Novel multi-core capacitor
By introducing clamping devices and graphite heat sinks into the new multi-core capacitor, the problems of insufficient heat dissipation and inconvenient installation of the capacitor are solved, more efficient heat dissipation and convenient installation and disassembly are achieved, and the service life of the capacitor is extended.
Patent Information
- Application Number
- CN202420697508.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-07
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2034-04-07
AI Technical Summary
The existing capacitors lack heat dissipation in a multi-core configuration, resulting in heat accumulation and heating up inside, affecting service life, and inconvenient installation and disassembly.
A new multi-core capacitor is designed, using a clamping device and a heat dissipation device. The clamping device generates clamping force through a spring column to facilitate installation and disassembly, and the heat dissipation device uses graphite heat sinks to conduct heat quickly.
It effectively improves the heat dissipation performance of the capacitor, extends the service life, and simplifies the installation and disassembly of the core.
Smart Images

Figure CN222300465U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of capacitors, in particular to a novel multi-core capacitor. Background Art
[0002] Capacitors, usually referred to as their ability to hold charge, are represented by the letter C. As the name suggests, capacitors are containers for electricity and are devices that hold charge. Capacitors are one of the electronic components used in large quantities in electronic equipment, and are widely used in circuits for DC isolation, AC passing, coupling, bypassing, filtering, tuning circuits, energy conversion, and control.
[0003] The existing patent (application number 202321529965.0) discloses a new type of multi-core capacitor, which includes at least two first and second core groups connected in series, and a connection assembly connected to the first and second core groups. The first and second core groups are composed of multiple capacitors arranged at intervals in the direction of current, and the connection assembly includes positive and negative pole connection groups respectively arranged on both sides of the first and second core groups, and at least one transfer connection group arranged between the first and second core groups. The transfer connection group includes a first connection piece for connecting the negative poles of multiple capacitors of the first core group, a second connection piece for connecting the positive poles of multiple capacitors of the second core group, and two lap pieces respectively overlapped on both sides of the second connection piece.
[0004] Existing capacitors do not have good heat dissipation, especially when there are many inner cores, it is easier for heat to accumulate inside and the temperature to rise, thus affecting the service life of the capacitor; in addition, the capacitor is also inconvenient to install and disassemble. Utility Model Content
[0005] The main purpose of the utility model is to provide a novel multi-core capacitor, which can effectively solve the problems in the background technology.
[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:
[0007] A novel multi-core capacitor comprises a capacitor housing, a clamping device is installed on the left inner wall and the right inner wall of the capacitor housing, a mounting device is installed on the upper end of the capacitor housing, a core is installed on the upper end of the mounting device, and a heat dissipation device is installed on the front and rear ends of the core.
[0008] Preferably, the clamping device includes a clamping plate, two of which are provided, and a group of spring columns are installed at the opposite ends of the two clamping plates, and the two clamping plates are respectively installed on the left inner wall and the right inner wall of the capacitor housing through the spring columns, and the middle of the front end and the middle of the rear end of the capacitor housing are provided with mounting grooves, and the left front end and the right front end of the capacitor housing are provided with movable grooves. The clamping plate is inserted into the slot, and after the clamping plate is inserted, the spring columns on it will also be contracted by force, thereby generating an inward clamping force, so that the fixing seat is clamped in the capacitor housing, and when the core needs to be taken out, the clamping plate is pushed out of the slot by pushing the clamping plate, and the fixing seat and the core can be pulled out of the capacitor housing by the pull plate, thereby facilitating the installation or removal of the core.
[0009] Preferably, the heat dissipation device comprises a first heat conducting plate and a second heat conducting plate, the front end of the first heat conducting plate and the rear end of the second heat conducting plate are both equipped with graphite heat sinks, and the first heat conducting plate and the second heat conducting plate are respectively installed at the front end and the rear end of the core. The graphite heat sink has a unique grain orientation, and conducts heat uniformly in two directions. The lamellar structure can adapt well to any surface, thereby enabling rapid heat conduction to the chip and increasing its service life.
[0010] Preferably, the mounting device comprises a fixing seat, two fixing seats are provided, a pull plate is installed on the upper end of the two fixing seats, a slot is opened on the lower part of the opposite ends of the two fixing seats, and the two fixing seats are respectively installed at the left and right ends of the core. The two fixing seats are respectively installed at the left and right ends of the core, and the pull plate thereon facilitates the core to be pulled out of the capacitor housing.
[0011] Preferably, the clamping plate is located in the movable groove.
[0012] Preferably, the card slot is consistent with the card plate in size and their positions correspond to each other on the left and right.
[0013] Compared with the prior art, the utility model has the following beneficial effects:
[0014] 1. The two fixing seats on the installation device are respectively installed on the left and right ends of the core. At this time, the two fixing seats are pushed into the capacitor housing. When the fixing seats are pushed to the bottom of the capacitor housing, the card plate on the clamping device is then clamped into the card slot. After the card plate is clamped, the spring column on it will also be forced to shrink, thereby generating an inward clamping force, thereby clamping the fixing seat in the capacitor housing. When the core needs to be taken out, the card plate is pushed out of the card slot by pushing the card plate. At this time, the fixing seat and the core can be pulled out of the capacitor housing by pulling the plate, thereby facilitating the installation or removal of the core.
[0015] 2. The No. 1 and No. 2 heat conducting plates on the heat dissipation device are installed at both ends of the core respectively, which can quickly conduct the heat in the core to the graphite heat sink. The graphite heat sink has a unique grain orientation and conducts heat evenly in two directions. The lamellar structure can adapt well to any surface, thereby quickly conducting heat to the chip and increasing its service life. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a schematic diagram of the overall structure of a novel multi-core capacitor of the utility model;
[0017] Figure 2 This is a schematic diagram of the overall structure of a clamping device for a novel multi-core capacitor of the utility model;
[0018] Figure 3 This is a schematic diagram of the overall structure of a novel heat dissipation device for a multi-core capacitor of the utility model;
[0019] Figure 4 The utility model is a schematic diagram of the overall structure of a novel installation device for multi-core capacitors.
[0020] In the figure: 1. capacitor housing; 2. clamping device; 3. heat dissipation device; 4. mounting device; 5. core; 20. clamping plate; 21. spring column; 22. movable groove; 23. mounting groove; 30. heat conducting plate No. 1; 31. heat conducting plate No. 2; 32. graphite heat sink; 40. fixing seat; 41. clamping slot; 42. pull plate. DETAILED DESCRIPTION
[0021] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.
[0022] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.
[0023] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0024] like Figure 1-4 As shown, a novel multi-core capacitor includes a capacitor housing 1, a clamping device 2 is installed on the left inner wall and the right inner wall of the capacitor housing 1, a mounting device 4 is installed on the upper end of the capacitor housing 1, a core 5 is installed on the upper end of the mounting device 4, and a heat dissipation device 3 is installed on the front and rear ends of the core 5.
[0025] The clamping device 2 includes a clamping plate 20, two clamping plates 20 are provided, and a group of spring columns 21 are installed at the opposite ends of the two clamping plates 20. The two clamping plates 20 are respectively installed on the left inner wall and the right inner wall of the capacitor housing 1 through the spring columns 21. The middle of the front end and the middle of the rear end of the capacitor housing 1 are provided with mounting grooves 23, and the left and right front ends of the capacitor housing 1 are provided with movable grooves 22; the clamping plate 20 is located in the movable groove 22. The clamping plate 20 is clamped into the clamping groove 41, and after the clamping plate 20 is clamped, the spring columns 21 thereon will also be contracted by force, thereby generating an inward clamping force, thereby clamping the fixing seat 40 in the capacitor housing 1, and when the core 5 needs to be taken out, the clamping plate 20 is pushed out of the clamping groove 41 by pushing the clamping plate 20, and at this time, the fixing seat 40 and the core 5 can be pulled out of the capacitor housing 1 by the pull plate 42, thereby facilitating the installation or removal of the core 5.
[0026] The heat dissipation device 3 includes a first heat conducting plate 30 and a second heat conducting plate 31. The front end of the first heat conducting plate 30 and the rear end of the second heat conducting plate 31 are both equipped with graphite heat sinks 32. The first heat conducting plate 30 and the second heat conducting plate 31 are respectively installed at the front end and the rear end of the core 5. The graphite heat sink 32 has a unique grain orientation, and conducts heat uniformly in two directions. The lamellar structure can be well adapted to any surface, thereby being able to quickly conduct heat to the chip 5 and improving its service life.
[0027] The mounting device 4 includes a fixing seat 40, and two fixing seats 40 are provided. A pull plate 42 is installed on the upper end of the two fixing seats 40, and a card slot 41 is opened at the lower part of the opposite ends of the two fixing seats 40. The two fixing seats 40 are respectively installed at the left and right ends of the core 5; the card slot 41 is consistent in size with the card plate 20 and the position is corresponding on the left and right. The two fixing seats 40 are respectively installed at the left and right ends of the core 5, and the pull plate 42 thereon facilitates the core 5 to be pulled out of the capacitor housing 1.
[0028] It should be noted that the utility model is a novel multi-core capacitor, wherein two fixing seats 40 on the mounting device 4 are respectively mounted on the left and right ends of the core 5. At this time, the two fixing seats 40 are pushed into the capacitor housing 1. When the fixing seats 40 are pushed to the bottom of the capacitor housing 1, the clamping plate 20 on the clamping device 2 is then clamped into the clamping groove 41. After the clamping plate 20 is clamped, the spring column 21 thereon will also be contracted by force, thereby generating an inward clamping force, thereby clamping the fixing seat 40 in the capacitor housing 1. When the core 5 needs to be taken out, the clamping plate 20 is clamped into the capacitor housing 1. By pushing the card plate 20, the card plate 20 is pushed out of the card slot 41. At this time, the fixing seat 40 and the core 5 can be pulled out of the capacitor housing 1 through the pull plate 42, thereby facilitating the installation or removal of the core 5. The first heat conducting plate 30 and the second heat conducting plate 31 on the heat dissipation device 3 are respectively installed at both ends of the core 5, which can quickly conduct the heat in the core 5 to the graphite heat sink 32. The graphite heat sink 32 has a unique grain orientation and uniformly conducts heat in two directions. The lamellar structure can adapt well to any surface, thereby being able to quickly conduct heat to the chip 5 and improving its service life.
[0029] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.
Claims
1. A novel multi-core capacitor, comprising a capacitor housing (1), characterized in that: A clamping device (2) is installed on the left inner wall and the right inner wall of the capacitor housing (1); a mounting device (4) is installed on the upper end of the capacitor housing (1); a core (5) is installed on the upper end of the mounting device (4); and a heat dissipation device (3) is installed on the front and rear ends of the core (5).
2. A novel multi-core capacitor according to claim 1, characterized in that: The clamping device (2) comprises a clamping plate (20), two clamping plates (20) are provided, a group of spring columns (21) are installed at the opposite ends of the two clamping plates (20), the two clamping plates (20) are respectively installed on the left inner wall and the right inner wall of the capacitor housing (1) through the spring columns (21), the front middle part and the rear middle part of the capacitor housing (1) are provided with mounting grooves (23), and the front left part and the front right part of the capacitor housing (1) are provided with movable grooves (22).
3. A novel multi-core capacitor according to claim 1, characterized in that: The heat dissipation device (3) comprises a first heat conducting plate (30) and a second heat conducting plate (31), the front end of the first heat conducting plate (30) and the rear end of the second heat conducting plate (31) are both provided with graphite heat sinks (32), and the first heat conducting plate (30) and the second heat conducting plate (31) are respectively provided at the front end and the rear end of the core (5).
4. A novel multi-core capacitor according to claim 2, characterized in that: The mounting device (4) comprises a fixing seat (40), two fixing seats (40) are provided, a pull plate (42) is installed at the upper end of the two fixing seats (40), a clamping groove (41) is opened at the lower part of the opposite ends of the two fixing seats (40), and the two fixing seats (40) are respectively installed at the left end and the right end of the core (5).
5. A novel multi-core capacitor according to claim 2, characterized in that: The clamping plate (20) is located in the movable groove (22).
6. A novel multi-core capacitor according to claim 4, characterized in that: The card slot (41) and the card plate (20) have the same size and corresponding positions on the left and right.
