Power module, inverter and energy storage equipment

Abstract

The utility model provides a power module, an inverter and energy storage equipment. The power module comprises a first circuit board, a second circuit board, a chip and a shielding piece. The first circuit board is configured to mount a power device. The second circuit board is vertically arranged on the first circuit board and is conductively connected with the first circuit board. The chip is integrated on one side, back to the power device, of the second circuit board. The shielding piece is arranged between the chip and the power device, and the projection area of the chip is located in the projection area of the shielding piece in the thickness direction of the second circuit board. In the power module, the power device is arranged on the first circuit board, the chip is arranged on the second circuit board, the second circuit board is vertically arranged on the first circuit board and is located between the chip and the power device, and the second circuit board is provided with conductive structures such as circuits made of metal materials. Therefore, the second circuit board is helpful for shielding electromagnetic radiation of the power device on the chip, and in addition, the power module can also improve the shielding effect of the chip through the shielding piece so as to further reduce the influence of the electromagnetic radiation on the chip.

Description

Technical Field

[0001] The present application relates to the field of chip shielding, specifically to a power module, an inverter and an energy storage device. Background Art

[0002] At present, portable and mobile energy storage devices are widely used in people's lives as a power supply device for household emergency power backup and outdoor entertainment operations. The inverter in the energy storage device usually has heat-generating devices such as inductors and transformers, so fans are generally required for heat dissipation. In related technologies, the fan is controlled and driven by a chip. For cost considerations, the chip is usually integrated on a circuit board. However, since high-power devices such as transformers are also integrated on the circuit board, these power devices will generate space electromagnetic radiation during work, which will affect the normal operation of the chip and eventually cause the fan to malfunction. Utility Model Content

[0003] In view of this, the present application provides a power module, an inverter and an energy storage device that can reduce the impact of power devices on the electromagnetic radiation of chips.

[0004] In one embodiment of the present application, a power module is provided, comprising a first circuit board, a second circuit board, a chip and a shielding member. The first circuit board is configured to mount a power device. The second circuit board is vertically arranged on the first circuit board and is conductively connected to the first circuit board. The chip is integrated on a side of the second circuit board facing away from the power device. The shielding member is arranged between the chip and the power device, and along the thickness direction of the second circuit board, the projection area of ​​the chip is located within the projection area of ​​the shielding member.

[0005] In the power module provided by the present application, since the power device is arranged on the first circuit board, the chip is arranged on the second circuit board, the second circuit board is vertically arranged on the first circuit board and is located between the chip and the power device, and since the second circuit board has conductive structures such as lines formed by metal materials, the second circuit board helps to shield the electromagnetic radiation of the power device to the chip. In addition, the power module can also enhance the shielding effect of the chip through the shielding component to further reduce the impact of electromagnetic radiation on the chip.

[0006] In some embodiments, a groove is provided on the side of the second circuit board facing away from the power device, and the shielding member is at least partially provided in the groove. The power module also includes an insulating member, which is provided on the side of the shielding member facing away from the power device. The chip is provided on the insulating member, and the insulating member is configured as an insulating chip and a shielding member.

[0007] In some embodiments, the power module further includes a first cover body, the first cover body is connected to the shielding member, a first accommodating cavity is formed between the first cover body and the shielding member, and the chip is located in the first accommodating cavity.

[0008] In some embodiments, the second circuit board includes a first board layer and a second board layer, the first board layer is located on the side of the second board layer facing away from the power device, the chip is arranged on the first board layer, and the shielding member is arranged between the first board layer and the second board layer to form a shielding layer.

[0009] In some embodiments, the power module further includes a second cover body, which is disposed on a side of the first board layer facing away from the second board layer, and a second accommodating cavity is formed between the second cover body and the first board layer, and the chip is located in the second accommodating cavity.

[0010] In some embodiments, the second circuit board is disposed at an edge of the first circuit board that is farthest from the power device.

[0011] In some embodiments, the second circuit board is disposed on the same side of the first circuit board as the power device, or the second circuit board is disposed on the back side of the first circuit board as the power device.

[0012] In some embodiments, the second circuit board is perpendicular to the first circuit board.

[0013] In one embodiment of the present application, an inverter is further provided. The inverter includes an inverter housing and a power module in any one of the above embodiments. The power module is disposed in the inverter housing.

[0014] An energy storage device is also provided in one embodiment of the present application. The energy storage device includes a battery pack and the above-mentioned inverter, and the battery pack is electrically connected to the inverter.

[0015] In the inverter and energy storage device provided by the present application, since the power device is arranged on the first circuit board, the chip is arranged on the second circuit board, and the second circuit board is vertically arranged on the first circuit board and is located between the chip and the power device, since the second circuit board has conductive structures such as lines formed by metal materials, the second circuit board helps to shield the electromagnetic radiation of the power device to the chip. In addition, the power module can also enhance the shielding effect of the chip through the shielding component to further reduce the impact of electromagnetic radiation on the chip, thereby improving the operating stability of the inverter and the energy storage device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional diagram of an energy storage device in one embodiment of the present application.

[0017] Figure 2 It is a three-dimensional diagram of an inverter in one embodiment of the present application.

[0018] Figure 3 for Figure 2 Enlarged view of point III in the middle.

[0019] Figure 4 It is a cross-sectional view of a second circuit board, a shielding member, an insulating member and a chip in one embodiment of the present application.

[0020] Figure 5 It is a cross-sectional view of a second circuit board, a shielding member, an insulating member and a chip in one embodiment of the present application.

[0021] Figure 6 It is a cross-sectional view of the second circuit board, the shielding component, the insulating component, the first cover body and the chip in one embodiment of the present application.

[0022] Figure 7 It is a cross-sectional view of a second circuit board, a shielding component and a chip in one embodiment of the present application.

[0023] Figure 8 It is a cross-sectional view of the second circuit board, the shielding component, the second cover and the chip in one embodiment of the present application.

[0024] Fig. 9 It is a cross-sectional view of the second circuit board, the shielding component, the second cover and the chip in one embodiment of the present application.

[0025] Main component symbols

[0026] 100-power module 10-first circuit board 20-second circuit board

[0027] 21- groove 22- first board layer 23- second board layer

[0028] 30- chip 40- shielding part 41- shielding layer

[0029] 50 - insulating member 60 - first cover 61 - first accommodation chamber

[0030] 70 - second cover 71 - second accommodation cavity 101 - power device

[0031] 200-Inverter 201-Casing 300-Energy storage device

[0032] 301-Battery pack. DETAILED DESCRIPTION

[0033] The technical solution of the present application will be described below in conjunction with the drawings in the implementation modes of the present application. Obviously, the described implementation modes are only part of the implementation modes of the present application, rather than all the implementation modes.

[0034] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a component centered. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may also be a component centered. When a component is considered to be "set on" another component, it may be directly set on the other component or there may also be a component centered. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "or / and" used herein includes any and all combinations of one or more of the related listed items.

[0036] At present, portable and mobile energy storage devices are widely used in people's lives as a power supply device for household emergency power backup and outdoor entertainment operations. The inverter in the energy storage device usually has heat-generating devices such as inductors and transformers, so fans are generally required for heat dissipation. In related technologies, the fan is controlled and driven by a chip. For cost considerations, the chip is usually integrated on a circuit board. However, since high-power devices such as transformers are also integrated on the circuit board, these power devices will generate space electromagnetic radiation during work, which will affect the normal operation of the chip and eventually cause the fan to malfunction.

[0037] In view of this, the present application provides a power module, an inverter and an energy storage device that can reduce the influence of power devices on the electromagnetic radiation of chips. The power module includes a first circuit board, a second circuit board, a chip and a shielding member. The first circuit board is configured to install a power device. The second circuit board is vertically arranged on the first circuit board and is conductively connected to the first circuit board. The chip is integrated on the side of the second circuit board facing away from the power device. The shielding member is arranged between the chip and the power device, and along the thickness direction of the second circuit board, the projection area of ​​the chip is located within the projection area of ​​the shielding member.

[0038] In the power module provided by the present application, since the power device is arranged on the first circuit board, the chip is arranged on the second circuit board, the second circuit board is vertically arranged on the first circuit board and is located between the chip and the power device, and since the second circuit board has conductive structures such as lines formed by metal materials, the second circuit board helps to shield the electromagnetic radiation of the power device to the chip. In addition, the power module can also enhance the shielding effect of the chip through the shielding component to further reduce the impact of electromagnetic radiation on the chip.

[0039] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0040] See also Figure 1 and Figure 2 In the embodiment of the present application, a power module 100, an inverter 200 and an energy storage device 300 are provided. The inverter 200 includes an inverter housing 201 and a power module 100. The power module 100 is arranged in the inverter housing 201. The inverter 200 realizes the function of power conversion through the power module 100. The energy storage device 300 includes a battery pack 301 and an inverter 200. The battery pack 301 can be electrically connected to the inverter 200. The inverter 200 can convert the direct current of the battery pack 301 into alternating current for use by the power load. The inverter 200 can also convert the alternating current of the power grid into direct current to charge the battery pack 301.

[0041] As an illustrative example, the energy storage device 300 may be a portable power source used in outdoor scenarios or a household energy storage system for storing energy for the home; the inverter 200 may also be used in other scenarios that require conversion between AC and DC; the battery pack 301 may be an energy storage power source, a household energy storage battery, etc.; the power load may be an air conditioner, a refrigerator, other energy storage devices or other electrical equipment, etc.

[0042] See also Figure 2 and Figure 3 In some embodiments, the power module 100 includes a first circuit board 10, a second circuit board 20 and a chip 30. The first circuit board 10 is used to install a power device 101. The power device 101 generates electromagnetic radiation in space when working. The second circuit board 20 is erected on the first circuit board 10 and is conductively connected to the first circuit board 10. The second circuit board 20 is located on one side of the power device 101. The chip 30 is integrated on the side of the second circuit board 20 facing away from the power device 101, that is, the second circuit board 20 is located between the chip 30 and the power device 101. Since the second circuit board 20 has a conductive structure such as a circuit formed by a metal material, the second circuit board 20 helps to shield the electromagnetic radiation between the power device 101 and the chip 30, thereby reducing the influence of the electromagnetic radiation on the chip 30 and improving the functional stability of the power module 100.

[0043] In some embodiments, the power device 101 is an electromagnetic radiation device such as an inductor or a transformer.

[0044] In some embodiments, the area of ​​the first circuit board 10 is greater than that of the second circuit board 20 , the first circuit board 10 serves as the main circuit board of the power module 100 , and the second circuit board 20 serves as the auxiliary circuit board of the power module 100 .

[0045] In some embodiments, the power module 100 further includes a shielding member 40 capable of conducting electricity, and the shielding member 40 is disposed between the chip 30 and the power device 101. Along the thickness direction of the second circuit board 20, the projection area of ​​the chip 30 is at least partially located within the projection area of ​​the shielding member 40, so that the shielding member 40 can play a role in shielding the electromagnetic radiation between the power device 101 and the chip 30, thereby further reducing the influence of the electromagnetic radiation on the chip 30 and improving the functional stability of the power module 100. It can be understood that in order to maximize the shielding member 40 to shield the electromagnetic radiation between the power device 101 and the chip 30, along the thickness direction of the second circuit board 20, the projection area of ​​the chip 30 is entirely located within the projection area of ​​the shielding member 40.

[0046] Optionally, the shielding member 40 is made of copper, which can better shield electromagnetic radiation.

[0047] See also Figure 3 and Figure 4 In some embodiments, the shielding member 40 is disposed on the side of the second circuit board 20 facing away from the power device 101, and the power module 100 further includes an insulating member 50, which is disposed on the side of the shielding member 40 facing away from the second circuit board 20, and the chip 30 is disposed on the side of the insulating member 50 facing away from the shielding member 40, so that the insulating member 50 insulates the chip 30 from the shielding member 40 to prevent the shielding member 40 from affecting the operation of the chip 30. As an illustrative example, the shielding member 40 and the insulating member 50 are both in sheet form, and the area of ​​the insulating member 50 is smaller than that of the shielding member 40 but larger than that of the chip 30; the shielding member 40 is a metal sheet, such as a copper sheet.

[0048] Optionally, see Figure 5 A groove 21 is provided on a side of the second circuit board 20 facing away from the power device 101 . The shielding member 40 is at least partially disposed in the groove 21 to reduce the overall thickness of the second circuit board 20 .

[0049] Optionally, the depth of the groove 21 is the same as the thickness of the shielding member 40 , so that the groove 21 can accommodate the entire shielding member 40 to minimize the overall thickness of the second circuit board 20 .

[0050] Optionally, see Figure 6The power module 100 further includes a first cover 60 capable of conducting electricity. The first cover 60 is connected to the shielding member 40. A first accommodating cavity 61 is formed between the first cover 60 and the shielding member 40. The chip 30 and the insulating member 50 are both located in the first accommodating cavity 61, so that the chip 30 is surrounded by the first cover 60 and the shielding member 40. Since the first cover 60 also plays a role in shielding electromagnetic radiation, the first cover 60 and the shielding member 40 can shield the chip 30 from electromagnetic radiation in all directions, minimize the influence of electromagnetic radiation on the chip 30, and thus improve the functional stability of the power module 100. Further optionally, the first cover 60 is conductively connected to the shielding member 40 to improve the shielding effect, or the first cover 60 is not conductively connected to the shielding member 40, as long as the shielding effect can be achieved.

[0051] Optionally, the first cover body 60 is made of copper, which can better shield electromagnetic radiation.

[0052] See also Figure 7 In some embodiments, the second circuit board 20 includes a first board layer 22 and a second board layer 23, the first board layer 22 is located on the side of the second board layer 23 facing away from the power device 101, the chip 30 is integrated in the first board layer 22, and the shielding member 40 is arranged between the first board layer 22 and the second board layer 23 to form a shielding layer 41, that is, at least a partial area of ​​the second circuit board 20 includes the first board layer 22, the shielding layer 41 and the second board layer 23 connected in sequence, and the chip 30 is located in the area of ​​the second circuit board 20 having the shielding layer 41, so that the shielding layer 41 plays a role in shielding electromagnetic radiation for the chip 30.

[0053] Optionally, the area of ​​the shielding layer 41 is the same as the area of ​​the second circuit board 20, that is, the entire area of ​​the second circuit board 20 has the first board layer 22, the shielding layer 41 and the second board layer 23 connected in sequence, so that the ability of the entire second circuit board 20 to shield electromagnetic radiation is greatly improved, thereby improving the shielding effect.

[0054] Optionally, see Figure 8 The power module 100 also includes a second cover body 70 that is conductive. The second cover body 70 is arranged on the side of the first plate layer 22 that is away from the second plate layer 23. A second accommodating cavity 71 is formed between the second cover body 70 and the first plate layer 22. The chip 30 is located in the second accommodating cavity 71. The second cover body 70 is used to shield the chip 30 from electromagnetic radiation, thereby improving the electromagnetic radiation shielding effect of the chip 30.

[0055] Optionally, see Fig. 9 The second cover body 70 passes through the first plate layer 22 and is conductively connected to the shielding layer 41, so that the second cover body 70 and the shielding layer 41 can shield the chip 30 from electromagnetic radiation in all directions, minimize the impact of electromagnetic radiation on the chip 30, and thereby improve the functional stability of the power module 100.

[0056] In some embodiments, see Figure 2 The second circuit board 20 is disposed at the edge of the first circuit board 10 farthest from the power device 101 to increase the distance between the chip 30 and the power device 101 , thereby reducing the electromagnetic radiation of the power device 101 to the chip 30 .

[0057] In some embodiments, see Figure 2 The second circuit board 20 and the power device 101 are arranged on the same side of the first circuit board 10, so as not to occupy the space on the other side of the first circuit board 10, thus saving volume.

[0058] In some embodiments, the second circuit board 20 and the power device 101 are respectively disposed on opposite sides of the first circuit board 10 to increase the distance between the chip 30 and the power device 101 , thereby reducing electromagnetic radiation from the power device 101 to the chip 30 .

[0059] In some embodiments, see Figure 2 The second circuit board 20 is perpendicular to the first circuit board 10 to facilitate installation.

[0060] In some embodiments, the power module 100 further includes a fan (not shown), which is used to dissipate heat for the power module 100 or even the entire inverter 200. The fan is conductively connected to the chip 30, and the chip 30 can control the rotation of the fan. In the related art, since the chip may be interfered by electromagnetic radiation, the operation of the chip is affected, which in turn causes the fan to fail to operate, making it difficult for heating devices such as inductors or transformers to dissipate heat, which easily affects the performance of the inverter. The power module 100 in the present application can shield the chip 30 from electromagnetic radiation, reduce the interference of electromagnetic radiation on the chip 30, thereby improving the operating stability of the chip 30, and allowing the fan to operate normally, thereby ensuring the heat dissipation efficiency of the power module 100 and even the entire inverter 200, and thus ensuring the performance of the inverter 200.

[0061] In addition, those skilled in the art should recognize that the above embodiments are only used to illustrate the present application and are not intended to be limiting of the present application. As long as they are within the spirit and scope of the present application, appropriate changes and modifications to the above embodiments are within the scope of the present application.

Claims

1. A power module, characterized in that: include: a first circuit board, wherein the first circuit board is configured to mount a power device; a second circuit board, the second circuit board being vertically arranged on the first circuit board and being conductively connected to the first circuit board; A chip, wherein the chip is integrated on a side of the second circuit board facing away from the power device; and A shielding member is provided between the chip and the power device, and along the thickness direction of the second circuit board, the projection area of ​​the chip is located within the projection area of ​​the shielding member.

2. The power module according to claim 1, wherein: A groove is provided on the side of the second circuit board facing away from the power device, and the shielding member is at least partially provided in the groove. The power module also includes an insulating member, which is provided on the side of the shielding member facing away from the power device. The chip is provided on the insulating member, and the insulating member is configured to insulate the chip from the shielding member.

3. The power module according to claim 2, characterized in that: The power module further includes a first cover body, the first cover body is connected to the shielding component, a first accommodating cavity is formed between the first cover body and the shielding component, and the chip is located in the first accommodating cavity.

4. The power module according to claim 1, wherein: The second circuit board includes a first board layer and a second board layer, the first board layer is located on a side of the second board layer facing away from the power device, the chip is arranged on the first board layer, and the shielding component is arranged between the first board layer and the second board layer to form a shielding layer.

5. The power module according to claim 4, characterized in that: The power module further includes a second cover body, which is disposed on a side of the first board layer facing away from the second board layer. A second accommodating cavity is formed between the second cover body and the first board layer, and the chip is located in the second accommodating cavity.

6. The power module according to any one of claims 1 to 5, characterized in that: The second circuit board is disposed at an edge of the first circuit board that is farthest from the power device.

7. The power module according to any one of claims 1 to 5, characterized in that: The second circuit board is arranged on the same side of the first circuit board as the power device, or the second circuit board is arranged on the back side of the first circuit board as the power device.

8. The power module according to any one of claims 1 to 5, characterized in that: The second circuit board is perpendicular to the first circuit board.

9. An inverter, characterized in that: The inverter comprises an inverter housing and a power module according to any one of claims 1 to 8, wherein the power module is arranged in the inverter housing.

10. An energy storage device, characterized in that: The energy storage device includes a battery pack and the inverter as claimed in claim 9, and the battery pack is electrically connected to the inverter.

Images