Heat dissipation device

Abstract

A heat dissipation device comprises a first fin unit, a second fin unit, a first heat pipe set, a second heat pipe set, a third heat pipe set and a temperature equalizing unit. The first fin unit is provided with a first concave area; the second fin unit is provided with a second concave area; the first heat pipe group is partially arranged in the first concave area and penetrates through the first fin unit and the second fin unit; the second heat pipe group is partially arranged in the first concave area and penetrates through the second fin unit; the third heat pipe group is partially arranged in the first concave area and penetrates through the second fin unit; the temperature equalizing unit is partially attached to the first heat pipe set, the second heat pipe set and the third heat pipe set in the first concave area and partially arranged in the second concave area.

Description

Technical Field

[0001] The present disclosure relates to the field of heat dissipation, and in particular to a heat dissipation device using a temperature homogenizing plate. Background Art

[0002] In accordance with modern needs, computers and various electronic devices are developing rapidly and their performance is constantly improving. However, in the process, the heat dissipation problem brought by high-performance hardware also comes along. Generally speaking, computers and various electronic devices usually use heat dissipation components to dissipate heat, such as using thermal paste or heat sinks to attach to the electronic components to be dissipated to absorb and dissipate the heat.

[0003] However, the above heat dissipation methods have limited effects, so the industry has developed heat dissipation elements that use the phase change of the working fluid to promote heat conduction. This type of heat dissipation element mainly achieves the purpose of transferring heat by the phase change and flow direction of the working fluid, but such heat dissipation elements are still unable to maintain effective and consistent heat dissipation when facing the large amount of heat energy generated by high-power processors (such as GPUs), resulting in poor overall heat dissipation efficiency.

[0004] Therefore, how to provide a heat dissipation device that can solve the above problems is one of the issues that the industry needs to overcome urgently. Utility Model Content

[0005] The purpose of the present disclosure is to provide a heat dissipation device to solve at least one of the above problems.

[0006] The present disclosure provides a heat dissipation device, comprising: a first fin unit having a first recessed area; a second fin unit having a second recessed area; a first heat pipe group, partly arranged in the first recessed area and penetrating the first fin unit and the second fin unit; a second heat pipe group, partly arranged in the first recessed area and penetrating the second fin unit; a third heat pipe group, partly arranged in the first recessed area and penetrating the second fin unit; and a temperature balancing unit, partly attached to the first heat pipe group, the second heat pipe group and the third heat pipe group in the first recessed area, and partly arranged in the second recessed area.

[0007] As in the aforementioned heat dissipation device, the temperature equalizing unit has a main body and two legs. The main body is attached to the first heat pipe group, the second heat pipe group and the third heat pipe group in the first recessed area. The two legs are respectively extended outward from one side of the main body and are spaced apart from each other and are arranged in the second recessed area.

[0008] As in the aforementioned heat dissipation device, the main body and the two legs are U-shaped.

[0009] As in the aforementioned heat dissipation device, the main body is used to contact a heat source.

[0010] As in the aforementioned heat dissipation device, the first heat pipe group includes three first heat pipes, and the three first heat pipes respectively have a first flat portion, a first bending portion and a first penetration portion connected in sequence. The first flat portion is arranged in the first recessed area and attached to the temperature averaging unit, and the first penetration portion penetrates the first fin unit and the second fin unit.

[0011] As in the aforementioned heat dissipation device, the cross section of the first flat portion is square, and the first penetration portion is in the shape of a circular tube.

[0012] As in the aforementioned heat dissipation device, the second heat pipe group includes four second heat pipes, and the four second heat pipes respectively have a second flat portion, a second bending portion and a second penetrating portion connected in sequence. The second flat portion is arranged in the first recessed area and attached to the temperature averaging unit, and the second penetrating portion penetrates the second fin unit.

[0013] As in the aforementioned heat dissipation device, the second fin unit includes four grooves, which are adjacent to the first fin unit and are used to accommodate the second bending portion.

[0014] As in the aforementioned heat dissipation device, the cross section of the second flat portion is square, and the second penetration portion is in the shape of a circular tube.

[0015] As in the aforementioned heat dissipation device, the third heat pipe group includes two third heat pipes, and the two third heat pipes respectively have a third flat portion, a third connecting portion and a third penetrating portion connected in sequence. The third flat portion is arranged in the first recessed area and attached to the temperature averaging unit, the third connecting portion is arranged in the first recessed area and adjacent to the junction of the first fin unit and the second fin unit, and the third penetrating portion penetrates the second fin unit.

[0016] As in the aforementioned heat dissipation device, the cross section of the third flat portion is square, and the third penetration portion is in the shape of a circular tube.

[0017] As in the aforementioned heat dissipation device, the first heat pipe group, the second heat pipe group and the third heat pipe group are made of copper.

[0018] As in the aforementioned heat dissipation device, the fin arrangement directions of the first fin unit and the second fin unit are the same as the heat pipe extension directions of the first heat pipe group, the second heat pipe group and the third heat pipe group.

[0019] As in the aforementioned heat dissipation device, the main body and the two legs are formed integrally with each other.

[0020] As in the aforementioned heat dissipation device, a chamber is formed inside the temperature-averaging unit, and the chamber is filled with a capillary structure, wherein the capillary structure is distributed in the chamber inside the main body and the two legs in an integrally formed manner.

[0021] In summary, by replacing the heat pipe with two legs in the heat dissipation device disclosed herein and forming a temperature averaging unit with the main body, the number of heat pipes can be reduced, thereby reducing the thermal resistance caused by welding the heat pipe to the temperature averaging unit. Secondly, the capillary structure is distributed in the chambers in the main body and the two legs in an integrated manner, which can avoid the disadvantage of the discontinuity of the capillary structure at the connection between the heat pipe and the temperature averaging unit in the 3D VC. Furthermore, the temperature averaging unit has better temperature averaging and heat dissipation efficiency than the heat pipe. When facing a large amount of heat energy generated by a high-power processor (such as a GPU), it can maintain effective and consistent heat dissipation, and the overall heat dissipation efficiency is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is an overall schematic diagram of the heat dissipation device disclosed in the present invention.

[0023] Figure 2 It is a schematic diagram of an exploded view of the heat dissipation device disclosed in the present invention.

[0024] Figure 3 for Figure 2 Schematic diagram of the cross section of the AA section line of the medium average temperature unit.

[0025] Figure 4 and Figure 5 Schematic diagram of the exploded view of some components in the heat dissipation device of the present invention from different perspectives.

[0026] The reference numerals are as follows:

[0027] 100 Heat sink

[0028] 1 First fin unit

[0029] 11. First concave area

[0030] 12 First through hole

[0031] 2 Second fin unit

[0032] 21 Second concave area

[0033] 22 Second upper through hole

[0034] 23 Second lower through hole

[0035] 24 grooves

[0036] 25 Opening

[0037] 3. First heat pipe group

[0038] 31 First Heat Pipe

[0039] 311 First flat part

[0040] 312 First bending part

[0041] 313 First Installation Department

[0042] 4. Second heat pipe group

[0043] 41 Second heat pipe

[0044] 411 Second flat part

[0045] 412 Second bending portion

[0046] 413 Second Installation Department

[0047] 5. Third heat pipe group

[0048] 51 Third heat pipe

[0049] 511 Third flat part

[0050] 512 Third connection

[0051] 513 The Third Installation Department

[0052] 6 Temperature averaging unit

[0053] 61 Body part

[0054] 62 Feet

[0055] 63 Chamber

[0056] 64 board

[0057] 65 Lower plate

[0058] 7 Module bracket

[0059] 8 Heat transfer medium DETAILED DESCRIPTION

[0060] The following describes the implementation of the present disclosure by means of specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification, and can also implement or apply the present disclosure by means of other different embodiments.

[0061] See also Figure 1 and Figure 2 The heat dissipation device 100 disclosed in the present invention includes a first fin unit 1, a second fin unit 2, a first heat pipe group 3, a second heat pipe group 4, a third heat pipe group 5 and a temperature balancing unit 6.

[0062] Further reading Figure 4 and Figure 5 The first fin unit 1 is a structure formed by arranging a plurality of fins at intervals, and has four first recessed areas 11 recessed from its top surface, and three first through holes 12 penetrating its two sides. The four first recessed areas 11 are spaced apart from each other, and the three first through holes 12 are spaced apart from each other.

[0063] The second fin unit 2 is connected to one side of the first fin unit 1. The second fin unit 2 is a structure formed by a plurality of fins arranged at intervals, and has two second recessed areas 21, two second upper through holes 22, four second lower through holes 23, four grooves 24 and three openings 25. The second recessed area 21 is formed by recessing from the top surface of the second fin unit 2 and is spaced apart from each other. The second upper through hole 22 and the second lower through hole 23 pass through the opposite sides of the second fin unit 2. The second upper through hole 22 is adjacent to the top surface of the second fin unit 2 and is spaced apart from each other. The second lower through hole 23 is adjacent to the bottom surface of the second fin unit 2 and is spaced apart from each other. The groove 24 is formed by recessing from the top surface and side surface of the second fin unit 2 and is connected to the second lower through hole 23, and is adjacent to the first fin unit 1. The opening 25 is exposed on the side surface of the second fin unit 2 and faces the first fin unit 1.

[0064] The first heat pipe group 3 is partially disposed in the first recessed area 11 and is penetrated in the first fin unit 1 and the second fin unit 2. In detail, the first heat pipe group 3 includes three first heat pipes 31, each of which has a first flat portion 311, a first bent portion 312 and a first penetration portion 313 connected in sequence, and the first flat portion 311 is connected to the first penetration portion 313 by the first bent portion 312, so that the first heat pipe 31 is roughly U-shaped as a whole. The first flat portion 311 is disposed in the first recessed area 11, and its cross-section is roughly square, thereby being roughly flush with the top surface of the first fin unit 1. The first bent portion 312 is exposed to the first fin unit 1 and is adjacent to the side of the first fin unit 1. The first penetration portion 313 is penetrated in the first through hole 12 and is roughly tubular. The first penetration portion 313 partially protrudes from the first fin unit 1 and is penetrated in the opening 25 of the second fin unit 2.

[0065] The second heat pipe group 4 is partially disposed in the first recessed area 11 and is penetrated in the second fin unit 2. In detail, the second heat pipe group 4 includes four second heat pipes 41, each of which has a second flat portion 411, a second bent portion 412 and a second penetration portion 413 connected in sequence, and the second flat portion 411 is connected to the second penetration portion 413 by the second bent portion 412. The second flat portion 411 is disposed in the first recessed area 11 and is arranged side by side with the first flat portion 311, and its cross section is roughly square, thereby being roughly flush with the top surface of the first fin unit 1. The second bent portion 412 is accommodated in the groove 24. The second penetration portion 413 is penetrated in the second lower through hole 23 and is roughly tubular.

[0066] The third heat pipe group 5 is partially disposed in the first recessed area 11 and is penetrated in the second fin unit 2. In detail, the third heat pipe group 5 includes two third heat pipes 51, each of which has a third flat portion 511, a third connecting portion 512 and a third penetrating portion 513 connected in sequence, and the third flat portion 511 is connected to the third penetrating portion 513 by the third connecting portion 512. The third flat portion 511 is disposed in the first recessed area 11 and is arranged side by side with the first flat portion 311 and the second flat portion 411, and its cross section is roughly square, thereby being roughly flush with the top surface of the first fin unit 1. The third connecting portion 512 is disposed in the first recessed area 11 and is adjacent to the junction of the first fin unit 1 and the second fin unit 2. The third penetrating portion 513 is penetrated in the second upper through hole 22 and is roughly tubular.

[0067] In one embodiment, the material of the first heat pipe group 3, the second heat pipe group 4 and the third heat pipe group 5 is copper. In another embodiment, the fin arrangement direction of the first fin unit 1 and the second fin unit 2 is the same as the heat pipe extension direction of the first heat pipe group 3, the second heat pipe group 4 and the third heat pipe group 5.

[0068] Please also read Figure 3 , the temperature averaging unit 6 is partially attached to the first heat pipe group 3, the second heat pipe group 4 and the third heat pipe group 5 of the first recessed area 11, and is partially arranged in the second recessed area 21. In detail, the temperature averaging unit 6 is formed by an upper plate 64 and a lower plate 65 assembled with each other, and a chamber 63 is formed inside, and the chamber 63 is filled with a working medium and a capillary structure. The temperature averaging unit 6 also has a main body 61 and two legs 62, and the main body 61 and the two legs 62 are formed in an integral manner. The main body 61 is attached to the first flat part 311, the second flat part 411 and the third flat part 511 of the first recessed area 11, and its size is roughly equal to the first fin unit 1. The two legs 62 are respectively extended outward from one side of the main body 61 and are spaced from each other, and are arranged in the second recessed area 21. In this embodiment, the main body 61 and the two legs 62 are roughly U-shaped as a whole, and the main body 61 is used to contact a heat source such as a display chip.

[0069] In one embodiment, the capillary structure is distributed in the cavity 63 in the main body 61 and the two leg portions 62 in an integral manner, that is, the capillary structure is roughly U-shaped as a whole.

[0070] In one embodiment, a heat-conducting medium 8 (such as a thermal pad) may be provided between the main body 61 and the heat source, and the main body 61, the foot 62, the first fin unit 1 and the second fin unit 2 may be fixed together by module brackets 7 of different shapes, and some module brackets 7 may also be provided with a heat-conducting medium 8 attached to the components around the display chip.

[0071] In summary, by replacing the heat pipe with two legs in the heat dissipation device disclosed herein and forming a temperature averaging unit with the main body, the number of heat pipes can be reduced, thereby reducing the thermal resistance caused by welding the heat pipe to the temperature averaging unit. Secondly, the capillary structure is distributed in the chambers in the main body and the two legs in an integrated manner, which can avoid the disadvantage of the discontinuity of the capillary structure at the connection between the heat pipe and the temperature averaging unit in the 3D VC. Furthermore, the temperature averaging unit has better temperature averaging and heat dissipation efficiency than the heat pipe. When facing a large amount of heat energy generated by a high-power processor (such as a GPU), it can maintain effective and consistent heat dissipation, and the overall heat dissipation efficiency is good.

[0072] The above embodiments are only used to illustrate the technical principles, features and effects of the present disclosure, and are not intended to limit the scope of implementation of the present disclosure. Those skilled in the art can modify and change the above embodiments without violating the spirit and scope of the present disclosure. However, any equivalent modifications and changes made by using the teachings of the present disclosure should still be listed in the claims.

Claims

1. A heat dissipation device, characterized in that: include: A first fin unit having a first recessed area; A second fin unit having a second recessed area; A first heat pipe group is partially disposed in the first recessed area and penetrates the first fin unit and the second fin unit; A second heat pipe group is partially disposed in the first recessed area and penetrates the second fin unit; A third heat pipe group is partially disposed in the first recessed area and penetrates the second fin unit; as well as The temperature balancing unit is partially attached to the first heat pipe group, the second heat pipe group and the third heat pipe group in the first recessed area, and is partially disposed in the second recessed area.

2. The heat dissipation device according to claim 1, characterized in that: The temperature balancing unit has a main body and two legs. The main body is attached to the first heat pipe group, the second heat pipe group and the third heat pipe group in the first recessed area. The two legs are respectively extended outward from one side of the main body and are spaced apart from each other and are arranged in the second recessed area.

3. The heat dissipation device according to claim 2, characterized in that: The main body and the two legs are U-shaped.

4. The heat dissipation device according to claim 2, characterized in that: The main body is used for contacting a heat source.

5. The heat dissipation device according to claim 1, characterized in that: The first heat pipe group includes three first heat pipes, each of which has a first flat portion, a first bending portion and a first penetration portion connected in sequence. The first flat portion is arranged in the first recessed area and attached to the temperature balancing unit, and the first penetration portion penetrates the first fin unit and the second fin unit.

6. The heat dissipation device according to claim 5, characterized in that: The cross section of the first flat portion is square, and the first penetration portion is tubular.

7. The heat dissipation device according to claim 1, characterized in that: The second heat pipe group includes four second heat pipes, each of which has a second flat portion, a second bending portion and a second penetration portion connected in sequence. The second flat portion is arranged in the first recessed area and attached to the temperature balancing unit, and the second penetration portion penetrates the second fin unit.

8. The heat dissipation device according to claim 7, characterized in that: The second fin unit includes four grooves, which are adjacent to the first fin unit and are used to accommodate the second bending portion.

9. The heat dissipation device according to claim 7, characterized in that: The cross section of the second flat portion is square, and the second penetration portion is tubular.

10. The heat dissipation device according to claim 1, characterized in that: The third heat pipe group includes two third heat pipes, and the two third heat pipes respectively have a third flat portion, a third connecting portion and a third penetrating portion connected in sequence. The third flat portion is arranged in the first recessed area and attached to the temperature averaging unit, the third connecting portion is arranged in the first recessed area and adjacent to the junction of the first fin unit and the second fin unit, and the third penetrating portion penetrates the second fin unit.

11. The heat dissipation device according to claim 10, characterized in that: The cross section of the third flat portion is square, and the third penetration portion is tubular.

12. The heat dissipation device according to claim 1, characterized in that: The first heat pipe group, the second heat pipe group and the third heat pipe group are made of copper.

13. The heat dissipation device according to claim 1, characterized in that: The fin arrangement directions of the first fin unit and the second fin unit are the same as the heat pipe extension directions of the first heat pipe group, the second heat pipe group and the third heat pipe group.

14. The heat dissipation device according to claim 2, characterized in that: The main body and the two legs are formed integrally with each other.

15. The heat dissipation device according to claim 2, characterized in that: A chamber is formed inside the temperature-averaging unit, and a capillary structure is filled in the chamber, wherein the capillary structure is distributed in the chamber inside the main body and the two legs in an integrated manner.

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