Pressing device for integrated circuit packaging

Abstract

The utility model discloses a pressing device for integrated circuit packaging, and relates to the technical field of integrated circuit packaging. The hot-pressing device comprises a bearing table and a hot-pressing assembly, the bearing table comprises a rotating disc, hot pressing plates arranged on the edge of the rotating disc in a circumferential array mode and limiting strips elastically arranged on the upper side faces of the hot pressing plates through elastic pieces. The hot-pressing assembly comprises a bottom plate, a support fixed to the upper side face of the bottom plate, a machine base fixed to the inner side of the end of the support, an air cylinder fixed to the middle of the upper side face of the machine base, an upper-layer plate fixed to the telescopic end of the air cylinder, a lower-layer plate connected with the upper-layer plate through a buffering piece and a mold frame fixed to the middle of the lower side face of the lower-layer plate. And the hot pressing cutter is fixed in the mold frame. The bag opening of the integrated circuit packaging bag is restrained through the elastic piece, it is ensured that hot pressing can be accurately conducted on the bag opening of the integrated circuit packaging bag in the hot pressing process, the rotating disc drives the multiple hot pressing plates to rotate circularly, the bag opening of the integrated circuit packaging bag is continuously pressed and packaged, and the pressing and packaging efficiency of the integrated circuit packaging bag is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of integrated circuit packaging, in particular to a pressing device for integrated circuit packaging. Background Art

[0002] Integrated circuit boards are usually packaged in insulating plastic bags. For example, the existing public patent (publication number CN 211196820 U) discloses a clamping device for integrated circuit packaging, including a base, a lower mounting platform is arranged on the upper end surface of the base, a crossbeam is arranged on the upper end of the rear end surface of the base, a mounting groove is arranged in the middle of the upper end surface of the lower mounting platform, and the lower end of the crossbeam is directly opposite to the upper end of the mounting groove. The beneficial effects are as follows: the utility model realizes packaging by one installation and one hot pressing by setting the pressure block and the hot pressing plate, greatly reducing the traditional packaging process, thereby improving the efficiency of packaging; by setting the precise position installation of the positioning column and the guide rod, a precise hot pressing process is realized to prevent the hot pressing plate from causing squeezing damage to the integrated circuit board.

[0003] During use, the above-mentioned pressing device is affected by the feeding structure, resulting in a long interval of pressing processing, which reduces the efficiency of integrated circuit board packaging. To this end, we provide a pressing device for integrated circuit packaging to solve the above-mentioned problems. Utility Model Content

[0004] The utility model aims to provide a clamping device for integrated circuit packaging, which solves the problem of low processing efficiency of the existing clamping device for integrated circuit packaging by continuously and efficiently conveying the integrated circuit board packaging bag through the carrier.

[0005] In order to solve the above technical problems, the utility model is realized by the following technical solutions:

[0006] The utility model discloses a pressing device for integrated circuit packaging, comprising a carrier for placing integrated circuit packaging bags under hot pressing, and a hot pressing assembly for pressing the integrated circuit packaging bags; the carrier comprises a turntable, a hot pressing plate arranged in a circumferential array at the edge of the turntable, a limit strip elastically arranged on the side surface of the hot pressing plate via an elastic member, and a limit groove opened on the upper side surface of the turntable; the hot pressing assembly comprises a bottom plate, a pressing table fixed to the side surface of the bottom plate, a limit plate fixed to one side of the pressing table, a bracket fixed to the side surface of the bottom plate, a machine base fixed to the inner side of the end of the bracket, a cylinder fixed to the middle part of the upper side surface of the machine base, an upper plate fixed to the telescopic end of the cylinder, a lower plate connected to the upper plate via a buffer, a mold frame fixed to the middle position of the lower side surface of the lower plate, and a hot pressing knife fixed inside the mold frame.

[0007] The utility model is further configured that a turntable is fixed on the upper side of the bottom plate, and the rotating shaft of the turntable is fixed to the turntable.

[0008] The utility model is further configured such that the hot pressing plate matches the upper side surface of the limiting plate, and the limiting plate is located directly below the hot pressing knife.

[0009] The utility model is further configured that a shell is fixed on the outside of the machine base, and a guide rod is movably provided through the upper part of the upper side surface of the machine base, and the bottom of the guide rod is fixed on the upper side of the upper plate.

[0010] The utility model is further configured such that the side edges of the upper plate and the lower plate are attached to the inner wall of the shell, and the lower part of the shell is opened.

[0011] The utility model is further configured that the lower side surface of the hot pressing knife is in a convex shape, and the hot pressing knife is externally connected to a heating circuit.

[0012] The utility model is further configured that the limiting groove is internally provided with an integrated circuit packaging bag, and the bag opening is clamped and arranged on the side surface of the limiting strip and the hot pressing plate.

[0013] The utility model has the following beneficial effects:

[0014] 1. The utility model places the integrated circuit packaging bag by setting a carrier platform and uses elastic parts to constrain the bag opening of the integrated circuit packaging bag, ensuring that the bag opening of the integrated circuit packaging bag can be accurately hot-pressed during the hot pressing process. At the same time, the turntable drives the circulation of several hot pressing plates to continuously press and seal the bag opening of the integrated circuit packaging bag, thereby improving its pressing and sealing efficiency.

[0015] 2. The utility model provides buffer protection for the mold frame and the hot pressing knife by arranging an elastic member between the upper plate and the lower plate, and can increase the stress between the hot pressing knife and the bag opening of the integrated circuit packaging bag, thereby increasing the degree of compression of the integrated circuit packaging bag. The telescopic end of the cylinder drives the upper plate downward, and the upper plate drives the lower plate and the mold frame fixed to the lower plate to move through the buffer member, and the hot pressing knife fixed to the mold frame moves downward until it contacts the side surface of the limit plate, thereby compressing and encapsulating the integrated circuit packaging bag.

[0016] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 The figure is a schematic diagram of the overall structure of a clamping device for integrated circuit packaging.

[0019] Figure 2 The present invention is a schematic diagram of the structure of a carrier platform of a clamping device for integrated circuit packaging.

[0020] Figure 3 The present invention is a schematic diagram of the structure of a hot pressing component of a pressing device for integrated circuit packaging.

[0021] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0022] 1. Carrying platform; 11. Turntable; 12. Limiting groove; 13. Hot pressing plate; 14. Limiting strip; 15. Elastic part; 2. Hot pressing assembly; 21. Bottom plate; 22. Pressing platform; 23. Limiting plate; 24. Bracket; 25. Shell; 26. Cylinder; 27. Guide rod; 28. Hot pressing knife; 29. ​​Mold rack; 210. Lower plate; 211. Machine base; 212. Buffer; 213. Upper plate. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. Specific embodiment 1

[0025] See also Figure 1 and Figure 2 The utility model is a clamping device for integrated circuit packaging, comprising a carrier 1 for hot pressing and placing an integrated circuit packaging bag, wherein the carrier 1 comprises a turntable 11, a hot pressing plate 13 arranged in a circumferential array at the edge of the turntable 11, a limiting strip 14 elastically arranged on the upper side of the hot pressing plate 13 via an elastic member 15, and a limiting groove 12 opened on the upper side of the turntable 11.

[0026] Specifically, in the pressing device for integrated circuit packaging involved in the present application, the carrier platform 1 is provided to place the integrated circuit packaging bag, and the elastic member 15 is used to constrain the bag opening of the integrated circuit packaging bag, thereby ensuring that the bag opening of the integrated circuit packaging bag can be accurately hot-pressed during the hot pressing process. At the same time, the turntable 11 drives the circular rotation of the plurality of hot pressing plates 13 to continuously press and seal the bag opening of the integrated circuit packaging bag, thereby improving its pressing and sealing efficiency.

[0027] Furthermore, a turntable is fixed on the upper side of the bottom plate 21 , and the rotation axis of the turntable is fixed to the turntable 11 .

[0028] Specifically, the turntable structure fixed on the upper side of the bottom plate 21 is used to drive the rotation of the turntable 11 to achieve the cyclic rotation of the plurality of hot pressing plates 13 . Specific embodiment 2

[0030] See also Figure 1 and Figure 3 On the basis of the specific embodiment 1, a pressing device for integrated circuit packaging includes a hot pressing assembly 2 for pressing an integrated circuit packaging bag, wherein the hot pressing assembly 2 includes a bottom plate 21, a pressing platform 22 fixed to the upper side of the bottom plate 21, a limiting plate 23 fixed to one side of the pressing platform 22, a bracket 24 fixed to the upper side of the bottom plate 21, a machine base 211 fixed to the inner side of the end of the bracket 24, a cylinder 26 fixed to the middle of the upper side of the machine base 211, an upper plate 213 fixed to the telescopic end of the cylinder 26, a lower plate 210 connected to the upper plate 213 via a buffer 212, a mold frame 29 fixed to the middle position of the lower side of the lower plate 210, and a hot pressing knife 28 fixed inside the mold frame 29.

[0031] Specifically, in the clamping device for integrated circuit packaging involved in the present application, a hot pressing component 2 is set to compress and package the bag mouth of the integrated circuit packaging bag. During the packaging process, the cylinder 26 is started, and the telescopic end of the cylinder 26 drives the upper plate 213 to press down. The upper plate 213 drives the lower plate 210 and the mold frame 29 fixed to the lower plate 210 to move through the buffer member 212, and the hot pressing knife 28 fixed to the mold frame 29 moves downward until it contacts the upper side of the limit plate 23, thereby compressing and packaging the integrated circuit packaging bag.

[0032] Furthermore, the hot pressing plate 13 cooperates with the upper side surface of the limiting plate 23, and the limiting plate 23 is located directly below the hot pressing knife 28; a shell 25 is fixed to the outside of the machine base 211, and a guide rod 27 is movably provided through the upper part of the upper side surface of the machine base 211, and the bottom of the guide rod 27 is fixed to the upper side of the upper plate 213; the side edges of the upper plate 213 and the lower plate 210 are attached to the inner wall of the shell 25, and the lower part of the shell 25 is opened.

[0033] Specifically, the limit plate 23 supports the hot pressing plate 13 and assists the hot pressing knife 28 to press the bag opening on the hot pressing plate 13. The guide rod 27 is used to balance the movement of the upper plate 213. During the movement of the upper plate 213 and the lower plate 210, their sides are constrained by the outer shell 25 and rise and fall linearly along the inner side of the outer shell 25.

[0034] Furthermore, the lower side of the hot pressing knife 28 is in the shape of a convex point, and the hot pressing knife 28 is externally connected to a heating circuit; the limiting groove 12 has an integrated circuit packaging bag built in, and its bag opening is clamped and arranged on the upper side of the limiting strip 14 and the hot pressing plate 13.

[0035] Specifically, the convex dot structure arranged on the lower side of the hot pressing knife 28 is used to form a tear line at the seal of the integrated circuit packaging bag during the hot pressing process, so as to facilitate the subsequent opening of the integrated circuit packaging bag. After the integrated circuit packaging bag is placed inside the limiting groove 12, the overall positioning of the integrated circuit packaging bag and the integrated circuit board is achieved to avoid the displacement of the pressing position caused by the movement of the integrated circuit packaging bag during the movement.

[0036] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0037] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A pressing device for integrated circuit packaging, comprising a carrier (1) for placing an integrated circuit packaging bag under hot pressing, and a hot pressing assembly (2) for pressing the integrated circuit packaging bag; characterized in that: The support platform (1) comprises a turntable (11), a hot pressing plate (13) arranged in a circumferential array at the edge of the turntable (11), a limiting strip (14) elastically arranged on the upper side of the hot pressing plate (13) via an elastic member (15), and a limiting groove (12) opened on the upper side of the turntable (11); The hot pressing assembly (2) comprises a bottom plate (21), a pressing platform (22) fixed to the upper side of the bottom plate (21), a limiting plate (23) fixed to one side of the pressing platform (22), a bracket (24) fixed to the upper side of the bottom plate (21), a machine base (211) fixed to the inner side of the end of the bracket (24), a cylinder (26) fixed to the middle of the upper side of the machine base (211), an upper plate (213) fixed to the telescopic end of the cylinder (26), a lower plate (210) connected to the upper plate (213) via a buffer (212), a mold frame (29) fixed to the middle position of the lower side of the lower plate (210), and a hot pressing knife (28) fixed inside the mold frame (29).

2. The pressing device for integrated circuit packaging according to claim 1, characterized in that: A turntable is fixed on the upper side of the bottom plate (21), and the rotation axis of the turntable is fixed to the turntable (11).

3. The pressing device for integrated circuit packaging according to claim 1, characterized in that: The hot pressing plate (13) cooperates with the upper side surface of the limiting plate (23), and the limiting plate (23) is located directly below the hot pressing knife (28).

4. The pressing device for integrated circuit packaging according to claim 1, characterized in that: A shell (25) is fixed to the outside of the machine base (211), and a guide rod (27) is movably provided through the upper part of the upper side surface of the machine base (211), wherein the bottom of the guide rod (27) is fixed to the upper side of the upper plate (213).

5. The pressing device for integrated circuit packaging according to claim 1, characterized in that: The side edges of the upper plate (213) and the lower plate (210) are attached to the inner wall of the outer shell (25), and the lower part of the outer shell (25) is open.

6. The pressing device for integrated circuit packaging according to claim 1, characterized in that: The lower side surface of the hot pressing knife (28) is in the shape of a convex point, and the hot pressing knife (28) is externally connected to a heating circuit.

7. The pressing device for integrated circuit packaging according to claim 1, characterized in that: An integrated circuit packaging bag is built into the limiting groove (12), and the bag opening is clamped between the limiting strip (14) and the upper side of the hot pressing plate (13).

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