Multifunctional gateway shell

Abstract

The utility model discloses a multifunctional gateway housing, which relates to the gateway housing field, and comprises a housing, the upper end of the housing is provided with a top cover, the left end and the right end of the housing are respectively provided with a heat radiation groove, the left inner wall of the housing is provided with a heat radiation part, the lower end of the top cover is provided with a moving part, and the moving part is provided with a heat radiation groove. A heat conduction part is arranged at the lower end of the moving part. According to the utility model, the heat conduction part is arranged to dissipate heat of the circuit board, and heat generated by the circuit board is conducted to external air, so that the heat can be discharged in time, thereby reducing the working temperature of the circuit board, being beneficial to preventing the circuit board from being overheated, keeping the circuit board within a safe working temperature range, ensuring the service life of the circuit board, and improving the working efficiency. And the position of the heat conduction part can be adjusted by arranging the moving part, so that the device is conveniently suitable for circuit boards of different models, and the application range of the device is widened.

Description

Technical Field

[0001] The utility model relates to the field of gateway shells, in particular to a multifunctional gateway shell. Background Art

[0002] The gateway housing is an external protective shell used to protect and wrap the network gateway device, usually made of durable materials such as metal or plastic. It is designed to provide adequate protection to prevent external environmental factors from damaging the gateway device or affecting its normal operation. The gateway housing usually has a reasonable structural design and good sealing performance to ensure that the internal electronic components are protected from external factors such as dust, water vapor, vibration, etc. In addition, the gateway housing may also have a heat dissipation hole design to maintain the normal temperature inside the device, and is usually equipped with appropriate interfaces and holes for connecting other devices or interfaces. In summary, the gateway housing plays a vital role in protecting the safe and stable operation of the gateway device.

[0003] The prior art (publication number: CN 214507108 U) discloses a multifunctional gateway housing, including a gateway housing, antennas rotatably matched with the gateway housing are respectively connected to the two sides of the gateway housing, a hanging rod is arranged between the antennas, an opening is formed at the top of the antenna, and the end of the hanging rod is inserted into the opening of the antenna;

[0004] Although the above patent allows the network cable and power cord to be inserted at multiple angles, and even if the gateway housing is lifted, the network cable and power cord do not need to be bent, thereby extending their service life, there are the following disadvantages. Since the gateway device generates a certain amount of heat during operation, if there are not sufficient internal heat dissipation measures, the heat cannot be effectively discharged, resulting in excessive temperature of the device. The high temperature environment will accelerate the aging of electronic components, reduce their lifespan, and may cause equipment failure or performance degradation. Further improvement is needed. For this reason, we propose a multifunctional gateway housing. Utility Model Content

[0005] The main purpose of the utility model is to provide a multifunctional gateway housing, which can effectively solve the problems in the background technology.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] A multifunctional gateway shell comprises a shell, wherein a top cover is arranged at the upper end of the shell, heat dissipation grooves are opened at the left and right ends of the shell, a heat dissipation component is arranged on the left inner wall of the shell, a moving component is arranged at the lower end of the top cover, and a heat conducting component is arranged at the lower end of the moving component.

[0008] Preferably, the heat-conducting component includes a connecting plate, a U-shaped plate is installed at the front and rear ends of the connecting plate, a silicone pad is installed at the lower end of the U-shaped plate, and a plurality of heat sinks distributed in a linear array are installed on the lower inner wall of the U-shaped plate, and a through groove is opened at the left end of each of the heat sinks.

[0009] Preferably, the movable component includes a first guide rail, two of which are provided and distributed front to back, the two first guide rails are installed at the lower end of the top cover, the outer surfaces of the two first guide rails are movably sleeved with a slide plate, the lower end of the slide plate has two first screw rods internally sleeved, and the lower end of the slide plate is installed with two left and right distributed second guide rails, the outer surfaces of the second guide rails are movably sleeved with a slider, the slider has a second screw rod internally sleeved, and two telescopic rods are installed at the lower end of the slider, and the outer surfaces of the two telescopic rods are movably sleeved with springs.

[0010] Preferably, the connecting plate is mounted on the lower ends of the two telescopic rods.

[0011] Preferably, the heat dissipation component includes a fixed block, two of which are arranged on the left inner wall of the outer shell, a fan is arranged between the two fixed blocks, the internal threaded sleeve of the upper fixed block is provided with a screw, the internal movable sleeve of the lower fixed block is provided with a guide rod, and the outer surface fixed sleeve of the screw is provided with a knob.

[0012] Preferably, the screw rod is movably connected between the upper portion of the front inner wall and the upper portion of the rear inner wall of the shell, and the guide rod is fixedly connected between the lower portion of the front inner wall and the lower portion of the rear inner wall of the shell.

[0013] Preferably, the fan is located on the right side of the left heat dissipation slot.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] 1. The circuit board can be cooled by setting up heat-conducting components. When in use, the silicone pad contacts the heating part of the circuit board, transfers the heat to the U-shaped plate and the heat sink for heat dissipation, increases the heat dissipation area, and conducts the heat generated by the circuit board to the outside air, so that the heat can be discharged in time, thereby reducing the working temperature of the circuit board. This helps prevent the circuit board from overheating, keeps the circuit board within a safe working temperature range, ensures its life, and reduces the problem of failure or performance degradation;

[0016] 2. The position of the heat-conducting component can be adjusted by setting a movable component. When in use, the horizontal position of the silicone pad can be adjusted by sliding the slide plate left and right, and the vertical position of the silicone pad can be adjusted by sliding the slider back and forth, so that the silicone pad is located above the high-heating component, which is convenient for different types of circuit boards and improves the application range of the device;

[0017] 3. The heat dissipation efficiency can be improved by setting up the heat dissipation components. When in use, turn on the power of the fan, and the airflow generated by the fan can effectively accelerate the heat transfer, quickly bring out the heat inside the equipment and on the U-shaped plate and heat sink, making the heat dissipation effect more rapid and effective. At the same time, turn the knob to drive the screw to rotate, and adjust the vertical position of the fan to ensure that the fan is directly facing the heat-conducting components, maximize the delivery of cold air to the surface of the heat-conducting components, improve the heat dissipation effect, effectively reduce the temperature of the equipment, and improve the functionality of the shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the entire structure proposed in this embodiment;

[0019] Figure 2 Schematic diagram of the internal structure of this embodiment;

[0020] Figure 3 Schematic diagram of the structure of the heat conducting component in this embodiment;

[0021] Figure 4 Schematic diagram of the structure of the moving parts in this embodiment;

[0022] Figure 5 Schematic diagram of the structure of the heat dissipation component in this embodiment;

[0023] In the figure: 1. shell; 2. heat sink; 3. top cover; 4. moving part; 5. heat-conducting part; 6. heat-dissipating part; 7. circuit board; 51. U-shaped plate; 52. silicone pad; 53. heat sink; 54. through groove; 55. connecting plate; 41. first guide rail; 42. slide plate; 43. first screw rod; 44. second guide rail; 45. slider; 46. second screw rod; 47. telescopic rod; 48. spring; 61. screw rod; 62. knob; 63. fixing block; 64. fan; 65. guide rod. DETAILED DESCRIPTION

[0024] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0025] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] like Figure 1-Figure 5 As shown, a multifunctional gateway housing comprises a housing 1, a top cover 3 is arranged at the upper end of the housing 1, the housing 1 is detachably connected to the top cover 3 by screws, heat dissipation grooves 2 are arranged at the left and right ends of the housing 1, a heat dissipation component 6 is arranged on the left inner wall of the housing 1, a moving component 4 is arranged at the lower end of the top cover 3, and a heat conducting component 5 is arranged at the lower end of the moving component 4.

[0028] In order to prevent the circuit board 7 from overheating and keep the circuit board 7 within a safe operating temperature range, the heat dissipation of the circuit board 7 can be carried out through the heat-conducting component 5. The specific structure is as follows: the heat-conducting component 5 includes a connecting plate 55, and a U-shaped plate 51 is installed at the front and rear ends of the connecting plate 55. A silicone pad 52 is installed at the lower end of the U-shaped plate 51. The silicone pad 52 is used to transfer heat. A plurality of heat sinks 53 distributed in a linear array are installed on the lower inner wall of the U-shaped plate 51. A through groove 54 is opened at the left end of each of the heat sinks 53. The through groove 54 is used to facilitate air to enter the heat sink 53 and increase the heat dissipation area.

[0029] If circuit boards 7 of different sizes are installed in the gateway housing, and the heating element is not under the silicone pad 52, in order to facilitate the application of circuit boards 7 of different models and improve the application range of the device, the position of the heat-conducting component 5 can be adjusted by the moving component 4. The specific structure is as follows: the moving component 4 includes a first guide rail 41, two first guide rails 41 are provided and distributed front and back, and the two first guide rails 41 are both installed at the lower end of the top cover 3. The outer surfaces of the two first guide rails 41 are jointly sleeved with a slide plate 42, and the lower end of the slide plate 42 is internally threaded with two first screws 43. The lower end of the slide plate 42 is provided with two left and right divided The second guide rail 44 of the cloth, the outer surface of the second guide rail 44 is movably sleeved with a slider 45, the internal thread sleeve of the slider 45 is provided with a second screw 46, two telescopic rods 47 are installed at the lower end of the slider 45, the outer surfaces of the two telescopic rods 47 are movably sleeved with springs 48, and the connecting plate 55 is installed at the lower end of the two telescopic rods 47. The spring 48 and the telescopic rod 47 are used to facilitate the upward and downward extension of the heat-conducting component 5. The first screw 43 and the second screw 46 are used to fix the slide plate 42 and the slider 45. When fixed, the first screw 43 is in movable contact with the lower end of the top cover 3, and the second screw 46 is in movably contact with the lower end of the slider 45.

[0030] The heat dissipation efficiency can be improved by the heat dissipation component 6, and the specific structure is as follows: the heat dissipation component 6 includes a fixed block 63, two fixed blocks 63 are provided, and the two fixed blocks 63 are both arranged on the left inner wall of the shell 1, and a fan 64 is commonly arranged between the two fixed blocks 63, the internal threaded sleeve of the upper fixed block 63 is provided with a screw rod 61, the internal movable sleeve of the lower fixed block 63 is provided with a guide rod 65, the outer surface fixed sleeve of the screw rod 61 is provided with a knob 62, the screw rod 61 is movably connected between the upper part of the front inner wall and the upper part of the rear inner wall of the shell 1, the guide rod 65 is fixedly connected between the lower part of the front inner wall and the lower part of the rear inner wall of the shell 1, and the fan 64 is located on the right side of the left heat dissipation slot 2.

[0031] The utility model proposes a multifunctional gateway housing. When in use, the circuit board 7 is installed in the housing 1. According to the position of the high-heat-generating element of the circuit board 7, the lateral position of the silicone pad 52 is adjusted by sliding the slide plate 42 left and right, and the vertical position of the silicone pad 52 is adjusted by sliding the slider 45 forward and backward, so that the silicone pad 52 is located above the high-heat-generating element. Then, the first screw 43 and the second screw 46 are tightened to fix the positions of the slide plate 42 and the slider 45, and the top cover 3 is connected to the housing 1, so that the silicone pad 52 is in contact with the high-heat-generating element of the circuit board 7, and the silicone pad 52 transfers heat to the U-shaped plate 51 and The heat sink 53 dissipates heat, increases the heat dissipation area, and conducts the heat generated by the circuit board 7 to the external air to prevent the circuit board 7 from overheating. The power of the fan 64 is turned on, and the airflow generated by the fan 64 can effectively accelerate the transfer of heat, and quickly bring out the heat inside the equipment and on the U-shaped plate 51 and the heat sink 53, so that the heat dissipation effect is faster and more effective. At the same time, the knob 62 is turned to drive the screw rod 61 to rotate, and the screw rod 61 adjusts the vertical position of the fan 64 through the upper fixing block 63 to ensure that the fan 64 directly faces the heat-conducting component 5, and blows cold air to the surface of the heat-conducting component 5 to the maximum extent.

[0032] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A multifunctional gateway housing, comprising a housing (1), characterized in that: The upper end of the housing (1) is provided with a top cover (3), the left end and the right end of the housing (1) are provided with heat dissipation grooves (2), the left inner wall of the housing (1) is provided with a heat dissipation component (6), the lower end of the top cover (3) is provided with a moving component (4), and the lower end of the moving component (4) is provided with a heat conduction component (5); The heat-conducting component (5) comprises a connecting plate (55), a U-shaped plate (51) is installed at the front and rear ends of the connecting plate (55), a silicone pad (52) is installed at the lower end of the U-shaped plate (51), a plurality of heat sinks (53) distributed in a linear array are installed on the lower inner wall of the U-shaped plate (51), and a through groove (54) is provided at the left ends of the plurality of heat sinks (53); The moving component (4) comprises a first guide rail (41), wherein two first guide rails (41) are provided and are distributed front to back, and the two first guide rails (41) are both mounted on the lower end of the top cover (3), and the outer surfaces of the two first guide rails (41) are movably sleeved with a slide plate (42), and the lower ends of the slide plates (42) are internally threaded with two first screw rods (43), and the lower ends of the slide plates (42) are mounted with two second guide rails (44) distributed left to right, and the outer surfaces of the second guide rails (44) are movably sleeved with a slider (45), and the internal threads of the sliders (45) are internally threaded with a second screw rod (46), and the lower ends of the sliders (45) are mounted with two telescopic rods (47), and the outer surfaces of the two telescopic rods (47) are both movably sleeved with springs (48).

2. A multifunctional gateway housing according to claim 1, characterized in that: The connecting plate (55) is mounted on the lower ends of the two telescopic rods (47).

3. A multifunctional gateway housing according to claim 1, characterized in that: The heat dissipation component (6) comprises a fixed block (63), two of which are provided, and the two fixed blocks (63) are both provided on the left inner wall of the housing (1), a fan (64) is provided between the two fixed blocks (63), a screw rod (61) is provided on the internal thread sleeve of the upper fixed block (63), a guide rod (65) is provided on the internal movable sleeve of the lower fixed block (63), and a knob (62) is provided on the outer surface of the screw rod (61).

4. A multifunctional gateway housing according to claim 3, characterized in that: The screw rod (61) is movably connected between the upper part of the front inner wall and the upper part of the rear inner wall of the shell (1), and the guide rod (65) is fixedly connected between the lower part of the front inner wall and the lower part of the rear inner wall of the shell (1).

5. A multifunctional gateway housing according to claim 4, characterized in that: The fan (64) is located on the right side of the left heat dissipation slot (2).

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