Large-size flip chip cleaning device

Abstract

The utility model relates to a large-size flip chip cleaning device. The large-size flip chip cleaning device comprises a rotating mechanism, a cleaning frame, cleaning nozzles and a dryer, the rotating mechanism comprises a base, an autorotation mechanism, a rotating main shaft and a turntable; the autorotation mechanism comprises a rotating platform, a platform rotating shaft and a material clamping part; and the cleaning nozzle and the dryer are positioned in the cleaning frame. The utility model has the advantages that: (1) the continuous rotation of the turntable accelerates the flowing and replacement of water flow in the central area at the bottom of the chip, enhances the cleaning effect of soldering flux, can spin-dry residual water spots on the surface of the flip chip, and accelerates the hot air drying speed of a workpiece; and (2) the rotating platform drives the workpiece to rotate on the premise that the turntable rotates, and each connecting area of the flip chip and the substrate can be fully contacted by water flow and blown by hot air, so that the condition of incomplete cleaning or water stain is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a large-size flip chip cleaning device. Background Art

[0002] Packaging has developed rapidly in recent years, and flip-chip electronic packaging has occupied most of the chip packaging market as the mainstream packaging form. For high-end flip-chip packaging, the chip used is a combination of multiple simple chips with different functions through advanced packaging technology (such as 2.5D, 3D packaging, etc.). With the increase in the number of cores and functional complexity of such high-performance chips, more and more chips need to be integrated into one chip, so the final chip size is larger and the number of bumps is larger. After the chip is flipped, the residual flux needs to be cleaned.

[0003] When cleaning existing flip-chip products, due to the large chip size and the large number of bumps, the water flow in the center area of ​​the chip cannot flow in time, and the distance between the chip and the substrate is small. When cleaning the bottom of the chip using traditional water washing methods, there is a problem of incomplete cleaning resulting in residual flux, which in turn brings about product performance and quality problems. Utility Model Content

[0004] The utility model aims to provide a large-size flip chip cleaning device, which can solve the problem of incomplete cleaning of the bottom of the large-size flip chip and residual solder flux.

[0005] In order to achieve the above-mentioned utility model object, the utility model provides a large-size flip chip cleaning device, which is used to clean and dry a large-size flip chip workpiece 5, including a rotating mechanism, a cleaning rack, a cleaning nozzle, and a dryer;

[0006] The rotating mechanism is located in the cleaning rack, and includes a base, a self-rotating mechanism, a rotating spindle, and a turntable; the base is connected to the turntable through the rotating spindle, and the turntable is connected to the self-rotating mechanism;

[0007] The self-rotating mechanism comprises a rotating platform, a platform rotating shaft, and a material clamping member, wherein the platform rotating shaft is connected to the rotating platform, and the material clamping member is located on the top of the rotating platform;

[0008] The cleaning nozzle and the dryer are both located in the cleaning frame.

[0009] Preferably, the turntable is a hexagonal turntable, and each side of the hexagonal turntable is connected to the rotation mechanism.

[0010] As a further improvement of the utility model, a waste liquid tank is provided at the bottom of the cleaning rack, and the waste liquid tank is located below the turntable.

[0011] Preferably, the clamp is configured to position the large-size flip chip workpiece on the rotating platform.

[0012] Preferably, the rotating main shaft and the platform rotating shaft are both correspondingly connected to a driving device.

[0013] Preferably, the turntable is configured to be driven to rotate by the rotating main shaft, and the rotating platform is configured to be driven to rotate by the platform rotating shaft.

[0014] Preferably, the dryer is configured to start a hot air drying operation after the cleaning nozzle completes the cleaning operation and stops the cleaning operation.

[0015] Preferably, the turntable and the rotating platform are configured to rotate when the cleaning nozzle and the dryer are in operation.

[0016] Preferably, the turntable rotates alternately clockwise and counterclockwise.

[0017] The utility model discloses a large-size flip chip cleaning device. In the connection area between the bump of the flip chip of the workpiece and the substrate, solder flux will remain. The workpiece is positioned on a rotating platform through a clamp. The rotating main shaft is externally connected to an existing driving device. The rotating main shaft drives the turntable to rotate continuously. At the same time, the platform shaft is externally connected to the existing driving device. The rotating platform drives the workpiece to rotate continuously with the platform shaft as the center. The cleaning nozzle in the cleaning frame continuously washes the workpiece with water. After a period of continuous cleaning, the cleaning nozzle stops working, while the turntable and the rotating platform continue to rotate. At the same time, the dryer starts a hot air drying operation to dry the workpiece.

[0018] Compared with the prior art, the large-size flip chip cleaning device of the utility model has the following advantages:

[0019] (1) The continuous rotation of the turntable accelerates the flow and replacement of water in the center area of ​​the bottom of the chip, enhances the cleaning effect of the flux, and can dry the residual water stains on the surface of the flip chip, speeding up the hot air drying speed of the workpiece;

[0020] (2) The rotating platform drives the workpiece to rotate on its own under the premise of the rotation of the turntable. The various connection areas between the flip chip and the substrate can be fully contacted by the water flow and blown by the hot air, avoiding incomplete cleaning or water stains. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the structure of a large-size flip chip cleaning device of the utility model;

[0022] Figure 2 Schematic diagram of the workpiece structure;

[0023] Figure 3 It is a schematic diagram of the rotating mechanism structure;

[0024] Figure 4 It is a schematic diagram of the structure of the rotation mechanism;

[0025] Figure 5 Schematic diagram of the rotation of the rotating platform. DETAILED DESCRIPTION

[0026] The specific implementation of the utility model is further described in detail below with reference to the accompanying drawings.

[0027] like Figure 1 As shown, a large-size flip chip cleaning device of the utility model is used to clean and dry a large-size flip chip workpiece, comprising a rotating mechanism 1, a cleaning rack 2, a cleaning nozzle 3, and a dryer 4;

[0028] The rotating mechanism 1 is located in the cleaning rack 2, as shown in FIG. Figure 3 As shown, the rotating mechanism 1 includes a base 11, a self-rotating mechanism 12, a rotating main shaft 13, and a turntable 14; the base 11 is connected to the turntable 14 through the rotating main shaft 13, and the turntable 14 is connected to the self-rotating mechanism 12;

[0029] like Figure 4 As shown, the self-rotating mechanism 12 includes a rotating platform 15, a platform shaft 16, and a material clamping member 17. The platform shaft 16 is connected to the rotating platform 15, and the material clamping member 17 is located on the top of the rotating platform 15;

[0030] The cleaning nozzle 3 and the dryer 4 are both located in the cleaning frame 2 .

[0031] The utility model discloses a large-size flip chip cleaning device, such as Figure 2 As shown, the connection area between the bump 52 of the flip chip 51 of the workpiece 5 and the substrate 53 will have residual flux, the workpiece 5 is positioned on the rotating platform 15 through the clamping member 17, the rotating spindle 13 is connected to the existing driving device, the rotating spindle 13 drives the turntable 14 to rotate continuously, and the platform shaft 16 is connected to the existing driving device, such as Figure 5 As shown, the rotating platform 15 drives the workpiece 5 to rotate continuously around the platform rotating shaft 16, and the cleaning nozzle 3 in the cleaning rack 2 continuously washes the workpiece 5 with water. After a period of continuous cleaning, the cleaning nozzle 3 stops the cleaning work, while the turntable 14 and the rotating platform 15 continue to rotate, and at the same time, the dryer 4 starts the hot air drying operation to dry the workpiece 5.

[0032] The turntable 14 can rotate alternately clockwise and counterclockwise. During the actual cleaning process, the forward and reverse rotations can more quickly remove the residual water stains in the gap between the bottom of the flip chip 51 and the substrate 53.

[0033] Different shapes of the turntable 14 are designed according to actual operation requirements to match the number of products cleaned at a time. The turntable 14 is preferably a hexagonal turntable, and each side of the hexagonal turntable is connected to a self-rotating mechanism 12, which can simultaneously clean and air-dry six workpieces 5, thereby improving the efficiency of batch cleaning operations. The hexagonal structure of the turntable 14 is more stable and more suitable for the rotation requirements of the turntable 14.

[0034] A waste liquid tank 21 is provided at the bottom of the cleaning rack 2, and the waste liquid tank 21 is located below the rotating disk 14. The waste liquid tank 21 can collect the waste liquid that is thrown off and collect and process it uniformly.

[0035] The preferred embodiments of the present invention have been specifically described above, but the present invention is not limited to the described embodiments. Those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the present invention, and these equivalent modifications or substitutions are all within the scope defined by the claims of this application.

Claims

1. A large-size flip chip cleaning device, used for cleaning and drying large-size flip chip workpieces, characterized in that: It includes a rotating mechanism, a cleaning rack, a cleaning nozzle, and a dryer; The rotating mechanism is located in the cleaning rack, and includes a base, a self-rotating mechanism, a rotating spindle, and a turntable; the base is connected to the turntable through the rotating spindle, and the turntable is connected to the self-rotating mechanism; The self-rotating mechanism comprises a rotating platform, a platform rotating shaft, and a material clamping member, wherein the platform rotating shaft is connected to the rotating platform, and the material clamping member is located on the top of the rotating platform; The cleaning nozzle and the dryer are both located in the cleaning frame.

2. A large-size flip chip cleaning device as claimed in claim 1, characterized in that: The turntable is a hexagonal turntable, and each side of the hexagonal turntable is connected to the self-rotation mechanism.

3. A large-size flip chip cleaning device as claimed in claim 1, characterized in that: A waste liquid tank is provided at the bottom of the cleaning rack, and the waste liquid tank is located below the turntable.

4. A large-size flip chip cleaning device as claimed in claim 1, characterized in that: The clamp is configured to position the large-size flip chip workpiece on the rotating platform.

5. A large-size flip chip cleaning device as claimed in claim 1, characterized in that: The rotating main shaft and the platform rotating shaft are both correspondingly connected to a driving device.

6. A large-size flip chip cleaning device as claimed in claim 5, characterized in that: The turntable is configured to be driven to rotate by the rotating main shaft, and the rotating platform is configured to be driven to rotate by the platform rotating shaft.

7. A large-size flip chip cleaning device as claimed in claim 1, characterized in that: The dryer is configured to start a hot air drying operation after the cleaning nozzle completes the cleaning operation and stops the cleaning operation.

8. A large-size flip chip cleaning device as claimed in claim 6 or 7, characterized in that: The turntable and the rotating platform are configured to rotate when the cleaning nozzle and the dryer are in operation.

9. A large-size flip chip cleaning device as claimed in claim 1, characterized in that: The turntable rotates alternately clockwise and counterclockwise.

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