Gas distribution device and wafer processing equipment

Abstract

The utility model provides a gas distribution device, which is applied to wafer processing equipment and comprises a main pipeline connected with a source of process gas; the number of the branch pipelines is at least two, one end of each branch pipeline is connected with the main pipeline, and the other end of each branch pipeline is correspondingly connected with one area of a gas inlet piece of a cavity of the wafer processing equipment; the branch pipeline comprises a valve, and the valve is arranged on the branch pipeline; the pressure gauges are arranged on the upstream of the valve and used for detecting the pressure value of the upstream of the valve, the number of the pressure gauges is at least two, and the pressure gauges are arranged on the branch pipelines respectively; and the controller is respectively connected with the pressure meter and the valve and is used for controlling the opening value of the valve according to the change of the pressure value of the pressure meter. The gas distribution device disclosed by the utility model can provide stable flow.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing equipment for semiconductor equipment, in particular to a gas distribution device for wafer processing equipment. Background Art

[0002] Semiconductor wafer processing equipment is a device for processing wafers. It can perform etching, thin film deposition, cleaning and other processes on the wafer surface. The above-mentioned wafer processing equipment all require the introduction of process gases during the process. However, the control of process gases (such as flow rate and flow velocity) is crucial to the process results. In the prior art, the process gases are controlled by installing a mass flow controller (MFC) in the gas pipeline.

[0003] However, during the process, when adjusting the process gas flow, the sudden flow change will cause the process gas to become unstable. When there are multiple zones at the inlet end, this problem is more serious due to the mutual influence between the zones. Utility Model Content

[0004] The utility model aims to provide a gas distribution device and wafer processing equipment, which are used to solve the problem of stable airflow control.

[0005] In order to achieve the above objectives, the utility model is implemented through the following technical solutions:

[0006] The utility model provides a gas distribution device, comprising:

[0007] a main pipeline connected to a source of process gas;

[0008] A branch pipeline, wherein there are at least two branch pipelines, one end of each branch pipeline is connected to the main pipeline, and the other end of each branch pipeline is respectively connected to a corresponding area of ​​the air inlet of the chamber of the wafer processing equipment; the branch pipeline includes a valve, and the valve is arranged on the branch pipeline;

[0009] A pressure gauge, which is arranged upstream of the valve and is used to detect the pressure value upstream of the valve. There are at least two pressure gauges, which are arranged on each branch pipeline respectively;

[0010] A controller is connected to the pressure gauge and the valve respectively, and is used to control the opening value of the valve according to the change of the pressure value of the pressure gauge.

[0011] Furthermore, the branch pipeline also includes a flow meter, which is arranged upstream of the valve, and the pressure gauge is arranged upstream of the flow meter.

[0012] Furthermore, it also includes: a distribution pipeline, and the main pipeline is connected to the branch pipelines respectively through the distribution pipeline.

[0013] Furthermore, the valve is a piezoelectric ceramic valve.

[0014] Furthermore, there are three branch pipelines.

[0015] Further, the main pipe includes a mass flow controller, and the mass flow controller is arranged on the main pipe.

[0016] Furthermore, the main pipeline also includes an upstream pressure gauge, and the upstream pressure gauge is arranged upstream of the mass flow controller.

[0017] Further, the controller is connected to the upstream pressure gauge, and the change in the pressure value is the change of the pressure gauge relative to the upstream pressure gauge.

[0018] The utility model also provides a wafer processing device, comprising:

[0019] a source storing a process gas;

[0020] a chamber for processing the wafer;

[0021] A gas distribution device, wherein the gas distribution device is the gas distribution device as described above, and the source is connected to the chamber through the gas distribution device.

[0022] Further, the chamber comprises an air inlet member, and the air inlet member is divided into at least two areas.

[0023] Furthermore, the chamber is an epitaxial chamber.

[0024] Furthermore, a pump is included, which is connected to the chamber and is used to control the pressure of wafer processing in the chamber.

[0025] Compared with the prior art, the utility model has the following advantages:

[0026] The utility model sets a valve in the branch pipeline, sets a pressure gauge upstream of the valve, uses the pressure gauge to monitor whether the pressure changes, and when the pressure changes, controls the opening value of the valve to quickly stabilize the pressure, and finally stabilizes the flow of the process gas in the branch pipeline, thereby stabilizing the process gas. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solution of the utility model, the following is a brief introduction to the drawings required for the description. Obviously, the drawings described below are an embodiment of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work:

[0028] Figure 1 A schematic diagram of the structure of the wafer processing equipment provided by the utility model;

[0029] Figure 2 This is another structural schematic diagram of the wafer processing equipment provided by the utility model. DETAILED DESCRIPTION

[0030] The scheme proposed by the utility model is further described in detail below in combination with the accompanying drawings and specific implementation methods. According to the following description, the advantages and features of the utility model will be clearer. It should be noted that the accompanying drawings adopt a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation method of the utility model. In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structure, proportion, size, etc. illustrated by the accompanying drawings of this specification are only used to match the content disclosed in the specification, so that people familiar with this technology can understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so it has no technical substantive significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effect that the utility model can produce and the purpose that can be achieved, should still fall within the scope of the technical content disclosed by the utility model.

[0031] Figure 1 FIG. 2 shows a wafer processing device of the present invention. Figure 1 As shown, the wafer processing equipment includes: a chamber 200, a source 300 and a gas distribution device 100, wherein the chamber 200 is used to process the wafer; the source 300 is connected to the chamber through the gas distribution device; and the source is used to store process gas. Optionally, the chamber 200 is at least one of an epitaxial chamber, a rapid thermal processing chamber, a CVD chamber, and an etching chamber, and the utility model takes an epitaxial chamber as an example.

[0032] The chamber 200 shown includes a chamber, an air inlet 201, and an exhaust 203. The chamber is used to accommodate wafers and perform semiconductor process on the wafers. The air inlet 201 is arranged at one end of the chamber, and the exhaust 203 is arranged at the other end of the chamber. Optionally, the air inlet 201 is divided into at least two zones, preferably, the air inlet is divided into three zones, namely zone A, zone B and zone C, so that the process gas is divided into three paths on the surface of the wafer W, and the flow rates of the three process gases can be independently controlled, thereby controlling the film deposition quality of the three zones on the surface of the wafer W.

[0033] The wafer processing equipment further includes a pump 205 , which is connected to the chamber and used to control the pressure of wafer processing in the chamber. Specifically, the pump 205 is connected to the exhaust member 203 .

[0034] During the process, the process gas is distributed from the source 300 through the gas distribution device 100 into different areas of the gas inlet 201, forming a stable flow field on the surface of the wafer W. Under the action of thermal radiation, the process gas decomposes and a uniform thin film grows on the surface of the wafer. Finally, under the control of the pump 205, the post-process process gas is extracted from the chamber through the exhaust part 203.

[0035] like Figure 1 As shown, the gas distribution device 100 includes: a main pipeline 101, a branch pipeline 103, at least one pressure gauge 104 and a controller 105.

[0036] The main pipeline 101 is connected to a source 300 of process gas;

[0037] There are at least two branch pipelines 103, one end of each of the branch pipelines is connected to the main pipeline 101, and the other end of each of the branch pipelines is respectively connected to a corresponding zone of the air inlet 201 of the chamber of the wafer processing equipment; the branch pipeline includes a valve 102, and the valve is arranged on the branch pipeline; optionally, there are three branch pipelines 103, and the three branch pipelines 103 are connected in parallel, and are respectively connected to zone A, zone B and zone C of the air inlet 201.

[0038] The pressure gauge 104 is disposed upstream of the valve and is used to detect the pressure value upstream of the valve;

[0039] A controller 105 is connected to the pressure gauge and the valve respectively, and is used to control the opening value of the valve according to the change of the pressure value of the pressure gauge.

[0040] The pressure gauge 104 of the utility model can monitor the pressure upstream of the valve in real time. When the flow is switched, the pressure gauge 104 can monitor the change in pressure. The controller adjusts the opening value of the valve according to the change in pressure, thereby reducing the pressure change at the pressure gauge, thereby quickly stabilizing the flow of the branch pipeline.

[0041] like Figure 2 As shown, the branch pipeline 103 further includes a flow meter 106, which is arranged upstream of the valve, and the pressure gauge is arranged upstream of the flow meter, and the flow meter is used to monitor the flow of the corresponding branch pipeline 103 in real time.

[0042] The gas distribution device 100 further includes a distribution pipeline 109 , through which the main pipeline 101 is connected to the branch pipelines 103 .

[0043] Optionally, the valve is a piezoelectric ceramic valve; and there are three branch pipelines, namely, corresponding to zone A, zone B and zone C of the air inlet member 201 respectively.

[0044] Optionally, the pressure gauge 104 is disposed on the main pipe.

[0045] Optionally, the pressure gauge 104 is disposed on at least one of the branch pipelines. Of course, more preferably, there are at least two pressure gauges, which are disposed on each of the branch pipelines, that is, a pressure gauge 104 is disposed on each of the branch pipelines. Compared with a pressure gauge disposed on the main line, the stability and life of the system are improved, and the pressure gauge 104 on one of the branch pipelines or multiple pressure gauges 104 can be used in combination as needed, thereby improving the precision and accuracy of the measurement.

[0046] The main pipeline 101 includes a mass flow controller 116, which is arranged in the main pipeline and used to control the flow of the main pipeline 101. There is at least one main pipeline 101, preferably, there are four main pipelines 101; and each main pipeline 101 is connected to a corresponding source 300, and the process gas includes a silicon source, a germanium source, a carrier gas, and a doping gas; the silicon source, the germanium source, the carrier gas, and the doping gas are placed in the corresponding source 300, and then collected and mixed through the four main pipelines 101.

[0047] Optionally, the pressure change can be determined based on the pressure gauge 104; of course, optionally, the pressure change can also be determined by other means, for example, the main line also includes an upstream pressure gauge (not shown in the figure), and the upstream pressure gauge is arranged upstream of the mass flow controller. The controller is connected to the upstream pressure gauge, and the change in the pressure value is the change of the pressure gauge relative to the upstream pressure gauge. That is, the opening value of the regulating valve is determined by whether the difference between the two pressure gauges changes.

[0048] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of more restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the process, method, article or device including the elements. In addition, the term "connection" herein means that A and B are directly connected, or that A and B are indirectly connected, such as A and B are connected through C, or even through more components such as C and D, and A and B can be connected in one piece, or in separate pieces, or removable or fixed. The term "optional" herein means that the technical feature can be combined or not combined with any feature in the text.

[0049] Although the content of the utility model has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the utility model. After reading the above content, various modifications and substitutions of the utility model will be obvious to those skilled in the art. Therefore, the protection scope of the utility model should be limited by the attached claims.

Claims

1. A gas distribution device, applied to wafer processing equipment, characterized in that: include: a main pipeline connected to a source of process gas; A branch pipeline, wherein there are at least two branch pipelines, one end of each branch pipeline is connected to the main pipeline, and the other end of each branch pipeline is respectively connected to a corresponding area of ​​the air inlet of the chamber of the wafer processing equipment; the branch pipeline includes a valve, and the valve is arranged on the branch pipeline; A pressure gauge, which is arranged upstream of the valve and is used to detect the pressure value upstream of the valve. There are at least two pressure gauges, which are arranged on each branch pipeline respectively; A controller is connected to the pressure gauge and the valve respectively, and is used to control the opening value of the valve according to the change of the pressure value of the pressure gauge.

2. The gas distribution device according to claim 1, characterized in that: The branch pipeline further includes a flow meter, which is arranged upstream of the valve, and the pressure gauge is arranged upstream of the flow meter.

3. The gas distribution device according to claim 2, characterized in that: Also includes: Distribution pipelines, the main pipeline is connected to the branch pipelines respectively through the distribution pipelines.

4. The gas distribution device according to claim 2, characterized in that: The valve is a piezoelectric ceramic valve.

5. The gas distribution device according to any one of claims 1 to 4, characterized in that: There are three branch pipelines.

6. The gas distribution device according to any one of claims 1 to 4, characterized in that: The main pipe includes a mass flow controller, and the mass flow controller is arranged on the main pipe.

7. The gas distribution device according to claim 6, characterized in that: The main pipeline further includes an upstream pressure gauge, and the upstream pressure gauge is arranged upstream of the mass flow controller.

8. The gas distribution device according to claim 7, characterized in that: The controller is connected to the upstream pressure gauge, and the change in the pressure value is the change of the pressure gauge relative to the upstream pressure gauge.

9. A wafer processing device, characterized in that: include: a source storing a process gas; a chamber for processing the wafer; A gas distribution device, wherein the gas distribution device is the gas distribution device as described in any one of claims 1 to 8, and the source is connected to the chamber through the gas distribution device.

10. The wafer processing equipment according to claim 9, characterized in that: The chamber includes an air inlet member which is divided into at least two zones.

11. The wafer processing equipment according to claim 9, characterized in that: The chamber is an epitaxial chamber.

12. The wafer processing equipment according to claim 9, characterized in that: A pump is also included, which is connected to the chamber and is used to control the pressure of wafer processing in the chamber.

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