Portable chip carrier plate

Abstract

The utility model relates to the technical field of chip carrier plates, and discloses a portable chip carrier plate, which comprises a frame body, a chip carrier plate is arranged in the frame body, a positioning groove is formed in the top of the frame body, a positioning block is fixedly connected to one side, close to the positioning groove, of the chip carrier plate, and the surface of the positioning block is slidably connected with the interior of the positioning groove. A power groove is formed in the frame body, the section of the power groove is in a [shape, a mounting frame is slidably connected into the power groove, and the section of the mounting frame is in an L shape. According to the portable chip carrier plate, a worker enables a power column to rotate, and after a pull rope is wound around the power column, the pull rope drives the mounting frame to slide out of the interior of the mounting groove; therefore, the chip carrier plate is more convenient to mount and dismount, and the situation that a worker needs to use a professional tool to screw a screw for multiple times when dismounting the chip carrier plate is reduced to a certain extent, so that the dismounting speed of the chip carrier plate is increased to a certain extent.

Description

Technical Field

[0001] The utility model relates to the technical field of chip carriers, and specifically relates to a portable chip carrier. Background Art

[0002] A chip carrier is a kind of circuit board, and the names of circuit boards include: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, printed circuit board, PCB board, aluminum substrate, high-frequency board, thick copper board, impedance board, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit miniaturization and visualization of the circuit board play an important role in the mass production of fixed circuits and the optimization of power distribution.

[0003] At present, most of the existing chip carriers are installed and fixed by screws. Due to the large number of screws, a lot of screws need to be disassembled and assembled during the disassembly and assembly process, and the steps are cumbersome. It often takes a lot of time and energy for workers to complete the disassembly and assembly work of the chip carrier. Moreover, the chip carrier is easily damaged during the process of screwing the screws, which increases the labor intensity of the workers to a certain extent and makes the loading and unloading of the chip carrier more troublesome. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a portable chip carrier to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A portable chip carrier, including a frame body. A chip carrier is arranged inside the frame body. A positioning groove is opened at the top of the frame body. A positioning block is fixedly connected to one side of the chip carrier close to the positioning groove. The surface of the positioning block is slidably connected to the inside of the positioning groove. A power groove is opened inside the frame body. The cross-section of the power groove is in a C shape. An installation frame is slidably connected to the inside of the power groove. The cross-section of the installation frame is in an L shape. An installation groove is opened on one side of the positioning block close to the installation frame. A spring is fixedly connected to one side of the installation frame away from the installation groove. The end of the spring away from the installation frame is fixedly connected to the inner wall of the power groove. The side of the installation frame close to the installation groove is inserted into the inside of the installation groove.

[0006] By adopting the above technical solution, the installation frame slides out of the inside of the installation groove, so that the installation and disassembly of the chip carrier are more convenient, and to a certain extent, it reduces the situation that workers need to use professional tools to screw the screws multiple times when disassembling the chip carrier.

[0007] As a further description of the above technical solution: A power column extending to the outside of the frame body is rotatably connected to the inside of the power groove. A pull rope is fixedly connected to the outer surface of the power column. The end of the pull rope away from the power column is fixedly connected to the surface of the installation frame. A slope is arranged at the top of the installation frame.

[0008] By adopting the above technical solution, the pull rope is wound around the power column, so that the pull rope can drive the mounting frame to move.

[0009] As a further description of the above technical solution: both sides of the chip carrier are fixedly connected with a protective layer, and the lower surface of the inner part of the frame is fixedly connected with a support block.

[0010] By adopting the above technical solution, the chip carrier can be protected to a certain extent by the protective layer.

[0011] As a further description of the above technical solution: a heat dissipation hole extending to the inside of the frame is opened at the bottom of the frame.

[0012] By adopting the above technical solution, air in the external environment can enter the interior of the frame more smoothly through the heat dissipation holes, and dissipate heat from the frame.

[0013] As a further description of the above technical solution: the bottom of the chip carrier is fixedly connected with a first reinforcement block and a second reinforcement block, the cross-sections of the first reinforcement block and the second reinforcement block are both V-shaped, the first reinforcement block and the second reinforcement block form a W shape, and a heat sink is arranged at the bottom of the chip carrier.

[0014] By adopting the above technical solution, a plurality of triangles are formed by the first reinforcing block, the second reinforcing block and the chip carrier, so that the first reinforcing block and the second reinforcing block can more stably support the chip carrier, thereby making the installation of the chip carrier more stable.

[0015] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0016] 1. The portable chip carrier is a chip carrier in which a worker rotates a power column so that a pull rope is wound around the power column. The pull rope drives the mounting frame to slide out of the mounting groove, thereby making the installation and removal of the chip carrier more convenient and, to a certain extent, reducing the need for workers to use professional tools to twist the screws multiple times when removing the chip carrier, thereby improving the removal speed of the chip carrier.

[0017] 2. The portable chip carrier has the first reinforcing block and the second reinforcing block made of the same rubber material. The first reinforcing block, the second reinforcing block and the chip carrier form a plurality of triangles, so that the first reinforcing block and the second reinforcing block can support the chip carrier more stably, thereby making the installation of the chip carrier more stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0019] Figure 2Structural schematic diagram of the power slot of the present utility model;

[0020] Figure 3 Structural schematic diagram of the frame structure of the present utility model;

[0021] Figure 4 For the present utility model Figure 3 Enlarged structural schematic diagram of A in it.

[0022] In the figure: 1. Frame; 2. Chip carrier board; 3. Positioning block; 4. Positioning slot; 5. Power column; 6. Installation slot; 7. Installation frame; 8. Pull rope; 9. Power slot; 10. Spring; 11. Protective layer; 12. Support block; 13. First strengthening block; 14. Second strengthening block; 15. Heat sink; 16. Heat dissipation hole. Specific implementation manner

[0023] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0024] Please refer to Figure 1-4 As shown, a portable chip carrier board includes a frame 1. A chip carrier board 2 is arranged inside the frame 1. A positioning slot 4 is opened at the top of the frame 1. A positioning block 3 is fixedly connected to one side of the chip carrier board 2 close to the positioning slot 4. The surface of the positioning block 3 is slidably connected to the inside of the positioning slot 4. A power slot 9 is opened inside the frame 1. The cross-section of the power slot 9 is in a C shape. An installation frame 7 is slidably connected to the inside of the power slot 9. The cross-section of the installation frame 7 is in an L shape. An installation slot 6 is opened on one side of the positioning block 3 close to the installation frame 7. One side of the installation frame 7 close to the installation slot 6 is inserted into the inside of the installation slot 6. The installation frame 7 can slide into and out of the inside of the installation slot 6. A spring 10 is fixedly connected to one side of the installation frame 7 away from the installation slot 6. One end of the spring 10 away from the installation frame 7 is fixedly connected to the inner wall of the power slot 9. By moving the installation frame 7, the spring 10 can be compressed and reset.

[0025] Furthermore, a power column 5 extending outside the frame 1 is rotatably connected to the inside of the power slot 9. A pull rope 8 is fixedly connected to the outer surface of the power column 5. One end of the pull rope 8 away from the power column 5 is fixedly connected to the surface of the installation frame 7. By winding the pull rope 8 around the power column 5, the pull rope 8 can drive the installation frame 7 to move.

[0026] Furthermore, a slope is provided on the top of the mounting frame 7, so that the mounting frame 7 can slide into the power slot 9 when the positioning block 3 slides into the positioning slot 4. When the positioning block 3 moves to a certain position, the spring 10 exerts force on the mounting frame 7, so that the mounting frame 7 slides into the mounting slot 6, and the chip carrier 2 is installed and fixed. After the staff rotates the power column 5 and the pull rope 8 is wrapped around the power column 5, the pull rope 8 drives the mounting frame 7 to slide out of the mounting slot 6, thereby making the installation and disassembly of the chip carrier 2 more convenient, and to a certain extent reduces the need for the staff to use professional tools to twist the screws multiple times when disassembling the chip carrier 2, thereby improving the disassembly speed of the chip carrier 2 to a certain extent.

[0027] Furthermore, both sides of the chip carrier 2 are fixedly connected with a protective layer 11 , and the material of the protective layer 11 is a rubber layer. The chip carrier 2 can be protected to a certain extent by the protective layer 11 .

[0028] Furthermore, a support block 12 is fixedly connected to the lower surface of the frame 1 , and the chip carrier 2 can be supported by the support block 12 . The material of the support block 12 is also rubber.

[0029] Furthermore, a heat dissipation hole 16 extending into the interior of the frame 1 is opened at the bottom of the frame 1 , and the heat dissipation hole 16 allows air in the external environment to enter the interior of the frame 1 more smoothly and dissipate heat from the frame 1 .

[0030] Furthermore, the bottom of the chip carrier 2 is fixedly connected with a first reinforcing block 13 and a second reinforcing block 14, the cross-sections of the first reinforcing block 13 and the second reinforcing block 14 are both V-shaped, and the first reinforcing block 13 and the second reinforcing block 14 form a W-shape. The material of the first reinforcing block 13 and the second reinforcing block 14 is also rubber. A plurality of triangles are formed by the first reinforcing block 13, the second reinforcing block 14 and the chip carrier 2, so that the first reinforcing block 13 and the second reinforcing block 14 can more stably support the chip carrier 2, thereby making the installation of the chip carrier 2 more stable.

[0031] Furthermore, a heat sink 15 is provided at the bottom of the chip carrier 2. The heat sink 15 is an existing structure and will not be described in detail herein. The heat sink 15 can transfer and dissipate the heat generated by the chip carrier 2 more smoothly.

[0032] Working principle: When the portable chip carrier is in use, the positioning block 3 slides into the positioning groove 4, so that the mounting frame 7 can slide into the power groove 9. When the positioning block 3 moves to a certain position, the spring 10 acts on the mounting frame 7 to make the mounting frame 7 slide into the mounting groove 6, and the chip carrier 2 is installed and fixed. The staff rotates the power column 5, and after the pull rope 8 is wrapped around the power column 5, the pull rope 8 drives the mounting frame 7 to slide out of the mounting groove 6, so that the installation and disassembly of the chip carrier 2 is more convenient. The first reinforcing block 13, the second reinforcing block 14 and the chip carrier 2 form multiple triangles, so that the first reinforcing block 13 and the second reinforcing block 14 can support the chip carrier 2 more stably, so that the installation of the chip carrier 2 is more stable.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A portable chip carrier, comprising a frame (1), characterized in that: Inside the housing (1), a chip carrier board (2) is provided. A positioning groove (4) is formed at the top of the housing (1). A positioning block (3) is fixedly connected to one side of the chip carrier board (2) close to the positioning groove (4). The surface of the positioning block (3) is slidably connected to the inside of the positioning groove (4). A power groove (9) is formed inside the housing (1). The cross-section of the power groove (9) is in a C shape. An installation frame (7) is slidably connected to the inside of the power groove (9). The cross-section of the installation frame (7) is in an L shape. An installation groove (6) is formed on one side of the positioning block (3) close to the installation frame (7). A spring (10) is fixedly connected to the side of the installation frame (7) away from the installation groove (6). The end of the spring (10) away from the installation frame (7) is fixedly connected to the inner wall of the power groove (9).

2. A portable chip carrier according to claim 1, characterized in that: The side of the installation frame (7) close to the installation groove (6) is inserted into the inside of the installation groove (6).

3. The portable chip carrier according to claim 1, characterized in that: A power column (5) extending to the outside of the housing (1) is rotatably connected to the inside of the power groove (9). A pull rope (8) is fixedly connected to the outer surface of the power column (5). The end of the pull rope (8) away from the power column (5) is fixedly connected to the surface of the installation frame (7).

4. The portable chip carrier according to claim 1, characterized in that: The top of the installation frame (7) is provided with an inclined surface.

5. The portable chip carrier according to claim 1, characterized in that: Protective layers (11) are fixedly connected to both sides of the chip carrier board (2).

6. The portable chip carrier according to claim 1, characterized in that: Support blocks (12) are fixedly connected to the lower surface inside the housing (1).

7. The portable chip carrier according to claim 1, characterized in that: Heat dissipation holes (16) extending to the inside of the housing (1) are formed at the bottom of the housing (1).

8. The portable chip carrier according to claim 1, characterized in that: A first reinforcement block (13) and a second reinforcement block (14) are fixedly connected to the bottom of the chip carrier board (2). The cross-sections of the first reinforcement block (13) and the second reinforcement block (14) are both in a V shape. The first reinforcement block (13) and the second reinforcement block (14) form a W shape. Heat sinks (15) are provided at the bottom of the chip carrier board (2).

Images