Wafer sucker

Abstract

The utility model provides a wafer suction cup, which is suitable for being connected with a vacuumizing device so as to suck a wafer, and comprises a cup body, a suction cup cover and a suction cup cover, the shell comprises an outer surface, an inner surface opposite to the outer surface, at least one vacuumizing air hole penetrating through the outer surface and the inner surface, and a plurality of vacuum breaking air holes penetrating through the outer surface and the inner surface, and is used for being connected with the vacuumizing device; and the extension part is connected with the outer periphery of the main body part and is used for contacting with the outer periphery of the wafer, so that the main body part, the extension part and the wafer jointly form a convection space. Therefore, the wafer can be prevented from being damaged when the wafer is adsorbed.

Description

Technical Field

[0001] The utility model relates to a wafer transport technology, in particular to a wafer suction cup used for wafer transport. Background Art

[0002] In the field of semiconductor manufacturing, in order to test, clean, evaporate, dry or soak the wafer in organic solvents, etc., a robotic arm or robotic finger is generally used with a wafer suction cup to carry out wafer handling operations.

[0003] Most of the existing wafer suction cups use Bernoulli's Law to eject gas at high speed from the suction cup's air outlet to form a rotating airflow and negative pressure in the cylindrical space inside the suction cup. This rotating airflow will be released into the external space through the gap between the suction cup and the wafer surface, thereby forming a stable laminar flow in the space between the suction cup and the wafer, and causing a pressure difference between the upper and lower surfaces of the wafer, ultimately forming an upward adsorption force on the wafer.

[0004] However, if the suction force is not set properly, the wafer suction cup may still touch the component manufacturing area on the surface of the wafer when sucking up the wafer, thereby damaging the wafer. Utility Model Content

[0005] Therefore, the main purpose of the present invention is to provide a wafer suction cup to overcome the problem that the wafer suction cup in the prior art causes damage to the wafer when sucking the wafer.

[0006] To achieve the above-mentioned purpose, the utility model provides a wafer suction cup according to one embodiment, which is suitable for connecting to a vacuum pumping device to absorb a wafer, and the wafer suction cup comprises: a plate body, comprising: a main body, comprising an outer surface, an inner surface relative to the outer surface, at least one vacuum air hole passing through the outer surface and the inner surface, and a plurality of vacuum-breaking air holes passing through the outer surface and the inner surface, and used to connect to the vacuum pumping device; and an extension portion, connected to the outer periphery of the main body and used to contact the outer periphery of the wafer, so that the main body, the extension portion and the wafer together form a convection space.

[0007] Optionally, the plurality of vacuum breaking air holes surround the at least one vacuum drawing air hole.

[0008] Optionally, the plurality of vacuum breaking air holes are evenly spaced in a circle and surround the at least one vacuum exhausting air hole.

[0009] Optionally, the plurality of vacuum breaking air holes surround the at least one vacuum pumping air hole. The number of the at least one vacuum pumping air hole is odd, and the aperture of the vacuum pumping air hole is larger than the aperture of the vacuum breaking air hole.

[0010] Optionally, the at least one vacuum air hole is plural in number, and the vacuum air holes are evenly spaced and arranged.

[0011] Optionally, an included angle between the main body and the extension portion is greater than 0 degrees and less than 180 degrees.

[0012] Optionally, the main body has at least one arc-shaped section between its center and its outer periphery.

[0013] In addition, the utility model also provides a wafer suction cup according to an embodiment, which is suitable for connecting to a vacuum pumping device to absorb a wafer, and the wafer suction cup comprises: a plate body, comprising: a main body, comprising an outer surface, an inner surface relative to the outer surface, at least one vacuum air hole penetrating the outer surface and the inner surface, a plurality of vacuum-breaking air holes penetrating the outer surface and the inner surface, and an annular groove recessed by the inner surface, and is used to connect the vacuum pumping device; and an extension portion, connected to the outer periphery of the main body and forming together with the main body a accommodating space for accommodating the wafer; and a sealing ring, which is arranged in the accommodating space and inserted into the annular groove, and is used to contact the outer periphery of the wafer, so that the main body, the sealing ring and the wafer form a convection space together.

[0014] Optionally, the plurality of vacuum breaking air holes surround the at least one vacuum drawing air hole.

[0015] Optionally, the plurality of vacuum breaking air holes are evenly spaced in a circle and surround the at least one vacuum exhausting air hole.

[0016] Optionally, the plurality of vacuum breaking air holes surround the at least one vacuum pumping air hole. The number of the at least one vacuum pumping air hole is odd, and the aperture of the vacuum pumping air hole is larger than the aperture of the vacuum breaking air hole.

[0017] Optionally, the at least one vacuum air hole is plural in number, and the vacuum air holes are evenly spaced and arranged.

[0018] Optionally, an included angle between the main body and the extension portion is greater than 0 degrees and less than 180 degrees.

[0019] Optionally, the main body has at least one arc-shaped section between its center and its outer periphery.

[0020] Optionally, the annular groove is close to the outer periphery of the main body, and the sealing ring is located in the accommodating space.

[0021] Optionally, the sealing ring is inclined toward the radial outside.

[0022] Therefore, the wafer suction cup provided by the utility model can generate appropriate upward adsorption force in the space formed by the main body and the extension of the disc body by arranging at least one vacuum evacuation air hole and a plurality of vacuum breaking air holes on the disc body, so as to adsorb the wafer and prevent excessive stress from causing damage to the wafer. In addition, the wafer suction cup only contacts the outer periphery of the wafer (i.e., the non-component manufacturing area of ​​the wafer surface), so the component manufacturing area of ​​the wafer surface can also be prevented from being damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solution of the utility model, the following briefly introduces the drawings required for use in the utility model. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 This is a schematic diagram of the appearance of a wafer suction cup according to an embodiment of the utility model;

[0025] Figure 2 for Figure 1 A cross-sectional view of a wafer chuck;

[0026] Figure 3 for Figure 2 Schematic diagram of the wafer suction cup when sucking the wafer;

[0027] Figure 4 is an exploded schematic diagram of a wafer chuck according to another embodiment of the utility model;

[0028] Figure 5A for Figure 4 A cross-sectional view of the wafer chuck after assembly;

[0029] Figure 5B for Figure 5A A partial enlarged view of

[0030] Fig. 6A for Figure 5A Schematic diagram of the wafer suction cup when sucking the wafer;

[0031] Figure 6B for Fig. 6A A partial enlarged view of

[0032] Figure 7 is a schematic diagram of the appearance of a wafer chuck according to yet another embodiment of the utility model; and

[0033] Figure 8 The figure is a schematic diagram of the appearance of a wafer suction cup according to another embodiment of the utility model.

[0034] Explanation of symbols

[0035] 1: Wafer suction cup

[0036] 10: Plate

[0037] 11: Main body

[0038] 111: Outer surface

[0039] 112: Inner surface

[0040] 113: Vacuum vent

[0041] 114: Vacuum hole

[0042] 12: Extension

[0043] 2: Vacuum device

[0044] 3: Wafer

[0045] 31: Wafer surface

[0046] 4: Wafer suction cup

[0047] 40: Plate

[0048] 41: Main body

[0049] 412: Inner surface

[0050] 413: Vacuum vent

[0051] 414: Vacuum hole

[0052] 415: Ring groove

[0053] 42: Extension

[0054] 43: Sealing ring

[0055] AS: Accommodation space

[0056] CS: Convection Space DETAILED DESCRIPTION

[0057] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0058] Please refer to Figures 1 to 3 The utility model provides a wafer suction cup 1 which is suitable for connecting to a vacuum pump 2 to suck a wafer 3 .

[0059] The wafer chuck 1 comprises a plate body 10 . The plate body 10 comprises a main body portion 11 and an extension portion 12 .

[0060] The main body 11 can be connected to the vacuum device 2 and includes an outer surface 111, an inner surface 112 opposite to the outer surface 111, a vacuum air hole 113 passing through the outer surface 111 and the inner surface 112, and a plurality of vacuum breaking air holes 114 passing through the outer surface 111 and the inner surface 112.

[0061] The vacuum breaking air holes 114 surround the vacuum exhausting air hole 113. For example, the vacuum breaking air holes 114 are evenly spaced and arranged in a circle and surround the vacuum exhausting air hole 113.

[0062] The main body 11 has at least one arc-shaped section between its center and its outer periphery.

[0063] The extension portion 12 is connected to the outer periphery of the main body portion 11 , and an included angle between the main body portion 11 and the extension portion 12 is greater than 0 degree and less than 180 degrees.

[0064] In use, the extension portion 12 of the wafer suction cup 1 will contact the outer periphery of the wafer surface 31 of the wafer 3 (i.e., the non-component manufacturing area of ​​the wafer surface 31), so that the main body 11, the extension portion 12 and the wafer 3 can form a convection space CS together. Moreover, in this embodiment, the aperture of the vacuum air hole 113 is larger than the aperture of the vacuum breaking air hole 114. When the vacuum pumping device 2 extracts air from the convection space CS through the vacuum air hole 113, the external gas will also enter the convection space CS from the vacuum breaking air hole 114, so that a proper airflow is formed in the convection space CS. Therefore, the adsorption force provided by the wafer suction cup 1 of the vacuum pumping device 2 can be properly adjusted, so that the adsorption force is not only sufficient to adsorb the wafer 3, but also can avoid excessive stress being applied to the wafer 3 and causing damage to the wafer 3.

[0065] However, the aperture size of the vacuum air hole 113, the number of the vacuum air hole 113, the position of the vacuum air hole 113, the aperture size of the vacuum breaking air hole 114, the number of the vacuum breaking air hole 114, and the position of the vacuum breaking air hole 114 are not limited to Figure 1 As long as the total amount of air drawn by all the vacuum holes 113 and the total amount of air flow through all the vacuum-breaking air holes 114 can be used to sufficiently adsorb the wafer 3 and the stress applied to the wafer 3 is appropriately and evenly distributed, the aperture size of the vacuum holes 113, the number of the vacuum holes 113, the position of the vacuum holes 113, the aperture size of the vacuum-breaking air holes 114, the number of the vacuum-breaking air holes 114 and the position of the vacuum-breaking air holes 114 can be adjusted in any way.

[0066] For example, if Figure 7As shown, the number of the vacuum holes 113 of the main body 11 of the wafer chuck 1 can be changed to be greater than 1 (for example but not limited to 3), and these vacuum holes 113 are evenly spaced and surrounded by a plurality of vacuum breaking holes 114, and Figure 7 The diameter of the vacuum vent 113 is smaller than Figure 1 The diameter of the vacuum vent 113 is as follows. Figure 8 As shown, the number of the vacuum holes 113 of the main body 11 of the wafer chuck 1 can be changed to be greater than 1 (for example but not limited to 3), and these vacuum holes 113 are evenly spaced and arranged around the plurality of vacuum breaking holes 114, and Figure 7 The diameter of the vacuum vent 113 is smaller than Figure 1 The aperture of the vacuum air hole 113 is as follows.

[0067] In addition, please refer to Figures 4 to 6B The utility model also provides another wafer suction cup 4, which is substantially similar to the wafer suction cup 1. The following only describes the differences between the wafer suction cup 4 and the wafer suction cup 1, and the rest of the wafer suction cup 4 can refer to the relevant description of the wafer suction cup 1, which will not be repeated here.

[0068] Compared to the wafer suction cup 1 , the wafer suction cup 4 further includes a sealing ring 43 made of elastic material, and an annular groove 415 is recessed on the inner surface 412 of the main body 41 of the wafer suction cup 4 .

[0069] The extension portion 42 and the main body 41 of the disk body 40 may together form an accommodating space AS to accommodate the sealing ring 43 and the wafer 3 .

[0070] The first end of the sealing ring 43 is accommodated in the annular groove 415, and the second end of the sealing ring 43 opposite to the first end is a free end. The diameter of the first end of the sealing ring 43 is smaller than the diameter of the second end of the sealing ring 43. Therefore, the sealing ring 43 mounted on the disk body 40 not only protrudes from the inner surface 412 of the main body 41, but also tilts toward the radial outer side of the wafer chuck 4.

[0071] In use, the sealing ring 43 of the wafer suction cup 4 will contact the outer periphery of the wafer surface 31 of the wafer 3 (i.e., the non-component manufacturing area of ​​the wafer surface 31), so that the main body 41, the sealing ring 43 and the wafer 3 can form a convection space CS together. When the vacuum pumping device extracts air from the convection space CS through the vacuum air hole 413, the external gas will also enter the convection space CS through the vacuum air hole 414, so that a proper airflow is formed in the convection space CS. Therefore, the wafer suction cup 4 can also achieve the same effect as the wafer suction cup 1.

[0072] The above description is only a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer suction cup, suitable for connecting to a vacuum device to suck a wafer, characterized in that: The wafer chuck comprises: a plate body, comprising: A main body, comprising an outer surface, an inner surface opposite to the outer surface, at least one vacuum evacuation air hole penetrating the outer surface and the inner surface, and a plurality of vacuum breaking air holes penetrating the outer surface and the inner surface, and used for connecting the vacuum evacuation device; as well as An extension part is connected to the outer periphery of the main body and is used to contact the outer periphery of the wafer, so that the main body, the extension part and the wafer form a convection space together.

2. The wafer chuck according to claim 1, characterized in that: The plurality of vacuum breaking air holes surround the at least one vacuum drawing air hole.

3. The wafer chuck according to claim 2, characterized in that: The plurality of vacuum breaking air holes are evenly spaced and arranged in a circle and surround the at least one vacuum exhausting air hole.

4. The wafer chuck according to claim 2, characterized in that: The number of the at least one vacuum exhausting air hole is odd, and the aperture of the vacuum exhausting air hole is larger than the aperture of the vacuum breaking air hole.

5. The wafer chuck according to claim 1, characterized in that: The at least one vacuum air hole is plural in number, and the vacuum air holes are evenly spaced and arranged.

6. The wafer chuck according to claim 1, characterized in that: An included angle between the main body and the extension portion is greater than 0 degree and less than 180 degrees.

7. The wafer chuck according to claim 1, characterized in that: The main body has at least one arc section between its center and its outer periphery.

8. A wafer suction cup, suitable for connecting to a vacuum device to suck a wafer, characterized in that: The wafer chuck comprises: a plate body, comprising: A main body, comprising an outer surface, an inner surface opposite to the outer surface, at least one vacuum evacuation air hole penetrating the outer surface and the inner surface, a plurality of vacuum breaking air holes penetrating the outer surface and the inner surface, and an annular groove concavely formed by the inner surface, and used for connecting the vacuum evacuation device; as well as an extension portion connected to the outer periphery of the main body portion and forming together with the main body portion a receiving space for receiving the wafer; as well as A sealing ring is arranged in the accommodating space and placed in the annular groove, and is used to contact the outer periphery of the wafer, so that the main body, the sealing ring and the wafer form a convection space together.

9. The wafer chuck according to claim 8, characterized in that: The plurality of vacuum breaking air holes surround the at least one vacuum drawing air hole.

10. The wafer chuck according to claim 9, characterized in that: The plurality of vacuum breaking air holes are evenly spaced and arranged in a circle and surround the at least one vacuum exhausting air hole.

11. The wafer chuck according to claim 9, characterized in that: The number of the at least one vacuum exhausting air hole is odd, and the aperture of the vacuum exhausting air hole is larger than the aperture of the vacuum breaking air hole.

12. The wafer chuck according to claim 8, characterized in that: The at least one vacuum air hole is plural in number, and the vacuum air holes are evenly spaced and arranged.

13. The wafer chuck according to claim 8, characterized in that: An included angle between the main body and the extension portion is greater than 0 degree and less than 180 degrees.

14. The wafer chuck according to claim 8, characterized in that: The main body has at least one arc section between its center and its outer periphery.

15. The wafer chuck according to claim 8, characterized in that: The annular groove is close to the outer peripheral edge of the main body, and the sealing ring is located in the accommodating space.

16. The wafer chuck according to claim 15, characterized in that: The sealing ring is inclined toward the radial outside.

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