087] Exemplarily, the heat dissipation system 50 may include two heat dissipation fans 540, which are arranged in parallel and are respectively located at the rear side of the laser light source 210 and the display chip 220. The heat generated by the laser light source 210 and the display chip 220 is taken away by the two heat dissipation fans 540, respectively, and the two heat dissipation fans 540 respectively blow airflow directly to the heat dissipation fins 512 to improve the heat dissipation effect of the laser light source 210 and the display chip 220.

[0088] The heat of the laser light source 210 is transferred to the first heat sink 510; the heat of the display chip 220 is transferred to the second heat sink 520; and the heat of the power board 40 is transferred to the third heat sink 530. The heat dissipation fan 540 generates an accelerated directional airflow to take away the heat of the first heat sink 510, the second heat sink 520 and the third heat sink 530. The heat of the laser light source 210, the display chip 220 and the power board 40 is indirectly taken away, thereby reducing the temperature of the laser light source 210, the display chip 220 and the power board 40. Heat dissipation methods are provided for heat-generating components at different positions, thereby improving the heat dissipation efficiency of the laser projection device 1 and ensuring the normal operation of the laser projection device.

[0089] In some embodiments, the laser projection device 1 includes a housing (not shown in the figure), which is disposed outside the support frame and is located outside the laser projection device 1. The housing can prevent the laser projection device 1 from being mechanically damaged.

[0090] Figure 5 This is a schematic diagram of the structure of the laser projection device provided in the embodiment of the present application. Figure 5 As shown, in some embodiments, the housing is provided with an air inlet 610 , and at least one of the left and right sides and the bottom of the laser projection device 1 is provided with an air inlet 610 .

[0091] Figure 6 for Figure 5 Side view of the laser projection device in FIG. Figure 6 As shown, in some embodiments, the housing is provided with an air outlet 620, and the air outlet 620 is located at the rear side of the laser projection device 1. The airflow outflow direction of the housing is direction B.

[0092] Reference Figure 5 As shown, in some embodiments, the airflow of the laser projection device 1 enters along A1, A2, and A3. The first radiator 510 is close to the left side of the housing, the second radiator 520 is close to the left side of the housing and the bottom side of the support frame 10, and the third radiator 530 is close to the right side of the housing. The airflow can directly exchange heat with the first radiator 510, the second radiator 520, and the third radiator 530, which can maximize the efficiency of heat exchange, and the heat is finally blown out from the air outlet 620 along with the airflow.

[0093] In some embodiments, the laser projection device 1 includes a support platform 70, which is movably connected to the housing. The support platform 70 can support the laser projection device 1, so that the laser projection device 1 remains stable during use and the projection image is prevented from shaking.

[0094] In some embodiments, the support platform 70 can also flexibly adjust the projection angle of the laser projection device 1, for example, it can adjust the elevation angle, horizontal rotation, etc. The laser projection device 1 can meet the needs of a variety of different scenarios.

[0095] In some embodiments, the laser projection device 1 includes a speaker 80 , which plays sounds that match the picture, and the speaker 80 is installed on the support frame 10 .

[0096] In some embodiments, the power board 40 and the third heat sink 530 are stacked and fixed on the mainboard assembly 30, which can reduce the number of brackets and save space. The optical engine 20, the mainboard assembly 30 and the speaker 80 are all fixed on the support frame 10, which also reduces the number of internal brackets, saves space and improves assembly efficiency.

[0097] The following is a detailed description of each component of the heat dissipation system in the laser projection device and each component of the mainboard assembly and their heat dissipation methods.

[0098] Figure 7 This is a structural diagram of the first heat sink provided in the embodiment of the present application. Figure 7 As shown, the first heat sink 510 includes a heat conducting plate 511, heat dissipation fins 512 and a heat pipe 513. The heat dissipation fins 512 are located at the rear side of the laser light source 210, and the heat conducting plate 511 and the heat dissipation fins 512 are connected by a heat pipe 513. The heat of the laser light source 210 is transferred to the heat conducting plate 511 by heat conduction, and then the heat is transferred to the heat dissipation fins 512 by the heat pipe 513. In this way, the heat dissipation area of ​​the first heat sink 510 is increased, and the heat dissipation efficiency of the first heat sink 510 is improved.

[0099] In some embodiments, the heat conducting plate 511 is made of a material with good thermal conductivity. For example, the heat conducting plate 511 can be made of an aluminum alloy material, which is light in weight and has good thermal conductivity.

[0100] In some embodiments, there is a large space on the front surface of the laser light source 210, and the heat conducting plate 511 is attached to the front surface of the laser light source 210. This arrangement is reasonable and the structure is compact.

[0101] In some embodiments, holes are processed on the heat conducting plate 511 , and the heat conducting plate 511 can be assembled using bolts, which facilitates the installation of the heat conducting plate 511 .

[0102] In some embodiments, the heat dissipation fins 512 are formed by a plurality of fins, and there are gaps between the fins to facilitate air flow between the gaps. The heat dissipation fins 512 increase the heat dissipation area of ​​the first heat sink 510 .

[0103] In some embodiments, the front side of the heat sink fin 512 is the air inlet side of the heat sink fin 512, and the rear side of the heat sink fin 512 is the air outlet side of the heat sink fin 512. The fins of the heat sink fin 512 are parallel to the axial direction of the heat sink fan 540, and the airflow generated by the heat sink fan 540 can pass through the gaps between the heat sink fins 512.

[0104] In some embodiments, the heat dissipation fins 512 are formed by welding a plurality of aluminum sheets, and fixing holes are provided on both sides of the bottom of the heat dissipation fins 512 , and the heat dissipation fins 512 are fixed to the support frame 10 through the fixing holes.

[0105] In some embodiments, the heat pipe 513 runs through the heat conducting plate 511 and the heat dissipating fins 512. A fluid with high heat conductivity is contained in the heat pipe 513. For example, the heat pipe 513 may contain fluid materials such as water, ethylene glycol, and ammonia.

[0106] The fluid in the heat pipe 513 absorbs the heat of the heat conducting plate 511 and is converted from liquid to gas. The converted gas flows along the tube cavity of the heat pipe 513 to the heat dissipation fins 512, transfers the heat to the heat dissipation fins 512, and then the temperature is reduced and condensed into liquid, which flows back to the heat conducting plate 511 along the tube cavity of the heat pipe 513. In this cycle, the first heat sink 510 has a high heat conduction efficiency.

[0107] Figure 8 This is a top view of the structure of the heat dissipation system and the optical engine provided in the embodiment of the present application. Figure 8 As shown, the second heat sink 520 is attached to the rear surface of the display chip 220 .

[0108] Fig. 9 This is a structural diagram of the second heat sink provided in the embodiment of the present application. Fig. 9 As shown, in some embodiments, the second heat sink 520 includes a heat conductive substrate 521 and a plurality of heat dissipation parts 522. One side of the heat conductive substrate 521 is attached to the rear surface of the display chip 220, and the other side of the heat conductive substrate 521 is provided with a plurality of heat dissipation parts 522, and the plurality of heat dissipation parts 522 are arranged at intervals. The heat conductive substrate 521 transfers the heat of the display chip 220 to the heat dissipation parts 522, and heat exchange is completed through the heat dissipation parts 522. The plurality of heat dissipation parts 522 can increase the heat dissipation area, and there are gaps between the heat dissipation parts 522, which ensures that airflow in all directions can pass through.

[0109] In some embodiments, the second heat sink 520 can be made of materials with good thermal conductivity such as copper or aluminum.

[0110] Fig.10 This is a front view of the second heat sink provided in the embodiment of the present application. Fig.10 As shown, in some embodiments, the heat dissipation portion 522 can be set to be columnar and the cross-section of the heat dissipation portion 522 is diamond-shaped, which can greatly reduce the air flow resistance, and the airflow can more easily pass through the heat dissipation portion 522, thereby improving the heat dissipation efficiency of the second heat sink 520.

[0111] The side of the heat-conducting substrate 521 that is in contact with the rear surface of the display chip 220 is provided with one or more protrusions 523 (not shown in the figure). The protrusions 523 are in close contact with the rear surface of the display chip 220, which is conducive to heat conduction.

[0112] In some embodiments, the cooling fan 540 is disposed between the cooling fins 512 and the laser light source 210, and the cooling fan 540 contacts the air inlet end surface of the cooling fins 512. When the air inlet portion 610 is disposed on the bottom side of the housing, the airflow formed by the cooling fan 540 does not exchange heat with other cooling components, but directly enters the cooling fins 512, and the first heat sink 510 has a higher heat dissipation efficiency.

[0113] The cooling fan 540 is disposed between the cooling fins 512 and the display chip 220. Furthermore, the cooling fan 540 is disposed between the cooling fins 512 and the heat dissipation portion 522. The orthographic projection of the second heat sink 520 on the cooling fins 512 can be located within the coverage of the cooling fins 512. The cooling fan 540 blows the airflow of the second heat sink 520 directly to the cooling fins 512. The cooling fins 512 receive the heat from the second heat sink 520, and jointly conduct the heat of the laser light source 210 and the display chip 220, which can improve the heat dissipation effect of the display chip.

[0114] Fig.11 This is a structural diagram of a third heat sink provided in an embodiment of the present application. Fig.11 As shown, the third heat sink 530 includes a heat sink substrate 531 and a plurality of heat sinks 532. One side of the heat sink substrate 531 is in contact with the surface of the power board 40, and the other side of the heat sink substrate 531 is provided with a plurality of heat sinks 532, which are arranged at intervals. The third heat sink 530 is provided with a plurality of heat sinks 532 to increase the heat dissipation area and improve the heat dissipation efficiency of the third heat sink 530.

[0115] In some embodiments, a thermal conductive material is applied between the heat dissipation substrate 531 and the power board 40 to fill the small gap between the heat dissipation substrate 531 and the power board 40 and increase the contact area between the heat dissipation substrate 531 and the power board 40. For example, thermal conductive silicone grease may be applied between the heat dissipation substrate 531 and the power board 40.

[0116] In some embodiments, the heat sink 532 extends along the first direction on the heat dissipation substrate 531 and a gap is provided between the heat sink 532 and the heat sink 532, and the heat sink 532 is provided with one or a partition opening 5321 in the first direction. In other words, the heat sink 532 is arranged in a two-dimensional array on the heat dissipation substrate 531. Similarly, airflows in all directions can pass through the gaps between the heat sink 532 to ensure the heat dissipation efficiency of the third heat sink 530.

[0117] In some embodiments, the third heat sink 530 can be made of materials with good thermal conductivity such as copper or aluminum.

[0118] In some embodiments, when the air inlet 610 is disposed on the left side of the housing, the airflow takes away the heat of the third radiator 530 , passes through the cooling fan 540 , and then passes through the cooling fins 512 . At this time, the third radiator 530 has a higher heat dissipation efficiency.

[0119] Reference Figure 1 As shown, in some embodiments, the motherboard assembly 30 includes a motherboard 310. The motherboard 310 is mounted above the motherboard bracket 320. The motherboard 310 is responsible for processing and controlling the input video signal and driving the optical engine 20 to output high-quality images.

[0120] In some embodiments, the mainboard 310 includes a central processing unit (not shown in the figure), which is the brain of the laser projection device 1 and is responsible for processing and controlling various operating instructions.

[0121] In some embodiments, the mainboard 310 includes a graphics processor (not shown in the figure), which is responsible for converting the video signal into an image signal and performing necessary image processing and optimization to ensure the quality of the projected image.

[0122] In some embodiments, the mainboard 310 includes a memory (not shown in the figure), which is used to cache video data and system parameters to ensure that the laser projection device 1 is smoother and more efficient when processing complex images.

[0123] In some embodiments, the mainboard assembly 30 includes a mainboard bracket 320. The mainboard bracket 320 is installed above the support frame 10, and such an arrangement saves the internal space of the laser projection device 1.

[0124] In some embodiments, the motherboard bracket 320 is provided with one or more protrusions 321. As described above, the motherboard assembly 30 includes multiple heat generating devices such as a CPU, a GPU, and a memory, and the protrusions 321 are in close contact with these heat generating devices of the motherboard assembly 30, which is conducive to heat conduction.

[0125] The heat generating device of the mainboard 310 transfers heat to the mainboard bracket 320 through the raised portion 321 , and the mainboard bracket 320 transfers heat to the support frame 10 through the connection with the support frame 10 , which can reduce the temperature of the mainboard 310 and ensure the normal operation of the mainboard 310 .

[0126] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0127] For the convenience of explanation, the above description has been made in conjunction with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or limit the embodiments to the specific forms disclosed above. Based on the above teachings, various modifications and variations can be obtained. The selection and description of the above embodiments are to better explain the principles and practical applications, so that those skilled in the art can better use the embodiments and various different variations of the embodiments suitable for specific use considerations.

Claims

1. A laser projection device, characterized in that: include: Support frame; An optical engine, supported by the support frame; the optical engine comprises a laser light source, a display chip and a lens, the laser light source and the display chip both extend along the height direction of the optical engine, and the laser light source and the display chip are located on the left and right sides of the optical engine, and the lens is arranged on the front side of the display chip; A mainboard assembly, arranged on the top of the optical engine and connected to the support frame; A power board, arranged between the mainboard assembly and the optical engine; The heat dissipation system includes a first heat sink, a second heat sink, a third heat sink and at least one heat dissipation fan; the first heat sink is bonded to the surface of the laser light source, the second heat sink is bonded to the surface of the display chip, and the third heat sink is attached to the side of the power board away from the mainboard assembly; the heat dissipation fan is arranged on the side of the laser light source and the display chip away from the lens.

2. The laser projection device according to claim 1, characterized in that: The first heat sink comprises a heat conducting plate, heat dissipation fins and a heat pipe, wherein the heat conducting plate is attached to the surface of the laser light source, the heat dissipation fins are located on a side of the laser light source away from the lens, and the heat pipe is connected between the heat conducting plate and the heat dissipation fins; Wherein, the heat dissipation fan is arranged between the heat dissipation fins, the laser light source and the display chip.

3. The laser projection device according to claim 2, characterized in that: The side of the heat dissipation fin facing the lens is the air inlet side of the heat dissipation fin, and the side of the heat dissipation fin facing away from the lens is the air outlet side of the heat dissipation fin.

4. The laser projection device according to claim 2, characterized in that: The heat conducting plate is attached to a surface of the laser light source on one side facing the lens.

5. The laser projection device according to claim 2, characterized in that: The heat dissipation fan abuts against a surface of one side of the heat dissipation fin facing the lens.

6. The laser projection device according to any one of claims 1 to 5, characterized in that: The second heat sink is attached to a surface of the display chip on a side away from the lens; The second heat sink includes a heat conductive substrate and a plurality of heat dissipation parts. The heat conductive substrate is attached to the surface of the display chip. The heat dissipation parts are vertically arranged on a side surface of the heat conductive substrate away from the display chip, and the heat dissipation parts are arranged at intervals.

7. The laser projection device according to claim 6, characterized in that: The heat dissipation portion is a columnar portion.

8. The laser projection device according to claim 6, characterized in that: At least one protrusion is provided on a surface of the heat-conducting substrate facing the display chip, and the protrusion is tightly fitted with the surface of the display chip.

9. The laser projection device according to any one of claims 1 to 5, characterized in that: The third heat sink includes a heat dissipation substrate and a plurality of heat dissipation fins. The heat dissipation substrate is attached to the surface of the power board. The heat dissipation fins are vertically arranged on a side surface of the heat dissipation substrate away from the power board, and the heat dissipation fins are arranged at intervals.

10. The laser projection device according to claim 9, characterized in that: Each of the heat sinks extends along the first direction, and each of the heat sinks is arranged at intervals along the second direction; Wherein, along the extension direction of the heat sink, the heat sink has at least one partition opening.

11. The laser projection device according to any one of claims 1 to 5, characterized in that: The mainboard assembly includes a mainboard and a mainboard bracket. The mainboard is connected to a side of the mainboard bracket facing away from the optical engine, and the mainboard bracket is connected to the supporting frame.

12. The laser projection device according to claim 11, characterized in that: The mainboard bracket has at least one raised portion, and the raised portion is in close contact with a corresponding component on the mainboard.

13. The laser projection device according to any one of claims 1 to 5, characterized in that: Also includes: A housing, arranged outside the support frame; Wherein, at least one of the left and right sides of the shell and the bottom of the support frame is provided with an air inlet, and the side of the shell facing away from the lens is provided with an air outlet.

14. The laser projection device according to claim 13, characterized in that: Also includes: The support gimbal is movably connected to the shell.

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