High-power electronic component with lead and flange

Abstract

The utility model discloses a high-power electronic component with a lead and a flange. Comprising a flange plate, a ceramic substrate arranged on the flange plate, a first surface electrode and a second surface electrode oppositely arranged on the ceramic substrate, a side electrode arranged on the side surface of the ceramic substrate and connected with the second surface electrode, and a back electrode arranged on the back surface of the ceramic substrate and connected with the side electrode, the resistive film layer is arranged between the first surface electrode and the second surface electrode, the packaging film layer covers the resistive film layer, the metal lead wire is connected with the first surface electrode, the protective cover plate is arranged on the packaging film layer and the metal lead wire, and the metal lead wire is welded with the first surface electrode through a thermocompression welding process. By limiting the structural composition of the electronic element, the flange plate is additionally arranged at the bottom of the ceramic substrate, and heat of a product is conducted into the radiator through the flange plate with a good heat conduction effect, so that normal operation of the product is guaranteed.

Description

Technical Field

[0001] The utility model belongs to the field of electronic component preparation, and in particular relates to a high-power electronic component with a lead wire and a flange. Background Art

[0002] Leaded flange RF power resistors are widely used, and their production needs to meet multiple conditions such as lead welding, product heat dissipation, impedance matching, etc. At present, the power resistors used for loads for energy absorption at the end of RF circuits and as isolation resistors on the market are mainly chip-type RF power resistors. The power and frequency that this product can achieve are much higher than ordinary resistors. However, due to its harsh use and installation conditions, it is necessary to equip the PCB board with air cooling, water cooling, and welding leads, which limits the application field or easily causes the PCB board to be overloaded and burned when the product is in use.

[0003] In order to ensure impedance matching and power characteristics, the chip RF power resistors are often designed with shorter lead ends, small product size, and lead width or lead width greater than the width of the input electrode layer. This results in insufficient lead contact surface for soldering when used by customers, which can easily cause the lead to fail to solder or fall off. In addition, if there is too much solder when soldering the PCB board at the bottom of the product, the bottom contact surface will be suspended, affecting heat dissipation; too little solder will cause the product to fall off, and it must also be installed under certain heat dissipation conditions such as air cooling and water cooling.

[0004] Due to the uncertainty of customers during installation, chip RF power resistor products frequently encounter problems during use or fail to reach the expected power, which needs further improvement. Utility Model Content

[0005] The utility model aims to overcome the shortcomings of the prior art and provide a high-power electronic component with leads and flanges.

[0006] The utility model adopts the following technical solutions:

[0007] A high-power electronic component with leads and flanges comprises a flange, a ceramic substrate arranged on the flange, a first surface electrode and a second surface electrode arranged opposite to each other on the ceramic substrate, a side electrode arranged on the side of the ceramic substrate and connected to the second surface electrode, a back electrode arranged on the back of the ceramic substrate and connected to the side electrode, a resistor film layer arranged between the first surface electrode and the second surface electrode, an encapsulation film layer covering the resistor film layer, a metal lead connected to the first surface electrode, and a protective cover plate arranged on the encapsulation film layer and the metal lead, wherein the metal lead is welded to the first surface electrode by a hot pressing welding process.

[0008] Furthermore, the first surface electrode includes a main body section arranged on the ceramic substrate opposite to the second surface electrode, an extension section connected to the main body section and extending outward, and a lead section connected to the extension section, and the metal lead is connected to the lead section.

[0009] Furthermore, the length of the main section is greater than the length of the extension section, and the length of the lead-out section is less than the length of the main section.

[0010] Furthermore, the flange includes a flange body and two mounting holes arranged opposite to each other on both sides of the flange body, and the ceramic substrate is arranged on the flange body between the two mounting holes.

[0011] Furthermore, the back electrode and the flange are connected via a welding sheet.

[0012] Furthermore, the protective cover plate is covered on the encapsulation film layer and the metal lead by an epoxy resin adhesive layer.

[0013] Furthermore, it also includes an ink marking layer arranged on the protective cover plate.

[0014] Furthermore, the protective cover plate is an aluminum oxide ceramic cover plate, a beryllium oxide ceramic cover plate, or an aluminum nitride ceramic cover plate.

[0015] Furthermore, the metal lead is a silver lead or a copper tinned lead.

[0016] Furthermore, the area of ​​the encapsulation film layer is larger than that of the resistance film layer, but does not completely cover the first surface electrode and the second surface electrode.

[0017] From the above description of the utility model, it can be seen that compared with the prior art, the beneficial effects of the utility model are as follows: the present application limits the structural composition of the electronic components, adds a flange at the bottom of the ceramic substrate, and conducts the heat of the product to the radiator through the flange with good thermal conductivity, thereby ensuring the normal operation of the product, and because of the setting of the flange, the product has low requirements on the circuit board and the use environment, and the circuit board can increase the product's power without additional grouting holes; in addition, a protective cover is introduced to cover the encapsulating film layer and the top of the metal lead, thereby increasing the firmness of the metal lead and providing secondary protection for the product to prevent the metal lead from falling off due to external force during transportation or use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the utility model;

[0019] Figure 2 It is an exploded schematic diagram of the utility model;

[0020] In the figure, 11-flange, 12-ceramic substrate, 13-first surface electrode, 14-second surface electrode, 15-side electrode, 16-back electrode, 17-resistance film layer, 18-encapsulation film layer, 19-metal lead, 20-protective cover, 21-welding piece, 22-epoxy resin layer, 111-flange body, 112-mounting hole, 131-main section, 132-extension section, 133-lead-out section. DETAILED DESCRIPTION

[0021] The present invention is further described below through specific implementation methods.

[0022] Reference Figure 1 to Figure 2 As shown, a high-power electronic component with leads and flanges includes a flange 11, a ceramic substrate 12 arranged on the flange 11, a first surface electrode 13 and a second surface electrode 14 arranged on the ceramic substrate 11, a side electrode 15 arranged on the side of the ceramic substrate 12 and connected to the second surface electrode 14, a back electrode 16 arranged on the back of the ceramic substrate 12 and connected to the side electrode 15, a resistor film layer 17 arranged between the first surface electrode 13 and the second surface electrode 14, an encapsulation film layer 18 covering the resistor film layer 17, a metal lead 19 connected to the first surface electrode 13, a protective cover plate 20 arranged on the resistor film layer 17 and the metal lead 19, and an ink marking layer 23 arranged on the protective cover plate 20. By arranging the flange 11 at the bottom of the ceramic substrate 12, the flange 11 is made of a metal material with good thermal conductivity, so that the heat of the product can be effectively conducted to the radiator, thereby ensuring the normal operation of the product. In addition, due to the heat dissipation of the flange 11, the product has low requirements on the circuit board and the use environment, and the circuit board can increase the power of the product in the case of additional grouting through holes.

[0023] The flange 11 includes a flange body 111 and two mounting holes 112 relatively arranged on both sides of the flange body 111. Relatively speaking, the ceramic substrate 12 is arranged on the flange body 111 and between the two mounting holes 112. The added flange 11 improves the convenience of product use. When using the product, it only needs to be fixed with screws in conjunction with the mounting holes. Even if the customer does not have reserved screw holes, it can be directly welded without considering the technical issues of the installer. Moreover, the welding of the flange 11 is uniformly customized by a machine, which greatly reduces the holes and solder unevenness caused by manual welding, and effectively ensures the electrical performance of the product.

[0024] The first surface electrode 13 includes a main body section 131 arranged on the ceramic substrate 12 opposite to the second surface electrode 14, an extension section 132 connected to the main body section 131 and extending outward, and a lead section 133 connected to the extension section 132. Specifically, the length of the main body section 131 is greater than the length of the extension section 132, and the length of the lead section 133 is less than the length of the main body section 131; further, the main body 131 and the second surface electrode 14 are arranged on the ceramic substrate 12 in a square shape.

[0025] The back electrode 16 has an area consistent with the bottom area of ​​the ceramic substrate 12 and is connected to the flange 11 via a welding piece 21. During welding, a welding piece 21 of suitable thickness is selected and precisely cut using a cutting machine. Considering the elongation of the welding piece 21 after melting, the size of the welding piece 21 is generally reduced by 5% or 10%, depending on the size of the product and the selected welding piece thickness.

[0026] The metal lead 19 is made of pure silver lead or copper tinned lead, and is connected to the first surface electrode 13 by a hot pressing welding process. Compared with traditional soldering, the hot pressing welding process has higher reliability and precision and will not cause solder overflow to affect the electrical performance of the product.

[0027] The encapsulation film layer 18 protects the resistance film layer 17 . Its area is larger than that of the resistance film layer 17 , but it does not completely cover the first surface electrode 13 or the second surface electrode 14 , thereby ensuring the connection between the metal lead 19 and the first surface electrode 13 .

[0028] The protective cover plate 20 has a surface area that is the same as that of the ceramic substrate 12 and is covered on the encapsulation film layer 18 and the metal lead 19 by an epoxy resin adhesive layer 22. The metal lead 19 is fixed secondary by the cooperation of the epoxy resin adhesive layer 22 and the protective cover plate 20, thereby preventing the metal lead 19 from falling off due to external force during transportation or use while playing the role of insulation and fixation, thereby greatly improving the safety and reliability of product use. Specifically, the protective cover plate 20 is an alumina ceramic cover plate, a beryllium oxide ceramic cover plate, or an aluminum nitride ceramic cover plate.

[0029] The present application limits the structural composition of the electronic components, adds a flange 11 at the bottom of the ceramic substrate 12, and transfers the heat of the product to the radiator through the flange 11 with good thermal conductivity, thereby ensuring the normal operation of the product. In addition, due to the provision of the flange 11, the product has low requirements on the circuit board and the use environment, and the circuit board can increase the product's use power without adding additional grouting holes. In addition, a protective cover plate 20 is introduced to cover the encapsulating film layer 18 and the top of the metal lead 17 to increase the firmness of the metal lead 19 and provide secondary protection for the product to prevent the metal lead 19 from falling off due to external forces during transportation or use.

[0030] The above description is only a preferred embodiment of the present invention, and therefore cannot be used to limit the scope of implementation of the present invention. That is, equivalent changes and modifications made according to the scope of application of the present invention and the contents of the specification should still fall within the scope covered by the present invention.

Claims

1. A high-power electronic component with leads and flanges, characterized in that: It includes a flange, a ceramic substrate arranged on the flange, a first surface electrode and a second surface electrode arranged opposite to each other on the ceramic substrate, a side electrode arranged on the side of the ceramic substrate and connected to the second surface electrode, a back electrode arranged on the back of the ceramic substrate and connected to the side electrode, a resistance film layer arranged between the first surface electrode and the second surface electrode, an encapsulation film layer covering the resistance film layer, a metal lead connected to the first surface electrode and a protective cover plate arranged on the encapsulation film layer and the metal lead, wherein the metal lead is welded to the first surface electrode by a hot pressing process.

2. A high-power electronic component with leads and flanges according to claim 1, characterized in that: The first surface electrode comprises a main body section arranged on the ceramic substrate opposite to the second surface electrode, an extension section connected to the main body section and extending outward, and a lead section connected to the extension section, and the metal lead is connected to the lead section.

3. A high-power electronic component with leads and flanges according to claim 2, characterized in that: The length of the main section is greater than that of the extension section, and the length of the lead-out section is less than that of the main section.

4. A high-power electronic component with leads and flanges according to claim 1, characterized in that: The flange comprises a flange body and two mounting holes arranged opposite to each other on two sides of the flange body, and the ceramic substrate is arranged on the flange body between the two mounting holes.

5. A high-power electronic component with leads and flanges according to claim 1, characterized in that: The back electrode and the flange are connected via a welding sheet.

6. A high-power electronic component with leads and flanges according to claim 1, characterized in that: The protective cover plate is covered on the encapsulation film layer and the metal lead through an epoxy resin adhesive layer.

7. A high-power electronic component with leads and flanges according to claim 1, characterized in that: Also included is an ink marking layer disposed on the protective cover plate.

8. A high-power electronic component with leads and flanges according to claim 1, characterized in that: The protective cover plate is an aluminum oxide ceramic cover plate, a beryllium oxide ceramic cover plate, or an aluminum nitride ceramic cover plate.

9. A high-power electronic component with leads and flanges according to claim 1, characterized in that: The metal lead wire is a silver lead wire or a copper tinned lead wire.

10. A high-power electronic component with leads and flanges according to claim 1, characterized in that: The encapsulation film layer has an area greater than that of the resistance film layer, but does not completely cover the first surface electrode and the second surface electrode.

Images