Charger shell injection mold

Abstract

The utility model discloses a charger shell injection mold, and relates to the field of injection molds, the charger shell injection mold comprises an upper mold base, a lower mold base is arranged at the lower end of the upper mold base, a male mold is connected to the lower end of the upper mold base, a female mold is arranged in the lower mold base, and the male mold is connected to the female mold. A first semiconductor plate and a second semiconductor plate are arranged in each of the upper die holder and the lower die holder, and the side ends of the first semiconductor plate and the second semiconductor plate are connected with connectors. The first semiconductor plate and the second semiconductor plate are arranged and connected to form a semiconductor refrigeration structure, the male die and the female die can be preheated before injection molding, the surface temperature of the die is evenly distributed, deformation and damage caused by temperature difference are reduced, after injection molding is completed, the male die and the female die can be subjected to heat absorption and cooling, and the injection molding efficiency is improved. And therefore, the production efficiency is improved, and the defects of deformation, shrinkage cavities and the like possibly caused by long-time high temperature of the product can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of injection molds, in particular to an injection mold for a charger shell. Background Art

[0002] The charger shell is generally made of plastic and is produced using an injection molding process. An injection molding machine is used to inject molten plastic material into a mold, and after cooling and solidification, the desired shell shape is formed. This process has the advantages of relatively low cost and high product precision, and is widely used in the production of charger shells.

[0003] However, the existing injection mold for charger shell has the following problems during the injection molding process: the mold cannot be preheated before injecting the casting liquid into the mold, which will cause part of the casting liquid to directly condense into small particles due to the temperature difference when it contacts the mold with low temperature, affecting the quality of the finished product; after the injection molding is completed, the mold cannot quickly dissipate heat and cool down, which will not only reduce the processing efficiency, but also the product may cause defects such as deformation and shrinkage due to long-term high temperature.

[0004] In order to solve the technical problem, the utility model proposes a charger shell injection mold. Utility Model Content

[0005] The main purpose of the utility model is to provide a charger shell injection mold, which can effectively solve the problems mentioned in the background technology.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] A charger shell injection mold comprises an upper mold base, a lower mold base is arranged at the lower end of the upper mold base, a punch is connected to the lower end of the upper mold base, a concave mold is opened in the lower mold base, a first semiconductor board and a second semiconductor board are arranged in the upper mold base and the lower mold base, the side ends of the first semiconductor board and the second semiconductor board are connected to connecting heads, the side ends of the upper mold base and the lower mold base are connected to a support frame, a rotating rod is rotatably connected inside the support frame, the side end of the rotating rod is connected to a connecting plate, the side end of the connecting plate is connected to a live wire head and a neutral wire head, the side end of the rotating rod is connected to a rotating connector, the outer end of the rotating rod is connected to a No. 1 gear, a motor is connected in the support frame, and the driving end of the motor is connected to a No. 2 gear.

[0008] Preferably, the first semiconductor plate and the second semiconductor plate are connected via an iron core, the first semiconductor plate and the second semiconductor plate are located in the male mold, and the first semiconductor plate and the second semiconductor plate are surrounded at the outer end of the female mold.

[0009] Preferably, the connector is located at the side end of the support frame, the live wire and the neutral wire can be connected to the connector, an electrical conductor is connected to the rotary connector, and the first gear is meshed with the second gear.

[0010] Preferably, a positioning rod is connected to the lower end of the upper die base, a positioning hole is provided in the lower die base, and the positioning rod is inserted into the positioning hole.

[0011] Preferably, the punch can be inserted into the die, and a top plate is slidably connected to the punch and the die, and the top plate is tightly connected to the punch and the die, and a No. 1 cylinder is connected to the upper die base and the lower die base, and the No. 1 cylinder is connected to the top plate.

[0012] Preferably, a liquid injection tube is connected to the upper die seat, and a connecting groove is provided at the lower end of the upper die seat and the upper end of the lower die seat, and the connecting groove is connected to the concave die.

[0013] Preferably, the rear end of the lower die base is connected to a No. 2 cylinder, the driving end of the No. 2 cylinder is connected to a push plate, and the push plate is located between the upper die base and the lower die base.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] In the utility model, a first semiconductor plate and a second semiconductor plate are provided, and the two are connected to form a semiconductor refrigeration structure. When the first semiconductor plate and the second semiconductor plate are energized, the first semiconductor plate generates heat, and the second semiconductor plate generates low temperature. The heat generated by the first semiconductor plate can be transmitted to the male mold and the female mold, so as to heat them and preheat the male mold and the female mold. The preheating can make the surface temperature of the mold evenly distributed, effectively eliminate the thermal stress of the mold, reduce deformation and damage caused by temperature differences, thereby improving the dimensional stability and surface quality of the product. After the injection molding is completed, the motor is started, which will be able to drive the rotating rod to rotate, so that the live wire head and the neutral wire head are swapped, so that the first semiconductor plate will generate low temperature, and the second semiconductor plate will generate heat. The first semiconductor plate generates low temperature and can absorb the heat of injection molding, so that the casting liquid can be quickly cooled. Rapid cooling can not only improve production efficiency, but also help reduce defects such as deformation and shrinkage holes that may be caused by long-term high temperature in the product.

[0016] In the utility model, a push plate and a No. 1 cylinder are arranged in the punch and the die. After the injection molding is completed, the upper die seat is lifted, and then the No. 1 cylinder is driven to push the push plate to move, the top plate of the punch moves downward, and the top plate in the concave surface moves upward. In this way, no matter whether the charger mold shell is stuck at the outer end of the punch or stuck inside the die, it can be ejected to complete demolding, and then the No. 2 cylinder is started to push the push plate to eject the charger mold shell out of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of an injection mold for a charger shell of the utility model;

[0018] Figure 2 This is a schematic diagram of the structure of the No. 2 cylinder of a charger shell injection mold of the utility model;

[0019] Figure 3 This is a schematic diagram of the front structure of a charger shell injection mold of the utility model;

[0020] Figure 4 This is a schematic diagram of the lower mold base structure of a charger shell injection mold of the utility model;

[0021] Figure 5 This is a schematic diagram of the support frame structure of a charger shell injection mold of the utility model;

[0022] Figure 6 This is a schematic diagram of the positions of the first semiconductor plate and the second semiconductor plate of an injection mold for a charger shell of the utility model.

[0023] In the figure: 1. upper die base; 2. lower die base; 3. punch; 4. die; 5. first semiconductor board; 6. second semiconductor board; 7. connector; 8. support frame; 9. rotating rod; 10. connecting plate; 11. live wire; 12. neutral wire; 13. rotary connector; 14. gear No. 1; 15. motor; 16. gear No. 2; 17. positioning rod; 18. positioning hole; 19. top plate; 20. cylinder No. 1; 21. injection pipe; 22. connecting groove; 23. cylinder No. 2; 24. push plate. DETAILED DESCRIPTION

[0024] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0025] like Figure 1-6As shown, a charger shell injection mold includes an upper mold base 1, a lower mold base 2 is arranged at the lower end of the upper mold base 1, a punch 3 is connected to the lower end of the upper mold base 1, a concave mold 4 is provided in the lower mold base 2, the punch 3 can be inserted into the concave mold 4, and the gap formed between the two is the shape of the charger shell, a positioning rod 17 is connected to the lower end of the upper mold base 1, a positioning hole 18 is provided in the lower mold base 2, the positioning rod 17 is inserted into the positioning hole 18, and the positioning rod 17 cooperates with the positioning hole 18 to be able to When the upper die base 1 is pressed down and connected with the lower die base 2, the punch 3 can be just inserted into the die 4 to complete the positioning. An injection tube 21 is connected to the upper die base 1. A connecting groove 22 is provided at the lower end of the upper die base 1 and the upper end of the lower die base 2. The connecting groove 22 is connected to the die 4. After the upper die base 1 and the lower die base 2 are connected, the casting liquid is injected into the injection tube 21. The casting liquid will enter the gap between the die 4 and the punch 3 through the connecting groove 22 to form the charger shell.

[0026] The upper die base 1 and the lower die base 2 are both provided with a first semiconductor plate 5 and a second semiconductor plate 6, which are connected by an iron core, so that the two will form a semiconductor refrigeration structure. The first semiconductor plate 5 and the second semiconductor plate 6 are located in the punch 3, and the first semiconductor plate 5 and the second semiconductor plate 6 are surrounded at the outer end of the die 4. When the first semiconductor plate 5 and the second semiconductor plate 6 are powered, one of the semiconductor plates absorbs heat to generate low temperature according to the "Peltier effect", while the other semiconductor plate generates heat.

[0027] The first semiconductor board 5 and the second semiconductor board 6 are both connected to the side ends of the connector 7, the upper die base 1 and the lower die base 2 are connected to the side ends of the support frame 8, the connector 7 is located at the side end of the support frame 8, the support frame 8 is internally connected with a rotating rod 9, the side end of the rotating rod 9 is connected to a connecting plate 10, the side end of the connecting plate 10 is connected to a live wire head 11 and a neutral wire head 12, the live wire head 11 and the neutral wire head 12 can be connected to the connector 7, the side end of the rotating rod 9 is connected to a rotating connector 13, and the rotating connector 13 is connected with an electric wire, so that the rotating rod 9 can be energized so that it passes The live wire 11 and the neutral wire 12 energize the connector 7 to supply power to the first semiconductor board 5 and the second semiconductor board 6. The outer end of the rotating rod 9 is connected to a No. 1 gear 14, and the support frame 8 is connected to a motor 15. The driving end of the motor 15 is connected to a No. 2 gear 16. The No. 1 gear 14 is meshed with the No. 2 gear 16, so as to start the motor 15 to drive the No. 2 gear 16 at the driving end to rotate. The rotation of the No. 2 gear 16 and the No. 1 gear 14 will drive the rotating rod 9 to rotate, thereby exchanging the positions of the live wire 11 and the neutral wire 12.

[0028] There is a top plate 19 slidingly connected inside the punch 3 and the die 4. The top plate 19 is tightly connected to the punch 3 and the die 4, and the casting liquid cannot overflow from the gap. The upper die base 1 and the lower die base 2 are both connected to a No. 1 cylinder 20, and the No. 1 cylinder 20 is connected to the top plate 19. Starting the No. 1 cylinder 20 will be able to push the top plate 19 to move, so that the top plate 19 is ejected from the punch 3 and the die 4, thereby ejecting the charger shell stuck at the outer end of the punch 3 or stuck in the die 4 to demold it. At this time, the position of the top plate 19 in the die 4 is flush with the upper surface of the lower die base 2, and the rear end of the lower die base 2 is connected to a No. 2 cylinder 23, and the driving end of the No. 2 cylinder 23 is connected to a push plate 24, which is located between the upper die base 1 and the lower die base 2. Starting the No. 2 cylinder 23 will push the push plate 24 to move, so that the demolded charger shell can be pushed out of the device.

[0029] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A charger shell injection mold, comprising an upper mold base (1), characterized in that: The lower end of the upper die seat (1) is provided with a lower die seat (2), the lower end of the upper die seat (1) is connected to a convex die (3), a concave die (4) is provided in the lower die seat (2), a first semiconductor board (5) and a second semiconductor board (6) are provided in both the upper die seat (1) and the lower die seat (2), the side ends of the first semiconductor board (5) and the second semiconductor board (6) are connected to connectors (7), and the side ends of the upper die seat (1) and the lower die seat (2) are connected to support frames (8) The support frame (8) is internally connected with a rotating rod (9), the side end of the rotating rod (9) is connected with a connecting plate (10), the side end of the connecting plate (10) is connected with a live wire head (11) and a neutral wire head (12), the side end of the rotating rod (9) is connected with a rotating connector (13), the outer end of the rotating rod (9) is connected with a first gear (14), the support frame (8) is internally connected with a motor (15), and the driving end of the motor (15) is connected with a second gear (16).

2. The charger shell injection mold according to claim 1, characterized in that: The first semiconductor plate (5) and the second semiconductor plate (6) are connected via an iron core; the first semiconductor plate (5) and the second semiconductor plate (6) are located in the male mold (3); and the first semiconductor plate (5) and the second semiconductor plate (6) are surrounded at the outer end of the female mold (4).

3. The charger shell injection mold according to claim 1, characterized in that: The connector (7) is located at the side end of the support frame (8), the live wire (11) and the neutral wire (12) can be connected to the connector (7), an electric wire is connected inside the rotary connector (13), and the first gear (14) is meshed with the second gear (16).

4. The charger shell injection mold according to claim 1, characterized in that: The lower end of the upper die seat (1) is connected to a positioning rod (17), a positioning hole (18) is provided in the lower die seat (2), and the positioning rod (17) is inserted into the positioning hole (18).

5. The charger shell injection mold according to claim 1, characterized in that: The punch (3) can be inserted into the die (4), and a top plate (19) is slidably connected between the punch (3) and the die (4). The top plate (19) is tightly connected to the punch (3) and the die (4). The upper die base (1) and the lower die base (2) are both connected to a No. 1 cylinder (20), and the No. 1 cylinder (20) is connected to the top plate (19).

6. The charger shell injection mold according to claim 1, characterized in that: The upper die seat (1) is connected to a liquid injection pipe (21), and the lower end of the upper die seat (1) and the upper end of the lower die seat (2) are both provided with a connecting groove (22), and the connecting groove (22) is connected to the concave die (4).

7. The charger housing injection mold according to claim 1, characterized in that: The rear end of the lower die base (2) is connected to a No. 2 air cylinder (23), and the driving end of the No. 2 air cylinder (23) is connected to a push plate (24), and the push plate (24) is located between the upper die base (1) and the lower die base (2).

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