Wafer cutting device

Abstract

The utility model discloses a wafer cutting device which comprises a base, the upper surface of the base is fixedly connected with a mounting frame, the side surface of the mounting frame is fixedly connected with a first motor, the output end of the first motor is fixedly connected with a lead screw, the side surface of the lead screw is in threaded connection with a sleeve, and the side surface of the sleeve is in threaded connection with a second motor. And the side surface of the sleeve is fixedly connected with a guide plate. According to the structure, through cooperation of the cooling liquid box, the liquid outlet pipe, the collecting box and the filter screen, when the device cuts a wafer, cooling liquid can flow out to the cutting knife, the cutting knife is cooled, and it is avoided that the cutting knife continuously operates in a high-heat state, and the cutting precision of the cutting knife and the service life of a blade are affected; cooling liquid flowing down after cooling can wash away chippings on the placing table and flow into the collecting box together to be collected in a centralized mode, the pressure of manual cleaning is relieved, meanwhile, the cooling liquid and the chippings collected in the centralized mode are separated under the action of the filter screen, the chippings can be recycled separately, and waste is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cutting, in particular to a wafer cutting device. Background Art

[0002] Wafer dicing equipment is a device used to divide semiconductor wafers into individual chips. Common types include mechanical dicing machines and laser dicing machines. These devices play a vital role in the semiconductor manufacturing process.

[0003] When cutting a wafer, the cutting blade usually generates a lot of heat during cutting. Overheating of the cutting blade will affect the cutting accuracy and blade life. The existing cutting device lacks a cooling device for the cutting blade, which reduces the service life of the cutting blade. In addition, some debris will be generated during cutting. All of these debris will remain on the carrier plate and need to be cleaned manually in time. If you forget to clean them, it may affect the clamping of the next wafer. After searching, it was found that the technical solution provided by the utility model with application number 202320146696.3 also has the above problems. Utility Model Content

[0004] According to the described chip cutting device, the purpose of the utility model is to solve at least one of the technical problems existing in the prior art, and to provide a chip cutting device. Through the cooperation of a coolant tank, a liquid outlet pipe, a collection box and a filter screen, the device can flow the coolant onto the cutting knife when cutting the chip, so as to cool the cutting knife and avoid the cutting knife from continuously running under a high temperature state, which affects its cutting accuracy and the life of the blade. The coolant flowing down after cooling can wash away the debris on the placement table and flow into the collection box for centralized collection, thereby reducing the pressure of manual cleaning. At the same time, the centralized collected coolant and debris are separated by the action of the filter screen, so that they can be recycled separately to reduce waste.

[0005] To achieve the above-mentioned purpose, the utility model also provides the above-mentioned base, the upper surface of the base is fixedly connected with a mounting frame, the mounting frame can avoid sparks during cutting, the side surface of the mounting frame is fixedly connected with a first motor, the first motor provides power for the rotation of the lead screw, and then the cutting knife is displaced left and right, the output end of the first motor is fixedly connected with a lead screw, the side surface of the lead screw is threadedly connected with a sleeve, the side surface of the sleeve is fixedly connected with a guide plate, the side surface of the sleeve is fixedly connected with a cross block, the lower surface of the cross block is fixedly connected with a telescopic rod, and the telescopic rod can adjust the height of the cutting knife by telescoping;

[0006] The end of the telescopic rod away from the cross block is fixedly connected to a mounting plate, the upper surface of the mounting plate is movably connected to a cutting knife clamp, the upper surface of the cutting knife clamp is threadedly connected with a bolt, and the bolt enables the cutting knife to be removed for replacement to increase the service life of the device; the upper surface of the mounting frame is fixedly connected to a coolant tank, and the side surface of the coolant tank is fixedly connected to a liquid outlet pipe, through which coolant can flow out to cool the cutting knife, and after the coolant flows down to the placement table, it can wash away the debris and flow into the collection box for centralized collection; the base is movably connected to the collection box inside for centralized collection of used coolant and debris, the side inner wall of the collection box is fixedly connected to a filter for separating debris and coolant, the bottom inner wall of the base is fixedly connected to a second motor, and the output end of the second motor is fixedly connected to the placement table.

[0007] According to the wafer cutting device, the first motor is electrically connected to an external power source, and the side surface of the lead screw is rotatably connected to the mounting frame.

[0008] According to the wafer cutting device, the upper surface of the guide plate is movably connected to the mounting frame, and the lower surface of the cutting blade clamping plate is fixedly connected with the cutting blade.

[0009] According to the wafer cutting device, the side surface of the bolt is threadedly connected to the mounting plate, and the side surface of the liquid outlet pipe is fixedly connected to the mounting plate.

[0010] According to the wafer cutting device, a solenoid valve is provided inside the liquid outlet pipe, and a handle is fixedly connected to the side surface of the collection box to provide a fulcrum for a person to pull out the collection box.

[0011] According to the wafer cutting device, the side surface of the collection box is fixedly connected to a drain pipe, and a valve is provided inside the drain pipe.

[0012] According to the wafer cutting device, the second motor is electrically connected to an external power source, and the lower surface of the placement table is movably connected to the base.

[0013] According to the wafer cutting device, a clamping device is fixedly connected to the upper surface of the placement table.

[0014] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0016] Figure 1 This is a front view of a wafer cutting device according to the utility model;

[0017] Figure 2 This is a side view of a wafer cutting device of the utility model;

[0018] Figure 3 It is a partial structural exploded diagram of a wafer cutting device of the utility model;

[0019] Figure 4 It is a partial structural cross-sectional view of a wafer cutting device of the utility model.

[0020] Legend:

[0021] 1. Base; 2. Mounting frame; 3. First motor; 4. Lead screw; 5. Sleeve; 6. Guide plate; 7. Cross block; 8. Telescopic rod; 9. Mounting plate; 10. Cutting knife clamp; 11. Bolt; 12. Liquid outlet pipe; 13. Coolant tank; 14. Collecting box; 15. Filter; 16. Second motor; 17. Placement table. DETAILED DESCRIPTION

[0022] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0023] Reference Figure 1-4 The utility model embodiment provides a wafer cutting device, which includes a base 1, the upper surface of the base 1 is fixedly connected with a mounting frame 2, the mounting frame 2 can avoid sparks during cutting, the side surface of the mounting frame 2 is fixedly connected with a first motor 3, the first motor 3 provides power for the rotation of a lead screw 4, thereby causing the cutting knife to move left and right, the output end of the first motor 3 is fixedly connected with the lead screw 4, the first motor 3 is electrically connected to an external power supply, the side surface of the lead screw 4 is rotatably connected to the mounting frame 2, the side surface of the lead screw 4 is threadedly connected with a sleeve 5, the side surface of the sleeve 5 is fixedly connected with a guide plate 6, the side surface of the sleeve 5 is fixedly connected with a cross block 7, the lower surface of the cross block 7 is fixedly connected with a telescopic rod 8, and the telescopic rod 8 can adjust the height of the cutting knife by telescoping.

[0024] The end of the telescopic rod 8 away from the cross block 7 is fixedly connected to a mounting plate 9, and a cutting knife clamping plate 10 is movably connected to the upper surface of the mounting plate 9. The upper surface of the guide plate 6 is movably connected to the mounting frame 2, and a cutting knife is fixedly connected to the lower surface of the cutting knife clamping plate 10. The upper surface of the cutting knife clamping plate 10 is threadedly connected with a bolt 11. The bolt 11 enables the cutting knife to be removed and replaced to increase the service life of the device. The upper surface of the mounting frame 2 is fixedly connected to a coolant tank 13, and the side surface of the coolant tank 13 is fixedly connected with a liquid outlet pipe 12. The side surface of the bolt 11 is threadedly connected to the mounting plate 9, and the side surface of the liquid outlet pipe 12 is fixedly connected to the mounting plate 9. The coolant can flow out through the liquid outlet pipe 12 to cool the cutting knife, and the coolant can flow down to the placement table 17 to place the broken The chips are washed away and flow into the collection box 14 for centralized collection. The base 1 is movably connected to the collection box 14 inside for centralized collection of used coolant and chips. The liquid outlet pipe 12 is provided with a solenoid valve inside. The side surface of the collection box 14 is fixedly connected with a handle to provide a fulcrum for people to pull out the collection box 14. The side inner wall of the collection box 14 is fixedly connected with a filter screen 15 for separating the chips and the coolant. The bottom inner wall of the base 1 is fixedly connected with a second motor 16. The output end of the second motor 16 is fixedly connected with a placement table 17. The side surface of the collection box 14 is fixedly connected with a drain pipe. A valve is provided inside the drain pipe. The second motor 16 is electrically connected to an external power supply. The lower surface of the placement table 17 is movably connected to the base 1, and the upper surface of the placement table 17 is fixedly connected with a clamping device.

[0025] Working principle: When the cutting knife cuts the wafer, turn on the power to start the telescopic rod 8 to adjust the height of the cutting knife, start the first motor 3 to drive the screw 4 to rotate, and then make the cutting knife produce a lateral displacement for cutting. When cutting in the rotation direction, you only need to control the telescopic rod 8 to move up and start the second motor 16 to make the placement table 17 drive the wafer to rotate. When cutting, open the solenoid valve to allow the coolant to flow out from the liquid outlet pipe 12 to the cutting knife to cool it down. The coolant flowing down will wash away the debris above on the placement table 17 and flow into the collection box 14 for centralized collection.

[0026] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A wafer cutting device, characterized in that: include: A base (1), wherein the upper surface of the base (1) is fixedly connected to a mounting frame (2), the side surface of the mounting frame (2) is fixedly connected to a first motor (3), the output end of the first motor (3) is fixedly connected to a lead screw (4), the side surface of the lead screw (4) is threadedly connected to a sleeve (5), the side surface of the sleeve (5) is fixedly connected to a guide plate (6), the side surface of the sleeve (5) is fixedly connected to a cross block (7), and the lower surface of the cross block (7) is fixedly connected to a telescopic rod (8); The end of the telescopic rod (8) away from the horizontal block (7) is fixedly connected to a mounting plate (9), the upper surface of the mounting plate (9) is movably connected to a cutting knife clamp (10), the upper surface of the cutting knife clamp (10) is threadedly connected to a bolt (11), the upper surface of the mounting frame (2) is fixedly connected to a cooling liquid tank (13), the side surface of the cooling liquid tank (13) is fixedly connected to a liquid outlet pipe (12), the interior of the base (1) is movably connected to a collecting box (14), the side inner wall of the collecting box (14) is fixedly connected to a filter screen (15), the bottom inner wall of the base (1) is fixedly connected to a second motor (16), and the output end of the second motor (16) is fixedly connected to a placement table (17).

2. A wafer cutting device according to claim 1, characterized in that: The first motor (3) is electrically connected to an external power source, and the side surface of the lead screw (4) is rotationally connected to the mounting frame (2).

3. A wafer cutting device according to claim 1, characterized in that: The upper surface of the guide plate (6) is movably connected to the mounting frame (2), and the lower surface of the cutting blade clamping plate (10) is fixedly connected to the cutting blade.

4. A wafer cutting device according to claim 1, characterized in that: The side surface of the bolt (11) is threadedly connected to the mounting plate (9), and the side surface of the liquid outlet pipe (12) is fixedly connected to the mounting plate (9).

5. A wafer cutting device according to claim 1, characterized in that: A solenoid valve is provided inside the liquid outlet pipe (12), and a handle is fixedly connected to the side surface of the collection box (14).

6. A wafer cutting device according to claim 1, characterized in that: The side surface of the collection box (14) is fixedly connected to a drainage pipe, and a valve is arranged inside the drainage pipe.

7. A wafer cutting device according to claim 1, characterized in that: The second motor (16) is electrically connected to an external power source, and the lower surface of the placement table (17) is movably connected to the base (1).

8. The wafer cutting device according to claim 1, characterized in that: A clamping device is fixedly connected to the upper surface of the placement table (17).

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