PCB with dustproof structure

Abstract

The utility model provides a PCB with a dustproof structure, and relates to the technical field of PCBs, the PCB comprises a heat dissipation baffle plate, one side of the heat dissipation baffle plate is provided with a support air bag, the inside of the support air bag is fixedly connected with a heat conduction rubber rod and a flexible heat conduction pad, and one end of the flexible heat conduction pad is fixedly provided with a heat insulation support frame. The PCB has the advantages that the heat dissipation sealing structures capable of being rotationally adjusted are arranged at the two ends of the protection structure at one end of the PCB, the air bag structures capable of deforming along with temperature change are arranged on one sides of the heat dissipation sealing structures, and heat is transmitted into the air bag structures through the heat conduction structures according to the internal temperature of the PCB; the air bag structure pushes the heat dissipation sealing structure to rotate, the position of the heat dissipation sealing structure is adjusted, heat dissipation plates capable of overturning in a reciprocating mode can be formed at the two ends of the protection structure along with adjustment of the position of the heat dissipation sealing structure, and the heat dissipation efficiency is improved through airflow driven in the reciprocating overturning process.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB boards, in particular to a PCB board with a dustproof structure. Background Art

[0002] The PCB board body is the provider of electrical connections for electronic components, and its design is mainly layout design; the main advantage of using circuit boards is that it greatly reduces wiring and assembly errors, improves the level of automation and production labor rate, and the PCB board body has developed from single-layer to double-layer, multi-layer and flexible boards, and is constantly developing towards high precision, high density and high reliability. In addition, it is constantly reducing the size, reducing costs and improving performance, so that the printed circuit board will still maintain a strong vitality in the development of future electronic products. When the current PCB board is in use, it is easy to stick to dust in the air. As the use time increases, more dust accumulation will cause short circuits on the PCB board, so the PCB board needs to be dustproof.

[0003] CN202222907153.7 introduces a PCB board with a dustproof structure, in which the circuit board body is installed in a protective frame on the bottom plate, and then the dust cover is fixed to the opening of the protective frame through a fixing component to form a closed environment, thereby achieving the effect of dustproofing the circuit board body, preventing excessive dust from adhering to the circuit board body and affecting the heat dissipation of the circuit board body, and preventing excessive dust from causing a short circuit in the circuit board body. This application provides a new protective structure for dustproofing PCB boards. Utility Model Content

[0004] Therefore, the purpose of the present invention is to provide a PCB board with a dustproof structure to solve the problems mentioned in the background technology and overcome the deficiencies in the prior art.

[0005] In order to achieve the above-mentioned purpose, an embodiment of one aspect of the utility model provides a PCB board with a dustproof structure, including a PCB board body, a protective cover covering electronic components is fixedly installed on the top of the PCB board body, both ends of the protective cover are rotatably connected with a heat dissipation baffle, a support airbag is arranged on one side of the heat dissipation baffle, a heat-conducting rubber rod and a flexible heat-conducting pad are fixedly connected to the interior of the support airbag, a heat-insulating support frame is fixedly installed on one end of the flexible heat-conducting pad, and a heat-insulating support frame is movably connected to a heat-conducting platform on one end of the heat-insulating support frame.

[0006] Preferably, any of the above schemes has a plurality of connection holes formed inside the PCB body, and a fixing groove matched with the protective cover is formed at one end of the PCB body.

[0007] By adopting the above technical solution, the components installed on the PCB are fixed through the connection holes, and the installed components are covered and protected by the protective cover, thereby improving the safety of the components.

[0008] Preferably, any of the above schemes has heat dissipation grooves adapted to the heat dissipation baffles at both ends of the protective cover, and a mounting groove adapted to the support airbag is provided at one end of the heat dissipation groove.

[0009] The above technical solution is adopted: the PCB board and its corresponding components inside the protective cover are cooled through the heat dissipation groove, and the heat dissipation groove is sealed and protected by a heat dissipation baffle. At the same time, a mounting groove is set on one side of the heat dissipation groove to facilitate the fixation of the support airbag.

[0010] Preferably, any of the above schemes is that rotation shafts are provided at both ends of the heat dissipation baffle, and the heat dissipation baffle is rotatably connected to the protective cover via the rotation shafts.

[0011] The above technical solution is adopted: the heat dissipation baffle can be rotated inside the heat dissipation slot by rotating the shaft, and the gas flow driven by the rotation of the heat dissipation baffle is used to accelerate the heat dissipation efficiency of the PCB board.

[0012] Preferably, from any of the above schemes, the supporting airbag comprises a mounting seat and a pushing airbag, the mounting seat is fixedly mounted inside the protective cover, a pushing airbag is fixedly mounted on one end of the mounting seat, and the pushing airbag is in contact with the heat dissipation baffle.

[0013] By adopting the above technical solution, the propulsion airbag is fixed by a mounting seat, the propulsion airbag and the protective cover can be connected and fixed, and the inside of the propulsion airbag is filled with inert gas, so that the gas inside the propulsion airbag expands due to heat and pushes the heat dissipation baffle to move.

[0014] Preferably, any of the above schemes is that the thermally conductive rubber rod and the thermally insulating support frame penetrate and push the airbag, a slot adapted to the flexible thermally conductive pad is provided inside the thermally insulating support frame, and the length of the thermally conductive rubber rod is less than that of the thermally insulating support frame.

[0015] The above technical solution is adopted: the flexible thermal pad is supported and fixed by a heat-insulating support frame, and the heat is conducted by using a heat-conducting rubber rod and the flexible thermal pad to transfer the heat to the gas inside the propulsion airbag.

[0016] Preferably, any of the above schemes is that the heat-conducting platform is fixedly mounted on one end of the PCB board body, and a movable groove adapted to the heat-conducting rubber rod and the flexible heat-conducting pad is provided inside the heat-conducting platform.

[0017] The above technical solution is adopted: the heat conduction platform is connected to the PCB board to gather the heat on the PCB board. When the heat-conducting rubber rod and the flexible heat-conducting pad are located inside the movable groove, they are connected to the heat-conducting platform to conduct the heat, and the airbag is pushed to expand due to heat, driving the heat-conducting rubber rod to move. The heat-conducting rubber rod is pulled out from the inside of the heat-conducting platform to reduce the rate of heat conduction, which pushes the airbag to cool down and shrink after the airbag dissipates heat itself, and the heat-conducting rubber rod is inserted into the movable groove to conduct heat again.

[0018] Compared with the prior art, the advantages and beneficial effects of the utility model are:

[0019] 1. A heat dissipation sealing structure that can be rotated and adjusted is arranged at both ends of the protective structure at one end of the PCB board, and an airbag structure that can be deformed with temperature changes is arranged on one side of the heat dissipation sealing structure. The heat is transferred to the inside of the airbag structure by using the heat conduction structure according to the internal temperature of the PCB board, and the volume of the airbag structure is controlled to change, so that the airbag structure pushes the heat dissipation sealing structure to rotate, and the position of the heat dissipation sealing structure is adjusted. With the adjustment of the position of the heat dissipation sealing structure, heat dissipation plates that can be flipped back and forth can be formed at both ends of the protective structure, and the airflow driven by the reciprocating flipping process is used to increase the heat dissipation efficiency, and the sealing structure can effectively improve the dustproof performance.

[0020] 2. A heat-conducting structure capable of gathering the heat inside the PCB is set inside the protective structure, so as to facilitate heat conduction and heat dissipation inside the PCB and improve the utilization efficiency of heat.

[0021] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0023] Figure 1 It is a structural schematic diagram according to an embodiment of the utility model;

[0024] Figure 2 It is a schematic diagram of a local structure according to an embodiment of the utility model;

[0025] Figure 3 This is a schematic diagram of the structure of a heat dissipation baffle according to an embodiment of the utility model;

[0026] Figure 4 It is a schematic diagram of the structure of the support airbag according to an embodiment of the utility model;

[0027] Among them: 1-PCB board body, 2-protective cover, 3-heat dissipation baffle, 4-support airbag, 41-mounting seat, 42-pushing airbag, 5-thermal rubber rod, 6-flexible thermal pad, 7-thermal insulation support frame, 8-thermal platform, 9-connecting hole, 10-heat dissipation slot, 11-mounting slot, 12-rotating shaft, 13-movable slot. DETAILED DESCRIPTION

[0028] The present invention is further described below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following description.

[0029] like Figure 1-4 As shown, a PCB board with a dustproof structure in an embodiment of the utility model includes a PCB board body 1, a protective cover 2 covering electronic components is fixedly installed on the top of the PCB board body 1, both ends of the protective cover 2 are rotatably connected with heat dissipation baffles 3, a support air bag 4 is arranged on one side of the heat dissipation baffle 3, a heat conductive rubber rod 5 and a flexible heat conductive pad 6 are fixedly connected inside the support air bag 4, a heat insulating support frame 7 is fixedly installed on one end of the flexible heat conductive pad 6, and a heat conductive platform 8 is movably connected to one end of the heat insulating support frame 7.

[0030] Preferably, any of the above solutions includes a plurality of connection holes 9 formed inside the PCB body 1 , and a fixing groove matched with the protective cover 2 formed at one end of the PCB body 1 .

[0031] By adopting the above technical solution, the components installed on the PCB are fixed through the connecting holes 9, and the installed components are covered and protected by the protective cover 2, thereby improving the safety of the components.

[0032] Preferably, any of the above schemes has heat dissipation grooves 10 adapted to the heat dissipation baffle 3 at both ends of the protective cover 2 , and a mounting groove 11 adapted to the support airbag 4 is provided at one end of the heat dissipation groove 10 .

[0033] The above technical solution is adopted: the PCB board and its corresponding components inside the protective cover 2 are cooled through the heat dissipation groove 10, and the heat dissipation groove 10 is sealed and protected by the heat dissipation baffle 3. At the same time, a mounting groove 11 is set on one side of the heat dissipation groove 10 to facilitate the fixing of the support airbag 4.

[0034] Preferably, any of the above schemes is that rotation shafts 12 are provided at both ends of the heat dissipation baffle 3, and the heat dissipation baffle 3 is rotatably connected to the protective cover 2 via the rotation shafts.

[0035] The above technical solution is adopted: the heat dissipation baffle 3 can be rotated inside the heat dissipation slot 10 by rotating the shaft 12, and the gas flow driven by the rotation of the heat dissipation baffle 3 is used to accelerate the heat dissipation efficiency of the PCB board.

[0036] Preferably, any of the above schemes includes a supporting airbag 4 including a mounting seat 41 and a pushing airbag 42. The mounting seat 41 is fixedly mounted inside the protective cover 2. The pushing airbag 42 is fixedly mounted on one end of the mounting seat 41. The pushing airbag 42 fits the heat dissipation baffle 3.

[0037] By adopting the above technical solution: the pushing airbag 42 is fixed by the mounting seat 41, the pushing airbag 42 and the protective cover 2 can be connected and fixed, and the inside of the pushing airbag 42 is filled with inert gas, so that the gas inside the pushing airbag 42 expands due to heat and pushes the heat dissipation baffle 3 to move.

[0038] Preferably, any of the above schemes passes through the heat-conducting rubber rod 5 and the heat-insulating support frame 7 to push the airbag 42 , a slot matching the flexible heat-conducting pad 6 is provided inside the heat-insulating support frame 7 , and the length of the heat-conducting rubber rod 5 is less than the length of the heat-insulating support frame 7 .

[0039] The above technical solution is adopted: the flexible thermally conductive pad 6 is supported and fixed by the heat insulating support frame 3, and the heat is conducted by the thermally conductive rubber rod 5 and the flexible thermally conductive pad 6 to transfer the heat to the gas inside the push airbag 42, wherein the thermal conduction efficiency of the thermally conductive rubber rod 5 is greater than the thermal conduction efficiency of the flexible thermally conductive pad 6.

[0040] Preferably, any of the above solutions is that the heat conducting platform 8 is fixedly mounted on one end of the PCB board body 1 , and a movable groove 13 adapted to the heat conducting rubber rod 5 and the flexible heat conducting pad 6 is provided inside the heat conducting platform 8 .

[0041] The above technical solution is adopted: the heat-conducting platform 8 is connected to the PCB board to gather the heat on the PCB board. When the heat-conducting rubber rod 5 and the flexible heat-conducting pad 6 are located inside the movable groove 13, they are connected to the heat-conducting platform 8 to conduct the heat, and the airbag 42 is pushed to expand due to the heat and drive the heat-conducting rubber rod 5 to move. The heat-conducting rubber rod 5 is pulled out from the inside of the heat-conducting platform 8 to reduce the rate of heat conduction, and the airbag 42 is pushed to cool down and shrink internally after the airbag 42 dissipates heat itself, and the heat-conducting rubber rod 5 is inserted into the movable groove 13 to conduct heat again.

[0042] The utility model provides a PCB board with a dustproof structure, and its working principle is as follows:

[0043] The heat inside the PCB board is transferred to the heat-conducting platform 8, and the heat-conducting rubber rod 5 and the flexible heat-conducting pad 6 transfer the heat gathered on the heat-conducting platform 8 to the inside of the pushing airbag 42, pushing the airbag 42 to expand and push the heat dissipation baffle 3 to rotate, while pushing the airbag 42 to drive the heat-conducting rubber rod 5 to move to one side of the heat-conducting platform 8, and pushing the airbag 42 to dissipate heat and reset it to drive the heat-conducting rubber rod 5 to reset.

[0044] Compared with the prior art, the present invention has the following beneficial effects:

[0045] 1. A heat dissipation sealing structure that can be rotated and adjusted is arranged at both ends of the protective structure at one end of the PCB board, and an airbag structure that can be deformed with temperature changes is arranged on one side of the heat dissipation sealing structure. The heat is transferred to the inside of the airbag structure by using the heat conduction structure according to the internal temperature of the PCB board, and the volume of the airbag structure is controlled to change, so that the airbag structure pushes the heat dissipation sealing structure to rotate, and the position of the heat dissipation sealing structure is adjusted. With the adjustment of the position of the heat dissipation sealing structure, heat dissipation plates that can be flipped back and forth can be formed at both ends of the protective structure, and the airflow driven by the reciprocating flipping process is used to increase the heat dissipation efficiency, and the sealing structure can effectively improve the dustproof performance.

[0046] 2. A heat-conducting structure capable of gathering the heat inside the PCB is set inside the protective structure, so as to facilitate heat conduction and heat dissipation inside the PCB and improve the utilization efficiency of heat.

Claims

1. A PCB board with a dustproof structure, comprising a PCB board body (1), a protective cover (2) covering electronic components being fixedly mounted on the top of the PCB board body (1), characterized in that: The two ends of the protective cover (2) are rotatably connected to a heat dissipation baffle (3), a support air bag (4) is arranged on one side of the heat dissipation baffle (3), a heat-conducting rubber rod (5) and a flexible heat-conducting pad (6) are fixedly connected inside the support air bag (4), a heat-insulating support frame (7) is fixedly installed on one end of the flexible heat-conducting pad (6), and a heat-conducting platform (8) is movably connected to one end of the heat-insulating support frame (7).

2. A PCB board with a dustproof structure as claimed in claim 1, characterized in that: A plurality of connection holes (9) are provided inside the PCB body (1), and a fixing groove matched with the protective cover (2) is provided at one end of the PCB body (1).

3. A PCB board with a dustproof structure as claimed in claim 2, characterized in that: Both ends of the protective cover (2) are provided with heat dissipation grooves (10) adapted to the heat dissipation baffle (3), and one end of the heat dissipation groove (10) is provided with a mounting groove (11) adapted to the support airbag (4).

4. A PCB board with a dustproof structure as claimed in claim 3, characterized in that: Rotating shafts (12) are provided at both ends of the heat dissipation baffle (3), and the heat dissipation baffle (3) is rotatably connected to the protective cover (2) via the rotating shaft.

5. A PCB board with a dustproof structure as claimed in claim 4, characterized in that: The supporting airbag (4) comprises a mounting seat (41) and a pushing airbag (42); the mounting seat (41) is fixedly mounted inside the protective cover (2); one end of the mounting seat (41) is fixedly mounted with the pushing airbag (42); the pushing airbag (42) and the heat dissipation baffle (3) are in close contact with each other.

6. A PCB board with a dustproof structure as claimed in claim 5, characterized in that: The heat-conducting rubber rod (5) and the heat-insulating support frame (7) penetrate and push the airbag (42); a slot matching the flexible heat-conducting pad (6) is provided inside the heat-insulating support frame (7); and the length of the heat-conducting rubber rod (5) is smaller than the length of the heat-insulating support frame (7).

7. A PCB board with a dustproof structure as claimed in claim 6, characterized in that: The heat-conducting platform (8) is fixedly mounted on one end of the PCB board body (1), and a movable groove (13) adapted to the heat-conducting rubber rod (5) and the flexible heat-conducting pad (6) is provided inside the heat-conducting platform (8).

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