Embedded structure of integrated circuit chip
By adopting a fixing structure of clamps and telescopic springs in the integrated circuit chip, combined with the design of heat conduction pipes and heat dissipation holes, the chip's stability and temperature increase in use are solved, and more efficient fixing and heat dissipation effects are achieved.
Patent Information
- Application Number
- CN202420542407.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-20
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2034-03-20
AI Technical Summary
Integrated circuit chips are prone to fall and offset due to equipment shaking during use, and long-term use causes the chip temperature to rise, reducing service life and increasing the risk of damage.
An internal inlay structure of an integrated circuit chip is designed, using a clamp and a telescopic spring to fix the chip, combining a heat conduction tube and a heat dissipation hole to reduce temperature, ensuring the stability and heat dissipation of the chip.
The chip is fixed by the mating of the clamp and the telescopic spring to prevent shaking and bearing. The combination of heat conduction pipe and heat dissipation holes effectively reduces the chip temperature and improves the stability and service life of the chip.
Smart Images
Figure CN222302228U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip design and manufacturing, in particular to an internal inlay structure of an integrated circuit chip. Background Art
[0002] In the field of chip design and manufacturing technology, an integrated circuit chip is an electronic device that is manufactured and integrated with thousands of microelectronic devices (such as resistors, capacitors, transistors, etc.) through micro-machining technology on a small semiconductor wafer, and these semiconductors are used to realize the functions of electronic products.
[0003] The inlay structure of integrated circuit chips is mainly to improve the performance, reliability and integration of chips. This structure achieves more efficient signal transmission by embedding different components and circuit layers into the motherboard.
[0004] In the process of realizing the utility model, the inventors found that the prior art had the following problems: 1. When using an integrated circuit, if the device is shaken for a long time, the chip is directly inserted into the motherboard, which is prone to fall and shift, affecting the use of the integrated circuit chip; 2. Long-term use of the integrated circuit can easily cause the chip temperature to accumulate and rise. The increase in chip temperature will reduce the service life of the chip and increase the probability of chip damage. Utility Model Content
[0005] The purpose of the utility model is to provide an internal embedding structure of an integrated circuit chip, so as to solve the problems of unstable chip installation and easy temperature rise when the chip is used proposed in the above background technology. To achieve the above purpose, the utility model provides the following technical solutions: an internal embedding structure of an integrated circuit chip, including a main board body, a main body top cover is installed on the upper end of the main board body, an embedding pin is attached to one side of the main board body, a heat dissipation hole is provided on the inner wall of the main board body, a limiting plate is installed on the lower end of the main body top cover, a chip base is attached to the bottom of the limiting plate, a chip is installed on the upper end of the chip base, a heat pipe is attached to the bottom of the chip base, a clamp is attached to one side of the chip base, and a telescopic spring is connected to one side of the clamp.
[0006] Further preferably, the embedded pins are evenly arranged along both sides of the outer wall of the main board body.
[0007] Further preferably, the heat dissipation holes are arranged symmetrically about a transverse center line of the mainboard body.
[0008] Further preferably, the limiting plates are installed symmetrically about the transverse center line of the chip base.
[0009] Further preferably, the heat pipes are evenly arranged along the bottom of the chip base.
[0010] Further preferably, the clamping plate forms a telescopic structure through the cooperation of the main board body and the telescopic spring.
[0011] Compared with the prior art, the utility model has the following beneficial effects:
[0012] In the utility model, by adding a clamping plate and a telescopic spring, the clamping plate can be extended forward by using the telescopic spring to clamp the chip laterally, so that the chip is fixed on the main board body. A limit plate is installed at the front end of the top cover of the main body. The limit plate can prevent the chip from shaking during use and affecting the effect of the chip.
[0013] In the utility model, by adding heat pipes and heat dissipation holes, the heat pipes can transfer the temperature of the chip accumulation to the heat pipes when the chip is in use, thereby preventing the temperature from accumulating inside the chip. Then, the hot air will dissipate from the heat dissipation holes to reduce the overall temperature of the chip. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic diagram of the main structure of the utility model;
[0015] Figure 2 This is a schematic diagram of the internal structure of the utility model;
[0016] Figure 3 It is a top view structural schematic diagram of the utility model.
[0017] In the figure: 1. Main board body; 2. Main body top cover; 3. Embedded pins; 4. Heat dissipation holes; 5. Limiting plate; 6. Chip base; 7. Chip; 8. Heat pipe; 9. Clamp; 10. Telescopic spring. DETAILED DESCRIPTION
[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technical personnel in this field without creative work are within the scope of protection of the utility model.
[0019] See also Figures 1 to 3 The utility model provides a technical solution: an embedded structure of an integrated circuit chip, comprising a main board body 1, a main body top cover 2 is installed on the upper end of the main board body 1, an embedding pin 3 is attached to one side of the main board body 1, a heat dissipation hole 4 is provided on the inner wall of the main board body 1, a limiting plate 5 is installed on the lower end of the main body top cover 2, a chip base 6 is attached to the bottom of the limiting plate 5, a chip 7 is installed on the upper end of the chip base 6, a heat pipe 8 is attached to the bottom of the chip base 6, a clamping plate 9 is attached to one side of the chip base 6, and a telescopic spring 10 is connected to one side of the clamping plate 9.
[0020] In this embodiment, Figure 1 and Figure 3 As shown, the embedding pins 3 are evenly arranged along both sides of the outer wall of the main board body 1; by installing the embedding pins 3 on both sides of the outer wall of the main board body 1, when the chip is needed, the embedding pins 3 can be inserted into the main board to fix the chip so that the chip can be used and work.
[0021] In this embodiment, Figure 1 and Figure 2 As shown, the heat dissipation holes 4 are symmetrically arranged about the transverse center line of the mainboard body 1; by providing the heat dissipation holes 4 on the inner wall of the mainboard body 1, after the heat pipe 8 transfers the temperature of the chip, the heat dissipation holes 4 can accelerate the circulation of air, so that the heat pipe 8 can quickly dissipate heat.
[0022] In this embodiment, Figure 2 and Figure 3 As shown, the limit plates 5 are installed symmetrically about the transverse center line of the chip base 6; by installing the limit plates 5 at the bottom of the main body top cover 2, after the chip base 6 is placed into the main board body 1 and fixed with the clamping plate 9 and the telescopic spring 10, the limit plates 5 can cooperate with the clamping plate 9 to clamp the chip up and down to prevent shaking.
[0023] In this embodiment, Figure 2 and Figure 3 As shown, the heat pipes 8 are evenly arranged along the bottom of the chip base 6; by installing the heat pipes 8 at the bottom of the chip base 6, when the chip temperature rises, the heat of the chip can be transferred to the heat pipes 8 to prevent the chip temperature from being too high and affecting its use.
[0024] In this embodiment, Figure 2 and Figure 3 As shown, the clamp 9 forms a telescopic structure through the cooperation of the mainboard body 1 and the telescopic spring 10; by installing the clamp 9 at one end of the telescopic spring 10, when installing the chip, the telescopic spring 10 can be used to push the clamp 9 forward to clamp the chip so that the chip is fixed on the mainboard.
[0025] The use method and advantages of the utility model: When the integrated circuit chip is used, the working process is as follows:
[0026] like Figure 1 , Figure 2 and Figure 3As shown, first use the telescopic spring 10 to make the telescopic spring 10 telescope backward, driving the clamping plate 9 to telescope backward, and then place the chip base 6 inside the main board body 1, so that the telescopic spring 10 is pushed forward, driving the clamping plate 9 to push forward to clamp the chip base 6 to fix the chip 7, and a limiting plate 5 is installed at the lower end of the main body top cover 2, and the limiting plate 5 is just in contact with the upper end of the chip base 6 to prevent up and down shaking during use. A heat pipe 8 is installed at the bottom of the chip base 6 to guide the temperature of the chip into the heat pipe 8. The inner wall of the main board body 1 is provided with a heat dissipation hole 4, and the heat dissipation hole 4 can speed up the circulation of air and make the heat pipe 8 dissipate heat faster, and then use the embedded pin 3 to fix the chip at the position where it needs to be placed.
[0027] The above shows and describes the basic principle, main features and advantages of the utility model. Technical staff in this industry should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model will have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.
Claims
1. An inlay structure of an integrated circuit chip, comprising a mainboard body (1), characterized in that: A main body top cover (2) is installed at the upper end of the main body (1), an embedding pin (3) is attached to one side of the main body (1), a heat dissipation hole (4) is provided on the inner wall of the main body (1), a limiting plate (5) is installed at the lower end of the main body top cover (2), a chip base (6) is attached to the bottom of the limiting plate (5), a chip (7) is installed at the upper end of the chip base (6), a heat pipe (8) is attached to the bottom of the chip base (6), a clamping plate (9) is attached to one side of the chip base (6), and a telescopic spring (10) is connected to one side of the clamping plate (9).
2. The inlay structure of an integrated circuit chip according to claim 1, characterized in that: The embedded pins (3) are evenly arranged along both sides of the outer wall of the mainboard body (1).
3. The inlay structure of an integrated circuit chip according to claim 1, characterized in that: The heat dissipation holes (4) are symmetrically arranged with respect to the transverse center line of the mainboard body (1).
4. The inlay structure of an integrated circuit chip according to claim 1, characterized in that: The limiting plates (5) are symmetrically installed with respect to the transverse center line of the chip base (6).
5. The inlay structure of an integrated circuit chip according to claim 1, characterized in that: The heat conducting pipes (8) are evenly arranged along the bottom of the chip base (6).
6. The inlay structure of an integrated circuit chip according to claim 1, characterized in that: The clamping plate (9) forms a telescopic structure through the cooperation of the main board body (1) and the telescopic spring (10).