Etching device capable of avoiding pool effect

Abstract

The utility model relates to the technical field of PCB (Printed Circuit Board) production, in particular to an etching device capable of avoiding a pool effect. The technical problems that a common PCB machining etching device lacks a liquid suction structure capable of adjusting the suction force in real time, so that a pool effect is likely to occur in the etching process of a PCB, meanwhile, an internal pressure compensation structure lacks, internal pressure is likely to change greatly, and the etching precision of the PCB needs to be improved are solved. According to the technical scheme, the etching device capable of avoiding the pool effect comprises a shell. According to the utility model, reacted etching liquid at the top of a PCB (Printed Circuit Board) is sucked away through the arranged vacuum suction assembly, the suction pressure is adjusted in real time, the pool effect is reduced and the etching precision is improved through the arranged induction bearing assembly and pressure sensing feedback, and the internal automatic constant pressure is realized through the arranged pressure regulation and control assembly, so that the precision compensation is completed, and the production efficiency is improved. And the etching precision is further ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB production, in particular to an etching device capable of avoiding a pool effect. Background Art

[0002] The etching process is one of the basic steps in the PCB production process. Simply put, the base copper is covered by the anti-corrosion layer, and the copper not protected by the anti-corrosion layer reacts with the etchant and is corroded away, eventually forming the designed circuit pattern and pad.

[0003] Common PCB processing etching devices lack a liquid suction structure that can adjust the suction force in real time, which leads to a pool effect in the PCB board during the etching process. At the same time, there is a lack of an internal pressure compensation structure, and the internal pressure is prone to large changes, which makes the etching accuracy of the PCB board need to be improved. For example, Chinese patent CN218450755U discloses a PCB board etching device, including a chassis, a frame is fixedly provided on the top of the chassis, a small box is fixedly provided on the top of the frame, a spray head is provided at the bottom of the small box, a filtering device is provided at the opening on the top of the chassis, and support blocks are fixedly provided on the inner walls on both sides of the chassis, and columns are provided on the top of the support blocks. However, the device cannot adjust the suction force in real time, and a pool effect is prone to occur.

[0004] Therefore, the above-mentioned PCB processing etching device lacks a liquid suction structure that can adjust the suction force in real time, which makes the PCB board prone to pool effect during the etching process. At the same time, the lack of an internal pressure compensation structure makes the etching accuracy of the PCB board need to be improved. This problem urgently needs to be solved to improve the usage scenario. Utility Model Content

[0005] In order to overcome the common PCB processing etching device, there is a lack of a liquid suction structure that can adjust the suction force in real time, and there is also a lack of an internal pressure compensation structure.

[0006] The technical solution of the utility model is: an etching device that can avoid the pool effect, including an outer shell, a liquid collecting chamber is arranged at the lower end of the inner part of the outer shell, a sealing door is installed at the front side of the left end of the outer shell through a hinge, a fixing frame is fixedly connected to the inner part of the outer shell near the upper end, an inductive bearing component is arranged on the top of the fixing frame, a PLC control host is installed at the top of the left end of the outer shell near the front side, a liquid medicine spraying component is connected to the middle position of the top of the outer shell, a vacuum suction component is arranged at the upper end of the inner part of the outer shell and the top of the right end of the outer shell, and a pressure regulating component is installed at the top of the left end of the outer shell near the back side.

[0007] Preferably, the etching liquid that has reacted on the top of the PCB board is sucked away by the provided vacuum suction component, and at the same time, the suction pressure is adjusted in real time through the provided inductive load-bearing component through pressure sensor feedback to reduce the pool effect and improve the etching accuracy. The internal pressure is automatically kept constant by the provided pressure regulating component, thereby completing precision compensation and further ensuring the etching accuracy, so as to solve the problem that the common PCB processing etching device lacks a liquid suction structure that can adjust the suction force in real time, resulting in the pool effect of the PCB board during the etching process, and lacks an internal pressure compensation structure, and the internal pressure is prone to large changes, so that the etching accuracy of the PCB board needs to be improved.

[0008] Preferably, the inductive load-bearing component includes a pressure sensor and a support bar; the pressure sensor is installed on the top of the fixed frame, and a support bar is arranged on the top of the pressure sensor. The PCB board to be etched is placed on the top of the support bar, and the pressure can be monitored in real time through the pressure sensor.

[0009] Preferably, the liquid medicine spraying assembly includes a liquid medicine barrel, a delivery pump, and a first connecting pipe; a liquid medicine barrel is arranged in the middle position of the top of the outer shell, and a delivery pump is installed on the top of the outer shell near the rear end of the liquid medicine barrel. The liquid medicine barrel and the delivery pump are connected to each other through the first connecting pipe. The delivery pump is started to extract the etching liquid in the liquid medicine barrel.

[0010] Preferably, the liquid medicine spraying assembly includes a second connecting pipe and a nozzle; the second connecting pipe is connected to the rear end of the delivery pump, and a plurality of nozzles are symmetrically installed on the upper and lower front ends of the second connecting pipe. The liquid medicine is delivered to the nozzle through the second connecting pipe by the delivery pump and sprayed out, and the upper and lower surfaces of the PCB board are etched at the same time.

[0011] Preferably, the vacuum suction assembly includes a hanging bar and an electric lifting rod; two hanging bars are hung at the upper end of the inner part of the shell, and the bottom of the hanging bars is connected to the electric lifting rod.

[0012] Preferably, the vacuum suction assembly includes a mounting plate and a suction hood; a mounting plate is provided at the lower end of the electric lifting rod, and a suction hood is installed in the middle of the mounting plate.

[0013] Preferably, the vacuum suction assembly includes a vacuum pump, a gas-liquid separation tank, and a third connecting pipe; a vacuum pump is installed on the top of the left end of the outer shell, a gas-liquid separation tank is connected to the top of the outer shell near the front end of the vacuum pump, and the right end of the gas-liquid separation tank is connected to the vacuum pump through the third connecting pipe.

[0014] Preferably, the vacuum suction assembly includes a fourth connecting tube and a fifth connecting tube; the left end of the gas-liquid separation tank is connected to the top of the suction hood through the fourth connecting tube, and the bottom of the right end of the gas-liquid separation tank is connected to the liquid collecting chamber through the fifth connecting tube. The vacuum pump is started to form a negative pressure environment near the suction hood, and the reacted etching liquid on the top of the PCB board is sucked away. The gas-liquid separation is performed through the gas-liquid separation tank, and the liquid is transported to the liquid collecting chamber through the fifth connecting tube. The pressure sensing data of the pressure sensor is used to control the extension and retraction of the electric lifting rod or change the working power of the vacuum pump, thereby adjusting the suction pressure in real time, reducing the pool effect, and improving the etching accuracy.

[0015] Preferably, the pressure regulating component includes an air pump and a sixth connecting pipe; the air pump is installed at the top of the left end of the shell near the back side, and the left end of the air pump is connected to the left side of the shell through the sixth connecting pipe.

[0016] Preferably, the pressure regulation component includes an air pressure sensor; an air pressure sensor is embedded in the top of the shell near the front end of the air pump, and the internal pressure of the shell is monitored by the air pressure sensor. By starting the air pump, air is delivered into the shell through the sixth connecting pipe, so that the internal pressure is automatically constant, thereby completing precision compensation and further ensuring the accuracy of etching.

[0017] Beneficial effects of the utility model:

[0018] 1. The etching liquid reacted on the top of the PCB board is sucked away by the vacuum suction component. At the same time, the inductive load-bearing component is set to adjust the suction pressure in real time through pressure sensor feedback to reduce the pool effect and improve the etching accuracy. The pressure control component is set to make the internal pressure automatic constant, so as to complete the precision compensation and further ensure the etching accuracy, so as to solve the problem that the common PCB processing etching device lacks a suction structure that can adjust the suction force in real time, resulting in the pool effect of the PCB board during the etching process. At the same time, the internal pressure is prone to large changes due to the lack of an internal pressure compensation structure, which makes the etching accuracy of the PCB board need to be improved;

[0019] 2. Start the vacuum pump to form a negative pressure environment near the suction hood, suck away the reacted etching liquid on the top of the PCB board, separate the gas and liquid through the gas-liquid separation tank, and transport the liquid to the liquid collecting chamber through the fifth connecting pipe. Through the pressure sensing data of the pressure sensor, control the extension and retraction of the electric lifting rod or change the working power of the vacuum pump, so as to adjust the suction pressure in real time, reduce the pool effect, and improve the etching accuracy. The internal pressure of the shell is monitored by the air pressure sensor, and the air is transported into the shell through the sixth connecting pipe by starting the air pump to make the internal pressure constant automatically, thereby completing the precision compensation and further ensuring the etching accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1Shown is a three-dimensional structural schematic diagram of an etching device that can avoid the pool effect of the utility model;

[0021] Figure 2 Shown is a schematic diagram of the main structure of an etching device that can avoid the pool effect of the utility model;

[0022] Figure 3 Shown is a schematic diagram of the structure of an inductive bearing assembly of an etching device capable of avoiding the pool effect of the utility model;

[0023] Figure 4 Shown is a schematic diagram of the structure of a liquid spraying component of an etching device that can avoid the pool effect of the utility model;

[0024] Figure 5 Shown is a schematic diagram of the structure of a vacuum suction assembly of an etching device that can avoid the pool effect of the utility model;

[0025] Figure 6 Shown is a schematic diagram of the structure of a pressure regulating component of an etching device that can avoid the pool effect of the utility model.

[0026] In the figure: 1. shell; 2. liquid collecting chamber; 3. sealing door; 4. fixing frame; 5. inductive bearing assembly; 6. PLC control host; 7. liquid spray assembly; 8. vacuum suction assembly; 9. pressure regulating assembly; 501. pressure sensor; 502. support bar; 701. liquid barrel; 702. delivery pump; 703. first connecting pipe; 704. second connecting pipe; 705. nozzle; 801. lifting bar; 802. electric lifting rod; 803. mounting plate; 804. suction hood; 805. vacuum pump; 806. gas-liquid separation tank; 807. third connecting pipe; 808. fourth connecting pipe; 809. fifth connecting pipe; 901. air pump; 902. sixth connecting pipe; 903. air pressure sensor. DETAILED DESCRIPTION

[0027] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0028] See also Figure 1-2 The utility model provides an embodiment: an etching device that can avoid the pool effect, including a shell 1, a liquid collecting chamber 2 is arranged at the lower end of the shell 1, a sealing door 3 is installed on the front side of the left end of the shell 1 through a hinge, a fixing frame 4 is fixedly connected to the upper end of the shell 1, an inductive bearing component 5 is arranged on the top of the fixing frame 4, a PLC control host 6 is installed at the top of the left end of the shell 1 near the front side, a liquid spraying component 7 is connected to the middle position of the top of the shell 1, a vacuum suction component 8 is arranged at the upper end of the shell 1 and the top of the right end of the shell 1, and a pressure regulating component 9 is installed at the top of the left end of the shell 1 near the back side.

[0029] See also Figure 3 In this embodiment, the inductive bearing assembly 5 includes a pressure sensor 501 and a support bar 502; the pressure sensor 501 is installed on the top of the fixing frame 4, and the support bar 502 is arranged on the top of the pressure sensor 501. The PCB board to be etched is placed on the top of the support bar 502, and the pressure can be monitored in real time through the pressure sensor 501.

[0030] See also Figure 4 In this embodiment, the liquid medicine spraying assembly 7 includes a liquid medicine barrel 701, a delivery pump 702, and a first connecting pipe 703; a liquid medicine barrel 701 is arranged in the middle position of the top of the shell 1, and a delivery pump 702 is installed at the top of the shell 1 near the rear end of the liquid medicine barrel 701. The liquid medicine barrel 701 and the delivery pump 702 are connected to each other through the first connecting pipe 703. The delivery pump 702 is started to extract the etching liquid in the liquid medicine barrel 701. The liquid medicine spraying assembly 7 includes a second connecting pipe 704 and a nozzle 705; the rear end of the delivery pump 702 is connected to the second connecting pipe 704, and a plurality of nozzles 705 are symmetrically installed at the front end of the second connecting pipe 704. The liquid medicine is delivered to the nozzle 705 through the delivery pump 702 and the second connecting pipe 704 is sprayed out, and the upper and lower surfaces of the PCB board are etched at the same time.

[0031] See also Figure 5 In this embodiment, the vacuum suction assembly 8 includes a hanging bar 801, an electric lifting rod 802, a mounting plate 803, and a suction hood 804; two hanging bars 801 are hung at the upper end of the inner part of the shell 1, and the bottom of the hanging bar 801 is connected to the electric lifting rod 802, and the lower end of the electric lifting rod 802 is provided with a mounting plate 803, and the middle position of the mounting plate 803 is installed with a suction hood 804, and the vacuum suction assembly 8 includes a vacuum pump 805, a gas-liquid separation tank 806, a third connecting pipe 807, a fourth connecting pipe 808, and a fifth connecting pipe 809; a vacuum pump 805 is installed at the top of the left end of the shell 1, and a gas-liquid separation tank 806 is connected to the top of the shell 1 near the front end of the vacuum pump 805, and the right end of the gas-liquid separation tank 806 The gas-liquid separation tank 806 is connected to the vacuum pump 805 through the third connecting pipe 807, the left end of the gas-liquid separation tank 806 is connected to the top of the suction hood 804 through the fourth connecting pipe 808, and the right end of the gas-liquid separation tank 806 is connected to the liquid collecting chamber 2 through the fifth connecting pipe 809. The vacuum pump 805 is started, and a negative pressure environment is formed near the suction hood 804 to suck away the reacted etching liquid on the top of the PCB board. The gas-liquid separation tank 806 is used for gas-liquid separation, and the liquid is transported to the liquid collecting chamber 2 through the fifth connecting pipe 809. The pressure sensing data of the pressure sensor 501 is used to control the extension and retraction of the electric lifting rod 802 or change the working power of the vacuum pump 805, so as to adjust the suction pressure in real time, reduce the pool effect, and improve the etching accuracy.

[0032] See also Figure 6In this embodiment, the pressure regulating component 9 includes an air pump 901, a sixth connecting pipe 902, and an air pressure sensor 903; the air pump 901 is installed at the top of the left end of the shell 1 near the back side, the left end of the air pump 901 is connected to the left side of the shell 1 through the sixth connecting pipe 902, and the air pressure sensor 903 is embedded in the top of the shell 1 near the front end of the air pump 901. The internal pressure of the shell 1 is monitored by the air pressure sensor 903. By starting the air pump 901, air is transported into the shell 1 through the sixth connecting pipe 902, so that the internal pressure is automatically constant, thereby completing precision compensation and further ensuring the accuracy of etching.

[0033] When working, the PCB board to be etched is placed on the top of the support bar 502, and the pressure can be monitored in real time through the pressure sensor 501. The delivery pump 702 is started to extract the etching solution in the solution barrel 701, and the solution is delivered to the nozzle 705 through the second connecting pipe 704 by the delivery pump 702 to be sprayed out, and the upper and lower surfaces of the PCB board are etched at the same time. The vacuum pump 805 is started to form a negative pressure environment near the suction hood 804, and the reacted etching solution on the top of the PCB board is sucked away. The gas-liquid separation tank 806 is used to separate the gas and liquid, and the liquid is delivered to the liquid collecting chamber 2 through the fifth connecting pipe 809. The pressure sensing data of the pressure sensor 501 is used to control the extension and contraction of the electric lifting rod 802 or change the working power of the vacuum pump 805, so as to adjust the suction pressure in real time, reduce the pool effect, and improve the etching accuracy. The pressure inside the shell 1 is monitored by the air pressure sensor 903, and the air pump 901 is started to deliver air to the shell 1 through the sixth connecting pipe 902, so that the internal pressure is automatically constant, thereby completing precision compensation and further ensuring the etching accuracy.

[0034] Through the above steps, the etching liquid that has reacted on the top of the PCB board is sucked away by the set vacuum suction component 8, and at the same time, the set inductive bearing component 5 adjusts the suction pressure in real time through pressure sensor feedback to reduce the pool effect and improve the etching accuracy. The set pressure control component 9 makes the internal pressure automatic constant, thereby completing precision compensation and further ensuring the etching accuracy, so as to solve the problem that the common PCB processing etching device lacks a liquid suction structure that can adjust the suction force in real time, resulting in the pool effect of the PCB board during the etching process, and lacks an internal pressure compensation structure, and the internal pressure is prone to large changes, so that the etching accuracy of the PCB board needs to be improved.

[0035] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the purpose of the present invention.

Claims

1. An etching device capable of avoiding a pool effect, comprising a housing (1), characterized in that: A liquid collecting chamber (2) is provided at the lower end of the shell (1); a sealing door (3) is installed at the front side of the left end of the shell (1) via a hinge; a fixing frame (4) is fixedly connected to the upper end of the shell (1); an inductive bearing component (5) is provided at the top of the fixing frame (4); a PLC control host (6) is installed at the top of the left end of the shell (1) near the front side; a liquid medicine spraying component (7) is connected to the middle of the top of the shell (1); a vacuum suction component (8) is provided at the upper end of the shell (1) and the top of the right end of the shell (1); and a pressure regulating component (9) is installed at the top of the left end of the shell (1) near the back side.

2. The etching device capable of avoiding the pool effect according to claim 1, characterized in that: The inductive bearing assembly (5) comprises a pressure sensor (501) and a support bar (502); the pressure sensor (501) is installed on the top of the fixing frame (4), and the support bar (502) is arranged on the top of the pressure sensor (501).

3. The etching device capable of avoiding the pool effect according to claim 1, characterized in that: The liquid medicine spraying assembly (7) comprises a liquid medicine barrel (701), a delivery pump (702), and a first connecting pipe (703); the liquid medicine barrel (701) is arranged in the middle of the top of the housing (1); the delivery pump (702) is installed at the top of the housing (1) near the rear end of the liquid medicine barrel (701); the liquid medicine barrel (701) and the delivery pump (702) are connected to each other via the first connecting pipe (703).

4. The etching device capable of avoiding the pool effect according to claim 3, characterized in that: The liquid medicine spraying assembly (7) comprises a second connecting pipe (704) and a spray head (705); the rear end of the delivery pump (702) is connected to the second connecting pipe (704), and the front end of the second connecting pipe (704) is symmetrically mounted with a plurality of spray heads (705) in an upper and lower manner.

5. The etching device capable of avoiding the pool effect according to claim 1, characterized in that: The vacuum suction assembly (8) comprises a hanging bar (801) and an electric lifting rod (802); two hanging bars (801) are hung at the upper end of the interior of the housing (1), and the bottom of the hanging bar (801) is connected to the electric lifting rod (802).

6. The etching device capable of avoiding the pool effect according to claim 5, characterized in that: The vacuum suction assembly (8) comprises a mounting plate (803) and a suction hood (804); the mounting plate (803) is arranged at the lower end of the electric lifting rod (802), and the suction hood (804) is installed in the middle of the mounting plate (803).

7. An etching device capable of avoiding the pool effect according to claim 6, characterized in that: The vacuum suction assembly (8) comprises a vacuum pump (805), a gas-liquid separation tank (806), and a third connecting pipe (807); the vacuum pump (805) is installed at the top of the left end of the housing (1); the gas-liquid separation tank (806) is connected to the top of the housing (1) near the front end of the vacuum pump (805); and the right end of the gas-liquid separation tank (806) is connected to the vacuum pump (805) via the third connecting pipe (807).

8. The etching device capable of avoiding the pool effect according to claim 7, characterized in that: The vacuum suction assembly (8) comprises a fourth connecting pipe (808) and a fifth connecting pipe (809); the left end of the gas-liquid separation tank (806) is connected to the top of the suction hood (804) via the fourth connecting pipe (808), and the right end bottom of the gas-liquid separation tank (806) is connected to the liquid collecting chamber (2) via the fifth connecting pipe (809).

9. The etching device capable of avoiding the pool effect according to claim 1, characterized in that: The pressure regulating component (9) comprises an air pump (901) and a sixth connecting pipe (902); the air pump (901) is installed at the top of the left end of the housing (1) near the back side, and the left end of the air pump (901) is connected to the left side of the housing (1) via the sixth connecting pipe (902).

10. An etching device capable of avoiding the pool effect according to claim 9, characterized in that: Pressure regulating component (9) air pressure sensor (903); an air pressure sensor (903) is embedded in the top of the housing (1) near the front end of the air pump (901).

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