Laser processing device

By using rotatable reflective components in laser processing devices to reflect different laser beams under different states, the problem that existing equipment can only be used in a single manner is solved, and the function of cutting different materials is realized, reducing cost and space occupation.

CN222307701UActive Publication Date: 2025-01-07HANS CNC SCI & TECH
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Patent Information

Application Number
CN202420934024.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-29
Publication Date
2025-01-07
Estimated Expiration
2034-04-29

AI Technical Summary

Technical Problem

Existing laser forming equipment can only be used in a single way and cannot cut different materials at the same time. For example, picosecond lasers cannot cut copper foil, and nanosecond lasers cannot cut cover film. The purchase of two devices at the same time increases space usage and cost.

Method used

A laser processing device is designed, including a first laser, a second laser, a rotatable reflective assembly and a processing head. By reflecting different laser beams to the processing head in different states, the function of cutting different materials is realized. Reduces the number of equipment and space consumption.

Benefits of technology

The ability to cut different materials in a laser processing device is realized, reducing costs and reducing the equipment footprint and improving the applicability of the equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a laser processing device which comprises a first laser device, a second laser device, a processing head, a rotatable reflection assembly and a control card, the rotatable reflection assembly can rotate between a first state and a second state, and the control card is connected with the first laser device, the second laser device, the processing head and the rotatable reflection assembly. The control module is used for controlling the first laser, the second laser, the machining head and the rotatable reflection assembly to work. According to the laser machining device, the rotatable reflection assembly is arranged and can rotate between the first state and the second state, during machining, two laser machining modes can be achieved through conversion of the rotatable reflection assembly between the first state and the second state, two kinds of laser forming equipment do not need to be purchased, and machining efficiency is improved. The occupied space of the laser processing device is reduced, and the cost is reduced.
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Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a laser processing device. Background Art

[0002] In the existing technology, the laser forming equipment on the market can only be used in a single application. For example, the equipment for cutting cover film with picosecond laser cannot cut copper foil, and the equipment for cutting copper foil with nanosecond laser cannot cut cover film. Purchasing two types of equipment at the same time increases the occupied space and costs. Utility Model Content

[0003] In order to overcome the problems existing in the above-mentioned prior art, the main purpose of the present application is to provide a laser processing device that can reduce the occupied space and reduce the cost.

[0004] In order to achieve the above objectives, this application specifically adopts the following technical solutions:

[0005] A laser processing device, comprising:

[0006] A first laser, configured to emit a first laser beam;

[0007] a second laser, configured to emit a second laser beam;

[0008] A rotatable reflective component, the rotatable reflective component is disposed on the laser light path emitted by the first laser and the laser light path emitted by the second laser, and the rotatable reflective component can rotate between a first state and a second state;

[0009] A processing head, which is arranged on the reflected light path of the rotatable reflecting component and is used for processing a workpiece based on the laser reflected by the rotatable reflecting component;

[0010] A control card, the control card is connected to the first laser, the second laser, the processing head and the rotatable reflective component respectively, and is used to control the first laser, the second laser, the processing head and the rotatable reflective component to work;

[0011] When the rotatable reflective assembly is in the first state, the rotatable reflective assembly is capable of reflecting the first laser beam to the processing head, and when the rotatable reflective assembly is in the second state, the rotatable reflective assembly is capable of reflecting the second laser beam to the processing head.

[0012] In some embodiments, the rotatable reflective assembly includes a rotating stage and a first reflective mirror, wherein the first reflective mirror is disposed on the rotating stage, and the rotating stage is used to drive the first reflective mirror to rotate between the first state and the second state.

[0013] In some embodiments, the rotating table includes a mounting seat, a driving member and a rotating member, the rotating member is rotatably connected to the mounting seat, the first reflector is mounted on the rotating member, the driving member is mounted on the mounting seat, and the driving member is connected to the rotating member for driving the rotating member to rotate, thereby driving the first reflector to rotate between the first state and the second state.

[0014] In some embodiments, the rotating member is provided with a mounting hole, the rotatable reflective assembly further comprises a mounting bracket, the mounting bracket is disposed in the mounting hole, and the first reflector is mounted on the mounting bracket.

[0015] In some embodiments, the rotating member is provided with first scale lines, and the first scale lines are distributed along the circumference of the rotating member.

[0016] In some embodiments, the rotating platform further includes a knob, which is disposed on the mounting seat and connected to the rotating member.

[0017] In some embodiments, a second scale line is provided on the outer surface of the knob along the circumference of the knob.

[0018] In some embodiments, the laser processing device further includes a second reflector and a third reflector, wherein the second reflector is disposed on a laser light path emitted by the first laser and is used to reflect the laser beam emitted by the first laser to the first reflector;

[0019] The third reflector is disposed on the laser light path emitted by the second laser, and is used to reflect the laser light beam emitted by the second laser to the first reflector.

[0020] In some embodiments, when the first reflector is in the first state, the reflective surface of the second reflector is arranged parallel to the reflective surface of the first reflector, and when the first reflector is in the second state, the reflective surface of the third reflector is arranged parallel to the reflective surface of the first reflector.

[0021] In some embodiments, the pulse width of the first laser is different from the pulse width of the second laser so that the first laser and the second laser can cut the workpiece to be processed of different materials, the workpiece to be processed includes a first material and a second material covering and attached to the first material, the first material includes copper foil, and the second material includes a covering film.

[0022] The present application discloses a laser processing device, which includes a first laser, a second laser, a processing head, a rotatable reflection component and a control card. The first laser is used to emit a first laser beam, and the second laser is used to emit a second laser beam. The rotatable reflection component is arranged on the laser light path emitted by the first laser and the laser light path emitted by the second laser, and the rotatable reflection component can rotate between a first state and a second state. The processing head is arranged on the reflection light path of the rotatable reflection component and is used to process a workpiece to be processed based on the laser reflected by the rotatable reflection component. The control card is respectively connected to the first laser, the second laser, the processing head and the rotatable reflection component and is used to control the operation of the first laser, the second laser, the processing head and the rotatable reflection component. When the rotatable reflection component is in the first state, the rotatable reflection component can reflect the first laser beam to the processing head. When the rotatable reflection component is in the second state, the rotatable reflection component can reflect the second laser beam to the processing head. The present application is provided with a rotatable reflective component, which can rotate between a first state and a second state. During processing, the rotatable reflective component is in the first state, and the laser beam emitted by the first laser can be reflected to the processing head through the rotatable reflective component. The rotatable reflective component is in the second state, and the laser beam emitted by the second laser can be reflected to the processing head through the rotatable reflective component. By converting the rotatable reflective component between the first state and the second state, two laser processing methods can be realized without purchasing two laser forming equipment, thereby reducing the space occupied by the laser processing device and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of a rotatable reflective assembly of a laser processing device provided by an embodiment of the present application in a first state;

[0024] Figure 2 A schematic diagram of a rotatable reflective assembly of a laser processing device provided by an embodiment of the present application in a second state;

[0025] Figure 3 A schematic diagram of the structure of a rotating table of a laser processing device provided in an embodiment of the present application;

[0026] Figure 4 A schematic structural diagram of a front view of a rotating table of a laser processing device provided in an embodiment of the present application;

[0027] Figure 5 A schematic diagram of a structure in which a rotating table of a laser processing device provided in an embodiment of the present application is equipped with a first reflector;

[0028] Figure 6A schematic structural diagram of another perspective of a rotating table of a laser processing device provided in an embodiment of the present application equipped with a first reflector.

[0029] Reference numerals:

[0030] 1. First laser; 2. Second laser; 3. Processing head; 4. Rotatable reflective assembly; 41. Rotating table; 410. Mounting seat; 411. Rotating member; 411a. First scale line; 411b. Mounting hole; 412. Knob; 412a. Second scale line; 42. First reflector; 420. First reflective surface; 421. Second reflective surface; 43. Mounting bracket; 5. Control card; 6. Second reflector; 7. Third reflector. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0032] In the description of this application, unless otherwise clearly specified and limited, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" refers to two or more, and the term "multiple" refers to two or more; the terms "connected", "fixed", etc. should be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0033] In the description of this specification, it should be understood that the directional words such as "upper" and "lower" described in the embodiments of the present application are described at the angles shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should also be understood that when it is mentioned that an element is connected to another element "upper" or "lower", it can not only be directly connected to another element "upper" or "lower", but also indirectly connected to another element "upper" or "lower" through an intermediate element.

[0034] Reference Figure 1 and Figure 2 As shown, Figure 1 A schematic diagram of a rotatable reflective component of a laser processing device provided in an embodiment of the present application in a first state, Figure 2A schematic diagram of a rotatable reflective component of a laser processing device provided in an embodiment of the present application in a second state. This embodiment discloses a laser processing device. The laser processing device includes a first laser 1, a second laser 2, a processing head 3, a rotatable reflective component 4 and a control card 5, wherein the first laser 1 is used to emit a first laser beam, and the second laser 2 is used to emit a second laser beam. The rotatable reflective component 4 is arranged on the laser light path emitted by the first laser 1 and the laser light path emitted by the second laser 2, and the rotatable reflective component 4 can rotate between the first state and the second state. The processing head 3 is arranged on the reflection light path of the rotatable reflective component 4, and is used to process a workpiece to be processed based on the laser reflected by the rotatable reflective component 4, wherein the workpiece to be processed includes a first material and a second material covered and bonded to the first material, the first material includes copper foil, etc., the second material includes a covering film, etc., and the workpiece to be processed can be a flexible printed circuit board (Full name in English: Flexible Printed Circuit, abbreviated as: FPC), etc. The control card 5 is connected to the first laser 1, the second laser 2, the processing head 3 and the rotatable reflective component 4 respectively. The control card 5 is used to control the opening and closing of the first laser 1, the second laser 2 and the processing head 3, and to control the rotation of the rotatable reflective component 4 between the first state and the second state. When the rotatable reflective component 4 is in the first state, the rotatable reflective component 4 can reflect the first laser beam to the processing head 3, and when the rotatable reflective component 4 is in the second state, the rotatable reflective component 4 can reflect the second laser beam to the processing head 3, wherein the first direction is Figure 1 The X direction in the second direction is Figure 1 in the Y direction.

[0035] In this embodiment, the pulse width of the first laser 1 is different from the pulse width of the second laser 2, so that the first laser 1 and the second laser 2 can cut different materials. For example, the first laser 1 is a picosecond laser, which is used to cut thinner materials such as plastic, glass, etc., and the second laser 2 is a nanosecond laser, which is used to cut thicker materials such as metal plates, ceramics, etc., thereby improving the applicability of the laser processing device. It can be understood that in other embodiments, the first laser 1 and the second laser 2 can also be other lasers.

[0036] This embodiment is provided with a rotatable reflection component 4, and the rotatable reflection component 4 can rotate between a first state and a second state. During processing, the rotatable reflection component 4 is in the first state, and the laser beam emitted by the first laser 1 can be reflected to the processing head 3 through the rotatable reflection component 4. The rotatable reflection component 4 is in the second state, and the laser beam emitted by the second laser 2 can be reflected to the processing head 3 through the rotatable reflection component 4. By transforming the rotatable reflection component 4 between the first state and the second state, two laser processing methods can be realized without purchasing two laser forming equipment, thereby reducing the occupied space of the laser processing device and reducing the cost.

[0037] Reference Figure 3 , Figure 4 and Figure 5 As shown, Figure 3 This is a schematic diagram of the structure of the rotating table of the laser processing device provided in the embodiment of the present application. Figure 4 This is a schematic structural diagram of a rotating table of a laser processing device provided in an embodiment of the present application from a front view. Figure 5 A schematic diagram of a structure in which a rotating table of a laser processing device provided in an embodiment of the present application is equipped with a first reflector. The rotatable reflective assembly 4 includes a rotating table 41, a first reflector 42 and a mounting bracket 43. The rotating table 41 includes a mounting seat 410, a driving member and a rotating member 411. The rotating member 411 is rotatably connected to the mounting seat 410, and the rotating member 411 is provided with a first scale line 411a and a mounting hole 411b. The first scale line 411a is distributed along the circumference of the rotating member 411 for detecting the rotation angle of the rotating member 411. The mounting bracket 43 is provided in the mounting hole 411b, and the first reflector 42 is mounted on the mounting bracket 43. The driving member is installed on the mounting seat 410, and the driving member is connected to the rotating member 411, and is used to drive the rotating member 411 to rotate, so as to drive the first reflector 42 to rotate between the first state and the second state.

[0038] In this embodiment, the driving member is a motor, and the rotating table 41 is driven by the motor. The motor drive can accurately control the speed and position of the movement, thereby improving the accuracy of the rotation angle of the rotating member 411. It can be understood that in other embodiments, the rotating table 41 can also be replaced by a rotating cylinder.

[0039] In this embodiment, the rotating table 41 also includes a worm wheel and a worm, the worm is connected to the driving member, the worm wheel is connected to the worm, and the rotating member 411 is connected to the worm wheel. When driving, the driving member drives the worm to rotate to drive the worm wheel to move, and the movement of the worm wheel drives the rotating member 411 to rotate. The rotation of the rotating member 411 drives the first reflector 42 to rotate between the first state and the second state. The worm wheel transmission structure has low noise and a certain stability, which improves the stability of the first reflector 42 rotating between the first state and the second state. It can be understood that in other embodiments, the rotating table 41 can also be driven to rotate by other transmission methods.

[0040] In this embodiment, the rotating platform 41 further includes a knob 412, which is disposed on the mounting seat 410 and connected to the rotating member 411. A second scale line 412a is provided on the outer surface of the knob 412 along the circumference of the knob 412, and the second scale line 412a is used to detect the rotation angle of the knob 412, thereby detecting the rotation angle of the rotating member 411. The knob 412 is used to fine-tune the rotating member 411 to ensure the accuracy of the rotation angle of the first reflector 42.

[0041] Reference Figure 5 As shown, the rotating table 41 is placed in a vertical state, that is, the rotating member 411 rotates around a first direction. At this time, the first reflector 42 is provided with a first reflective surface 420. When the first reflector 42 is in the first state, the laser beam emitted by the first laser 1 is reflected to the processing head 3 through the first reflective surface 420. When the rotating table 41 rotates around the first direction by a preset angle so that the first reflector 42 is in the second state, the laser beam emitted by the second laser 2 is reflected to the processing head 3 through the first reflective surface 420.

[0042] Reference Figure 6 As shown, Figure 6 A schematic diagram of the structure of the rotating table of the laser processing device provided in the embodiment of the present application equipped with a first reflector from another perspective. In other embodiments, the rotating table 41 is placed in a horizontal state, that is, the rotating member 411 rotates around the second direction. At this time, the first reflector 42 is provided with a first reflective surface 420 and a second reflective surface 421. When the first reflector 42 is in the first state, the laser beam emitted by the first laser 1 is reflected to the processing head 3 through the first reflective surface 420. When the first reflector 42 is in the second state, the laser beam emitted by the second laser 2 is reflected to the processing head 3 through the second reflective surface 421.

[0043] Reference Figure 1 and Figure 2As shown, the laser processing device further includes a second reflector 6 and a third reflector 7. The second reflector 6 is arranged on the laser light path emitted by the first laser 1, and is used to reflect the laser beam emitted by the first laser 1 to the first reflector 42. The third reflector 7 is arranged on the laser light path emitted by the second laser 2, and is used to reflect the laser beam emitted by the second laser 2 to the first reflector 42.

[0044] When the first reflector 42 is in the first state, the reflective surface of the second reflector 6 is arranged parallel to the reflective surface of the first reflector 42. When the first reflector 42 is in the second state, the reflective surface of the third reflector 7 is arranged parallel to the reflective surface of the first reflector 42. In the first direction, the angle A between the first reflector 42 and the first direction is 45°, the angle B between the second reflector 6 and the first direction is 45°, and the angle C between the third reflector 7 and the first direction is 45°, so as to ensure that the first reflector 42, the second reflector 6 and the third reflector 7 are arranged in a stacked manner in the second direction, thereby reducing the lateral occupied space of the laser processing device.

[0045] In this embodiment, in the first direction, the angle A between the first reflector 42 and the first direction is 45°, the angle B between the second reflector 6 and the first direction is 45°, and the angle C between the third reflector 7 and the first direction is 45°. It can be understood that in other embodiments, in the first direction, the angle between the first reflector 42 and the first direction can also be other angles, such as 30°. At this time, the angle B between the second reflector 6 and the first direction and the angle C between the third reflector 7 and the first direction can be set according to the positions of the second reflector 6, the third reflector 7, the first laser 1 and the second laser 2.

[0046] In a specific application scenario, when processing by the first laser 1 is required, the control card 5 is used to control the rotation of the rotating table 41 so that the first reflector 42 is in the first state, and then the control card 5 controls the first laser 1 to be turned on, and the laser beam emitted by the first laser 1 is reflected to the first reflector 42 through the second reflector 6, and then reflected to the processing head 3 through the first reflector 42, so that the workpiece is processed by the first laser 1; when processing by the second laser 2 is required, the control card 5 is used to control the rotation of the rotating table 41 so that the first reflector 42 is in the second state, and then the control card 5 controls the second laser 2 to be turned on, and the laser beam emitted by the second laser 2 is reflected to the first reflector 42 through the third reflector 7, and then reflected to the processing head 3 through the first reflector 42, so that the workpiece is processed by the second laser 2, thereby realizing two laser processing methods.

[0047] The above is only a preferred specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A laser processing device, characterized in that: include: A first laser, configured to emit a first laser beam; a second laser, configured to emit a second laser beam; A rotatable reflective component, the rotatable reflective component is disposed on the laser light path emitted by the first laser and the laser light path emitted by the second laser, and the rotatable reflective component can rotate between a first state and a second state; A processing head, which is arranged on the reflected light path of the rotatable reflecting component and is used for processing a workpiece based on the laser reflected by the rotatable reflecting component; A control card, the control card is connected to the first laser, the second laser, the processing head and the rotatable reflective component respectively, and is used to control the first laser, the second laser, the processing head and the rotatable reflective component to work; When the rotatable reflective assembly is in the first state, the rotatable reflective assembly is capable of reflecting the first laser beam to the processing head, and when the rotatable reflective assembly is in the second state, the rotatable reflective assembly is capable of reflecting the second laser beam to the processing head; Wherein, the workpiece to be processed comprises a first material and a second material covering and laminating the first material, the first material comprises a copper foil, and the second material comprises a covering film; The pulse width of the first laser is different from the pulse width of the second laser, so that the first laser and the second laser can cut the workpiece to be processed made of different materials.

2. The laser processing device according to claim 1, characterized in that: The rotatable reflective assembly includes a rotating platform and a first reflective mirror. The first reflective mirror is disposed on the rotating platform. The rotating platform is used to drive the first reflective mirror to rotate between the first state and the second state.

3. The laser processing device according to claim 2, characterized in that: The rotating platform includes a mounting seat, a driving member and a rotating member, the rotating member is rotatably connected to the mounting seat, the first reflector is mounted on the rotating member, the driving member is mounted on the mounting seat, and the driving member is connected to the rotating member for driving the rotating member to rotate, so as to drive the first reflector to rotate between the first state and the second state.

4. The laser processing device according to claim 3, characterized in that: The rotating member is provided with a mounting hole, and the rotatable reflecting assembly further comprises a mounting bracket, the mounting bracket is arranged in the mounting hole, and the first reflecting mirror is mounted on the mounting bracket.

5. The laser processing device according to claim 3, characterized in that: The rotating member is provided with first scale lines, and the first scale lines are distributed along the circumference of the rotating member.

6. The laser processing device according to claim 3, characterized in that: The rotating platform further comprises a knob, which is arranged on the mounting seat and connected to the rotating member.

7. The laser processing device according to claim 6, characterized in that: A second scale line is provided on the outer surface of the knob along the circumference of the knob.

8. The laser processing device according to claim 2, characterized in that: The laser processing device further includes a second reflector and a third reflector, wherein the second reflector is disposed on a laser light path emitted by the first laser and is used to reflect the laser light beam emitted by the first laser to the first reflector; The third reflector is disposed on the laser light path emitted by the second laser, and is used to reflect the laser light beam emitted by the second laser to the first reflector.

9. The laser processing device according to claim 8, characterized in that: When the first reflector is in the first state, the reflective surface of the second reflector is arranged parallel to the reflective surface of the first reflector, and when the first reflector is in the second state, the reflective surface of the third reflector is arranged parallel to the reflective surface of the first reflector.