Electronic device

Abstract

The utility model belongs to the technical field of equipment heat dissipation, and discloses electronic equipment. The electronic equipment comprises a cabinet body, an electronic module, a capacitor pool module and a heat dissipation device, the electronic module comprises an electronic cavity and an electronic device, and the electronic device is arranged in the electronic cavity. The capacitor pool module comprises a capacitor cavity and a plurality of capacitors, the plurality of capacitors are arranged in the capacitor cavity, the capacitor cavity is communicated with the electronic cavity to form a first heat dissipation channel, and an internal circulation fan is arranged in the first heat dissipation channel, so that airflow in the first heat dissipation channel circularly flows between the electronic cavity and the capacitor cavity; the first heat dissipation channel is not communicated with an external flow path of the cabinet body, and the heat dissipation device is configured to dissipate heat and cool air flow in the first heat dissipation channel. According to the electronic equipment, heat dissipation of the capacitor is achieved through the heat dissipation device of the electronic device, and the heat dissipation efficiency of the capacitor is improved; and the heat dissipation channel is not communicated with the outside of the cabinet body, so that the external environment can be prevented from polluting electronic devices in the cabinet body, and a high protection effect is formed.

Description

Technical Field

[0001] The utility model relates to the technical field of equipment heat dissipation, in particular to electronic equipment. Background Art

[0002] The inverter is an electronic device that changes the voltage, frequency, number of phases and other electrical quantities or characteristics of the power system. With the rapid development of the new energy industry, the application of inverters in complex and harsh environments has gradually increased. Application environments such as wind, sand, and salt spray have become increasingly normalized, and the protection requirements for inverters have become increasingly higher. The power module is the core component of the inverter. As the power increases, its reliability directly determines whether the inverter can operate normally.

[0003] In the prior art, the power component dissipates heat by directly exchanging heat with the coolant through a radiator. The capacitor component includes multiple independent capacitors, and it is necessary to set up separate heat dissipation channels for the multiple capacitors, and the heat dissipation structure is relatively complex. Moreover, during the heat dissipation process, the airflow in the external environment enters the cabinet, causing pollution or even corrosion to the electronic components in the cabinet, making it difficult for the converter to work normally in harsh environments.

[0004] Therefore, there is an urgent need to improve electronic equipment to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide an electronic device, which integrates multiple capacitors into a capacitor cavity, and connects the heat dissipation duct of the capacitor with the heat dissipation duct of the electronic device to form a circulating duct, and uses the heat dissipation device of the electronic device to achieve heat dissipation of the capacitor, thereby improving the heat dissipation efficiency of the capacitor, and no additional heat dissipation device is required, thereby reducing the manufacturing cost. At the same time, the first heat dissipation channel is isolated from the external environment of the cabinet, so as to avoid pollution and corrosion of the capacitor and the electronic device by the external environment, thereby improving the protection.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] Electronic equipment, including:

[0008] Cabinet;

[0009] An electronic module is arranged in the cabinet, the electronic module comprises an electronic cavity and an electronic device, and the electronic device is arranged in the electronic cavity;

[0010] A capacitor pool module is arranged in the cabinet, the capacitor pool module includes a capacitor cavity and a plurality of capacitors, the plurality of capacitors are arranged in the capacitor cavity, the capacitor cavity is connected with the electronic cavity to form a first heat dissipation channel, an internal circulation fan is arranged in the first heat dissipation channel, so that the airflow in the first heat dissipation channel circulates between the electronic cavity and the capacitor cavity, and the first heat dissipation channel is not connected with the external flow path of the cabinet;

[0011] The heat dissipation device is arranged outside the cabinet, and is configured to dissipate heat and cool the airflow in the first heat dissipation channel.

[0012] As an optional solution, the capacitor cavity is surrounded by an air duct enclosure and a capacitor busbar, and the multiple capacitors in the capacitor cavity are electrically connected to the capacitor busbar.

[0013] As an optional solution, the electronic device further includes at least one power module, and the power module is electrically connected to the capacitor pool module. When there are multiple power modules, multiple power modules are connected to one capacitor pool module.

[0014] As an optional solution, an airflow gap is provided between the capacitor and the inner wall of the capacitor cavity, and / or between adjacent capacitors, and the airflow in the first heat dissipation channel can pass through the airflow gap.

[0015] As an optional solution, the heat dissipation device includes:

[0016] The air-to-air radiator is arranged on the air flow path in the first heat dissipation channel. The inner wall surface of the air-to-air radiator exchanges heat with the air flow in the first heat dissipation channel and transfers heat to the outer wall surface of the air-to-air radiator for dissipation.

[0017] As an optional solution, the heat dissipation device further includes:

[0018] The external circulation fan is arranged outside the air-to-air radiator and is used to drive the outside air to flow to the outer wall surface of the air-to-air radiator for heat exchange.

[0019] As an optional solution, a connecting channel is provided between the electronic cavity and the capacitor cavity to connect the electronic cavity and the capacitor cavity.

[0020] As an optional solution, the electronic device further includes:

[0021] A power module includes a power component, a heat dissipation component and a heat dissipation cavity, wherein the power component is arranged outside the heat dissipation cavity, a second heat dissipation channel is formed inside the heat dissipation cavity, and the second heat dissipation channel is connected to the outside of the cabinet. The heat dissipation component is used to dissipate heat for the power component, and the heat dissipation end of the heat dissipation component is arranged in the second heat dissipation channel.

[0022] As an optional solution, the second heat dissipation channel is provided with a module air inlet and a module air outlet connected to the outside of the electronic device, and the power module also includes a module heat exchange fan, which is configured to drive the airflow in the second heat dissipation channel from the module air inlet to the module air outlet.

[0023] As an optional solution, the power module further includes:

[0024] An air collecting cavity is connected to the second heat dissipation channel. When there are multiple power modules, the second heat dissipation channels of multiple power modules are connected to the same air collecting cavity, and the air collecting cavity is connected to the outside of the electronic device.

[0025] Beneficial effects:

[0026] The electronic device proposed by the utility model integrates multiple capacitors into a capacitor cavity to form a capacitor pool module, which is convenient for installation, maintenance and repair. The capacitor cavity is connected with the electronic cavity to form a first heat dissipation channel, and an internal circulation fan is arranged in the first heat dissipation channel, so that the airflow in the electronic cavity and the capacitor cavity forms a circulation flow, and the airflow is cooled by the heat dissipation device and then exchanges heat with the electronic device and the capacitor, thereby realizing the cooling of the electronic device and the capacitor, and improving the heat dissipation efficiency of the capacitor relative to the natural heat dissipation method of the capacitor in the prior art. At the same time, the capacitor and the electronic device share a heat dissipation channel and a heat dissipation device, and there is no need to set up a heat dissipation device additionally, which can reduce the manufacturing cost. Furthermore, the first heat dissipation channel is not connected to the external flow path of the cabinet, and the airflow circulates in the first heat dissipation channel without contacting the outside air, which is well protected, and can prevent the electronic device and the capacitor from being polluted by air, thereby achieving high protection. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a front view of the electronic device provided by the first embodiment of the utility model;

[0028] Figure 2 This is a schematic diagram of the internal structure of the electronic device provided by the first embodiment of the utility model. Figure 1 ;

[0029] Figure 3 It is a structural schematic diagram of a capacitor pool module provided in Embodiment 1 of the present utility model;

[0030] Figure 4 It is a partial structural schematic diagram of a power module provided in Embodiment 1 of the present utility model;

[0031] Figure 5 The airflow trace in the second heat dissipation channel provided in the first embodiment of the utility model Figure 1 ;

[0032] Figure 6 This is a schematic diagram of the internal structure of the electronic device provided by the first embodiment of the utility model. Figure 2 ;

[0033] Figure 7 The airflow trace in the second heat dissipation channel provided in the first embodiment of the utility model Figure 2 ;

[0034] Figure 8 It is a front view of the electronic device provided by the second embodiment of the utility model;

[0035] Fig. 9 It is a structural schematic diagram of a capacitor pool module provided in Embodiment 2 of the present utility model;

[0036] Fig.10 It is a schematic diagram of the internal structure of an electronic device provided in Embodiment 2 of the present utility model.

[0037] In the figure:

[0038] 1. Electronic module; 11. Electronic cavity; 12. Electronic device; 13. Internal circulation fan; 14. Heat dissipation device; 141. Air-to-air radiator; 142. External circulation fan;

[0039] 2. capacitor pool module; 20. first heat dissipation channel; 21. capacitor cavity; 211. air duct enclosure; 212. capacitor busbar; 213. capacitor air inlet; 214. capacitor air outlet; 22. capacitor; 220. air gap;

[0040] 3. Cabinet; 30. Connecting channel;

[0041] 4. Power module; 41. Power component; 42. Heat dissipation component; 421. Heat dissipation end; 43. Heat dissipation cavity; 430. Second heat dissipation channel; 431. Module air inlet; 432. Module air outlet; 44. Connecting busbar; 45. Module heat exchange fan; 46. Air collecting cavity. DETAILED DESCRIPTION

[0042] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0043] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0045] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0046] Embodiment 1:

[0047] like Figure 1 As shown, this embodiment provides an electronic device, including a cabinet 3 and an electronic module 1, a capacitor pool module 2 and a power module 4 arranged in the cabinet 3, and the electronic module 1, the capacitor pool module 2 and the power module 4 are arranged in order from top to bottom in the cabinet 3. At least one power module 4 is provided, and the power module 4 is electrically connected to the capacitor pool module 2. When multiple power modules 4 are provided, multiple power modules 4 are connected to one capacitor pool module 2. In this embodiment, six power modules 4 are provided, and the six power modules 4 are arranged in order from left to right. The six power modules 4 are electrically connected to the same capacitor pool module 2. By setting the capacitor 22 collection as a capacitor pool, the connection with the power module 4 can be achieved by setting a capacitor busbar, and the connection operation is more convenient. In this embodiment, the electronic device is a converter. In other embodiments, it can also be other electronic devices with heat dissipation requirements.

[0048] Specifically, Figure 2 and Figure 3 As shown, the electronic module 1 includes an electronic cavity 11 and an electronic device 12, and the electronic device 12 is arranged in the electronic cavity 11. The capacitor pool module 2 includes a capacitor cavity 21 and a plurality of capacitors 22, and the plurality of capacitors 22 are arranged in the capacitor cavity 21. The capacitor cavity 21 is connected with the electronic cavity 11 to form a first heat dissipation channel 20, and an internal circulation fan 13 is arranged in the first heat dissipation channel 20, so that the airflow in the first heat dissipation channel 20 circulates between the electronic cavity 11 and the capacitor cavity 21, and the first heat dissipation channel 20 is not connected to the external flow path of the cabinet 3. A heat dissipation device 14 is arranged outside the cabinet 3, and the heat dissipation device 14 is used to dissipate heat and cool the airflow in the first heat dissipation channel 20.

[0049] The electronic device proposed in this embodiment integrates a plurality of capacitors 22 into the capacitor cavity 21 to form a capacitor pool module 2, which is convenient for installation, maintenance and repair. The first heat dissipation channel 20 is formed by connecting the capacitor cavity 21 with the electronic cavity 11, and an internal circulation fan 13 is arranged in the first heat dissipation channel 20, so that the airflow in the electronic cavity 11 and the capacitor cavity 21 forms a circulation flow, and the airflow is cooled by the heat dissipation device 14 and then heat is exchanged with the electronic device 12 and the capacitor 22, thereby realizing the cooling of the electronic device 12 and the capacitor 22, and improving the heat dissipation efficiency of the capacitor 22 relative to the natural heat dissipation method of the capacitor 22 in the prior art. At the same time, the capacitor 22 and the electronic device 12 share a heat dissipation channel and a heat dissipation device 14, and no additional heat dissipation device 14 is required, which can reduce the manufacturing cost. Furthermore, the first heat dissipation channel 20 and the external flow path of the cabinet 3 are not connected to each other, and the airflow circulates in the first heat dissipation channel 20, does not contact with the outside air, and is well protected, and can prevent the electronic device 12 and the capacitor 22 from being polluted by air, thereby achieving high protection.

[0050] Alternatively, if Figure 2 and Figure 3 As shown, a connecting channel 30 is provided between the electronic cavity 11 and the capacitor cavity 21 to connect the electronic cavity 11 and the capacitor cavity 21. A capacitor air inlet 213 and a capacitor air outlet 214 are formed on the front side and the rear side of the capacitor cavity 21, respectively, and an electronic air inlet and an electronic air outlet are formed on the front side and the rear side of the electronic cavity 11, respectively. Two connecting channels 30 are provided, one connecting channel 30 connects the capacitor air inlet 213 and the electronic air outlet, and the other connecting channel 30 connects the capacitor air outlet 214 and the electronic air inlet, thereby realizing a closed loop of the first heat dissipation channel 20. Figure 2 As shown by the air flow trace a, a counterclockwise airflow is formed in the first heat dissipation channel 20. Of course, in other embodiments, the internal circulation fan 13 can also drive the airflow in the first heat dissipation channel 20 to flow clockwise.

[0051] Specifically, if Figure 2 As shown, the heat dissipation device 14 includes an air-to-air heat sink 141, which is arranged on the air flow path in the first heat dissipation channel 20. The air flow in the first heat dissipation channel 20 flows through the air-to-air heat sink 141, and the inner wall surface of the air-to-air heat sink 141 exchanges heat with the air flow in the first heat dissipation channel 20, and transfers the heat to the outer wall surface of the air-to-air heat sink 141 for dissipation. The inside of the air-to-air heat sink 141 is isolated from the external environment, and the first heat dissipation channel 20 and the air-to-air heat sink 141 form a closed flow path, which is in contact with the outside air, and can achieve a good protection effect. After the first heat dissipation channel 20 enters the air-to-air heat sink 141 for heat exchange, the heat absorbed by the air-to-air heat sink 141 will be dissipated to the outside air through the outer wall surface of the air-to-air heat sink 141, so that the air-to-air heat sink 141 can continue to play a heat dissipation role. The air-to-air heat sink 141 is a conventional heat exchange device in the prior art, and its specific structure, connection relationship and working principle are not described in detail here.

[0052] like Figure 2 As shown, in order to increase the heat dissipation rate of the outer wall of the air-to-air radiator 141, the heat dissipation device 14 also includes an external circulation fan 142, which is arranged outside the air-to-air radiator 141, and is used to drive the outside air to flow to the outer wall of the air-to-air radiator 141 for heat exchange, thereby accelerating the air flow at the outer wall of the air-to-air radiator 141, thereby increasing the heat dissipation rate of the outer wall of the air-to-air radiator 141, and ensuring that the air-to-air radiator 141 maintains a high heat exchange efficiency.

[0053] Alternatively, if Figure 3 As shown, the capacitor cavity 21 is surrounded by an air duct enclosure 211 and a capacitor busbar 212, and at least one capacitor 22 in the capacitor cavity 21 is electrically connected to the capacitor busbar 212. The air duct enclosure 211 and the capacitor busbar 212 are sealed to prevent the air flow in the capacitor cavity 21 from leaking from the connection between the air duct enclosure 211 and the capacitor busbar 212, and ensure that the air flow can only flow out of the capacitor cavity 21 through the air outlet of the capacitor 22.

[0054] Optionally, a wind gap 220 is provided between the capacitor 22 and the inner wall of the capacitor cavity 21, and / or between adjacent capacitors 22, and the airflow in the first heat dissipation channel 20 can pass through the wind gap 220. By reserving the wind gap 220, the airflow in the capacitor cavity 21 can be ensured to flow smoothly. At the same time, the wind gap 220 between adjacent capacitors 22 is conducive to increasing the contact area between the airflow and the capacitor 22, thereby improving the heat dissipation effect on the capacitor 22.

[0055] Alternatively, if Figure 2 and Figure 4As shown, the power module 4 includes a connecting busbar 44, a power component 41, a heat dissipation component 42 and a heat dissipation cavity 43. The power component 41 is arranged outside the heat dissipation cavity 43 and is electrically connected to the capacitor busbar 212 through the connecting busbar 44. A second heat dissipation channel 430 is formed inside the heat dissipation cavity 43, and the second heat dissipation channel 430 is connected to the outside of the cabinet 3. The heat dissipation component 42 is used to dissipate heat from the power component 41, and the heat dissipation end 421 of the heat dissipation component 42 is arranged in the second heat dissipation channel 430. The heat dissipation end 421 of the heat dissipation component 42 is generally set as a heat dissipation fin. The heat dissipation component 42 performs heat exchange with the power component 41, and the temperature of the heat dissipation component 42 rises. The heat dissipation component 42 performs heat dissipation and cooling through the heat dissipation fins with the air in the second heat dissipation channel 430, and the heat dissipation component 42 performs heat dissipation and cooling, so that the heat dissipation component 42 can continuously dissipate heat and cool the power component 41. Since the power component 41 is arranged outside the second heat dissipation channel 430, it will not contact with the air in the second heat dissipation channel 430, and can avoid being affected by the air in the second heat dissipation channel 430, which helps to improve the protection.

[0056] Specifically, the second heat dissipation channel 430 is provided with a module air inlet 431 and a module air outlet 432 connected to the outside of the electronic device. The power module 4 also includes a module heat exchange fan 45, and the module heat exchange fan 45 is configured to drive the air flow in the second heat dissipation channel 430 from the module air inlet 431 to the module air outlet 432, thereby accelerating the air flow in the second heat dissipation channel 430, which helps to improve the heat dissipation effect of the heat dissipation component 42.

[0057] There is no limitation on the location of the module air inlet 431 and the module air outlet 432. Figure 2 As shown, in one embodiment, the module air inlet 431 is arranged on the lower side of the heat dissipation cavity 43, and the module air outlet 432 is arranged on the rear side of the heat dissipation cavity 43. The airflow direction in the heat dissipation cavity 43 is as shown in FIG. Figure 2 As shown by the airflow trace b, the airflow enters the heat dissipation cavity 43 from the lower side of the heat dissipation cavity 43 and flows out from the rear side. Figure 5 As shown, the module air outlet 432 may also be disposed on the front side of the heat dissipation cavity 43 , and the airflow will flow out from the front side of the heat dissipation cavity 43 .

[0058] In another embodiment, Figure 6 As shown, the module air inlet 431 is arranged on the front side of the heat dissipation cavity 43, and the module air outlet 432 is arranged on the lower side of the heat dissipation cavity 43. The airflow direction in the heat dissipation cavity 43 is as shown in FIG. Figure 6 As shown by the airflow trace b, the airflow enters the heat dissipation cavity 43 from the front side of the heat dissipation cavity 43 and flows out from the bottom side. Figure 7 As shown, the module air inlet 431 may also be disposed on the rear side of the heat dissipation cavity 43 , and the airflow will enter the heat dissipation cavity 43 from the rear side of the heat dissipation cavity 43 .

[0059] Optionally, combined Figure 1 and Figure 6 As shown, the power module 4 also includes an air collecting cavity 46, which is connected to the second heat dissipation channel 430. When there are multiple power modules 4, the second heat dissipation channels 430 of multiple power modules 4 are connected to the same air collecting cavity 46, and the air collecting cavity 46 is connected to the outside of the electronic device. Specifically, the air collecting cavity 46 is arranged at the bottom side of the heat dissipation cavity 43, and the second heat dissipation channels 430 of multiple power modules 4 are connected by setting the air collecting cavity 46, so that the airflow in the second heat dissipation channel 430 can be centrally regulated.

[0060] The module heat exchange fan 45 is arranged in the air collecting cavity 46, specifically on the lower side of the air collecting cavity 46. The module heat exchange fan 45 is used to blow air into the air collecting cavity 46 or extract the airflow in the air collecting cavity 46 to the outside of the cabinet 3, so that the airflow in the second heat dissipation channel 430 flows from the module air inlet 431 to the module air outlet 432, thereby accelerating the flow of air in the second heat dissipation channel 430.

[0061] Embodiment 2:

[0062] like Figure 8-Figure 10 As shown, this embodiment provides an electronic device, which is basically the same as the first embodiment, except that:

[0063] The capacitor pool module 2 is vertically arranged at the rear side of the power module 4, and the capacitor air outlet 214 and the capacitor air inlet 213 are respectively arranged at the upper side and the lower side of the capacitor cavity 21. Fig.10 As shown, in one embodiment, the capacitor air inlet 213 is arranged on the upper side of the capacitor cavity 21, and the capacitor air outlet 214 is arranged on the lower side of the capacitor cavity 21, and a counterclockwise airflow is formed in the first heat dissipation channel 20. The airflow direction is as shown in FIG. Fig.10 In another embodiment, the capacitor air inlet 213 may be disposed on the lower side of the capacitor cavity 21 , and the capacitor air outlet 214 may be disposed on the upper side of the capacitor cavity 21 , so that a clockwise airflow is formed in the first heat dissipation channel 20 .

[0064] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. An electronic device, characterized in that include: Cabinet (3); An electronic module (1) is arranged in the cabinet (3), wherein the electronic module (1) comprises an electronic cavity (11) and an electronic device (12), wherein the electronic device (12) is arranged in the electronic cavity (11); A capacitor pool module (2) is arranged in the cabinet (3), the capacitor pool module (2) comprises a capacitor cavity (21) and a plurality of capacitors (22), the plurality of capacitors (22) are arranged in the capacitor cavity (21), the capacitor cavity (21) is connected with the electronic cavity (11) to form a first heat dissipation channel (20), an internal circulation fan (13) is arranged in the first heat dissipation channel (20), so that the airflow in the first heat dissipation channel (20) circulates between the electronic cavity (11) and the capacitor cavity (21), and the first heat dissipation channel (20) is not connected to the external flow path of the cabinet (3); A heat dissipation device (14) is arranged outside the cabinet (3), and the heat dissipation device (14) is configured to dissipate heat and cool the airflow in the first heat dissipation channel (20).

2. The electronic device according to claim 1, characterized in that: The capacitor cavity (21) is surrounded by an air duct enclosure (211) and a capacitor busbar (212), and the plurality of capacitors (22) in the capacitor cavity (21) are electrically connected to the capacitor busbar (212).

3. The electronic device according to claim 2, characterized in that: The electronic device further comprises at least one power module (4), wherein the power module (4) is electrically connected to the capacitor pool module (2); when a plurality of the power modules (4) are provided, a plurality of the power modules (4) are connected to one capacitor pool module (2).

4. The electronic device according to claim 1, characterized in that: An air gap (220) is provided between the capacitor (22) and the inner wall of the capacitor cavity (21), and / or between adjacent capacitors (22), and the airflow in the first heat dissipation channel (20) can pass through the air gap (220).

5. The electronic device according to claim 1, characterized in that: The heat dissipation device (14) comprises: The air-to-air heat sink (141) is arranged on the air flow path in the first heat dissipation channel (20); the inner wall surface of the air-to-air heat sink (141) exchanges heat with the air flow in the first heat dissipation channel (20), and transfers heat to the outer wall surface of the air-to-air heat sink (141) for dissipation.

6. The electronic device according to claim 5, characterized in that: The heat dissipation device (14) further comprises: An external circulation fan (142) is arranged outside the air-to-air radiator (141) and is used to drive external air to flow to the outer wall surface of the air-to-air radiator (141) for heat exchange.

7. The electronic device according to claim 1, characterized in that: A connecting channel (30) is provided between the electronic cavity (11) and the capacitor cavity (21) so as to connect the electronic cavity (11) and the capacitor cavity (21).

8. The electronic device according to any one of claims 1 to 7, characterized in that: The electronic device further comprises: A power module (4) comprises a power component (41), a heat dissipation component (42) and a heat dissipation cavity (43); the power component (41) is arranged outside the heat dissipation cavity (43); a second heat dissipation channel (430) is formed inside the heat dissipation cavity (43); the second heat dissipation channel (430) is connected to the outside of the cabinet (3); the heat dissipation component (42) is used to dissipate heat from the power component (41); and a heat dissipation end (421) of the heat dissipation component (42) is arranged inside the second heat dissipation channel (430).

9. The electronic device according to claim 8, characterized in that: The second heat dissipation channel (430) is provided with a module air inlet (431) and a module air outlet (432) connected to the outside of the electronic device, and the power module (4) further comprises a module heat exchange fan (45), wherein the module heat exchange fan (45) is configured to drive the air flow in the second heat dissipation channel (430) to flow from the module air inlet (431) to the module air outlet (432).

10. The electronic device according to claim 8, characterized in that: The power module (4) further comprises: An air collecting cavity (46), the air collecting cavity (46) being connected to the second heat dissipation channel (430); when a plurality of the power modules (4) are provided, the second heat dissipation channels (430) of the plurality of the power modules (4) are connected to the same air collecting cavity (46), and the air collecting cavity (46) is connected to the outside of the electronic device.

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