Novel heat dissipation chip capacitor
By designing a heat dissipation structure in the chip capacitor, including heat conduction plate, pin, spring and heat sink, the problem of reduced electrical performance caused by the temperature increase of the chip capacitor is solved, and better heat dissipation effect and electrical performance stability are achieved.
Patent Information
- Application Number
- CN202323351981.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-11
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2033-12-11
AI Technical Summary
The chip capacitor generates heat during use, causing temperature to rise, which in turn reduces electrical performance and may lead to rupture or damage.
A new type of heat dissipation patch capacitor is designed, using the sliding connection between the ceramic chip and the heat conduction plate, combined with components such as pins, springs, traction ropes and heat sinks to form a heat dissipation structure, improving the thermal conductivity and preventing flux from being blocked during welding.
It effectively reduces the temperature of the chip capacitor, improves its electrical performance, avoids damage caused by high temperature, and improves the contact area with the circuit board and heat dissipation effect.
Smart Images
Figure CN222319984U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of patch capacitors, in particular to a novel heat dissipation patch capacitor. Background Art
[0002] A chip capacitor is an electronic component used to store and release electric charges. A chip capacitor is composed of a ceramic chip and two conductor plates. The principle of a chip capacitor is to use the electric field between the two conductor plates to store electric charges.
[0003] With respect to the above-mentioned and existing related technologies, the inventors believe that the following defects often exist: the chip capacitor will generate a certain amount of heat during use, which will increase the temperature of the chip capacitor, thereby causing the electrical performance of the chip capacitor to deteriorate, and further causing the chip capacitor to rupture or be damaged.
[0004] Therefore, the utility model provides a novel heat dissipation chip capacitor. Utility Model Content
[0005] The utility model aims to solve the disadvantage in the prior art that the temperature of the patch capacitor increases, thereby causing the electrical performance of the patch capacitor to deteriorate, and proposes a new type of heat dissipation patch capacitor.
[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a new type of heat dissipation patch capacitor, including a ceramic chip, both ends of the ceramic chip are fixedly connected with conductor plates, the surface of the ceramic chip is provided with a heat dissipation structure, the heat dissipation structure includes a heat conducting plate, the heat conducting plate is slidably connected to the surface of the ceramic chip, two fixing plates are fixedly connected on both sides of the heat conducting plate, the surface of the fixing plate is slidably penetrated by a pin, the surface of the ceramic chip is fixedly connected with two limit frames, and the size of the limit frames is adapted to the size of the pin.
[0007] The effect achieved by the above components is: by setting up the heat dissipation structure, it is easy to dissipate the heat of the chip capacitor, avoiding the chip capacitor from overheating during use, which leads to the reduction of electrical performance and damage of the chip capacitor.
[0008] Preferably, the arc surface of the latch is sleeved with a spring, and two ends of the spring are fixedly connected to the latch and the fixing plate respectively.
[0009] The effect achieved by the above components is that the latch is inserted into the limit frame with the help of the contraction force of the spring, and the spring prevents the latch from falling off after being inserted into the limit frame.
[0010] Preferably, a traction rope is fixedly connected to the surface of the latch, and a pull ring is fixedly connected to one end of the traction rope away from the latch.
[0011] The effects achieved by the above components are: the movement of the pull ring will drive the traction rope to move, and the movement of the traction rope will drive the bolt to move, and the pull ring can facilitate pulling the traction rope and then facilitating pulling the bolt.
[0012] Preferably, a plurality of heat dissipation holes are provided on the surface of the heat conducting plate.
[0013] The effects achieved by the above components are: the heat dissipation holes further improve the heat dissipation effect of the heat conducting plate.
[0014] Preferably, a protective plate is slidably connected to the surface of the heat conducting plate, and two limit plates are rotatably connected to the surface of the heat conducting plate.
[0015] The effect achieved by the above components is: to make the limiting plate separate from the limiting of the protective plate, and then remove the protective plate from the surface of the heat conducting plate, so that the protective plate protects the heat dissipation holes, thereby avoiding the effect of the flux used for welding being blocked in the heat dissipation holes when welding the chip capacitors.
[0016] Preferably, a heat sink is fixedly connected to the surface of the ceramic chip, and the heat sink is a copper sheet.
[0017] The effect achieved by the above components is that the heat sink will fit tightly to the surface of the circuit board. Since the heat sink is a copper sheet, the copper sheet has good thermal conductivity, thereby further improving the heat dissipation effect of the chip capacitor.
[0018] In summary:
[0019] 1. In the utility model, by setting a heat dissipation structure, the heat conducting plate is placed on the surface of the ceramic chip, so that the heat conducting plate is attached to the surface of the ceramic chip, and the pin is inserted into the limiting frame, so that the heat conducting plate is limited to the surface of the ceramic chip. After the chip capacitor is soldered to the surface of the circuit board, the heat conducting plate will be attached to the surface of the circuit board, thereby increasing the contact area between the chip capacitor and the circuit board, thereby improving the heat dissipation effect of the chip capacitor. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;
[0021] Figure 2 For this utility model Figure 1 Schematic diagram of some structures in ;
[0022] Figure 3 For this utility model Figure 2 A in the enlarged view;
[0023] Figure 4 It is a structural schematic diagram of the heat conducting plate of the utility model;
[0024] Figure 5It is a structural schematic diagram of the heat sink of the utility model.
[0025] Legend: 1. Ceramic chip; 2. Conductor sheet; 3. Heat dissipation structure; 301. Heat conducting plate; 302. Fixing plate; 303. Latch; 304. Limiting frame; 305. Spring; 306. Traction rope; 307. Pull ring; 308. Heat dissipation hole; 309. Protective plate; 310. Limiting plate; 311. Heat sink. DETAILED DESCRIPTION
[0026] Reference Figure 1 As shown, the utility model provides a technical solution: a new type of heat dissipation chip capacitor, including a ceramic chip 1, both ends of the ceramic chip 1 are fixedly connected with a conductor sheet 2, and the surface of the ceramic chip 1 is provided with a heat dissipation structure 3. By setting the heat dissipation structure 3, it is convenient to dissipate the heat of the chip capacitor, and avoid the chip capacitor from being overheated during use, resulting in the electrical performance of the chip capacitor being reduced and damaged.
[0027] The specific setting and function of the heat dissipation structure 3 will be described in detail below.
[0028] Reference Figure 2 - Figure 5As shown, in this embodiment: the heat dissipation structure 3 includes a heat conducting plate 301, which is slidably connected to the surface of the ceramic chip 1, and two fixing plates 302 are fixedly connected to both sides of the heat conducting plate 301, and the surface of the fixing plate 302 is slidably penetrated by a plug 303, and the surface of the ceramic chip 1 is fixedly connected to two limit frames 304, and the size of the limit frame 304 is adapted to the size of the plug 303. The arc surface of the plug 303 is covered with a spring 305, and the two ends of the spring 305 are respectively fixedly connected to the plug 303 and the fixing plate 302. The plug 303 is inserted into the limit frame 304 by the contraction force of the spring 305, and the spring 305 can prevent the plug 303 from falling off after being inserted into the limit frame 304. A traction rope 306 is fixedly connected to the surface of the plug 303, and a pull ring 307 is fixedly connected to one end of the traction rope 306 away from the plug 303. The movement of the pull ring 307 will drive the traction rope 306 to move, and the movement of the traction rope 306 will drive the plug 303 to move. The pull ring 307 can facilitate the pulling of the traction rope 306, and then facilitate the pulling of the plug 303. A plurality of heat dissipation holes 308 are provided on the surface of the heat conducting plate 301, and the heat dissipation holes 308 can further improve the heat dissipation effect of the heat conducting plate 301. A protective plate 309 is slidably connected to the surface of the heat conducting plate 301, and two limit plates 310 are rotatably connected to the surface of the heat conducting plate 301, so that the limit plate 310 is separated from the limit of the protective plate 309, and then the protective plate 309 is removed from the surface of the heat conducting plate 301. The protective plate 309 can protect the heat dissipation holes 308, thereby preventing the solder used for welding from clogging the heat dissipation holes 308 when soldering the chip capacitor. The surface of the ceramic chip 1 is fixedly connected with a heat sink 311, which is a copper sheet. The heat sink 311 will fit tightly on the surface of the circuit board. Since the heat sink 311 is a copper sheet, the copper sheet has good thermal conductivity, thereby further improving the heat dissipation effect of the chip capacitor.
[0029] Working principle: when the chip capacitor needs to be installed on the surface of the circuit board, first pull the pull ring 307. The movement of the pull ring 307 will drive the traction rope 306 to move. The movement of the traction rope 306 will drive the pin 303 to move. The movement of the pin 303 will slide in the fixed plate 302. The pin 303 will stretch the spring 305 when sliding. At this time, the spring 305 is in a stretched state. When the pin 303 moves to a suitable position, the heat conducting plate 301 is placed on the surface of the ceramic chip 1 so that the heat conducting plate 301 fits the surface of the ceramic chip 1. Then release the pull ring 307. The pin 303 will be inserted into the limit frame 304 with the help of the contraction force of the spring 305. Then rotate the limit plate 310. When the limit plate 310 is rotated to a suitable position, put the protective plate 309 on the surface of the heat conducting plate 301 so that the protective plate 309 covers the heat dissipation holes 308 opened on the surface of the heat conducting plate 301. Then The limit plate 310 is rotated in the opposite direction. When the limit plate 310 rotates, it will slide along the surface of the protective plate 309. The limit plate 310 reaches the function of limiting the position of the limit plate 310, and then the chip capacitor is placed on the surface of the circuit board for welding. When the chip capacitor is placed on the surface of the circuit board, the heat sink 311 will fit tightly on the surface of the circuit board. Because the heat sink 311 is a copper sheet, the copper sheet has good thermal conductivity, thereby further improving the effect of heat dissipation of the chip capacitor. After the chip capacitor is welded on the surface of the circuit board, the heat conducting plate 301 will fit on the surface of the circuit board. The limit plate 310 is rotated to make the limit plate 310 disengage from the limit on the protective plate 309, and then the protective plate 309 is removed from the surface of the heat conducting plate 301. The protective plate 309 protects the heat dissipation hole 308, thereby avoiding the effect of the flux used for welding being blocked in the heat dissipation hole 308 when the chip capacitor is welded.
[0030] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.
Claims
1. A novel heat dissipation chip capacitor, comprising a ceramic chip (1), characterized in that: Conductor sheets (2) are fixedly connected to both ends of the ceramic chip (1); a heat dissipation structure (3) is provided on the surface of the ceramic chip (1); the heat dissipation structure (3) comprises a heat conducting plate (301); the heat conducting plate (301) is slidably connected to the surface of the ceramic chip (1); two fixing plates (302) are fixedly connected to both sides of the heat conducting plate (301); a plug (303) is slidably penetrated through the surface of the fixing plate (302); two limit frames (304) are fixedly connected to the surface of the ceramic chip (1); the size of the limit frames (304) is adapted to the size of the plug (303).
2. A novel heat dissipation chip capacitor according to claim 1, characterized in that: The arc surface of the latch (303) is sleeved with a spring (305), and two ends of the spring (305) are respectively fixedly connected to the latch (303) and the fixing plate (302).
3. A novel heat dissipation chip capacitor according to claim 2, characterized in that: A traction rope (306) is fixedly connected to the surface of the latch (303), and a pull ring (307) is fixedly connected to one end of the traction rope (306) away from the latch (303).
4. A novel heat dissipation chip capacitor according to claim 1, characterized in that: A plurality of heat dissipation holes (308) are provided on the surface of the heat conducting plate (301).
5. The novel heat dissipation chip capacitor according to claim 1, characterized in that: The surface of the heat conducting plate (301) is slidably connected to a protective plate (309), and the surface of the heat conducting plate (301) is rotatably connected to two limit plates (310).
6. The novel heat dissipation chip capacitor according to claim 1, characterized in that: A heat sink (311) is fixedly connected to the surface of the ceramic chip (1), and the heat sink (311) is a copper sheet.