Copper dissolving tank
By introducing an adjustable copper frame and hydraulic cylinder adjustment mechanism into the copper dissolving tank, combined with the copper ion detector and controller, the problem of poor copper dissolving speed control is solved, and the copper ion concentration in the plating solution is stabilized and The uniformity of the electroplating film is improved.
Patent Information
- Application Number
- CN202421017599.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-10
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2034-05-10
AI Technical Summary
The existing copper dissolution method cannot control the copper dissolution rate in the copper dissolution tank, resulting in unstable copper ion concentration in the plating solution, affecting the uniformity of the film after electroplating.
A copper-soluble tank is designed, including an adjustable copper frame and hydraulic cylinder adjustment mechanism. The position of the copper frame is monitored and adjusted in real time through a copper ion detector and controller to ensure the immersion degree of copper material and sulfuric acid, thereby stabilizing the Copper ion concentration.
The copper ion concentration in the plating solution is stabilized and the uniformity of the film plating after electroplating is improved.
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Figure CN222332128U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of water electroplating, in particular to a copper dissolving tank. Background Art
[0002] In the preparation process of composite copper foil, the copper layer is usually thickened by water electroplating. During the water electroplating process, the copper ions in the copper-containing plating solution are reduced to copper atoms on the surface of the film and attached to the surface of the film. The quality of the copper-containing plating solution will affect the quality of the film product after water electroplating. In the water electroplating process, a copper-containing plating solution with a stable concentration needs to be continuously passed into the plating tank. Before the copper-containing plating solution enters the plating tank, the copper material needs to be dissolved into the copper-containing plating solution.
[0003] The existing copper dissolving method is to directly put the copper material into a copper dissolving tank containing sulfuric acid, and then transport the copper-containing plating solution to the electroplating tank after the copper material is dissolved. This copper dissolving method cannot control the copper dissolving speed in the copper dissolving tank, which will cause the copper ion concentration in the plating solution flowing out of the copper dissolving tank to be sometimes high and sometimes low, and the concentration of the plating solution entering the electroplating tank will change, resulting in uneven coating. Utility Model Content
[0004] In order to overcome the deficiencies of the prior art, the utility model provides a copper dissolving tank, which can adjust the speed of copper material dissolution, stabilize the copper ion concentration of the plating solution flowing out of the copper dissolving tank, and improve the uniformity of the plating layer of the film after electroplating.
[0005] The technical solution adopted by the utility model to solve its technical problems is:
[0006] A copper dissolving tank comprises a tank body and a cover body, wherein a copper material frame is fixedly arranged on the inner side of the cover body, and the copper material frame is located in the tank body; an adjustment mechanism is arranged between the tank body and the cover body, and the adjustment mechanism is used to drive the cover body to approach or move away from the tank body to adjust the height of the copper material frame in the tank body.
[0007] As a further improvement of the above technical solution, a plurality of first slide grooves are arranged on the tank body, the adjustment mechanism includes a hydraulic cylinder and a push rod, one end of the push rod is fixed on the cover body, the push rod is slidably connected in the first slide groove, and the hydraulic cylinder is fixedly connected to the tank body.
[0008] As a further improvement of the above technical solution, a guide rod is further provided on the cover body, a second slide groove is provided on the tank body, and the guide rod is slidably provided in the second slide groove.
[0009] As a further improvement of the above technical solution, the guide rod is arranged along the circumferential direction of the cover body, and the guide rod and the push rod are arranged at an interval.
[0010] As a further improvement of the above technical solution, a plurality of holes are provided on the copper material frame.
[0011] As a further improvement of the above technical solution, the bottom of the copper material frame is arc-shaped.
[0012] As a further improvement of the above technical solution, a material adding cover is arranged on the top of the cover body, and the material adding cover is located at the opening of the copper material frame.
[0013] As a further improvement of the above technical solution, a protective cover is disposed on the cover body, and the protective cover is sleeved on the periphery of the tank body.
[0014] As a further improvement of the above technical solution, a copper ion detector is arranged in the tank body.
[0015] As a further improvement of the above technical solution, it also includes a controller, which is electrically connected to the copper ion detector and the hydraulic cylinder and is used to receive the detector signal and control the operation of the hydraulic cylinder.
[0016] The beneficial effects of the utility model are as follows: the utility model provides a copper dissolving tank, which uses a copper material frame that can move up and down to make the copper material in the copper material frame and the sulfuric acid in the tank body be completely immersed, partially immersed or completely separated, so as to adjust the speed of copper material dissolution, stabilize the copper ion concentration of the plating solution flowing out of the copper dissolving tank, and improve the uniformity of the plating layer of the thin film after electroplating. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The utility model is further described below in conjunction with the accompanying drawings and embodiments.
[0018] Figure 1 This is a schematic structural diagram of a copper dissolving tank provided by an embodiment of the utility model;
[0019] Figure 2 This is an exploded view of a copper dissolving tank provided by an embodiment of the utility model;
[0020] Figure 3 The utility model is a cross-sectional view of a copper dissolving tank provided in one embodiment.
[0021] Figure numerals: 1, cover body; 11, feeding cover; 2, tank body; 21, first slide groove; 22, second slide groove; 3, protective cover; 4, adjustment mechanism; 41, push rod; 42, hydraulic cylinder; 5, copper material frame; 51, hole; 6, guide rod. DETAILED DESCRIPTION
[0022] The following will be combined with the embodiments and drawings to clearly and completely describe the concept, specific structure and technical effects of the utility model, so as to fully understand the purpose, characteristics and effects of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, other embodiments obtained by technicians in this field without creative work are all within the scope of protection of the utility model. In addition, all the connection / connection relationships involved in the patent do not refer to the direct connection of components, but refer to the fact that according to the specific implementation situation, a better connection structure can be formed by adding or reducing connection accessories. For example, fixed connection / fixed installation can be selected according to the needs of screw connection, bolt connection, pin connection, key connection, bonding, mortise and tenon connection, welding, riveting and other methods. For example, detachable connection can be selected according to the needs of screw connection, bolt connection, threaded connection, snap connection, mortise and tenon connection, Velcro connection and other methods. The various technical features in the creation of the utility model can be combined interactively without conflicting with each other.
[0023] Please refer to Figure 1-Figure 3 A copper dissolving tank comprises a tank body 2, a cover body 1 and a copper material frame 5, wherein the copper material frame 5 is fixedly arranged on the inner side of the cover body 1, and the copper material frame 5 is located in the tank body 2, and the copper material frame 5 is used to hold the copper material to be dissolved, and the tank body 2 is slidably connected with the cover body 1, and a plurality of first slide grooves 21 are arranged on the tank body 2, and the first slide grooves 21 are arranged along the edge of the tank body 2, and an adjustment mechanism 4 is arranged between the cover body 1 and the tank body 2, and the adjustment mechanism 4 is used to drive the cover body 1 to approach or move away from the tank body 2 to adjust the height of the copper material frame 5 in the tank body 2.
[0024] The regulating mechanism 4 comprises a hydraulic cylinder 42 and a push rod 41, one end of the push rod 41 is fixed on the cover body 1, the push rod 41 is slidably connected in the first slide groove 21, and the lifting and lowering of the push rod 41 can be controlled by the hydraulic cylinder 42, the hydraulic cylinder 42 is fixedly connected to the tank body 2, and the hydraulic cylinder 42 and the tank body 2 can be fixed in a threaded connection, a welding connection or a pin connection. When the copper ion concentration in the plating solution in the tank body is too high, the cover body 1 is lifted, so that part or all of the copper material in the copper material frame 5 leaves the liquid part; when the copper ion concentration in the plating solution in the copper dissolving tank is too low, the cover body 1 is lowered, so that more copper material is immersed in the sulfuric acid solution, so that the copper ion concentration of the plating solution flowing out of the copper dissolving tank remains stable.
[0025] Among them, there are multiple push rods 41 arranged around the edge of the cover body 1, and the push rods 41 are evenly arranged on the cover body 1, so no matter where the cover body 1 moves to the tank body 2, it can get uniform support, so that the cover body 1 and the tank body 2 can move stably, avoiding shaking or jamming caused by uneven support.
[0026] Furthermore, the cover body 1 is also provided with a guide rod 6, the number of which is at least three, and the guide rods 6 are evenly arranged along the circumferential direction of the cover body 1 and spaced apart from the top rod 41, and a second slide groove 22 is provided on the tank body 2, and the guide rod 6 is slidably arranged in the second slide groove 22, and the guide rod 6 has a guiding function to ensure that the cover body 1 moves up and down in the vertical direction during the lifting process, thereby avoiding the cover body 1 from shaking during the lifting process.
[0027] Furthermore, the copper material frame 5 is provided with a plurality of holes 51, which can filter the copper material and allow sulfuric acid to enter the copper material frame 5 to react with the copper material, so that the copper material is dissolved into a copper sulfate solution, and is transported to the electroplating tank as an electroplating solution for electroplating. The shape of the holes 51 on the copper material frame 5 can be a grid shape, a circle, a rectangle, etc., which is not limited here.
[0028] The bottom of the copper material frame 5 is arc-shaped, which can increase the contact area between the copper material and the sulfuric acid, and prevent the copper material from being deposited in the corner and unable to fully contact and react with the sulfuric acid.
[0029] Furthermore, a charging cover 11 is provided on the top of the cover body 1, and the charging cover 11 is located at the opening of the copper material frame 5, so as to facilitate the addition of copper material into the copper material frame 5. When it is necessary to add copper material into the copper material frame 5, the charging cover 11 can be opened to add the copper material, and the charging cover 11 can be closed after the addition is completed, so as to prevent foreign impurities from entering the copper material frame 5, thereby ensuring the purity and quality of the copper material. The copper material can be copper material in different forms such as copper balls and copper wires.
[0030] The charging cover 11 may also be provided with a handle for the convenience of the operator.
[0031] Furthermore, a protective cover 3 is disposed on the cover body 1 , and the protective cover 3 is sleeved on the outer circumference of the tank body 2 , so as to prevent the copper material and the interior of the tank body 2 from being contaminated when the cover body 1 is lifted up.
[0032] Furthermore, a copper ion detector is provided in the tank body 2, and the copper ion detector is used to detect the copper ion concentration in the solution.
[0033] The copper dissolving tank also includes a controller, which is electrically connected to the copper ion detector and the hydraulic cylinder 42, and is used to receive the detector signal and control the operation of the hydraulic cylinder 42. When the copper ion detector transmits the copper ion concentration data in the tank body 2 to the controller, it is compared with the preset standard copper ion concentration range. When the copper ion concentration is higher than the standard copper ion concentration range, the cover 1 is raised to separate the copper material from the sulfuric acid. When the copper ion concentration is lower than the standard copper ion concentration range, the cover 1 is lowered so that the copper material is immersed in sulfuric acid. At this time, if the copper ion concentration is still lower than the standard copper ion concentration range, the copper material is supplemented in the copper material frame 5. Thereby, the copper ion concentration in the copper dissolving tank can be always maintained within a stable range, which is conducive to improving the uniformity of electroplating.
[0034] The above is a specific description of the preferred implementation of the utility model, but the invention of the utility model is not limited to the described embodiments. Technical personnel familiar with the field can also make various equivalent deformations or substitutions without violating the spirit of the utility model. These equivalent deformations or substitutions are all included in the scope defined by the claims of this application.
Claims
1. A copper melting tank, characterized in that: It comprises a tank body and a cover body, wherein a copper material frame is fixedly arranged on the inner side of the cover body, and the copper material frame is located in the tank body; an adjustment mechanism is arranged between the tank body and the cover body, and the adjustment mechanism is used to drive the cover body to approach or move away from the tank body to adjust the height of the copper material frame in the tank body.
2. The copper dissolving tank according to claim 1, characterized in that: The tank body is provided with a plurality of first slide grooves, the adjusting mechanism comprises a hydraulic cylinder and a push rod, one end of the push rod is fixed on the cover body, and the other end is connected to the hydraulic cylinder, the push rod is slidably connected in the first slide grooves, and the hydraulic cylinder is fixedly connected to the tank body.
3. The copper dissolving tank according to claim 2, characterized in that: The cover body is also provided with a guide rod, the tank body is provided with a second slide groove, and the guide rod is slidably arranged in the second slide groove.
4. The copper dissolving tank according to claim 3, characterized in that: The guide rod is arranged along the circumferential direction of the cover body, and the guide rod is spaced apart from the push rod.
5. The copper dissolving tank according to any one of claims 1 to 4, characterized in that: The copper material frame is provided with a plurality of holes.
6. The copper dissolving tank according to claim 5, characterized in that: The bottom of the copper material frame is arc-shaped.
7. The copper dissolving tank according to any one of claims 1 to 4 or 6, characterized in that: A material adding cover is arranged on the top of the cover body, and the material adding cover is located at the opening of the copper material frame.
8. The copper dissolving tank according to any one of claims 1 to 4 or 6, characterized in that: The cover body is provided with a protective cover which is sleeved on the periphery of the tank body.
9. The copper dissolving tank according to any one of claims 2 to 4, characterized in that: A copper ion detector is arranged in the tank body.
10. The copper dissolving tank according to claim 9, characterized in that: It also includes a controller, which is electrically connected to the copper ion detector and the hydraulic cylinder and is used to receive the detector signal and control the operation of the hydraulic cylinder.